Club 3D takes a giant leap and destroys the competition with the release of the most quiet, cool and brutally fast Club 3D Radeon HD 7970 royalAce graphic card, the latest addition to the PokerSeries family.

Get the best of the best with Club 3D's PokerSeries, the Radeon HD 7970 royalAce offers great performance by breaking the GHz barrier on the GPU, clocking at 1050MHz, making it amazingly fast, up to 7% faster in games when compared to the reference HD 7970 GHz Edition. The Radeon HD 7970 royalAce is a quiet card, achieving 31.5 dB on idle, 38 dB at load, making it the ideal choice for gaming and multimedia. By utilizing a custom cooler design with a dual fan and four high performance heatpipes it ensures the card to remain cool at 71 °C on average when gaming. A Dual BIOS toggle switch offers overclocking potential for the most demanding gamer and overclocking enthusiast.

GLOBALFOUNDRIES today announced it is moving forward with the final construction for the extension of Module 1 at the Fab 8 campus in New York. The project will add 90,000 square feet of manufacturing capacity, bringing the total capacity for Fab 8 Module 1 to 300,000 square feet. Construction activities are scheduled to begin in August and work is expected to be completed in December 2013.

"During the construction of Fab 8, we extended the shell of the Module 1 building with the expectation that our business would continue to grow. Today we see increasingly strong demand from our customers, especially at the 28nm node, and we are excited to be moving forward with this next phase in the development of the Fab 8 campus," said Eric Choh, vice president and general manager, Fab 8, GLOBALFOUNDRIES. "By continuing to expand our investment in the project, GLOBALFOUNDRIES is delivering more options to our global customers, while helping to redefine upstate New York as a premier hub of the global semiconductor industry, creating thousands of new advanced manufacturing jobs, and contributing billions of dollars to the regional economy."

AMD (NYSE:AMD) today announced revenue for the second quarter of 2012 of $1.41 billion, net income of $37 million, or $0.05 per share, and operating income of $77 million. The company reported non-GAAP net income of $46 million, or $0.06 per share, and non-GAAP operating income of $86 million.

"Overall weakness in the global economy, softer consumer spending and lower channel demand for our desktop processors in China and Europe made the closing weeks of the quarter challenging," said Rory Read, AMD president and CEO. "We are taking definitive steps to improve our performance and correct the issues within our control as we expect headwinds will continue in the third quarter as the industry sets a new baseline. We remain optimistic about our core businesses as well as future opportunities with our competitively differentiated next-generation Accelerated Processor Units (APUs). Our recently launched Trinity APU continues to gain traction with customers. We are committed to driving profitable growth."

Eurocom Corporation (www.eurocom.com), a developer of long lifespan, high performance, fully upgradable Notebooks and Mobile Workstations has been testing and benchmarking and is now launching the NVIDIA Quadro K5000M GPU with 1344 CUDA cores and 4GB GDDR5 graphics memory in its Panther 3.0 Mobile Workstation.

NVIDIA Quadro K5000M graphics are manufactured on the newest 28nm kepler based GPU architecture from NVIDIA. Featuring a long list of technologies such as PhysX, CUDA, DirectX 11 and OpenCL, the NVIDIA Quadro K5000M will offer next generation graphics performance for the EUROCOM Panther 3.0 Mobile Workstation.

A leading brand of graphics card maker - VTX3D, today adds three new models, HD7870/7850/7770 into X-Edition series, which make this series more completed for OC enthusiast to choose. Being self-designed of VTX3D, these three models are designed to provide gamers the most extreme performance at its same class, also bring unbeatable HD gaming experience with DirectX 11 support.

Equipped with 2GB of GDDR5 memory, the HD7870 X-Edition clocks at 1100MHz for core and 1225MHz of memory speed. There are two types of memory size, 1GB and 2GB of GDDR5 for HD7850 X-Edition, and both with 860MHz/1200MHz for core and memory respectively. HD7770 X-Edition is fitted with 1GB of DDR5 memory clocked at 1150MHz of core and 1250MHz of memory speed.

AMD today announced immediate availability of the AMD FirePro W600 professional graphics card, the company's first professional graphics card to leverage AMD's Graphics Core Next architecture and 28nm production technology, for use in high-resolution, content-rich, multi-screen display wall environments. With this launch, AMD is addressing a growing need for large, dynamic screens that are easily updated with new content.

