NVIDIA today announced its first data center CPU, an Arm-based processor that will deliver 10x the performance of today's fastest servers on the most complex AI and high performance computing workloads.

The result of more than 10,000 engineering years of work, the NVIDIA Grace CPU is designed to address the computing requirements for the world's most advanced applications—including natural language processing, recommender systems and AI supercomputing—that analyze enormous datasets requiring both ultra-fast compute performance and massive memory. It combines energy-efficient Arm CPU cores with an innovative low-power memory subsystem to deliver high performance with great efficiency.

Today, Arm introduced the Armv9 architecture in response to the global demand for ubiquitous specialized processing with increasingly capable security and artificial intelligence (AI). Armv9 is the first new Arm architecture in a decade, building on the success of Armv8 which today drives the best performance-per-watt everywhere computing happens.

To address the greatest technology challenge today - securing the world's data - the Armv9 roadmap introduces the Arm Confidential Compute Architecture (CCA). Confidential computing shields portions of code and data from access or modification while in-use, even from privileged software, by performing computation in a hardware-based secure environment.

Nintendo's Switch console is one of the most successful consoles ever made by the Japanese company. It has sold in millions of units and has received great feedback from the gaming community. However, as the hardware inside the console becomes outdated, the company is thinking about launching a new revision of the console, with the latest hardware and technologies. Today, we got ahold of information about the graphics side of things in Nintendo's upcoming console. Powered by NVIDIA Tegra SoC, it will incorporate unknown Arm-based CPU cores. The latest rumors suggest that the CPU will be accommodated with NVIDIA's Ada Lovelace GPU architecture. According to @kopite7kimi, a known hardware leaker, who simply replied to VideoCardz's tweet with "Ada", we are going to see the appearance of Ada Lovelace GPU architecture in the new SoC. Additionally, the new Switch SoC will have hardware accelerated NVIDIA Deep Learning Super Sampling (DLSS) and 4K output.

Xilinx, Inc., the leader in adaptive computing, today announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.

As the world's only hardware adaptable cost-optimized portfolio based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC's state-of-the-art InFO (Integrated Fan-Out) packaging technology. Using InFO, Artix and Zynq UltraScale+ devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.

According to the official company website, Apple will no longer manufacture its iMac Pro computers based on Intel processors. Instead, the company will carry these models in its store, only while the supplies last. Apple will be replacing these models with next-generation iMac Pro devices that will be home to the custom Apple Silicon processors, combining Arm CPU cores with custom GPU design. Having a starting price of 4990 USD, the Apple iMac Pro was able to max out at 15000 USD. The most expensive part was exactly the Intel Xeon processor inside it, among the AMD GPU with HBM. Configuration pricing was also driven by storage/RAM options. However, even the most expensive iMac Pro with its 2017 hardware had no chance against the regular 2020 iMac, so the product was set to be discontinued sooner or later.

When the stock of the iMac Pro runs out, Apple will replace this model with its Apple Silicon equipped variant. According to the current rumor mill, Apple is set to hold a keynote on March 16th that will be an announcement for new iMac Pro devices with custom processors. What happens is only up to Apple, so we have to wait and see.

SiPearl has this week announced their collaboration with Open-Silicon Research, the India-based entity of OpenFive, to produce the next-generation SoC designed for HPC purposes. SiPearl is a part of the European Processor Initiative (EPI) team and is responsible for designing the SoC itself that is supposed to be a base for the European exascale supercomputer. In the partnership with Open-Silicon Research, SiPearl expects to get a service that will integrate all the IP blocks and help with the tape out of the chip once it is done. There is a deadline set for the year 2023, however, both companies expect the chip to get shipped by Q4 of 2022.

When it comes to details of the SoC, it is called Rhea and it will be a 72-core Arm ISA based processor with Neoverse Zeus cores interconnected by a mesh. There are going to be 68 mesh network L3 cache slices in between all of the cores. All of that will be manufactured using TSMC's 6 nm extreme ultraviolet lithography (EUV) technology for silicon manufacturing. The Rhea SoC design will utilize 2.5D packaging with many IP blocks stitched together and HBM2E memory present on the die. It is unknown exactly what configuration of HBM2E is going to be present. The system will also see support for DDR5 memory and thus enable two-level system memory by combining HBM and DDR. We are excited to see how the final product looks like and now we wait for more updates on the project.

AAEON, an industry leader in Edge Computing solutions, announces the SRG-3352C Compact Edge IoT Gateway System. The SRG-3352C brings reliable, cost effective gateway operations with expandability and wireless communication support designed to quickly deploy edge networks in a variety of environments.
The SRG-3352C builds upon the features, durability and reliability of the SRG-3352 Edge IoT Gateway System with expanded support for more connections and wireless communications. All of this is packed into a compact form factor that makes deploying the SRG-3352C even easier, powering more flexible edge network deployments.

The SRG-3352C is powered by the Arm Cortex-A8 800 MHz RISC processor. This innovative processor reduces the energy requirements of the system, allowing for a more efficient system to help save electricity costs. While powerful enough to connect edge networks together, the low energy usage can help cities with achieving green energy goals, and even allow the system to operate on solar power or batteries. It also eliminates the need for dedicated heatsinks, allowing the system to operate in wider temperatures, from 0°C up to 60°C without loss in performance.

Addressing the demands of the modern data center, Xilinx, Inc. (NASDAQ: XLNX) today announced a range of new data center products and solutions, including a new family of Alveo SmartNICs, smart world AI video analytics applications, an accelerated algorithmic trading reference design for sub-microsecond trading, and the Xilinx App Store.

Today's most demanding and complex applications, from networking and AI analytics to financial trading, require low-latency and real-time performance. Achieving this level of performance has been limited to expensive and lengthy hardware development. With these new products and solutions, Xilinx is eliminating the barriers for software developers to quickly create and deploy software-defined, hardware accelerated applications on Alveo accelerator cards.

In September of last year, NVIDIA has officially announced that the current industry rumor about its big acquisition was true. The company has announced that it is acquiring Arm Limited from the Softbank Group. Paying as much as $40 billion for the purchase, NVIDIA is gaining access to the complete company, along with its extensive portfolio of IP and knowledge. That means that NVIDIA is not essentially a holder of the Arm ISA, which is the most dominant ISA within mobile processors. Such a deal, however, is a bit hard to process without some troubles popping up along the way. As Arm held a neutral position as IP provider, NVIDIA is expected to remain as such, and the company even promised to stay true to that.

However, not everything is going as planned. Before completing the acquisition process, NVIDIA must first comply with regulators from all around the world, including the US, UK, EU, and China. If any objections raise within those regions, they are to be interrogated. Today, Google, Microsoft, and Qualcomm have objected that NVIDIA's Arm acquisition is hurting the market and are urging antitrust officials to intervene. Mentioned companies believe that NVIDIA's move is hurting the market and the company could limit its competitors from accessing the IP, thus breaking Arm's neutral position as an IP provider. NVIDIA has made statements that Arm will remain in such a position, however, the skepticism of the mentioned companies is slowing the merger. Now all that remains is to see how the conflicted companies solve their worries.

Apple has today patented a new approach to how it uses memory in the System-on-Chip (SoC) subsystem. With the announcement of the M1 processor, Apple has switched away from the traditional Intel-supplied chips and transitioned into a fully custom SoC design called Apple Silicon. The new designs have to integrate every component like the Arm CPU and a custom GPU. Both of these processors need good memory access, and Apple has figured out a solution to the problem of having both the CPU and the GPU accessing the same pool of memory. The so-called UMA (unified memory access) represents a bottleneck because both processors share the bandwidth and the total memory capacity, which would leave one processor starving in some scenarios.

Apple has patented a design that aims to solve this problem by combining high-bandwidth cache DRAM as well as high-capacity main DRAM. "With two types of DRAM forming the memory system, one of which may be optimized for bandwidth and the other of which may be optimized for capacity, the goals of bandwidth increase and capacity increase may both be realized, in some embodiments," says the patent, " to implement energy efficiency improvements, which may provide a highly energy-efficient memory solution that is also high performance and high bandwidth." The patent got filed way back in 2016 and it means that we could start seeing this technology in the future Apple Silicon designs, following the M1 chip.

Update 21:14 UTC: We have been reached out by Mr. Kerry Creeron, an attorney with the firm of Banner & Witcoff, who provided us with additional insights about the patent. Mr. Creeron has provided us with his personal commentary about it, and you can find Mr. Creeron's quote below.

MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6 nm Dimensity 1200 and 1100 chipsets to MediaTek's 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more.

