At VLSI Symposium 2023, scheduled to take place between June 11-16, Intel is set to demonstrate its PowerVia technology working efficiently on an E-Core chip built using the Intel 4 node. Conventional chips have power and signal interconnects distributed across multiple metal layers. PowerVia, on the other hand, dedicates specific layers for power delivery, effectively separating them from the signal routing layers. This approach allows for vertical power delivery through a set of power-specific Through-Silicon Vias (TSVs) or PowerVias, which are essentially vertical connections between the top and bottom surfaces of the chip. By delivering power directly from the backside of the chip, PowerVia reduces power supply noise and resistive losses, optimizing power distribution and improving overall energy efficiency. PowerVia is set to make a debut in 2024 with Intel 20A node.

For VLSI Symposium 2023 talk, the company has prepared a paper that highlights a design made using Intel 4 technology and implements E-Cores only in a test chip. The document states: "PowerVia Technology is a novel innovation to extend Process Scaling by having Power Delivery on the backside. This paper presents the pre and post silicon findings from implementing an Intel E-Core in PowerVia Technology. PowerVia enabled standard cell utilization of greater than 90 percent in large areas of the core while showing greater than 5 percent frequency benefit in silicon due reduced IR drop. Successful Post silicon debug is demonstrated with slightly higher but acceptable throughput times. The thermal characteristics of the PowerVia testchip is inline with higher power densities expected from logic scaling."

Intel is planning a major change in its client processor brand extensions with its next-generation mobile processors codenamed "Meteor Lake." The company is working to introduce the new Core Ultra brand extensions, where "Ultra" replaces the "i" in extensions such as i3, i5, i7, and i9 in some processor models. An example of such a brand extension would be the "Core Ultra 5 1003H." Ashes of the Singularity benchmark leaks of the processors surfaced on social media.

The benchmark also detects 128 EU (1,024 unified shaders) for the iGPU powering "Meteor Lake." If true, this iGPU could offer performance that's in the league of an Arc A380 discrete GPU, with some performance lost to the shared memory setup compared to the A380 with its dedicated graphics memory. The iGPU clock speed is detected to be 2.10 GHz, and having 4 MB of L2 cache, the last-level cache local to the Graphics Tile. The detection string for the iGPU as reported by its OpenCL ICD reads "Intel(R) Graphics i gfx-driver-ci-master-13736 DCH RI (1024S 128C SM3.0 2.1GHz, 4MB L2, 12.7GB)."

Armored Core VI: Fires of Rubicon, the latest high-octane action game by FromSoftware, Inc. and Bandai Namco Europe S.A.S. will release globally on August 25. Combining the 25 years of experience developing the ARMORED CORE franchise and action games in the Elden Ring, and Dark Souls franchise, Armored Core VI: Fires of Rubicon is full of mech action, including fast-paced battles, in-depth customization, and thrilling boss fights. The game is coming to PlayStation 5, PlayStation 4, Xbox Series X|S, Xbox One, and PC via Steam, and is now available to pre-order at participating retailers and on Bandai Namco Store.

A mysterious new substance called "Coral" was discovered on the remote planet, Rubicon 3. As an energy source, this substance was expected to dramatically advance humanity's technological and communications capabilities. Instead, it caused a catastrophe that engulfed the planet and the surrounding stars in flames and storms, forming a Burning Star System. Almost half a century later, Coral has resurfaced on Rubicon 3, a planet now contaminated and sealed off by the catastrophe. Extra-terrestrial corporations and resistance groups fight over control of the substance. The player infiltrates Rubicon as an independent mercenary and finds themselves in a struggle over the substance with the corporations and other factions.

Following on from yesterday's news of Meteor Lake's "Adamantine" L4 cache another leaky bit of information has popped up. A tipster on Twitter, Bionic_squash, has uploaded a slide from a supposedly official Intel presentation document, and it shows a small selection of Meteor Lake-S and Arrow Lake-S desktop CPUs, as well as the refreshed Raptor Lake-S series. The majority of recent leaks have pointed to laptop variants of Intel's fourteenth generation Core lineup, and not much has emerged about a desktop-dedicated range in a while - prompting further murmurs about Team Blue canning that side of things. The Meteor Lake-S family is still in the works according to the leaked chart and industry experts reckon that a product launch is due later in the year.

By looking closely at the chart, it shows that the Meteor Lake-S desktop processors are limited to 35 and 65 W TDPs, meaning that Core i3 and i5 lines are the only offerings within the 14th generation desktop lineup. Performance enthusiasts will need to look at the 15th gen Arrow Lake-S lineup - where the big i7 and i9 CPUs (up to 125 W) sit, or the refreshed Raptor Lake lineup which also offers a wide range of options - from i3 up to i9. Industry experts are a bit puzzled about Meteor Lake's prospects in the desktop processor sector - when considering a (speculated) skew to more entry-level and mid-range minded customers. Will Intel lose out by not offering more powerful variants, or are they working on a refreshed 14th generation product lineup for 2025?

Amid the push for technology independence, Chinese companies are pushing out more products to satisfy the need for the rapidly soaring demand for domestic data processing silicon. Today, we have information that Chinese Loongson has launched a 3D5000 CPU with as many as 32 cores. Utilizing chiplet technology, the 3D5000 represents a combination of two 16-core 3C5000 processors based on LA464 cores, based on LoongArch ISA that follows the combination of RISC and MIPS ISA design principles. The new chip features 64 MB of L3 cache, supports eight-channel DDR4-3200 ECC memory achieving 50 GB/s, and has five HyperTransport (HT) 3.0 interfaces. The TDP configuration of the chip is officially 300 Watts; however, normal operation is usually at around 150 Watts, with LA464 cores running at 2 GHz.

Scaling of the new chip goes beyond the chiplet, and pours over into system, as 3D5000 supports 2P and 4P configurations, where a single motherboard can become a system of up to 128 cores. To connect them, Loongson uses a 7A2000 bridge chip that is reportedly 400% faster than the previous solution, although we have no information about the last chip bridge. Based on the LGA-4129 package, the chip size is 75.4x58.5×6.5 mm. Regarding performance, Loongson compares it to the average Arm chip that goes into smartphones and claims that its designs are up to four times faster. In SPEC2006, performance reaches 425 points, while maintaining a single TeraFLOP at dual-precision 64-bit format. On the other hand, the processor was built for security, as the chip has a custom hardware-baked security to prevent Spectre and Meltdown, has an on-package Trusted Platform Module (TPM), and has a secret China-made security algorithm with an embedded custom security module that does encryption and decryption at 5 Gbps.

ASUS today announced refreshed models in the ultralight, kilogram-class ExpertBook B5 laptop series—ExpertBook B5 (B5402C) and ExpertBook B5 Flip (B5402F).

Available in both traditional clamshell and 360°-convertible forms for the ultimate in portability, flexibility and clarity, the latest ExpertBook B5 models feature expansive 14-inch displays and are packed with the latest high-performance and enterprise-grade security technologies, including up to a 13th Gen Intel Core i7 processor with Intel vPro support and Intel Iris Xe graphics, optional TPM 2.0, both face and fingerprint login, a physical webcam shield, AI noise cancelation for crystal-clear conferencing, ASUS NumberPad for fast data input and, with ExpertBook B5 Flip, a quick-charging garaged stylus.

Introducing the Xbox Elite Wireless Controller Series 2 - Core, now in red and blue. We expanded the core version of the Xbox Elite Series 2 lineup to give gamers more options to play like a pro. Play in style with just the components you need to unleash your best game. The new, vibrant red and blue color schemes of the core version of Xbox Elite Series 2 are sure to make a statement amongst your friends while delivering key performance-focused benefits.

Turn on a dime with adjustable tension thumbsticks where inches are the difference. Make split seconds count with hair trigger locks and stay on target with wrap-around rubberized grips. Enjoy limitless customization with exclusive button mapping options to find your groove. Perfect your game day prep with assignable custom profiles so you can dominate regardless of playbook or sport.

Today at the Amplify Partner Conference, HP Inc announced its latest line-up of gaming hardware and software designed to bring gamers everything they need to enjoy the games they love. The new OMEN Transcend 16 Laptop, OMEN 16 Laptop, Victus 16 Laptop, and a vast range of stunning OMEN monitors offer casual, hobbyist, lifestyle, and hardcore gamers the power and flexibility to play and work hard. To bring everything together, new enhancements in OMEN Gaming Hub offer a variety of performance and personalization features.

People everywhere seek devices that can adapt to hybrid play and work. Sixty-two percent of gamers prefer a PC that fits their entire life instead of being used for gaming only. With a billion new gamers entering the space in the last seven years and 84 percent of them using games to connect with others with similar interests, gaming devices enable access to countless games and corresponding communities.

For more than a decade, Intel and its partners have been on a mission to virtualize the world's networks, from the core to the RAN (radio access network) and out to the edge, moving them from fixed-function hardware onto programmable, software-defined platforms, making networks more agile while driving down their complexity and cost.

Now operators are looking to cross the next chasm in delivering cloud-native functionality for automating, managing and responding to an increasingly diverse mix of data and services, providing organizations with the intelligence needed at the edge of their operations. Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).

Back in January, Intel officially increased the price of its 12th Gen Core processors by 10 percent, a move that was thought to help push the 13th Gen Core processors in retail. Here we are, barely a month later and Intel is now said to be cutting the price on said 12th Gen Core processors by as much as 20 percent. The report comes from DigiTimes in Taiwan and should as such be taken with a pinch of salt, but apparently the higher-end SKUs are expected to see the biggest price cuts.

