Last week we brought you news of Ubisoft's hard three machine activation limit on Anno 2070 and how it scuppered a review by Guru3D when they swapped out graphics cards. Guru3D's post then went viral on the web and it appears that this has put sufficient pressure or 'heat' on Ubisoft to relax the restrictions just a tiny bit, since they weren't going to use any more Ubisoft games for benchmarks. So what have they done? Allowed an unlimited number of graphics card swaps. That's it, everything else stays the same, so if other components such as the CPU, motherboard etc are changed, then one will still run into this frustrating brick wall and have to get in touch with customer support to reset the activations.

TechPowerUp also published the latest version of ThrottleStop, a nifty utility that lets you monitor the CPU clock speed throttling scheme used by your notebook, and provides you with options to override or change it. This is particularly useful for noteboook users facing performance issues even when the notebook is plugged in, despite enabling Windows "high-performance" power scheme. The application's main window lets you perform both monitoring and tweaking, its left pane provides you with tweaking your CPU's power scheme using three methods, while its right pane lets you monitor the way in which your OS is throttling the CPU, down to the level of logical CPUs (threads).DOWNLOAD: ThrottleStop 4.0

Anno 2070's Draconian DRM: Guru3D's Graphics Card Review Killed Off (UPDATED)

Hilbert Hagedoorn of well-known PC tech review site guru3d.com recently bought a copy of Ubisoft's Anno 2070 and wanted to use it in one of his graphics card reviews. However, he became badly unstuck. This game comes on the Steam platform and the store page states: "3rd-party DRM: Solidshield Tages SAS 3 machine activation limit". Unfortunately for Guru3D, they found out exactly what this means, which resulted in just one performance graph, an aborted review, an unplayable game - and bad publicity for Ubisoft once again. They have published an article about their experience, pledging not to use their titles again because of this DRM.

Like with the Frio Snow Edition, Thermaltake's higher-end CPU air cooler, the Frio OCK, also has a Snow Edition variant. As a variant, its specifications are otherwise identical to the original, except that the black+red colored plastic parts (such as shrouds, fan frames, and impellers), are replaced with white+blue colored ones. The blue, of course, is an "icy" shade of it. The top shroud is black, to offer a nice contrast with the white+blue colored fan frame. Measuring 143 x 136.8 x 158.4 mm (LxWxH), the cooler weighs about 1.1 kg. It uses a slightly larger heatsink than the one found on the Frio, to which heat is conveyed by six 6 mm-thick heat pipes. The heatsink is ventilated by two 130 mm fans in "push-pull" configuration. The new variant also provides out-of-the-box support for LGA2011 socket.

Responding to the market's new-found love for white colored components, Thermaltake announced a few "Snow Edition" products, including the Frio Snow Edition, pictured below. This cooler uses the same exact design as the original version, but replaces the black+red plastic parts of it with white+blue, including a white colored fan impeller. It is a typical aluminum fin tower-type heatsink with two pre-fitted 120 mm fans in push-pull configuration. It measures 139 x 98 x 165 mm (LxWxH), weighing a little over 1 kg. Another feature of this cooler is out-of-the-box support for socket LGA2011.

Arctic showed of two nearly-identical CPU coolers, the Freezer i30 and Freezer A30. The two are identical till the point where the i30 is designed for Intel sockets only (LGA2011, LGA1155/1156), while the A30, for AMD sockets only (AM3+/AM3/AM2+/AM2). The two share a tower-type aluminum fin-stack heatsink design, capable of handling thermal loads of up to 320W.

The heatsink uses four 8 mm thick exposed-copper heat pipes that make direct contact with the CPU at the base, and pass through the heatsink, which is then ventilated by a 120 mm PWM-controlled fan with a fancy-looking frame. Rubber standoffs attach the fan to the heatsink dampening vibrations. The retention clips come attached to the heatsink out of the box. A 0.5g syringe of Arctic MX-4 compound is included, while the coolers' base don't come with the compound pre-applied.

AMD has been slapped with a lawsuit by Quanta for allegedly selling faulty CPUs & GPUs that were unfit for purpose, since they didn't meet specified heat tolerances and subsequently failed. Taiwan-based Quanta may not have a name that the general public immediately recognizes, however they are actually the world's largest contract manufacturer of notebooks, so this lawsuit is a big deal. They claim that the faulty parts were used in notebooks made for NEC. The lawsuit was filed in a district court in San Jose, California and in the filing, Quanta claims they have "suffered significant injury to prospective revenue and profits". As Bloomberg reports, "the lawsuit also claims breach of warranty, negligent misrepresentation, civil fraud and interference with a contract."

