Just basing this off the picture, but the fact the top heatsink is not perfectly parallel to the lower heatsink is triggering the hell out of me :laugh:
They arent 5 years behind tho....
And if you dont let boards unload as much power as they want to the CPU that the CPU does not need, their perf/watt isnt actually that bad.
Intel will be using the same lithography for sub Intel 7 geometries as TSMC has been using for their 3-7nm. They are not as far behind as you think. Lithography is the technology (ie EUV) used for patterning step of fabricating. Transitioning to EUV is basically mandatory to keep improving...