Friday, December 13th 2013
Core i7 "Haswell-E" Engineering Sample Pictured
Here's the first picture of Intel's next-generation Core i7 HEDT (high-end desktop) processor, codenamed "Haswell-E." Based on Intel's latest "Haswell" micro-architecture, the chip will be Intel's first HEDT processor to ship with eight cores, and the first client CPU to ship with next-generation DDR4 memory interface. In addition to IPC improvements over "Ivy Bridge" that come with "Haswell," the chip integrates a quad-channel DDR4 integrated memory controller, with native memory speeds of DDR4-2133 MHz; a PCI-Express gen 3.0 root complex with a total of 40 PCI-Express lanes, and yet the same DMI 2.0 (4 GB/s) chipset bus.
Built into the LGA2011-3 socket, "Haswell-E" will be incompatible with current LGA2011 motherboards, as the notches of the package will vary from LGA2011 "Ivy Bridge-E." Intel will introduce the new X99 Express chipset, featuring all 6 Gb/s SATA ports, integrated USB 3.0 controllers, and a PCI-Express gen 2.0 root complex for third-party onboard controllers. Interestingly, there's no mention of SATA-Express, which Intel's next-generation 9-series chipset for Core "Broadwell" platforms reportedly ships with; and X99 isn't looking too different from today's Z87 chipset. With engineering samples already out, it wouldn't surprise us if Intel launches "Haswell-E" along the sidelines of any of next year's big-three trade-shows (CES, CeBIT, and Computex).
Source:
VR-Zone
Built into the LGA2011-3 socket, "Haswell-E" will be incompatible with current LGA2011 motherboards, as the notches of the package will vary from LGA2011 "Ivy Bridge-E." Intel will introduce the new X99 Express chipset, featuring all 6 Gb/s SATA ports, integrated USB 3.0 controllers, and a PCI-Express gen 2.0 root complex for third-party onboard controllers. Interestingly, there's no mention of SATA-Express, which Intel's next-generation 9-series chipset for Core "Broadwell" platforms reportedly ships with; and X99 isn't looking too different from today's Z87 chipset. With engineering samples already out, it wouldn't surprise us if Intel launches "Haswell-E" along the sidelines of any of next year's big-three trade-shows (CES, CeBIT, and Computex).
49 Comments on Core i7 "Haswell-E" Engineering Sample Pictured
I give props to Intel for finally jetisoning the SATA II ports entirely. I'm definitely in the boat with everyone criticizing X79 for being one heck of a hot PCH, but that might be because its based on 45 nm technology. Rectifying that shouldn't be a problem, assuming Intel actually wants to push some boundaries...
I hope X99 brings some dignity back to the high end market. X79 was, speaking on my opinion only, a fail for the high-end. It didn't push any boundaries, it only added extra cores and some connectivity. Those that could use it obviously saw an improvement, but it could have been renamed to CE (Crunchers Edition), and been more accurate than HE (High End).
I've personally haven't had any issues with the X79 over heating, so I can't relate. I can say that it is pretty nice and convenient to have 40 PCI-E lanes off the CPU though.
So much hate for a decent platform... If there is anything to complain about (at least with SB-E) is that power consumption is a bit high. Other than that, my 3820 is just as capable as any other quad-core out there at the moment. While it might not be the "fastest" it isn't a limiting factor in anything I do.
I should also add, at least SB-E/IVB-E has the heat-spreader soldered to the die. Don't need to de-lid that. That's a perk in and of itself.
Without AMD, the CPU industry is dead.
8 cores at 5 GHz :droool: This isn't really the same socket as current 2011, it's 2011-3 which has a different pinout and it's not backwards compatible. There's also people like me who can actually use all cores available :toast:
I'd honestly love 12 cores on a single CPU :) I thought it like you for quite a good amount of time, until I bought a RAID card with "balls" and never thought about the lack of anything in X79 anymore.
Having the entire board watercooled makes for a quiet and chilly system :toast:
I actaully have a lot of questions about Haswell-E but I understand its too early for any real answers,....
But...clockspeed is gonna take a dive here, with 8 cores, I suspect. If not, AWESOME!!!
Hope to have more info soon. ;)
Maybe you'll have to pay in organs.
I suppose even the Low TDP Saints Intel have problems dealing with the increasing leakage currents of their ever-shrinking process. kekeke... Meanwhile, even though I've got a decent OC, I've got a sweet undervoltage which makes my chip run noticeably below its TDP. *shrug* I forgot what point I wanted to make.
P.S. has the availability & price of DDR4 already good?
My favorite manufacturing process is the 32nm SOI that FX processors are done on. It OCs well under LN2 it OCs well under water it OCs well on air and it can survive really high voltage much longer than intel's 32nm or 22nm and is easier to cool on the CPU to heatsink heat transfer level not the heatsink dissipation level.
If AMD made it possible to stick multiple FX chips onto one motherboard my 3960X could find it self saying bye bye because FX 8350s aren't nearly as expensive to replace when you fry them and are funner(more options and better IMC) to OC