Twitter user @harukaze5719 has put together a cheat sheet that gives us an easy overview on what we might be able to expect, if the 20 percent price cut is done across the board. This should make Intel's 12th Gen Core processors quite attractive price wise, as all models would end up selling for much less than they did before the 10 percent price increase. This would give Intel some extra leverage over AMD, which might be forced to lower its prices in turn, to be able to stay competitive.

SUS IoT, the global AIoT solution provider, today announced PE3000G—the industry's first edge AI system to support Mobile PCI Express Module (MXM) GPUs from both NVIDIA and Intel. Specifically, the all-new industrial PC works seamlessly with NVIDIA Ampere/Turing or Intel Arc A-series MXM GPUs. Powered by a 12th Gen Intel Core processor and up to 64 GB of DDR5 4800 MHz memory, and combining a proven power design, guaranteed and fanless thermal performance, and superior physical and mechanical ruggedness, PE3000G brings unprecedented longevity, computing power, flexibility and reliability to AI computing at the edge—making it an ideal option for scenarios where resilience, longevity and both CPU and GPU scalability are paramount.

"PE3000G is ASUS IoT's response to the burgeoning demand for accelerating AI inference and extreme deployment in industrial settings," commented KuoWei Chao, General Manager of the ASUS IoT business unit. "With robust power, thermal and mechanical design, it pushes versatile edge-AI-inference applications to business-critical applications. PE3000G is an ideal fit to accelerate edge AI inference in SWaP-constrained applications, such as machine vision in factory automation, outdoor surveillance system and AI-inference systems for autonomous vehicles."

Intel's Xeon processors feature a wide range of embedded functionalities that the company has developed over the years. One such is the Virtual RAID on CPU (VROC) that enabled the functionality of an NVMe RAID card on the CPU, simplifying the installation, cost, and maintenance of high-performance storage arrays. Debuting in 2017, it is present in some consumer-facing Core models and Xeon Scalable platforms where it sees the highest usage. However, on January 6, Intel posted a product change notice that notified the users that the VROC function would be discontinued, with the last orders being placed on January 23 and the last shipping with VROC being made on March 31. This caused confusion, especially in the enterprise sector, which utilizes Intel Xeon processors for their workloads and storage arrays.

Tom's Hardware has reached out to Intel for clarification and got the following statement:

Intel SpokespersonThe PCN [Product Change Notice] was prematurely posted while the decision was under evaluation. After discussing with the ecosystem and customers we realize there is significant demand for this product and intend to continue to support it.

ASUS today announced the all-new TUF Gaming A16 Advantage Edition, an all-AMD gaming laptop with a redesigned chassis and an incredibly immersive 16-inch display. The TUF Gaming A15, A17, F15 and F17 laptops also make a triumphant return, sporting the latest silicon from AMD, Intel, and NVIDIA to power players into the next generation of gaming performance.

TUF A16 Advantage Edition announced
Built for serious gaming with subtle styling, the TUF Gaming A16 Advantage Edition is a sleek gaming laptop built to demolish the competition. Powered completely by AMD, the TUF Gaming A16 features up to an AMD Ryzen 9 Zen 4 processor and AMD Radeon RDNA 3 mobile graphics. "AMD and ASUS have partnered to deliver our latest 'Zen 4' and RDNA 3 technologies into the most innovative form factors," said Jason Banta, CVP and GM OEM PC. "The TUF Gaming A16 Advantage Edition delivers blistering gaming performance and outstanding power efficiency in a sleek portable chassis."

ASUS today announced Zenbook 14 Flip OLED (UP3404), the latest and most powerful 14-inch model in its premium thin-and-light convertible Zenbook Flip series. The elegant and versatile Zenbook 14 Flip OLED offers new levels of performance from its 13th Gen Intel Core processors, Intel Iris Xe integrated graphics, up to 1 TB PCIe SSD, 16 GB of RAM and a long-lasting 75 Wh battery. For easy I/O, there are two Thunderbolt 4 ports, a USB 3.2 Type-A port, and an HDMI 2.1 (TMDS) port. Fast and stable WiFi 6E (802.11ax) ensures reliable wireless connectivity.

Superb visuals are provided by the enlarged 14-inch 16:10 2.8K OLED touchscreen, which is PANTONE Validated and has a 100% DCI-P3 gamut. It's also TÜV-certified for eye care, and supports an optional ASUS Pen 2.0 MPP 2.0 stylus. The compact Zenbook 14 Flip OLED is just 15.9 mm thin and weighs only 1.5 kg, with a 360° any-position hinge. Thoughtful design features include an ambient light color sensor that automatically adjusts brightness and color temperature, and enables adaptive dimming to help maintain OLED display longevity. There's also an IR camera for fast face login.

