SK Hynix Inc. announced today that it has developed HBM2E DRAM product with the industry's highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity compared to the previous HBM2. SK Hynix's HBM2E supports over 460 GB (Gigabyte) per second bandwidth based on the 3.6 Gbps (gigabits-per-second) speed performance per pin with 1,024 data I/Os (Inputs/Outputs). Through utilization of the TSV (Through Silicon Via) technology, a maximum of eight 16-gigabit chips are vertically stacked, forming a single, dense package of 16 GB data capacity.

SK Hynix's HBM2E is an optimal memory solution for the fourth Industrial Era, supporting high-end GPU, supercomputers, machine learning, and artificial intelligence systems that require the maximum level of memory performance. Unlike commodity DRAM products which take on module package forms and mounted on system boards, HBM chip is interconnected closely to processors such as GPUs and logic chips, distanced only a few µm units apart, which allows even faster data transfer.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is releasing a highly optimized, extremely low latency Trident Z Neo series DDR4-3800MHz CL14 RGB memory kit in 16 GB (8 GB x2) and 32 GB (8 GB x4) capacities for the AMD Ryzen 3000 series CPU and X570 chipset platform. Built with the powerful Samsung B-die component, this is the perfect DDR4 memory kit for those looking to push the limits of memory bandwidth on your new AMD Ryzen 3000 platform.

At this point, it's well-known that memory performance with the new AMD Ryzen 3000 processor series is best when Infinity Fabric being tied to the memory clock at a 1:1 ratio. The G.SKILL R&D team is dedicated to push the performance boundaries even further and developed a high-frequency, low-latency memory kit at DDR4-3800 CL14-16-16-36 in capacity configurations of 8GBx2 and 8GBx4, reaching a superb memory bandwidth performance under the optimal 1:1 ratio.

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, today announced its new High Bandwidth Memory (HBM2E) product at NVIDIA's GPU Technology Conference (GTC) to deliver the highest DRAM performance levels for use in next-generation supercomputers, graphics systems, and artificial intelligence (AI).

The new solution, Flashbolt , is the industry's first HBM2E to deliver a 3.2 gigabits-per-second (Gbps) data transfer speed per pin, which is 33 percent faster than the previous-generation HBM2. Flashbolt has a density of 16Gb per die, double the capacity of the previous generation. With these improvements, a single Samsung HBM2E package will offer a 410 gigabytes-per-second (GBps) data bandwidth and 16 GB of memory.

Sapphire has reportedly developed an odd-ball Radeon RX 570 graphics card, equipped with 16 GB of GDDR5 memory, double the memory amount the SKU is possibly capable of. The card is based on the company's NITRO+ board design common to RX 570 thru RX 590 SKUs, and uses sixteen 8 Gbit GDDR5 memory chips that are piggybacked (i.e. chips on both sides of the PCB). When Chinese tech publication MyDrivers reached out to Sapphire for an explanation behind such a bizarre contraption, the Hong Kong-based AIB partner's response was fascinating.

Sapphire in its response said that they wanted to bolster the card's crypto-currency mining power, and giving the "Polaris 20" GPU additional memory would improve its performance compared to ASIC miners using the Cuckoo Cycle algorithm. This can load up the video memory anywhere between 5.5 GB to 11 GB, and giving the RX 570 16 GB of it was Sapphire's logical next step. Of course Cuckoo Cycle is being defeated time and again by currency curators. This card will be a stopgap for miners until ASIC mining machines with expanded memory come out, or the proof-of-work systems are significantly changed.

GIGABYTE expanded its teething DDR4 memory lineup with a new 16 GB (2x 8 GB) dual-channel DDR4 memory kit, called simply "GIGABYTE Memory 2666MHz." These modules lack the Aorus branding featured on the company's very first DDR4 modules. You instead get 32 mm tall, 7 mm-thick modules with a restrained design, and plain GIGABYTE branding.

One area where the company refined its design is the heatspreaders, which are thicker, and have more mass to them, even if they lack finnage. GIGABYTE's module does what it says on the tin - DDR4-2666 with 16-16-16-35 timings, at 1.2 Volts. Out of the box, it packs both JEDEC and XMP SPD profiles. Memory controllers that support DDR4-2666 (such as Intel "Coffee Lake" and later), should run it at the advertised speeds without any user intervention. For older platforms, an XMP 2.0 profile helps achieve the advertised settings. The modules are backed by lifetime warranty.

AMD is giving final touches to the new Radeon Pro WX 8200 professional graphics card. Launched over a year following the Radeon Pro WX 9100, the WX 8200 has a leaner feature-set, while continuing to be based on AMD's current IP. The card still uses the 14 nm "Vega 10" MCM, but with a core-config akin to that of the RX Vega 56. You get 56 NGCUs working out to 3,584 stream processors, 224 TMUs, 64 ROPs, and a 4096-bit wide HBM2 memory interface, handling 16 GB of memory on this card. The air-cooled card also has a leaner connectivity load-out, with just four mini-DisplayPort 1.4 connectors (the WX 9100 comes with six). Its 8-pin + 6-pin connectors are positioned at the rear-end to be SSI workstation-friendly. The card surfaced on CompuBench database, in which its performance numbers are only slightly behind those of the WX 9100, but significantly better than the "Polaris 20" based WX 7100. AMD is expected to launch this card at SIGGRAPH 2018.

Sk Hynix has added to its product catalog single-die 16 Gb DDR4 memory chips, which should enable a two-fold increase in maximum memory capacity per single DIMM. This allows SK Hynix to sell same-capacity chips with fewer memory semiconductor dies, due to the increase in storage density, and to increase maximum memory capacity at the same memory die populations as before. The benefits are lower power consumption (due to the reduced number of memory dies to power), and the possibility of putting together either dual-ranked 64 GB modules, quad-ranked 128 GB LRDIMMs and octal-ranked 256 GB LRDIMMs. That last part is the most important: theoretically, the maximum amount of memory on top Intel or AMD server platforms could double, which could enable up to 4 TB RAM in EPYC systems, for example. And as memory-hungry as big data applications have become, there's ever need for higher memory capacity.

SK Hynix's 16 Gb DDR4 chips are organized as 1Gx16 and 2Gx8 and supplied in FBGA96 and FBGA78 packages, respectively. Current 16 Gb density speeds stand at DDR4-2133 CL15 or DDR4-2400 CL17 modes at 1.2 V. SK Hynix plans increase the available frequencies in the third quarter of this year, adding DDR4-2666 CL19 to the lineup.

The next step in Intel's Optane product launch could be right around the corner, as retailers have started listing the company's upcoming Optane MEM M10 cache drives up for pre-order. If you'll remember, these products were first leaked in some Intel product roadmap slides, where they appeared identified as "System Acce. Gen 1.0". Whether or not today's workloads and faster SSD-based storage require the introduction of a faster caching solution is up for debate; however, Intel seems to think there is room in the market for these caching solutions, even if the vast majority of users would be much better served by acquiring a higher capacity SSD as their primary drive (especially if they're coming from the HDD world).

These new Optane MEM M10 cache drives will come in capacities ranging from 16 GB to 64 GB. The M10 modules will take the M.2 2280 form-factor and deliver data through the PCIe 3.0 interface. Prices are being quoted at $47.58 for the 16 GB model, $82.03 for the 32 GB model, and $154.37 for the largest, 64 GB model. These should ensure lower latency and higher throughput than traditional SSDs do, due to their caching of users' more heavily requested data; however, due to the very nature of these caching solutions, and the memory footprint available for them, it's likely most users will hit severe performance bottlenecks, at the very least, on the 16 GB model.

TweakTown has put forth an article wherein they claim to have received info from industry insiders regarding the upcoming Vega 56's performance. Remember that Vega 56 is the slightly cut-down version of the flagship Vega 64, counting with 56 next-generation compute units (NGCUs) instead of Vega 64's, well, 64. This means that while the Vega 64 has the full complement of 4,096 Stream processors, 256 TMUs, 64 ROPs, and a 2048-bit wide 8 GB HBM2 memory pool offering 484 GB/s of bandwidth, Vega 56 makes do with 3,548 Stream processors,192 TMUs, 64 ROPs, the same 8 GB of HBM2 memory and a slightly lower memory bandwidth at 410 GB/s.

The Vega 56 has been announced to retail for about $399, or $499 with one of AMD's new (famous or infamous, depends on your mileage) Radeon Packs. The RX Vega 56 card was running on a system configured with an Intel Core i7-7700K @ 4.2GHz, 16 GB of DDR4-3000 MHz RAM, and Windows 10 at 2560 x 1440 resolution.

The liquid cooled version of AMD's latest graphics card meant for the "pioneering crowd" of prosumers has been made available over at SabrePC. It sports the exact same GPU you'd find on the air-cooled version, featuring all the same 4096 Stream Processors and 16 GB of HBM2 memory. The only differences are, and you guessed it, the higher cooling capacity afforded by the AIO solution, and the therefore increased TDP from the 300 W of the air-cooled version to a eyebrow-raising 375 W. That increase in TDP must come partially from the employed cooling solution, but also from an (for now, anecdotal) ability for the card to more easily sustain higher clocks, closer to its AMD-rated 1,630 MHz peak core clock.

You can nab one right now in that rather striking gold and blue color scheme, and have it shipped to you in 24H. Hit the source link for the SabrePC page.

It's here. The Radeon Vega that's not for gamers, that is. After what seems like a year of waiting forward to AMD's next generation GPU architecture, so it has finally appeared. As we all knew was going to be the case, Vega's first foray in the market is geared at the more profitable professional sector of the market. The good news for professionals: the pricing is lower than previously reported. Instead of the expected $1,199 and $1,799 for an air cooled or water-cooled version of the card respectively, AMD is commanding a much less demanding price tag of $999 for the air cooled version (available now) and $1,499 for the water-cooled one (to be available in Q3.)

One thing that deserves to be placed before the break is a software feature of the new Vega Frontier Edition graphics cards: AMD has changed their driver scheme into a single-package installer (available in the source), with both the professional-geared drivers, and the gaming ones as well. This means that after all that Raja Koduri told us to wait for AMD's consumer, gaming-oriented RX Vega graphics cards, these will probably work just as well for gaming as for professional workloads.