Apple today introduced the new iPad with an all-screen design featuring a large 10.9-inch Liquid Retina display. The new iPad is powered by the A14 Bionic chip, which delivers even faster performance with incredible power efficiency for demanding tasks while still providing all-day battery life. Updated cameras include an Ultra Wide 12MP front camera located along the landscape edge of iPad for an even better video calling experience, and an updated 12MP back camera to capture sharp, vivid photos and 4K video. A USB-C port supports a wide range of accessories, Wi-Fi 6 brings even faster connections, and cellular models feature superfast 5G so users can stay connected on the go. Designed specifically for the new iPad, the all-new Magic Keyboard Folio features an incredible typing experience, a click-anywhere trackpad, and a versatile two-piece design. With iPadOS 16 and support for Apple Pencil (1st generation), iPad offers users more ways to be creative and productive. The new iPad is available to order starting today, with availability in stores beginning Wednesday, October 26.

"We're so excited to bring the completely redesigned iPad to our most advanced iPad lineup ever," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "With a large 10.9-inch Liquid Retina display, powerful A14 Bionic chip, a first-ever landscape front camera, fast wireless connectivity, USB-C, and support for incredible accessories like the new Magic Keyboard Folio, the new iPad delivers more value, more versatility—and is simply more fun."

Apple today announced the next generation of Apple TV 4K—more powerful, entertaining, and affordable than ever, and offering impressive cinematic quality. Driven by the A15 Bionic chip that delivers faster performance and more fluid gameplay, the new Apple TV 4K features endless entertainment options for everyone to enjoy on the biggest screen in the home. HDR10+ support joins Dolby Vision on Apple TV 4K, so users can watch their favorite movies and TV shows in the best quality possible across more TVs. Running tvOS, the powerful and intuitive OS for the living room, and featuring the popular Siri Remote, Apple TV 4K simplifies the way users discover and enjoy their favorite content. Its seamless integration with other Apple devices and services magically transforms the living room in different ways for the entire family, while also adding convenience as a smart home hub.

The new Apple TV 4K is available in two configurations: Apple TV 4K (Wi-Fi), which offers 64 GB of storage; and Apple TV 4K (Wi-Fi + Ethernet), which offers support for Gigabit Ethernet for fast networking and streaming, Thread mesh networking protocol to connect even more smart home accessories, and twice the storage for apps and games (128 GB). Customers can order the new Apple TV 4K with Siri Remote today at a new starting price of $129, with availability beginning Friday, November 4.

Amazon today introduced Kindle Scribe—the next generation of Kindle that unites reading with writing. Kindle Scribe features the world's first 10.2-inch, 300 pixels per inch (ppi), Paperwhite display, and an included pen that never needs charging. The premium, front-lit, and glare-free display feels like reading and writing on paper, with crisp text and ample space for larger fonts, images, charts, and documents. Designed for reading and notetaking in millions of books, adding notes to documents, journaling, and more, Kindle Scribe is available for preorder today from just $339 and will ship later this year.

"Kindle Scribe is the best Kindle we've ever built, creating a reading and writing experience that feels like real paper," said Kevin Keith, vice president of Amazon Devices. "It's inspired by the Kindle customers who have added billions of notes and highlights to books over the years, and it's also ideal for reviewing and marking up documents, managing your to-do list, or doodling over a big idea. Plus, it offers all the Kindle benefits customers know and love—millions of books on demand, adjustable fonts, premium reading features, and weeks and weeks of battery life—with the benefit of a beautiful, large display."

Acer today announced support for the new 13th Gen Intel Core processors on the Predator Orion 7000 (PO7-650) series desktops, delivering serious power and further elevating users' PC gameplay. Engineered for hard-core gaming enthusiasts and creators, the upgradable gaming desktop pushes the limits of high-performance multi-tasking and next-level computing power.

"With the new 13th Gen Intel Core desktop processors, the Predator Orion 7000 powers extraordinary performance for even the most demanding game titles," said Jeff Lee, General Manager, Stationary Computing, IT Products Business, Acer Inc. "The Predator Orion 7000 continues to deliver best-in-class gameplay experiences beyond what gamers expect, and we're excited to be among the first to bring the new CPUs to market."

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its comprehensive product readiness for the newly available AMD Ryzen 7000 series of processors and the accompanying X670 and B650 chipset motherboards. From a new dedicated range of CORSAIR DDR5 memory for AMD platforms, to a huge lineup of award-winning CPU coolers, PC power supplies, cases and accessories, CORSAIR has the complete lineup of products to help enthusiasts build their new AMD-powered PC.