"Whether we are checking flight times at the airport or watching the latest ads on massive screens in city squares, digital signage has quickly become an important and ubiquitous part of our lives," said Matt Skynner, corporate vice president and general manager of AMD Graphics. "To enable these displays, the digital signage industry demands technology that can be regularly refreshed with new, feature-rich content. With the launch of the AMD FirePro W600 professional graphics card, AMD is helping advance the digital display wall industry by providing suppliers and developers with impressive display density, performance and exceptional value."

PNY Technologies, Inc. ("PNY") today announced the release of the Verto GeForce GT 640 1024MB DDR3 graphics card. This new entry-level NVIDIA 28nm Kepler card features dedicated graphics performance from this powerful next-generation GeForce architecture.

The GT 640 delivers premium multimedia performance and reliable entry-level gaming, for a faster, more immersive experience. Harnessing PhysX technology, bring your HD videos, photos, web, and games to life; edit your photos and videos; or play the latest DirectX 11 games with GPU-accelerated tessellation. Accelerate your desktop's performance with cutting-edge features, such as CUDA technology to handle the most demanding system tasks -- such as photo editing -- and delivering incredible performance improvements over traditional CPUs. Adding to the incredible performance and power efficiency of the GT 640 is the new -- built from the ground up -- SMX unit, available only on Kepler. The revolutionary Kepler GPU has taken graphics to the next level and allows the GT 640 to simultaneously run up to three monitors with NVIDIA Surround technology -- expanding your viewing perspective and increasing productivity.

At next week's Design Automation Conference (DAC) in San Francisco, Calif., GLOBALFOUNDRIES plans to demonstrate an enhanced silicon-validated design flow for its 28nm Super Low Power (SLP) technology with Gate First High-k Metal Gate (HKMG). The flow provides proven and complete front-to-back support for advanced analog/mixed-signal (AMS) design using the industry's latest design automation technology. In addition, the company will reveal jointly developed design flows with its EDA partners in certifying both analog and digital "double patterning aware" flows for its 20nm process, with silicon validation expected in early 2013 at that technology node.

As a result of GLOBALFOUNDRIES' commitment to silicon validation of flows before releasing them, customers have the confidence to produce signoff-ready 28nm digital and analog designs using the industry's most advanced set of design tools, tool scripts, and methodologies from the leading EDA suppliers. The company's tight collaboration with the design tool and IP ecosystem also accelerates its ability to develop working flows for advanced nodes such as 20nm, providing their advantages in gate density, performance, and lower power to customers ahead of other foundries.

Mentor Graphics Corp. today announced that GLOBALFOUNDRIES is helping its customers improve reliability checking by adding Calibre PERC to select 28nm bulk CMOS design enablement flows. Calibre PERC will give designers access to the new reliability verification rules developed by the IBM Semiconductor Development Alliance (ISDA), augmented with GLOBALFOUNDRIES specific checks to help prevent external latch-up. Using Calibre PERC's unique architecture, complex reliability rules that require the integration of logical (net list) and layout (GDS) information can be fully automated, eliminating manual spreadsheet-based efforts and reducing the chances of design errors.

"In the past, verification of latch-up immunity depended on manual layout checks and rough approximations of device and interconnect resistance using traditional mechanisms," said Bill Liu, vice president of design enablement at GLOBALFOUNDRIES. "Now our customers can perform accurate measurements and analysis automatically using Calibre PERC's data integration capability. For example, some of our customers are currently using PERC to accurately determine the resistance of the paths in complex output driver arrays as a function of device spacing. This allows them to easily and accurately detect points in the circuit where latch-up could be an issue and to make appropriate improvements."

Eurocom Corporation, a developer of long lifespan, fully upgradable Notebooks and Mobile Workstations has been testing the AMD Radeon HD 7970M in its new line of 3rd Generation Intel Core i7 (Ivy Bridge) powered notebooks. Eurocom technicians achieved a score of P22111 in 3DMark Vantage in the EUROCOM Racer and a score of P5848 in 3DMark 11.