If you thought the overclocking and benchmark feats we reported on a few days ago here and here were impressive, wait until you see what four cards can do. Overclocking champion Shamino over at Kingpin Cooling has set four 3DMark and one Unigene benchmark record:

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA VB7009 embedded Mini-ITX board. Measuring only 17cm x 17cm, the VIA VB7009 Mini-ITX is an extremely flexible embedded board with top class functionality and performance for POS and kiosks.

The VIA VB7009 is a cost effective solution offering a broad range of power efficient VIA CPU choices, including the dual core VIA NanoTM X2 processor, providing superior flexibility to match customers' embedded computing needs. Paired with the VIA VX900 unified all-in-one media system processor, the VIA VB7009 Mini-ITX embedded board delivers a highly optimized platform that boasts stunning HD video performance of the most demanding video formats at resolutions of up to 1080p.

The Taiwan Criminal Investigation Bureau has been doing a bit of investigating and has arrested four engineers working for Intel's OEM partners (names not disclosed) for flogging Engineering Sample (ES) processors on eBay. ES processors are intended strictly for qualification testing purposes for development of new products by OEM's and are only loaned to them under strict non-disclosure agreements, hence putting these on eBay is illegal. The Bureau searched the suspects houses last month and found 178 ES CPU's, worth around $800,000. Note that this value seems to be somewhat high, as it would make each CPU worth around $4,500. We will update this article if new values come to light. Also, this is not a new operation that has been busted, since the suspects had admitted to selling around 500 ES CPU's since 2009. For their efforts, the fab four now face five years in prison.

It should be noted for anyone contemplating the purchase of such dodgy CPU's on eBay or similar places, that they may be overstressed and contain faults, due to the intensive and sometimes destructive testing they go through.

After extensive development work our newest product is on the market available. The Coollaboratory ALPHEOS Liquid Cooler offers by its perfectly co-ordinated aquifer system a brilliant cooling efficiency.

By the multiplicity of the superfine lamellas, which have a small distance too each other, results an extreme flow rate which dissolves the warm-restraining boundary layers. Thereupon the Coollaboratory ALPHEOS Liquid Cooler catapults itself into the best regions of all available water cooler at the market in the matter of cooling performance. It was provided on basis of computational fluid dynamics, therefore all death water zones were eliminated, which additionally affects the cooling performance positively.

Welcome to the first TechPowerUp news post of 2012! Read on for a couple of impressive overclocking feats with the HD 7970 graphics card.

It looks like the new AMD Radeon HD 7970 could be a bit of a dark horse and a lot more potent than its stock specifications would suggest - excellent for creating a competitive graphics card market. The reviews at stock speeds show the flagship HD 7970 to be around 10-15% faster than NVIDIA's flagship GTX 580, which doesn't seem all that impressive since the GTX 580 has been on the market for over a year now. However, what the reviews haven't really shown, is what kind of an overclocking monster the HD 7970 is. It definitely looks like AMD could have easily beaten the GTX 580 by a much bigger margin than they did, had they wanted to and it makes one wonder why they didn't.

VR-Zone have spent the New Year weekend overclocking this beast, having reached a whopping 1.26 GHz core clock speed with their HD 7970 - and decent benchmark improvements to go with it. Also, with the fan at 100%, the card never got above a very comfortable 68 degrees centigrade while running Furmark, which is amazing considering how this test is specifically designed to heat a graphics card to the max - but please see the update at the bottom of the article. The stock cooler may be noisy, but it's certainly very effective: an excellent result which will prolong the working life of the card.

Not quite two weeks ago, we reported on leaked pictures of AMD's upcoming Radeon HD 7770 mid-range graphics card based on the new Southern Islands architecture and listed its basic specs. Well, the leaks keep coming and bigpao007 of ChipHell has leaked more pictures with some benchmarks to go with them. The test setup consisted of an Ivy Bridge ES CPU - Core i5-3550K at 3.3Ghz and Z77 chipset-based motherboard. The driver used was the AMD Catalyst 8.940 RC2, giving the following 3DMark benchmark results:

Danger Den announced the release for sale the new highest performing CPU waterblock, the DD-M6 CPU Block with shipments beginning January 2nd, 2012.

The DD-M6 CPU Block replaces the long running MC-TDX block improving upon the performance and reliability. Thermal performance is significantly improved while maintaining a low flow restriction design. Available in solid copper and brass parts that are non-plated or nickel plated. A new and improved mounting system is also part of the DD-M6 CPU block package allowing reliable mounting pressure in an attractive package.