New AMD Ryzen 7000 processors and their supporting X670 and B650 chipset motherboards bring with them a huge change from past generations in the adoption of DDR5 memory, substantially increasing memory frequency versus DDR4. CORSAIR has a complete range of performance DDR5 created especially for AMD platforms, including the illustrious DOMINATOR PLATINUM RGB DDR5, the panoramically lit VENGEANCE RGB DDR5, or minimalist VENGEANCE DDR5. Available in a range of frequencies up to 6,000 MHz and capacities up to 64 GB, all CORSAIR DDR5 memory for AMD supports the new AMD EXPO (Extended Profiles for Overclocking) standard, offering single-setting-setup to ensure owners can easily run their memory at the speed it was created to run at.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce two new extreme overclocked performance DDR5 memory specifications to its flagship Trident Z5 RGB series: DDR5-6800 CL32-45-45-108 32 GB (2x 16 GB) and DDR5-6400 CL32-39-39-102 64 GB (2x 32 GB). These memory kits come with Intel XMP 3.0 memory overclocking profiles and have been validated on the latest 12th Gen Intel Core desktop processor and Intel Z690 chipset platform.

Dedicated to developing extreme overclock speed memory kits, the G.SKILL Trident Z5 RGB DDR5-6800 CL32-45-45-108 2x 16 GB memory kit is the ideal choice for overclocking enthusiasts to experience extreme DDR5 frequency performance. The screenshot below shows the DDR5-6800 memory kit validated with Intel Core i7-12700K desktop processor and ASUS ROG Maximus Z690 Hero motherboard.

Amazon today announced the next generation of Fire HD 8 tablets, launching four new models: Fire HD 8, Fire HD 8 Plus, Fire HD 8 Kids Pro, and Fire HD 8 Kids. The all-new Fire HD 8, powered by a 30% faster processor and all-day battery life, provides customers with a premier entertainment experience and the ability to get more things done at home or on the go. And for the first time, customers can select a Disney Design bundle for the Fire HD 8 Kids featuring Mickey Mouse or Disney Princess cases. The new Fire HD 8 tablets are available for pre-order today and will begin shipping next month.

"Our best-selling tablet this year just got even better for customers. The all-new Fire HD 8 tablets are faster, lighter, and powered by all-day battery life, delivering great entertainment for the whole family," said Kevin Keith, vice president of Amazon Devices. "For a complete kids tablet experience, the all-new Fire Kids tablets include one year of Amazon Kids+, a virtual playground of thousands of ad-free games, videos, books, apps, and more, kid-friendly case, a two-year worry-free guarantee, and easy-to-use parental controls."

AMD today announced a new addition to the Instinct MI200 family of accelerators. Officially titled Instinct MI210 accelerator, AMD tries to bring exascale-class technologies to mainstream HPC and AI customers with this model. Based on CDNA2 compute architecture built for heavy HPC and AI workloads, the card features 104 compute units (CUs), totaling 6656 Streaming Processors (SPs). With a peak engine clock of 1700 MHz, the card can output 181 TeraFLOPs of FP16 half-precision peak compute, 22.6 TeraFLOPs peak FP32 single-precision, and 22.6 TFLOPs peak FP62 double-precision compute. For single-precision matrix (FP32) compute, the card can deliver a peak of 45.3 TFLOPs. The INT4/INT8 precision settings provide 181 TOPs, while MI210 can compute the bfloat16 precision format with 181 TeraFLOPs at peak.

The card uses a 4096-bit memory interface connecting 64 GBs of HMB2e to the compute silicon. The total memory bandwidth is 1638.4 GB/s, while memory modules run at a 1.6 GHz frequency. It is important to note that the ECC is supported on the entire chip. AMD provides an Instinct MI210 accelerator as a PCIe solution, based on a PCIe 4.0 standard. The card is rated for a TDP of 300 Watts and is cooled passively. There are three infinity fabric links enabled, and the maximum bandwidth of the infinity fabric link is 100 GB/s. Pricing is unknown; however, availability is March 22nd, which is the immediate launch date.

AMD places this card directly aiming at NVIDIA A100 80 GB accelerator as far as the targeted segment, with emphasis on half-precision and INT4/INT8 heavy applications.