The AMD Radeon HD 7970M is currently the highest performing mobile GPU by AMD, giving Eurocom customers a superior choice of video processor options to configure into their new Eurocom system or upgrade into their existing system. The addition of the AMD Radeon 7970M GPU offers customers a greater selection of video processor options to fit any preference or performance level

Today leading international mainboard and graphics card maker MSI officially announces the new GeForce GTX 670 graphics card featuring the latest 28nm GeForce GTX 670 GPU and 2GB GDDR5 memory; supports PCI Express 3.0 standard to provide better performance and power efficiency than previous generation. The GeForce GTX 670 graphics card features NVIDIA's GPU Boost technology which allows the core clock to be automatically adjusted on the fly for optimal in-game performance.

When used with the MSI Afterburner overclocking utility, the power limit and clock offset can be adjusted as well for better overclocking capability; GPU overvoltage function to boost overclocking potential up to 22%! A single card is able to also support NVIDIA 3DVision Surround technology for up to four monitors to give gamers the best in-game experience.

Leading international graphics card and mainboard maker MSI today announced MSI R7870 Hawk, equipped with AMD's 28nm Radeon HD 7870 GPU. MSI introduce the flagship design concept of Lightning series into R7870 Hawk, adopting UnlockedDigitalPower that incorporates an Unlocked BIOS, DigitalPWM Controller, and Enhanced Power Design to boost overclocking potential and make overclocking easier than ever. With the industry first "GPU Reactor" power panel, it reduces power supply noise as well as increases overclocking stability. As for thermal solution, MSI R7870 Hawk utilizes the latest Twin Frozr IV Thermal Design with Dust Removal Technology.

The dual 8cm fan setup with PropellerBlade Technology generate massive airflow for fast heat dissipation while remaining whisper silent. The two form-in-one heatsinks improve cooling for memory and the power module as well ensure structural integrity. The R7870 Hawk uses Military Class III components which have passed rigorous testing to meet MILSTD810G standards, guaranteeing the card's stability and reliability under actual use conditions. Moreover, the "3X3 OC Kits" are designed to simplify overclocking, which makes it easier for users to fine-tune their graphics cards. Competing with flagship design of Lightning series, R7870 Hawk absolutely stands out on top among the industry's HD 7870 based graphics cards.

Despite the fact that NVIDIA is frantically seeking out other semiconductor foundries for high-volume manufacturing its 28 nm chip designs, and despite some looming irritants, NVIDIA appears to value its relationship with TSMC highly. NVIDIA's senior vice president for Advanced Technology Group Joe Greco, in a recent company blog post, credited close collaboration with TSMC for the stellar energy-efficiency (performance/Watt) figures NVIDIA's Kepler architecture has been able to achieve.

"The advancement that TSMC offered was a new optimized process technology. Kepler is manufactured using TSMC's 28nm high performance (HP) process, the foundry's most advanced 28nm process which uses their first-generation high-K metal gate (HKMG) technology and second generation SiGe (Silicon Germanium) straining," read the blog post. "Using TSMC's 28nm HP process enabled us to reduce active power by about 15 percent and leakage by about 50 percent compared to 40nm, resulting in an overall improvement in power efficiency of about 35 percent (see charts)."

GLOBALFOUNDRIES today announced a significant milestone on the road to enabling 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, NY, the company has begun installation of a special set of production tools to create Through-Silicon Vias (TSVs) in semiconductor wafers processed on the company's leading-edge 20nm technology platform. The TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding requirements of tomorrow's electronic devices.

Essentially vertical holes etched in silicon and filled with copper, TSVs enable communication between vertically stacked integrated circuits. For example, the technology could allow circuit designers to place stacks of memory chips on top of an application processor, which can dramatically increase memory bandwidth and reduce power consumption-a key challenge for designers of the next generation of mobile devices such as smartphones and tablets.

With launches of new-generation GPUs by NVIDIA and AMD, and new ARM application processor designs by various industry players, TSMC is under pressure to ramp up its production capacity for its new 28 nanometer note. DigiTimes research suggests that this ramp-up is going at a faster rate than older processes such as 40 nm and 65 nm nodes (when those were new). Digitimes Research analyst Nobunaga Chai claims that the 28 nm node started generating revenues in Q4, 2011, and sales ratio reached 5% in the following quarter. It is anticipated to see TSMC significantly ramp up its 28nm production capacity later in 2012, Chai believes.