"MediaTek continues to expand its 5G portfolio with highly integrated solutions for a range of devices from the high-end to the mid-tier," said JC Hsu, Corporate Vice President and General Manager of MediaTek's Wireless Communications Business Unit. "Our new Dimensity 1200 stands out with its impressive 200MP camera support and advanced AI capabilities, in addition to its innovative connectivity, display, audio and gaming enhancements."

Intel's future CEO Pat Gelsinger, who supersedes current CEO Bob Swan come February 15th, has reportedly compared Intel with Apple's efforts, in wake of that company's decision to leave the Intel ecosystem in favor of in-house designed ARM CPUs. As Apple M1-powered devices hit reviewers' tables, the opinions mostly went one-sided in favor of Apple's decision, clamoring for that particular CPU design to be only lightly short of a computing miracle, considering the amount of computing power provided at that chip's TDP, and running circles around Apple's previous Intel implementations.

According to The Oregonian, a local newspaper from (you guessed it) Oregon where Intel has a strong branch presence, Intel held an all-hands meeting of its Oregon workforce, attended by future Intel CEO Pat Gelsinger, who is quoted as having remarked that "We [Intel] have to deliver better products to the PC ecosystem than any possible thing that a lifestyle company in Cupertino makes. We have to be that good, in the future." Considering how Apple's M1 has raised the world's attention to the ARM architecture as a competitor with strong enough arguments to face the x86 ecosystem (as if ARM powering the world's current fastest supercomputer wasn't a strong enough argument), that seems like a strong yet adequate statement. We'll see how Intel fares with its Alder lake CPUs, which essentially bring ARM's design philosophy of an heterogeneous CPU with both high-performance and high-efficiency cores to the x86 table.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the Exynos 2100 through its first virtual event, Exynos On 2021. The new mobile processor is the company's first premium 5G-integrated mobile processor built on the most advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node.

The chip's computation and graphic processing performance have been improved and refined to surpass the power user's performance expectations. As Samsung's first 5G-integrated flagship mobile processor, the Exynos 2100 is built on an advanced 5 nm EUV process technology that allows up to 20-percent lower power consumption or 10-percent higher overall performance than the 7 nm predecessor. For further enhancement, the chip offers improved cache memory utilization and a stronger scheduler. The octa-core CPU comes in an improved tri-cluster structure made up of a single powerful Arm Cortex -X1 core that runs at up to 2.9 GHz, three high-performing Cortex-A78 cores and four power-efficient Cortex-A55 cores delivering more than 30-percent enhancement in multi-core performance than the predecessor.

NVIDIA's planned acquisition of Arm was one of 2020's defining moments for the tech industry, and many articles have already been written on the possible industry-wide consequences of this acquisition. However, the resulting NVIDIA company could raise some questions as to business practices and competition - critics, technologists, and lobbyists have already been working hard in calling the deal's attention to regulating authorities. And that seems to be paying off, as UK's Competition and Markets Authority announced Wednesday that it plans to investigate NVIDIA's proposed acquisition of British chip designer Arm.

This effort by the CMA will take place in a staggered way, where the regulator is for now asking for third party input on the deal and its consequences for British competition and the tech industry at large, before launching its official probe later this year. As is always the case with these sort of deals, some in the field expect the deal to be blocked, including Arm co-founder Hermann Hauser; others, however, speak to its eventual success. NVIDIA's share price has kept dropping ever since the announcement, from a high of $536.31 to $506.21 at time of writing.

Designing a custom processor can be a rewarding thing. You can control your ecosystem surrounding it and get massive rewards in terms of application-specific performance uplift, or lower total cost of ownership. It seems like cloud providers have figured out that at their scale, designing a custom processor can get all of the above with the right amount of effort put into it. If you remember, in 2018, Amazon has announced its Graviton processor based on Arm instruction set architecture. Today, the company has almost 10% of its AWS instances based on the Graviton 1 or 2 processors, which is a massive win for a custom design.

Following Amazon's example, the next company to join the custom server processor race is going to be Microsoft. The Redmond based giant is looking to build a custom lineup of processors that are meant to satisfy Microsoft's most demanding sector - server space. The company's Azure arm is an important part where it has big and increasing revenue. By building a custom processor, it could satisfy the market needs better while delivering higher value. The sources of Bloomberg say that Microsoft is planning to use Arm ISA, and start building independence from the x86 vendors like Intel and AMD. Just like we saw with AWS, the industry cloud giants are starting to get silicon-independent and with their scale, they can drive the ecosystem surrounding the new processors forward rapidly. The sources are also speculating that the company is building custom processors for Surface PCs, and with Windows-on-Arm (WoA) project, Microsoft has laid the groundwork in that field as well.

Amazon Web Services (AWS), the world's largest cloud services provider, has launched its Graviton series of custom processors some time ago. With Graviton, AWS had a plan to bring down the costs of offering some cloud services both for the customer and for the company. By doing that, the company planned to attract new customers offering greater value, and that plan seems to be working out well. When AWS launched its first-generation Graviton processor, the company took everyone by surprise and showed that it is capable of designing and operating its custom processors. The Graviton series of processors is based on the Arm Instruction Set Architecture (ISA) and the latest Graviton 2 series uses Arm Neoverse N1 cores as the base.

Today, thanks to the data from Liftr Insights, we get to see just how many total AWS instances are Graviton based. The data is showing some rather impressive numbers for the period from June 2019, to August 2020. In that timeframe, Intel with its Xeon offerings has seen its presence decrease from 88% to 70%, while AMD has grown from 11% to 20% presence. And perhaps the greatest silent winner here is the Graviton processor, which had massive growth. In the same period, AWS increased Graviton instance number from making up only 1% of all instances, to make up 10% of all instances available. This is a 10-fold increase which is not a small feat, given that data center providers are very difficult when it comes to changing platforms.

Today, Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company, announced that Arm, a global leader in semiconductor design and silicon intellectual property development and licensing, will leverage AWS for its cloud use, including the vast majority of its electronic design automation (EDA) workloads. Arm is migrating EDA workloads to AWS, leveraging AWS Graviton2-based instances (powered by Arm Neoverse cores), and leading the way for transformation of the semiconductor industry, which has traditionally used on-premises data centers for the computationally intensive work of verifying semiconductor designs.

To carry out verification more efficiently, Arm uses the cloud to run simulations of real-world compute scenarios, taking advantage of AWS's virtually unlimited storage and high-performance computing infrastructure to scale the number of simulations it can run in parallel. Since beginning its AWS cloud migration, Arm has realized a 6x improvement in performance time for EDA workflows on AWS. In addition, by running telemetry (the collection and integration of data from remote sources) and analysis on AWS, Arm is generating more powerful engineering, business, and operational insights that help increase workflow efficiency and optimize costs and resources across the company. Arm ultimately plans to reduce its global datacenter footprint by at least 45% and its on-premises compute by 80% as it completes its migration to AWS.

Fugaku—the Arm technology-based supercomputer jointly developed by RIKEN and Fujitsu—was awarded the number one spot on the Top500 list for the second time in a row. This achievement further highlights the rapidly evolving demands of high-performance computing (HPC) that Arm technology uniquely addresses through the unmatched combination of power efficiency, performance, and scalability.

In addition to the great work RIKEN and Fujitsu have done, we're seeing more adoption for Arm-based solutions across our ecosystem. ETRI, the national computing institute of the Republic of Korea, recently announced plans to adopt the upcoming Neoverse V1 (formerly code-named Zeus) CPU design, which feature Arm Scalable Vector Extensions (SVE), for its K-AB21 system. ETRI has set a goal of 16 teraflops per CPU and 1600 teraflops per rack for AB 21 (which stands for 'Artificial Brain 21') while reducing power consumption by 60% compared to its target.

The 56th edition of the TOP500 saw the Japanese Fugaku supercomputer solidify its number one status in a list that reflects a flattening performance growth curve. Although two new systems managed to make it into the top 10, the full list recorded the smallest number of new entries since the project began in 1993.

The entry level to the list moved up to 1.32 petaflops on the High Performance Linpack (HPL) benchmark, a small increase from 1.23 petaflops recorded in the June 2020 rankings. In a similar vein, the aggregate performance of all 500 systems grew from 2.22 exaflops in June to just 2.43 exaflops on the latest list. Likewise, average concurrency per system barely increased at all, growing from 145,363 cores six months ago to 145,465 cores in the current list.

MediaTek today unveiled its new Dimensity 700 5G smartphone chipset, a 7 nm SoC designed to bring advanced 5G capabilities and experiences to the mass market. The addition of the Dimensity 700 to MediaTek's Dimensity family of 5G chips gives device makers a full suite of options for 5G smartphone models - from flagship and premium to mid-range and mass market devices - making 5G more accessible for consumers everywhere.