Welcome to the TechPowerUp 2011 PC technology Christmas special. We hope that you will enjoy reading it while tucking into your turkey, Christmas presents and a little too much wine... In this article, we go through the technology of 2011 that has had the most significance, the most impact and was generally the most talked about. It's not necessarily the best tech of 2011 which is the most significant though, since lemons can be just as significant as the ground-breakers in how they fail to deliver - and the backlash that goes with it.

January: Intel Sandy Bridge i5 & i7

Released on January 9th, the new Intel Core i5 & i7 processors were based on Intel's second generation Core architecture built on a 32 nm production process (HEXUS review). They included an IGP (Integrated Graphics Processor) physically on the same piece of silicon along with HyperThreading. These new dual and quad core processors soundly beat all previous generations of Intel processors in terms of processing performance, heat, power use, features and left AMD in the dust. Therefore, Intel badly needed some competition from AMD and unless you have been living under a rock, you will know how that turned out in October with the launch of Bulldozer. Sandy Bridge was a sound win and is generally considered to be the only architecture worth considering at this point. The i5-2500K is currently at the sweet spot of price/performance. It comes at a stock speed of 3.3 GHz, but typically overclocks to an amazing 4.5 - 5 GHz with a decent air cooler and without too much difficulty in getting there. Models in the budget i3 range were released at various times later. See this Wikipedia article for details.

The U.S. Army might be financing one of the most epic videos games ever made that very few people may ever play. The "game" is called Dismounted Soldier Training System and was commissioned by the U.S. government back in May for a staggering cost of 57 million dollars. The contract was awarded to RealTime Immersive Inc. All of this according to PC Gamer. Everything about this simulator is said to be cutting edge but the hardware it runs on. In a GamePro interview with the director of strategic programs at Intelligent Decisions, Floyd West is said to have stated, "With CryEngine 3 being used for Crysis 2 and the capabilities that game engine provides, it allows us to make the most realistic simulation possible. We're able to transport soldiers to accurately recreated locales like Afghanistan and Iraq, where we can simulate everything from visuals to 360-degree sound."

The virtual reality headsets the trainees wear will run from a backpack unit similar to a top of the range gaming laptop, called the 'Man Wearable Unit'. "While the man wearable units aren't running on an off-the-shelf Alienware, the internal components themselves are commercial off-the-shelf CPUs and GPUs like NVIDIA graphic cards and whatnot."

As this is an internal military training simulator we the public may never play it. However that doesn't mean we cannot watch the trailers in awe and wonder if our own rigs could render thousands of kilometers in such massive detail.

Trailer 1 | Trailer 2

Sharkoon presents another series of cases: Available in three color editions, the Sharkoon T28 offers a lot of space especially for hard drive installation, thankfully due to the removable hard drive cage, and also perfect for extra-long graphic cards.

Externally the Sharkoon T28 offers a black body and a rectilinear mesh front design. Power and Reset buttons are elegantly chromed. In regards to the front connectors, Audio In/Out stands ready between three USB2.0 ports and a USB3.0 interface. An acrylic window on the left side panel gives an insight into the interior of the colored mainboard tray. Choose from three color editions: Red, green, and for the first time after numerous customer suggestions, blue. Also, the operating and hard drive LEDs illuminate in the edition color as well as the three pre-installed 120 mm fans. Two fans rotate in the front, the third in the back. All possess a 4-pin power supply and a 3-pin mainboard connector.

Micron Technology, one of the biggest DRAM companies, has announced that it's working the JEDEC standards organization for computer memory, to standardize a new DRAM interface and die-stacking technology called three-dimensional stacking, or 3DS, which may be incorporated into the upcoming DDR4 standard. X-bit labs has a nice summary of how 3DS works:

The idea behind 3DS is to use specially designed and manufactured master-and-slave DRAM die, with only the master die interfacing with the external memory controller. 3DS technology uses optimized DRAM die, single DLL per stack, reduced active logic, single shared external I/O, improved timing, and reduced load to the external world. This combination of features can improve timing, bus speeds, and signal integrity while lowering both power consumption and system overhead for next-generation modules, according to Micron.

In 2012, Intel will update its processor lineup up to performance 2 tiers with new models based on the spanking new 22 nm "Ivy Bridge" silicon, which will increase performance over the current generation, and bring some new features to the table. In late November, a list of desktop Core i5/i7 models could be compiled, which were later confirmed on roadmap slides. CPU World compiled retail channel pricing of several of those Core i5/i7 "Ivy Bridge" chips. The prices look to be more or less consistent with current "Sandy Bridge" Core processors, which those chips are bound to replace. The Core i7-3770K, for example, which will replace the Core i7-2600K, will be similarly priced to it.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced Android support for VIA x86 embedded platforms, starting with support for the VIA EITX-3002 Em-ITX board. Running Android on an x86 platform offers increased flexibility, great multimedia support and cost saving advantages for embedded applications such as in-vehicle entertainment and interactive kiosks.

