Team Group's T-FORCE & T-CREATE Takes Home Four Awards at 2024 Red Dot Design Award

[btarunr]

Team Group Inc. has been committed to developing a wide range of memory products for years and has received international recognition for long-term efforts. Today, Team Group proudly announces that the gaming label and creator label, T-FORCE and T-CREATE, have taken home four awards from the Red Dot Design Award 2024 for the T-FORCE DARK AirFlow I SSD Cooler, T-FORCE SIREN GD120S AIO SSD Cooler, T-FORCE XTREEM DDR5 Desktop Memory, and T-CREATE CinemaPr P31 External SSD. The success is a testimony to Team Group's outstanding R&D capability and incredibly innovative designs, which have once again propelled new heights on the stage of a world-class design award.

One of the four most prestigious design awards in the world, the Red Dot Design Award of Germany is an important indicator of industrial design and development trends around the world. The Red Dot received thousands of submissions from over 60 countries in 2024, all vying for the highly influential award. Submissions are judged by a panel of experts, hailing from all over the world, on their innovation, solution, product, design, and concept. Team Group sub-labels, T-FORCE and T-CREAT, stood out with stellar R&D and quality designs, adding to Team Group's illustrious history.



To overcome heat from high-speed transmissions with PCIe Gen 5 SSD, Team Group has launched two perfect solutions: the T-FORCE DARK AirFlow I SSD Cooler and T-FORCE SIREN GD120S AIO SSD Cooler. The AirFlow I employs Team Group's patented ultra-thin graphene heat sink technology, and highly conductive thermal materials to dissipate heat, ensuring high-speed performances over a long period. The T-FORCE SIREN GD120S is a unique all-in-one (AIO) water cooler for SSDs and is equipped with precision aluminium alloy dual-tube water blocks with an ARGB PWM fan to cool down SSDs and offer personalized lighting designs. The two cooling solutions allow consumers to enjoy PCIe GEN 5 SSDs to their fullest extent.

The T-FORCE XTREEM DDR5 Desktop Memory delivers powerful overclocking up to frequencies of 8200 MHz with its exclusive patented IC grading verification technology, pushing the boundaries of DDR5 memory frequencies. It also uses a 2 mm aluminium alloy heat spreader for perfect cooling, exhibiting both the hardness and durability of basalt and the delicate texture of a black sand beach, paired with the iconic T-FORCE emblem, ensuring gamers enjoy overclocking and exquisite craftsmanship simultaneously.

Designed for professional photographers, the T-CREATE CinemaPr P31 External SSD can be perfectly paired with the cages of professional cameras, digital SLR cameras, or mobile phones. The twelve patented screw holes allow the CinemaPr P31 External SSD to be secured onto any cages from multiple sides. The SSD supports USB Type-C interfaces, enabling transmissions to reach up to 2,000 MB/s, and offers ample storage for various coding formats. With the CinemaPr P31 External SSD, creators can capture every brilliant moment in motion.Team Group is committed to meeting industry and consumer needs by adapting innovative technologies to environmental changes and market demands, aiming to deliver reliable and diverse solutions, and showcasing excellent designs on the international stage.

View at TechPowerUp Main Site

 

[Heiro78]

Insanity is a 120 AIO for an SSD. I thought it was wild but cool to have a radiator on an SSD to keep them even cooler. These will be needed on Gen 6 SSDs!

 

[Double-Click]

So they polished up last year's abomination, and then added another one...
This is beyond ridiculous with Gen 5, no one should need a friggin' AIO or tower style heatsink to keep a drive cool.

 

[Keullo-e]

I understand a beefy heatsink for a fast & hot M.2 SSD, but an AIO..?

 

[ypsylon]

These ideas clearly illustrate why M.2 should die off already, especially 2280. Gen.4 was pushing the limits, but Gen.5 is ludicrous and Gen.6 I hope will never arrive. Simply put tiny PCB is beyond thermally constrained. Every single motherboard has plenty of real estate to slap some MCIO (4i/8i) connectors which should be de-facto standard moving forward. Can transfer SATA/SAS/NVMe with right cabling. It takes like 3 cm^2 of space unlike M.2. 2.5" NVMe drives have thermal envelope of 25W or more on those monster 61.44TB drives (M.2 is struggling already at 12W and Gen5 pushes this to peak 17...). Let M.2 bloody die (or stop at Gen4) in desktops and replace it with something useful (plenty of good choices!) and move on. M.2 should only remain in laptops as it was designed in the first place.

 

[Heiro78]

These ideas clearly illustrate why M.2 should die off already, especially 2280. Gen.4 was pushing the limits, but Gen.5 is ludicrous and Gen.6 I hope will never arrive. Simply put tiny PCB is beyond thermally constrained. Every single motherboard has plenty of real estate to slap some MCIO (4i/8i) connectors which should be de-facto standard moving forward. Can transfer SATA/SAS/NVMe with right cabling. It takes like 3 cm^2 of space unlike M.2. 2.5" NVMe drives have thermal envelope of 25W or more on those monster 61.44TB drives (M.2 is struggling already at 12W and Gen5 pushes this to peak 17...). Let M.2 bloody die (or stop at Gen4) in desktops and replace it with something useful (plenty of good choices!) and move on. M.2 should only remain in laptops as it was designed in the first place.

I've heard that there was another spec called U.2 that seems better than M.2 and SATA SSDs. But maybe it didn't take off because of how cool and space friendly M.2 SSDs are. Meaning how they practically snap onto a MOBO and don't require other space in the case.