With the advent of highly-complex 28 nm discrete PC graphics processors, and ARM designers lined up with their increasingly powerful SoCs, TSMC is bound to see a pile up of orders for chips built on its newest bulk manufacturing process. In view of this, the "messiah of the fabless" is planning an expansion of its 28 nm manufacturing facility. This expansion is set to occur a little later in 2012. TSMC reportedly is running at full capacity at its 12-inch fabs because of strong demand for 28 nm as well as 40 nm and 65 nm. Due to this, some designers are approaching TSMC's competitors UMC and Samsung for 28 nm bulk manufacturing, according to sources. The expansion will follow a revision of TSMC's capex target for 2012, up from US $6 billion.

AMD today reached a major milestone in the graphics industry with worldwide availability of its full line of next generation AMD Radeon HD 7000 Series GPUs in less than three months. Starting in December, AMD launched the AMD Radeon HD 7900 Series, followed in February by the AMD Radeon HD 7700 Series and completed today with availability of the AMD Radeon HD 7800 Series graphics cards.

"Bringing the first 28nm graphics cards to market in December spurred us to continue pushing the boundaries, product after product, culminating with today's product availability," said Zvika Greenstein, director of product management, GPU Division, AMD. "Look at our feature set: Graphics Core Next, AMD Eyefinity 2.0, AMD PowerTune, AMD ZeroCore Power technologies and of course our GHz Edition graphics cards - it is without doubt that AMD stands alone in the graphics industry."

NVIDIA seems to be playing the blame game according to a article over at Xbit. This is what they had to say, "Chief executive officer of NVIDIA Corp. said that besides continuously increasing capital expenditures that the company ran into in the recent months will be accompanied by lower than expected gross margins in the forthcoming quarter. The company blames low yields of the next-generation code-named Kepler graphics chips that are made at TSMC's 28nm node. "Decline [of gross margin] in Q1 is expected to be due to the hard disk drive shortage continuing, as well as a shortage of 28nm wafers. We are ramping our Kepler generation very hard, and we could use more wafers. The gross margin decline is contributed almost entirely to the yields of 28nm being lower than expected. That is, I guess, unsurprising at this point," said Jen-Hsun Huang, chief executive officer of NVIDIA, during a conference call with financial analysts.

NVIDIA's operating expenses have been increasing for about a year now: from $329.6 million in Q1 FY2012 to $367.7 million in Q4 FY2012 and expects OpEx to be around $383 million in the ongoing Q1 FY2013. At the same time, the company expects its gross margins in Q1 FY2013 to decline below 50% for the first time in many quarters to 49.2%. Nvidia has very high expectations for its Kepler generation of graphics processing units (GPUs). The company claims that it had signed contracts to supply mobile versions of GeForce "Kepler" chips with every single PC OEM in the world. In fact, NVIDIA says Kepler is the best graphics processor ever designed by the company. [With Kepler, we] won design wins at virtually every single PC OEM in the world. So, this is probably the best GPU we have ever built and the performance and power efficiency is surely the best that we have ever created," said Mr. Huang.

AMD (NYSE:AMD) today announced revenue for the fourth quarter of 2011 of $1.69 billion, net loss of $177 million, or $0.24 per share, and operating income of $71 million. The company reported non-GAAP net income of $138 million, or $0.19 per share, and non-GAAP operating income of $172 million. Fourth quarter non-GAAP net income excludes an impairment of AMD's investment in GLOBALFOUNDRIES of $209 million, restructuring charges of $98 million, the loss from discontinued operations of $4 million, the amortization of acquired intangible assets of $3 million and a loss on debt repurchase of $1 million.

For the year ended December 31, 2011, AMD reported revenue of $6.57 billion, net income of $491 million, or $0.66 per share, and operating income of $368 million. Full year non-GAAP net income was $374 million, or $0.50 per share, and non-GAAP operating income was $524 million.

Making silicon chips is not easy, requiring hugely expensive fabs, with massive clean-room environments and at every process shrink, the complexity and difficulty of making the things goes up significantly. It looks like TSMC and GlobalFoundries are both having serious yield problems with their 28 nm process nodes, according to Mike Bryant, technology analyst at Future Horizons and this is causing a rash of non-working wafers - to the point of having nothing working with some chip designs submitted for production. It seems that the root cause of these problems are to do with the pressures of bringing products to market, rather than an inherent problem with the technology; it just takes time that they haven't got to iron out the kinks and they're getting stuck: "Foundries have come under pressure to release cell libraries too early - which end up with designs that don't work," Bryant said. In an effort to try and be seen to treat every customer equally, TSMC is attempting to launch ten 28 nm designs from seven companies, but it's not working out too well: "At 45-nm, only NVIDIA was affected. At 28-nm any problems for TSMC will be problems for many customers" said Bryant.

Taiwan foundries are going to be cutting prices by 10 to 15% for wafers built on mature node processes. Since these wafers have lower production costs the foundries are passing on the savings. This move is to boost consumer confidence in building their inventory after a year of shaky ground in the U.S. and European markets. This according to DigiTimes.

Also DigiTimes is reporting despite slow demand for mature process manufacturing, Taiwan Semiconductor Manufacturing Company (TSMC) continues to see orders heat up for advanced 28nm technology, according to sources at non Taiwan-based chip suppliers.

This news could mean that these same vendors that are getting a cut in overhead thanks to the foundries could pass on the savings to the end customer to boost revenue.

AMD Introduces the Radeon HD 7970 Graphics Card, The 28 nm Era Begins

Bring ye a fresh set of bragging rights because today AMD has (paper) launched the first graphics card powered by a 28 nm GPU, the Radeon HD 7970. Equipped with one Tahiti chip, this new, high-end offering is the first to make use of the GCN (Graphics Core Next) architecture which is claimed to deliver an improvement 'of over 150% in performance/sq mm over the prior generation.'

The Radeon HD 7970 also adopts the PCI Express 3.0 standard (which ensures a large, healthy bandwidth), and implements the PowerTune and AMD ZeroCore Power technologies that allow for 'higher performance levels while maximizing power efficiencies'.

AMD CEO Rory Read, speaking at the IT Supply Chain conference organized by Raymond James this Tuesday, said that his company had begun shipping 28 nm GPUs for revenue (meaning, in volumes big enough to fetch revenue). With it, AMD fulfilled its promise to be the first to the market with GPUs built on the 28 nm silicon fab process. AMD's foundry partner for these chips is TSMC. "We are ramping 28nm [products] with TSMC in Taiwan and shipping the products here and now. We are very excited about the products," said Read.

At the upcoming CES event, AMD will formally unveil a range of products that will use its 28 nm GPUs. CES will give AMD a good opportunity to bag design wins with large volume manufacturers of notebooks and PCs. What this means for the enthusiast community is that whenever AMD does launch its Radeon HD 7900 series, it won't be a "paper-launch".

GLOBALFOUNDRIES and ARM today revealed the latest advances in their longstanding collaboration to deliver optimized system-on-chip (SoC) solutions for ARM Cortex-A series processor designs using ARM Artisan advanced physical IP and GLOBALFOUNDRIES' leading-edge process technologies. The companies announced the industry's first test chip based on a dual-core Cortex-A9 processor operating at frequencies of more than 2.5GHz. In addition, a 20nm tape out using GLOBALFOUNDRIES' Technology Qualification Vehicle (TQV) was also announced for SoCs based on Cortex-A9 processors.

The two companies worked closely together to develop a TQV strategy that allows GLOBALFOUNDRIES to optimize its advanced process technology for customer designs based on Cortex-A series processors. The solution is more than a standard test chip. Each TQV is designed to emulate a full specification SoC and aims to improve performance, lower power consumption and facilitate a faster path to market for foundry customers.

Today may be a Fringe-less Friday but worry not, there are plenty of thing to do like contemplating the two recently-leaked images of an AMD Tahiti-powered graphics card. Tahiti is a 'next-gen' GPU built on TSMC's 28 nm process that's supposed to be at the heart of the Radeon HD 7900 series models (the HD 7950, HD 7970, and then probably the dual-GPU HD 7990).

The card seen below comes with one Tahiti chip protected by a heatspreader/shield (only the die is exposed) and has a red PCB, a 5+1-phase PWM, two BIOSes, two PCIe power plugs, CrossFire connectors enabling quad-GPU configurations, and 12 memory chips which support previous reports of a 384-bit memory interface.

The Radeon HD 7900 series cards are rumored to debut in January at CES 2012 (January 10-13) so we still have one month of leaks to look forward to. Oh, and the winter holidays.