During the Supercomputing (SC) 21 event, Intel has disclosed additional information regarding the company's upcoming Xeon server processor lineup, codenamed Sapphire Rapids. One of the central areas of improvement for the new processor generation is the core architecture based on Golden Cove, the same core found in Alder Lake processors for consumers. However, the only difference between the Golden Cove variant found in Alder Lake and Sapphire Rapids is the amount of L2 (level two) cache. With Alder Lake, Intel equipped each core with 1.25 MB of its L2 cache. However, with Sapphire Rapids, each core receives a 2 MB bank.

One of the most exciting things about the processors, confirmed by Intel today, is the inclusion of High-Bandwidth Memory (HBM). These processors operate with eight memory channels carrying DDR5 memory and offer PCIe Gen5 IO expansion. Intel has confirmed that Sapphire Rapids Xeons will feature up to 64 GB of HBM2E memory, including a few operating modes. The first is a simple HBM caching mode, where the HBM memory acts as a buffer for the installed DDR5. This method is transparent to software and allows easy usage. The second method is Flat Mode, which means that both DDR5 and HBM are used as contiguous address spaces. And finally, there exists an HBM-only mode that utilizes the HBM2E modules as the only system memory, and applications fit inside it. This has numerous benefits, primarily drawn from HBM's performance and reduced latency.

Apple today announced M1 Pro and M1 Max, the next breakthrough chips for the Mac. Scaling up M1's transformational architecture, M1 Pro offers amazing performance with industry-leading power efficiency, while M1 Max takes these capabilities to new heights. The CPU in M1 Pro and M1 Max delivers up to 70 percent faster CPU performance than M1, so tasks like compiling projects in Xcode are faster than ever. The GPU in M1 Pro is up to 2x faster than M1, while M1 Max is up to an astonishing 4x faster than M1, allowing pro users to fly through the most demanding graphics workflows.

M1 Pro and M1 Max introduce a system-on-a-chip (SoC) architecture to pro systems for the first time. The chips feature fast unified memory, industry-leading performance per watt, and incredible power efficiency, along with increased memory bandwidth and capacity. M1 Pro offers up to 200 GB/s of memory bandwidth with support for up to 32 GB of unified memory. M1 Max delivers up to 400 GB/s of memory bandwidth—2x that of M1 Pro and nearly 6x that of M1—and support for up to 64 GB of unified memory. And while the latest PC laptops top out at 16 GB of graphics memory, having this huge amount of memory enables graphics-intensive workflows previously unimaginable on a notebook. The efficient architecture of M1 Pro and M1 Max means they deliver the same level of performance whether MacBook Pro is plugged in or using the battery. M1 Pro and M1 Max also feature enhanced media engines with dedicated ProRes accelerators specifically for pro video processing. M1 Pro and M1 Max are by far the most powerful chips Apple has ever built.

DRAM contract prices are likely to exit a bullish period that lasted three quarters and be on the downswing in 4Q21 at a QoQ decline of 3-8%, according to TrendForce's latest investigations. This decline can be attributed to not only the declining procurement activities of DRAM buyers going forward, but also the drop in DRAM spot prices ahead of contract prices. While the buying and selling sides attempt to gain the advantage in future transactions, the DRAM market's movement in 2022 will primarily be determined by suppliers' capacity expansion strategies in conjunction with potential growths in demand. The capacity expansion plans of the three largest DRAM suppliers (Samsung, SK hynix, and Micron) for 2022 are expected to remain conservative, resulting in a 17.9% growth in total DRAM bit supply next year. On the demand side, inventory levels at the moment are relatively high. Hence, DRAM bit demand is expected to grow by 16.3% next year and lag behind bit supply growth. TrendForce therefore forecasts a shift in the DRAM market next year from shortage to surplus.

AAEON, an industry leader in embedded solutions, introduces the BOXER-6643-TGU compact industrial system. With rugged construction, the system delivers the performance and innovative technologies of the 11th Generation Intel Core U processors (formerly Tiger Lake) to applications in tough environments, providing wide operating temperature range and 5G support, to power embedded controller and Industrial IoT (IIoT) gateway applications.

The BOXER-6643-TGU is powered by the 11th Generation Intel Core U processors, delivering greater performance over previous generations, with innovative Intel technologies ensuring more accurate, secure data processing. With up to 64 GB of memory, the system allows users to utilize the full extent of the system's processing capabilities, and with the Intel Iris Xe embedded graphics, users can leverage more powerful GPU processing to power AI and Edge Computing industrial applications. With dual HDMI ports, the system can also support 4K high definition video on two monitors, perfect for powering digital signage.