"With our expanded Dimensity portfolio we're bringing the latest 5G capabilities to every smartphone tier so more people can enjoy 5G experiences," said Dr. JC Hsu, Corporate VP and GM of MediaTek's Wireless Communications Business Unit. "The Dimensity 700 has an impressive mix of 5G connectivity features, advanced camera capabilities like night shot enhancements and multiple voice assistant support, all in a super power-efficient design."

In the past few years, the Windows-on-Arm (WoA) market has gotten some momentum has with companies trying to develop their WoA PCs, primarily laptops. One example of that is Microsoft. The company has launched a Surface notebook powered by a custom chip from Snapdragon, called Surface Pro X. This device is being powered by the Snapdragon SQ2 processor. However, what seemed to be missing for a while was the lack of support from the Arm itself for this type of market. That is what the company decided to change and make a brand new processor IP dedicated to "on-the-go" devices as they call it, translating into laptops.

The Cortex-A78C is a new design direction which Arm thinks is a good way for laptops, to get some more serious work done. Unlike the regular Cortex-A78 which is a heterogeneous design of big and little cores (Arm's famous big.LITTLE architecture), the new Cortex-A78C revision aims to change that. The "C" version of the processor is actually a homogeneous structure made up of all the big cores. Where you would typically use four big and four little cores for a design, Arm has decided to go all big with this design. For multithreaded purposes, this is the right decision to boost performance. The level three (L3) cache has seen a boost as well, translating to 8 MB of L3$ found on the die. We are eagerly awaiting to see the first designs based on this configuration and see how it performs.

Apple late Monday sent out a public invite to an online launch event dated November 10, without revealing what it is. With new generation iPhones and Watches and iPads already announced it's likely that the November 10 event could deal with Macs, specifically, the company's very first MacBooks powered by a non-Intel processor since the company embraced x86 some decade-and-a-half ago.

Apple, having gained in-house expertise in designing powerful Arm-based SoCs, is likely to debut a new Arm-based processor with sufficient muscle to drive MacBooks, in what will be a "client-first" strategy of replacing x86 with Arm for Apple. This will likely see the most client-segment products, such as MacBooks and Mac Mini, get the processor, followed by MacBook Pros, iMacs, and lastly workstation-segment products such as the Mac Pro and iMac Pro. The November 10 event will likely only cover the very first Arm-powered MacBooks. Apple has been selling Arm-powered Mac Minis to ISVs along with a special version of macOS "Big Sur," so they could port their Mac software to the new platform. Arm-powered Macs could also see some form of unification between the iOS and macOS software ecosystems.

Apple announced plans to transition their Mac lineup to in-house ARM-based processors earlier this year. This decision came as a result of Apple's dependence on Intel for new processors each year and their recent underwhelming improvements. The upcoming 12 core chip is expected to be manufactured on TSMC's 5 nm node which should deliver significant power savings and performance. Apple has been working to optimize macOS and first party applications for the new processors along with sending out developer transition kits to hopefully ensure major software is supported at launch. The processor is rumored to debut in an upcoming 13-inch MacBook Pro or a new MacBook Air and should launch at a dedicated event in November according to a recent report by Bloomberg.

Editor's Note: This is written by Arm vice president and general manager Paul Williamson.

Over the last year, I have been inspired by the innovators who are dreaming up solutions to improve and enrich our daily lives. Tomorrow's mobile applications will be even more imaginative, immersive, and intelligent. To that point, the industry has come such a long way in making this happen. Take app stores for instance - we had the choice of roughly 500 apps when smartphones first began shipping in volume in 2007 and today there are 8.9 million apps available to choose from.

Mobile has transformed from a simple utility to the most powerful, pervasive device we engage with daily, much like Arm-based chips have progressed to more powerful but still energy-efficient SoCs. Although the chip-level innovation has already evolved significantly, more is still required as use cases become more complex, with more AI and ML workloads being processed locally on our devices.

Today Arm announced the spin-out of Cerfe Labs to develop and license new types of non-volatile memories based on correlated electron materials (CeRAM) and ferroelectric transistors (FeFETs). Arm CeRAM researchers will join Cerfe Labs and assume ownership of the Arm joint development project with Symetrix Corporation.

As part of the spin-out, Arm will transfer its full CeRAM IP portfolio of more than 150 patent families to Cerfe Labs that will be the foundation for a roadmap of related CeRAM technologies. Cerfe Labs initial focus will be on producing meaningful prototypes which will be licensed to partners with a goal of accelerating timing of enabling these novel non-volatile materials for systems.