Key advantages for Android on x86 include leverage of Android development resources and existing apps, rich I/O flexibility, greater CPU performance as well as higher display resolutions of up to 1920 x 1080. In addition VIA has released SMART ETK, an Embedded Tool Kit which allows monitoring and control of peripheral devices through the Android OS, allowing for greater environmental control of kiosk and other installed environments.

Today Windows updater may have brought "Bulldozer" users a little surprise. A hotfix that increases the AMD flagship processors performance. As this "hotfix" is bleeding edge news any benchmarks have yet to be seen but this confirms Windows 7 was in fact hampering "Bulldozer" from performing at 100% in all prior benches. What percentage it was previously performing at has yet to be determined. Here is a small snippet from the Hotfix release notes.

This article introduces an update that optimizes the performance of AMD Bulldozer CPUs that are used by Windows 7-based or Windows Server 2008 R2-based computers. Currently, the performance of AMD Bulldozer CPUs is slower than expected. This behavior occurs because the threading logic in Windows 7 and in Windows Server 2008 R2 is not optimized to use the Simultaneous Multithreading (SMT) scheduling feature. This feature was introduced in the Bulldozer family of AMD CPUs.

You can download the Hotfix here.

Zalman took its first dip into water cooling after a while, with the CNPS20LQ, a self-contained (closed loop) CPU cooler. Designed and made originally by Asetek, a well-established brand name in OEM water cooling solutions, the CNPS20LQ uses a single-fan (dual-fan capable) radiator design. Its radiator measures 120 (W) x 158 (L) x 25 (H) mm. The radiator houses a small reservoir. The block houses a pump, which draws power from standard 4-pin CPU power header, and supports PWM control. The two are connected by flexible tubing. The block features a copper base with pre-applied thermal interface material. The CNPS20LQ supports all current socket types, including Intel LGA2011, LGA1155/1156, LGA1366, LGA775; AMD AM3+, FM1, and AM3/AM2+/AM2. It is priced at €69.90.

AMD's new Bulldozer "FX" series of processors may be very lacklustre performers in reviewer's benchmarks and have garnered considerable scorn in enthusiast circles, but they're a very good performer for AMD's bottom line. Incredibly, they are selling out as soon as shops get them in stock - and they are not even priced very competitively against Intel's offerings, so perhaps the "It's an 8 core CPU!!" marketing is working well on the uninformed "enthusiast" after all? Mind you, what enthusiast, however uninformed, wouldn't know exactly how these products perform? Every tech website and computer magazine has covered these chips by now. The mind boggles.

It looks like there's a subtle but relentless push to get ARM CPUs into desktop PCs. Morgan Stanley recently surveyed 30 PC makers (names not revealed) and discovered that 40% of them are interested in trying out ARM-based PCs within the next two years. As we reported previously that the Wintel alliance appears to be crumbling, this finding appears to add weight to that assertion. Of course, there's a huge mountain to climb before ARM processors can compete head to head with high performance x86, as explained in our article, not least because Microsoft won't begin supporting ARM until Windows 8 is released late next year and the fact that the vast majority of existing software won't run on ARM. A real catch-22 if ever there was one. Just as crucially, the many high performance enhancements and interface standards that currently go into making a modern x86 chip fly will also have to go into an ARM - and developing that isn't going to be cheap, although it may not take that long, since these are tried and trusted technologies that need to be applied. Still, the interest is there and Morgan Stanley expect that 10% (39 million) PCs, excluding tablets, will have an ARM processor at their heart. If true, it will make for interesting times.

Previous preliminary reports have suggested that the forthcoming Ivy Bridge CPUs will have single threaded performance on par with the existing Sandy Bridge CPUs and will mainly deliver improvements to power consumption and integrated graphics - nothing for PC enthusiasts to get excited about. However, in leaked documents sent to partners, Intel have now revealed official performance figures for IB and they look rather good. They've produced a raft of benchmarks, which reveal improvements such as 56% in ArcSoft Media Expresso, 25% in Excel 2010 and a 199% gain in the 3D Mark Vantage GPU benchmark. Unfortunately, they haven't released any benchmarks based on high performance 3D games, but it's probably safe to say that they will be similarly improved. Now, on to the benchmarks, which compare their new 3.4 GHz i7-3770 (4 cores + HT) with the current 3.4 GHz i7-2600, also with 4 cores + HT: