Sunnyvale-based AMD Inc. has today launched two new FX Series processors, the FX-6200 hexa-core and the FX-4170 quad-core, and announced price reductions for the October-released FX-8120 and FX-6100.

The FX-6200 and FX-4170 are made on 32 nm process technology, and feature an AM3+ package, a TDP of 125 W, and 8 MB of L3 cache. The FX-6200 has a base clock of 3.8 GHz (4.1 GHz Turbo) and is up for pre-order @ 152.70 Euro while its quad-core sibling is set to 4.2 GHz (4.3 GHz Turbo) and is selling for 120.60 Euro.

The updated FX-8120 and FX-6100 prices stand at $185 and $145, respectively.

Before the end of this quarter AMD is set to introduce a bunch of fresh FX Series chips, including three boasting a 95 W TDP, the FX-4150 quad-core, the FX-6120 hexa-core and the FX-8140 octo-core.

The FX-4150 features a base clock of 3.9 GHz (4.1 GHz Turbo) and 12 MB of cache (4 MB L2 + 8 MB L3) while the FX-6120 has its cores set to 3.5 GHz (4.1 GHz Turbo) and packs 14 MB of cache. As for the FX-8140, it's clocked at 3.2 GHz (4.1 GHz) and has 16 MB of cache. All three models have an AM3+ package and are made using 32 nm process technology. No word on pricing yet.

Since it needs to make way for 22 nm processors (codename Ivy Bridge) Intel has decided on discontinuing two more 32 nm chips, the 3.2 GHz Core i3-550 and the 3.33 GHz i3-560.

Released back in 2010, these 'old timers' will be available for new orders until June 29 and will continue shipping till December 7th (for the tray SKUs) or until supplies are depleted (boxed SKUs).

While Intel and AMD are making efforts to come up with low-power x86 processor platforms to compete with the plethora of ARM processor vendors, manufacturers of the target devices of these low-power x86 processors - tablets, netbooks, and smartphones; note that the architecture simply isn't competitive due to its prices. ARM processors are manufactured by a variety of companies, in a variety of different SoC configurations, and as such the tough competition among these companies ensure ARM processor platforms are comparatively cheaper to low-power x86 ones.

Intel recently debuted its 32 nm "Medfield" Atom processors, with power consumption as low as 11W for the platform. In the second half of 2012, it will launch another line of processors with under 10W power consumption, for high-end smartphones. AMD, on the other hand, will unveil "Hondo", which combines its x86 architecture with Radeon graphics IP, and a power consumption target of less than 5W. In 2013, it plans to launch the "Temash" APU, with power consumption under 2W, and built on the 28 nm process.

AMD may be busy building up hype for its Trinity-generation APUs (accelerated processing units) but it's still churning out new chips, the latest releases being the rather low-profile Athlon II X4 641 and X4 638. Both of these models are made on 32 nm technology, have an FM1 packaging, and boast four 'Stars' x86 cores just like those found in Llano APUs (but unlike Llano, these Athlons don't have integrated graphics).

The Athlon II X4 641 comes with a core clock of 2.8 GHz, 4 MB of L2 cache, and a 100 W TDP, while the Athlon II X4 638 features a 2.7 GHz clock, 4 MB of L2 cache, and a TDP of 65 W. Both CPUs are priced at $81 (pricing is for 1000-unit tray quantities).

Today at its annual Financial Analyst Day, AMD has presented an updated roadmap detailing the hardware it plans to bring to the table during 2012 and 2013. For this year, the Sunnyvale-based company is preparing a processor quarter which includes the Trinity, Brazos 2.0 and Hondo APUs (accelerated processing units) and the Vishera CPU.

Set to be the main weapon in AMD's x86 arsenal, the Trinity APU (aka the 2nd gen A Series) is made on 32 nm process technology, and features DirectX 11 graphics, two/four Piledriver cores (Piledrive is said to deliver 25% better performance than the Stars cores found in Llano APUs), and a TDP that can go as low as 17 W on mobile parts. Trinity is expected to debut in Q2 and already has close to 100 design wins (more than Llano had before its release).

The Wind U180, meticulously crafted by MSI for 2012, marks a new zenith in computer technology, offering both performance and an esthetically pleasing looks. It comes in minimalist black, angel white or lavender, is less than one-inch thin, tips the scales at just 1 kg, and is sheathed in MSI's own attractive IMR color film print to prevent scratches and smudges. Let this highly mobile piece of computer technology add color to your life.

Eric Kuo, associate vice president for global sales, MSI Notebook, points out that the MSI Wind U180, a new generation netbook characterized by painstaking attention to craftsmanship and innovation, not only packs significantly more power, it is the ideal solution to meet today's mobile multimedia needs. Its display is some three times more powerful than that of the previous generation, enabling the high resolution LED screen to show much more detail and color. What's more, the HDMI slot allows you to connect the U180 netbook to a large HDTV to maximize multimedia entertainment.

US chip giant Intel has now added seven new processors to its portfolio, the Core i5-2550K, i5-2450P and i5-2380P targeting desktops, and the Celeron B815, B720, 867 and 797 for mobile PCs.

The Core i5-2550K costs $225 ($9 more than the i5-2500K) and features four cores @ 3.4 GHz (the 2500K has a base clock of 3.3 GHz), four threads, 6 MB of L3 cache and a TDP of 95W. The i5-2450P ($195) and i5-2380P ($177) have similar specs, expect their base clock is 3.2 GHz and 3.1 GHz, respectively.

Making silicon chips is not easy, requiring hugely expensive fabs, with massive clean-room environments and at every process shrink, the complexity and difficulty of making the things goes up significantly. It looks like TSMC and GlobalFoundries are both having serious yield problems with their 28 nm process nodes, according to Mike Bryant, technology analyst at Future Horizons and this is causing a rash of non-working wafers - to the point of having nothing working with some chip designs submitted for production. It seems that the root cause of these problems are to do with the pressures of bringing products to market, rather than an inherent problem with the technology; it just takes time that they haven't got to iron out the kinks and they're getting stuck: "Foundries have come under pressure to release cell libraries too early - which end up with designs that don't work," Bryant said. In an effort to try and be seen to treat every customer equally, TSMC is attempting to launch ten 28 nm designs from seven companies, but it's not working out too well: "At 45-nm, only NVIDIA was affected. At 28-nm any problems for TSMC will be problems for many customers" said Bryant.

After many years of planning, work and investment, Intel is now finally looking ready to step up and challenge ARM in the smartphone space. Yesterday at CES 2012 Intel announced that not one but two major companies - Lenovo and Motorola, will be using its 32 nm Medfield SoC (System-on-chip) for smartphones and tablets coming out later this year.

Lenovo is set to kick off the Medfield game as soon as Q2 when it will release in China the K800 smartphone running Android 4.0 (Ice Cream Sandwich). The K800 is powered by a 1.6 GHz (single-core/dual-threaded) Atom Z2460 chip, and features a 4.5-inch TFT touchscreen, an 8-megapixel rear-facing camera, 802.11 b/g/n WiFi, Bluetooth 3.0, and GPS. Lenovo's plans also include a 10-inch Android tablet that's likely also scheduled for a Q2 arrival.

VR-Zone have been having a little chat with Intel 'sources', who have leaked some juicy tidbits for us to enjoy in the form performance and power news. The upcoming next generation Medfield platform is Intel's first true System on a Chip (SoC) and is designed to compete with various low power ARM offerings in the tablet space. To help achieve this, they've gone through an internal restructure, merging four business units into just one: Ultra-Mobility, Mobile Wireless, Mobile Communications and Netbook & Tablet PC. The business unit is now simply known as Mobile and Communications. It's being run by Mike Bell and Hermann Eul and the first product to emerge from it will be is the 32 nm Medfield SoC solution.

VR-Zone explained that the competition will be "Apple's A-Series, NVIDIA Tegra, Qualcomm Snapdragon, Samsung Exynos, Texas Instruments OMAP and the likes. Out of all the chips mentioned above, only Samsung's Exynos is currently manufactured in 32nm process, just like Medfield."

Intel is planning to launch a new system-on-chip (SoC) processor derived from Atom, for network-attached storage (NAS) devices. NAS devices simple computers that connect hard drives directly to the network, where they are accessed by other computers. Over the years, NAS devices have added several functions, such as the ability to expand storage from external storage devices, the ability to perform simple tasks such as bit-torrent downloads, etc. To keep up with the growing need for compute power with these "super-NAS" devices, and to keep power draws low, there is a demand for low-power, low-footprint (small in size), and high-performance processing cores. This is one small but emerging segment that Intel doesn't want to concede to high-end multi-core ARM processors.

Sources told DigiTimes that Intel is working on an entire lineup of Atom processors for NAS devices, targeting various performance and power-draw segments. Intel is codenaming these Atom processors "Centerton". The chips are built on second-generation Atom architecture, and will be built on the 32 nm process. In related news, Intel also plans to roll out 22nm Silvermont-based Atom processors in 2013 and 14nm Airmont-based Atom parts in 2014, according to sources.

Besides the fact that they are carved out of the same piece of silicon by disabling components, all AMD FX series processors, from the quad-core FX-4000 series, to the eight-core FX-8000 series have one thing in common: they're all "unlocked", meaning they have an upwards-unlocked base-clock multiplier, which makes overclocking them a whole lot easier. Take that away and what do you get? A new Phenom II processor line. That's right, it is learned that AMD has a new line of Phenom II processors, eight-core for now, that are being carved out of the 32 nm Zambezi silicon.

Intuitively branded within the new Phenom II X8 and existing Phenom II X6 markers, these chips feature relatively lower clock speeds, meaning they will be priced low, competitive with Intel's sub-$200 Core i3 and Core i5 processors. AMD will also tinker with Zambezi's caches. The new chips came to light when some motherboard manufacturers leaked them on CPU support lists of certain motherboards, on their websites. For now we're getting to hear about two eight-core models, the 2.40 GHz Phenom II X8 2420, and 3.00 GHz Phenom II X8 3020; and two six-core models, the 2.50 GHz Phenom II X6 2520, and 2.80 GHz Phenom II X6 2820. Relevant details are tabled below. It beats us why AMD didn't take the opportunity (new silicon) to label these "Phenom III".

Welcome to the TechPowerUp 2011 PC technology Christmas special. We hope that you will enjoy reading it while tucking into your turkey, Christmas presents and a little too much wine... In this article, we go through the technology of 2011 that has had the most significance, the most impact and was generally the most talked about. It's not necessarily the best tech of 2011 which is the most significant though, since lemons can be just as significant as the ground-breakers in how they fail to deliver - and the backlash that goes with it.

January: Intel Sandy Bridge i5 & i7

Released on January 9th, the new Intel Core i5 & i7 processors were based on Intel's second generation Core architecture built on a 32 nm production process (HEXUS review). They included an IGP (Integrated Graphics Processor) physically on the same piece of silicon along with HyperThreading. These new dual and quad core processors soundly beat all previous generations of Intel processors in terms of processing performance, heat, power use, features and left AMD in the dust. Therefore, Intel badly needed some competition from AMD and unless you have been living under a rock, you will know how that turned out in October with the launch of Bulldozer. Sandy Bridge was a sound win and is generally considered to be the only architecture worth considering at this point. The i5-2500K is currently at the sweet spot of price/performance. It comes at a stock speed of 3.3 GHz, but typically overclocks to an amazing 4.5 - 5 GHz with a decent air cooler and without too much difficulty in getting there. Models in the budget i3 range were released at various times later. See this Wikipedia article for details.

AMD's new Bulldozer "FX" series of processors may be very lacklustre performers in reviewer's benchmarks and have garnered considerable scorn in enthusiast circles, but they're a very good performer for AMD's bottom line. Incredibly, they are selling out as soon as shops get them in stock - and they are not even priced very competitively against Intel's offerings, so perhaps the "It's an 8 core CPU!!" marketing is working well on the uninformed "enthusiast" after all? Mind you, what enthusiast, however uninformed, wouldn't know exactly how these products perform? Every tech website and computer magazine has covered these chips by now. The mind boggles.

Russian website Overclockers.ru claims to have a complete picture of what Intel's upcoming 22 nm Core "Ivy Bridge" desktop (2012 Core Processor Family) looks like. The site compiled model names, extensions, clock speeds, Turbo Boost speeds, L3 cache sizes, and TDP ratings of as many as 18 models, most of which are quad-core.

The table reflects that most clock speeds are similar to today's Sandy Bridge LGA1155 processor models, some have Turbo Boost speeds as high as 3.90 GHz. Since Ivy Bridge silicon is an optical shrink of Sandy Bridge LGA1155, from 32 nm to 22 nm, and since Intel is using a more energy-efficient transistor design, there are significant improvements in TDP ratings.

Intel started shipping the new Pentium 350, a model designed specifically for low-cost servers, micro-servers, and home servers; a segment Intel originally planned to address with some of its Atom dual-core chips. The Pentium 350 is an offshoot from entry-level desktop and notebook platforms the Pentium brand is currently in charge of, it is designed with durability and energy-efficiency required by servers in mind.

Available in the LGA1155 package, Pentium 350 is a dual-core processor based on the 32 nm Sandy Bridge dual-core silicon. It is clocked at 1.20 GHz, and features 3 MB of shared L3 cache apart from 256 KB L2 cache per core. Thanks to its low clock speed, the chip's TDP is rated at just 15W, making it ideal for home and small business servers. It will naturally benefit from the high IPC of Sandy Bridge architecture. The chip features Intel64 instruction set, its integrated memory controller supports up to 32 GB of dual-channel DDR3-1066/DDR3-1333 MHz memory.

Intel released its latest performance-segment processor, the Core i7-2700K. The i7-2700K is a quad-core chip in the LGA1155 package, based on the 32 nm "Sandy Bridge" silicon. It is clocked at 3.50 GHz, and features an unlocked base clock ratio multiplier, which makes overclocking possible. It features AVX instruction set, AES native acceleration, HyperThreading (which enables 8 logical CPUs), 256 KB L2 cache per core, and 8 MB of shared L3 cache.

Apart from these, it packs a dual-channel DDR3 integrated memory controller, PCI-Express root complex, and Intel HD 3000 series integrated graphics. The TDP remains consistent with many other Core i5 and Core i7 "Sandy Bridge" chips, at 95W. An interesting development here is that the pricing of Core i7-2700K didn't turn out to be what Amazon and MWave were charging for their pre-orders (around US $380), the retail price of this chip is merely $15 higher than that of the Core i7-2600K, at $332.

AMD is rumored to be seeking ties with TSMC, Taiwan's premier semiconductor manufacturing foundry, for future manufacturing of its "Bulldozer" architecture processors, according to a report by DonanimHaber. This has two very distinct implications: first, AMD could be facing issues with GlobalFoundries 32 nm HKMG node, its de facto foundry for CPU manufacturing, and second, this could just be an obvious development of future low-power APUs based on the new x86 architecture being manufactured at TSMC, much like how current E-series and C-series APUs are.

Then again, AMD doesn't exactly have any APUs in works that use "Bulldozer" architecture for the x86 cores, rather, its successor codenamed "Piledriver". Another couple of important things to note here are that TSMC does not have a 32 nm bulk node (it was scrapped with the transition to 28 nm bulk), and its HKMG (high-K metal gate transistor) manufacturing technology is deployed rather recently. It would be interesting to follow this development.

Intel released its latest generation of Atom processors, codenamed "Cedar Trail". Unlike earlier expected, the portable (netbook) variants of the new Atom processor aren't launched this day, just the low-power desktop (nettop) variants of Atom D2500 and Atom D2700. Cedar Trail is built on the 32 nm fabrication process, it features faster graphics, more graphics connectivity options (such as DisplayPort), hardware HD video acceleration, and a faster integrated memory controller.

Both the D2500 and D2700 are dual-core processors, with two x86-64 cores, and four logical CPUs for the OS to deal with, using HyperThreading technology. The D2500 is clocked at 1.86 GHz, while the D2700 runs at 2.13 GHz. Both chips feature 1 MB of shared L2 cache, the TDP of both are rated at 10W. New features included with the two are Intel Wireless Display Technology, Fast Boot, and PC Sync. The improved embedded graphics core is capable of 1080p video playback, supports hardware acceleration of popular HD video formats, and supports Blu-ray 2.0 format. Available to OEMs, the Atom D2500 and D2700 are BGA chips, priced at $42 and $52 in 1K quantities, respectively. The portable (netbook) variants of this generation, the N2600 and N2800, are expected to arrive a little later.

AMD showed off a notebook powered by its next-generation "Trinity" A-Series accelerated processing unit (APU). Trinity makes use of the Piledriver x86-64 micro-architecture (a more evolved version of Bulldozer), packs two Piledriver modules (four cores), and a faster DirectX 11 compliant Radeon graphics component. AMD displayed a Trinity-powered notebook running Deus Ex: Human Revolution. Trinity will be built on the 32 nm process, and will make use of the new socket FM2 platform. There's no word so far pointing that FM2 will be incompatible with FM1.

An internal presentation slide leaked to the press reveals some details of AMD's next generation "Trinity" APUs that succeed current generation A-Series "Llano" Fusion series. The presentation was run by AMD's principal foundry partner, Global Foundries, outlining upcoming products built on the 32 nm High-K metal gate transistor (HKMG) process. With Trinity, AMD is expecting a 50% improvement in gigaFLOP performance over the present generation, which doesn't sound far-fetched considering it will use next-generation Piledriver CPU core architecture and Radeon HD 7000 series graphics, which uses VLIW4 stream processor architecture.

Piledriver is an evolved x86 architecture that uses the modular shared resource design of Bulldozer, with much higher IPC compared to Stars architecture. VLIW4 stream processors ensure higher performance per square millimeter die area. Trinity will be available for notebooks as "Comal" and "Virgo" for desktops. They will be branded in the A-Series. AMD expects a 2012 market entry for the two.

Intel updated its product offer to OEMs with a new low-cost ultra-low voltage (ULV) processor, the Intel Celeron M 857. The chip is designed for use in ultra-portable notebooks. Built on the 32 nm processor node, this dual-core chip is clocked at 1.20 GHz, lacks HyperThreading, has 2 MB of shared L3 cache, dual-channel DDR3 IMC, and embedded graphics. The chip has a TDP of just 17W. Celeron M 857 has the same channel price as Celeron M 847, $134, which it displaces.

As reported last week, Intel released its new Core i7-980 six-core processor to the retail channel. The new chip is priced at US $583 in 1000-unit tray quantities, displacing the Core i7-970 from this exact price point it previously held. It is expected that the i7-970 could eventually become cheaper while the platform is still in the market. The Core i7-980 is a socket LGA1366 six-core processor based on the 32 nm "Westmere" silicon. It is clocked at 3.33 GHz, with Turbo Boost speeds of up to 3.60 GHz. Unlike the Core i7-980X Extreme Edition, this chip has an upwards locked BClk multiplier, and its QPI link runs at 4.80 GT/s instead of 6.40 GT/s on the 980X Extreme Edition. As a trade off, the new chip is a little over half the price of the 980X Extreme Edition, which retailed for around US $999.

One of AMD's design goals for its Fusion architecture must have been its application in mobile processors, where AMD isn't the brightest in terms of energy efficiency. The company's fastest product for the notebook platform is based on the Llano silicon, will release in 2011, and is a quad-core APU. Enter the AMD A8-3530MX.

Built on the 32 nm process with FS1 package, the A8-3530MX is an accelerated processing unit (APU), it combines a quad-core processor with a powerful GPU and northbridge component. With a default clock speed of 1.90 GHz and TurboCore speed of 2.60 GHz, the A8-3530MX packs 4 MB of L2 cache, and a dual-channel DDR3-1600 MHz memory controller, that also supports DDR3L-1333 MHz.

The GPU component is the DirectX 11 compliant AMD Radeon HD 6620G, with 400 stream processors, and engine clock speed of 444 MHz. To drive it, the northbridge component is entirely integrated into the APU, which packs a PCI-Express 2.0 hub to support discrete graphics. Despite so much machinery, the top-of-the-line chip maintains a TDP of 45W (common for notebook quad-core chips).