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

AMD today announced availability of the new AMD Radeon PRO W6000X series GPUs for Mac Pro. The new GPU product line delivers exceptional performance and incredible visual fidelity to power a wide variety of demanding professional applications and workloads, including 3D rendering, 8K video compositing, color correction and more.

Built on groundbreaking AMD RDNA 2 architecture, AMD Infinity Cache and other advanced technologies, the new workstation graphics line-up includes the AMD Radeon PRO W6900X and AMD Radeon PRO W6800X GPUs. Mac Pro users also have the option of choosing the AMD Radeon PRO W6800X Duo graphics card, a dual-GPU configuration that leverages high-speed AMD Infinity Fabric interconnect technology to deliver outstanding levels of compute performance.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is delighted to announce the launch of new capacities for TOUGHRAM XG RGB DDR4 Memory Kits, aiming to meet the toughest needs of creators while producing video, animation or exporting large files.

The memory kits are forged with frequencies up to 3600 and 4000 MHz and capacities up to 32 GB (16 GB x2) and 64 GB (32 GB x2). The TOUGHRAM XG RGB series inherits the same craftsmanship and quality expected from the TOUGHRAM name; they are compatible with the latest AMD and Intel motherboards and they have been through rigorous tests to select tightly-screened ICs, designed with a with a ten-layer PCB, constructed with 10μ gold fingers and 2oz copper inner layers to ensure high and stable performance. Designed with 2 different colors of aluminium and trimmed with a chrome stripe in the middle, the TOUGHRAM XG RGB is ambitioned at providing an exclusive style for users standing out from the normal.

According to Bloomberg, which first predicted the arrival of Apple custom processors in MacBooks, we have another piece of information regarding Apple's upcoming MacBook Pro lineup, set to arrive this summer. As you are aware, MacBook Pro right now comes in two different variants. The first is a smaller 13-inch design that is powered by Apple's M1 chip, while the second is a 16-inch design powered by an Intel Core processor. However, it seems like that will no longer be the case when the next-generation lineup arrives. Starting this summer, all of the MacBook Pro models will have Apple's custom silicon powering these devices, which bring Intel's presence to an end.

And the successor to the now-famous M1 chip seems to be very good. As per the report, Apple is upgrading the architecture and the total core count. There are two different chips, codenamed Jade C-Chop and Jade C-Die. Both are 10-core designs, equipped with two small and eight big cores. The difference between the two is the total number of graphics cores enabled. The smaller version will have 16 graphics cores, while the bigger one will have 32 graphics cores. On the SoC, there will be an updated Neural Engine, for better AI processing. These new processors will come with up to 64 GB of RAM in selected configurations as well. The report also notes the arrival of HDMI port, SD card slot, and MagSafe for charging.

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.

ASUS today announced Mini PC PB62, a durable computer that delivers powerful performance to provide flexibility, expandability and performance to suit a range of business applications, including digital signage, point-of-sales (POS) system, kiosks and intelligent vending machines. Mini PC PB62 is powered by the latest desktop-grade up to 11th Generation Intel Core processor and fast DDR4 3200 MHz memory.

Engineered for performance: 11th Gen Intel Core, DDR4 3200 MHz memory and Intel Optane
With the latest up to 11th Gen Intel Core i7 processors, Mini PC PB62 is caters for with support for either a 35- or 65-watt CPU - so it's ready to be specified for supreme efficiency or maximum performance. PB62 also has built-in support for Intel Optane H20 memory, the technology that greatly improves storage speeds, enables frequently-used documents, pictures, videos and applications to be accessed more quickly while improving overall system performance to maximize productivity and efficiency.

In the name of Odin, Chinese manufacturer Asgard has launched their first DDR5 memory modules to market - beating some competing western companies that are still "gearing up" for it. Owned by the much less interestingly-named Shenzhen Jiahe Jinwei Electronic Technology Co., Ltd., Asgard likewise lost some of its flair in naming these DDR5 sticks - the best they could do was VMA5AUK-MMH224W3. The modules will be available in 32 GB, 64 GB and 128 GB per-stick densities.

The initial modules don't have any flair - they're built with the same green PCB that's actually the forerunner of today's colored ones. The company hs also announced that the modules win run at a relatively mild 4,800 MHz (the DDR5 specification goes up to 8,400 MHz), and that its timings coincide with JEDEC's "B" classification, which should mean 40-40-40. The voltage likewise remains at the JEDEC-set standard of 1.1 V. The company announced that mass-production rollout will only occur after there are actual CPUs and platforms that can take advantage of the DDR5 memory spec, and said that they expect Intel's Alder-Lake, Sapphire Rapids and Tiger Lake-U from the blue team, as well as Van Gogh and Rembrandt APUs from the AMD camp. No word on consumer pricing was available at time of writing.

In the upstream semiconductor industry, the major foundries such as TSMC and UMC are reporting fully loaded capacities, while in the downstream, the available production capacity for OSAT is also lacking, according to TrendForce's latest investigations. Given this situation, suppliers of NAND Flash controller ICs such as Phison and Silicon Motion are now unable to meet upside demand from their clients. Not only have many controller IC suppliers temporarily stopped offering quotes for new orders, but they are also even considering raising prices soon because the negotiations between NAND Flash suppliers and module houses over 1Q21 contracts are now at the critical juncture. The potential increases in prices of controller ICs from outsourced suppliers (IC design houses) are currently estimated to be the range of 15-20%.

With regards to the demand side, demand has risen significantly for eMMC solutions with medium- and low-density specifications (i.e., 64 GB and lower), for which NAND Flash suppliers have mostly stopped updating the NAND Flash process technology, while maintaining support with the legacy 2D NAND or the 64L 3D NAND process. This is on account of strong sales for Chromebook devices and TVs. As older processes gradually account for a lowering portion of bit output proportions from NAND Flash suppliers, these companies are exhibiting a lowered willingness to directly supply such eMMC products to clients. As a result, clients now need to turn to memory module houses, which are able to source NAND Flash components and controllers, to procure eMMC products in substantial quantities.

The percentage distribution of 2021 NAND Flash bit demand by application currently shows that client SSD accounts for 31%, enterprise SSD 20%, eMMC/UFS 41%, and NAND wafer 8%, according to TrendForce's latest investigations. TrendForce expects NAND Flash ASP to undergo QoQ declines throughout 2021, since the number of NAND suppliers far exceeds DRAM suppliers, and the bit supply remains high. As Samsung, YMTC, SK Hynix, and Intel actively expand their NAND Flash bit output in 1Q21, the oversupply situation in the industry will become more severe, with a forecasted 6% QoQ increase in NAND Flash bit output and a 10-15% QoQ decline in NAND Flash ASP in 1Q21.

HyperX has launched their Impact lineup of DDR4 DRAM, which boasts of high memory densities per stick for space-constrained setups such as laptops or SFF PCs. The new Impact SODIMMs are available in capacities up to 32 GB per stick, which should make possible for users to install up to 64 GB of DDR4 RAM in their system. All Impact SODIMM operate at 1.2 V, thus enabling relatively low power consumption.

Available operating frequencies stand at 2400 MHz (15-15-15); 2666 MHz (16-18-18); 2933 MHz (17-19-19); and 3200 MHz (20-22-22) - timings are slightly loose, but that's to be expected at these densities and, most importantly in space and/or cooling-constrained environments, voltage. HyperX Impact SODIMMs are available in single modules, dual channel kits, and quad channel kits. MSRP starts at $77 for a 16 GB module running at 2400 MHz, and apparently tops out at $358.99 for 2x 32 GB modules at 3200 MHz.

TeamGroup recently announced another addition to their DDR4 memory lineup especially aimed at creators. The new, aptly named T-Create lineup features clean, back-to-basics aesthetics with slim metal heatspreaders that aren't too gaudy and are absent of any RGB. The new chips are available in capacities ranging from 16 GB (2 x 8 GB) through to 64 GB (2x 32 GB). Available speeds are set at DDR4-3200 (22-22-22-52 timings and 1.20 V) and DDR4-2666 (19-19-19-43 timings and 1.20 V).

The TeamGroup T-Create Classic 10L feature a 10-layer PCB and limited lifetime warranty, and are available in silvery-white. Pricing starts at $56.99 for the 2x 8 GB 2666 MHz kit and goes up to $216.99 for the 2x 32 GB 3200 MHz one.

GeIL, Golden Emperor International Ltd. - one of the world's leading PC components & peripheral manufacturers announced ORION series memory for gamers and content creators providing high speed as well as massive memory capacity scalable up to 4000 MHz CL18 64 GB (2 x 32 GB) kit.

High speed and low latencies used to be gamers' favorite while massive memory capacity which greatly helps the multimedia creation is preferred for content creators. Scaling up to 2x 32 GB 4000 MHz CL18, GeIL ORION series memory is an exceptionally balanced choice designed to satisfy multiple needs, especially for users require both extraordinary performance for gaming and massive memory capacity for multimedia creation.