Acer today expanded its ChromeOS product line with the new Acer Chromebox CXI5 and Chromebox Enterprise CXI5. It also announced the Acer Add-In-One 24, a modular all in one solution consisting of either the Acer Chromebox CXI5 or the Acer Chromebox Enterprise CXI5 and a 24-inch FHD docking monitor. Both solutions help businesses and commercial institutions streamline space and simplify maintenance, upgrades, and repairs, resulting in less downtime and long-term cost savings.

"These new ChromeOS-based Acer systems are excellent choices for businesses and institutions that require reliable computers that are easy to setup, use, and manage while making the most of limited space environments," said Jeff Lee, General Manager, Stationary Computing, IT Products Business, Acer Inc. "Outfitted with the latest technology, including Intel vPro and integrated malware protection, these powerful devices are able to support the multitasking capabilities and tight security required in organizations today."

LG Electronics (LG) is introducing an expanded LG gram lineup, which offers more diversity than ever thanks to the arrival of the exciting, new gram Ultraslim and gram Style, at CES 2023. LG gram continues to provide both power and portability, packing premium specs into sleek, ultra-lightweight form factors delivering take-anywhere convenience and exceptional user experiences.

LG gram Ultraslim
Headlining the LG gram showcase at CES 2023 is the brand-new LG gram Ultraslim (model 15Z90RT), the thinnest gram model yet. A laptop designed for users seeking supreme portability, the Ultraslim has an ultra-light weight of just 998 grams and a depth (when closed) of only 10.99 millimeters; around the same thickness of a smartphone or notepad. Even though it is the most svelte gram in the 2023 lineup, the 15Z90RT still supplies impressive image quality and processing power, packing a 15.6-inch OLED display with Anti-glare Low Reflection (AGLR) coating and Intel 's 13th Gen Raptor Lake chip with Performance Cores (P-Cores). Further enhancing the excellent portability of the new model is the inclusion of an ultra-compact adapter.

GIGABYTE TECHNOLOGY Co. Ltd, the world's leading brand of personal computers, is introducing new members of the AERO Creator Laptop Series with the 13th Gen. Intel Core Processors and NVIDIA GeForce RTX 40 Series Laptop GPUs: AERO 16 OLED and AERO 14 OLED. As the world is lifting lockdown restrictions, the wheels of the world economy have been revived toward the path of recovery. However, post-pandemic work patterns have become the new norm. Consumers' screen time is prolonged due to hybrid work patterns and working from home, whereas the frequency of business trips has also been rising.

GIGABYTE conducted in-depth analyses about the criticality of screens for creators on the move, which leads to the development of OLED eye-protection laptops with the world's strictest dual color calibration. With the new laptops, consumers will not only get to enjoy the visual feasts but also be prepared for highly productive creation processes. The GIGABYTE AERO Series has been targeting creators, designers, and office workers, offering strict color accuracy, low blue light eye-protection technology, and lightweight for high mobility as its main features. In terms of product design, after undergoing 88 CNC forging processes, the thorough tempering gives the laptop an exquisite appearance, elegant like a masterpiece of fine art. The "Illusory Iridescent" design concept added more quality details to the silky smooth texture, bringing a touch of aesthetic and inspiration to all work hours. The practicality of the creator laptops is once again elevated and now graced with a sleek artistic sense.

The 13th Gen Intel Core desktop processor family has overtaken the longstanding processor overclocking frequency world record. In less than three months, the Intel Core i9-13900K has twice set the frequency overclocking world record.

The ASUS overclocking team officially set a new world record for overclocking, pushing the 13th Gen Intel Core i9-13900K past the 9 gigahertz barrier to 9.008 GHz. Additionally, the team set new records in PIFAST (6.85 seconds) and SUPERPI 1M (3.822 seconds). Combining the Core i9-13900K with the ROG MAXIMUS Z790 APEX - and a healthy dose of liquid helium - the ASUS overclocking team became the latest to showcase the unprecedented overclocking performance in Intel's unlocked processors. Working with partners like ASUS, Intel continues to provide desktop enthusiasts and gamers with the best processors and features for overclocking in the PC industry.

ASUS today announced Mini PC PL64, an industrial mini PC featuring a fanless design and powered by up to a 12th Generation Intel Core i7 (15 W) processor. Each PL64 unit has been subjected to a battery of reliability tests, and the fanless design ensures optimal performance even in ambient temperatures of up to 50°C. This mini PC features dual LAN ports, including 2.5 Gbps Ethernet, dual COM ports, five USB ports, along with triple 4K display support at 60 Hz.

Mini PC PL64 employs a new, almost-silent fanless design that minimizes dust ingress into the chassis to prolong product life. The fanless design and 15-watt CPU support make PL64 ideal for industrial applications where reliability, durability, and low noise are paramount. The cooling system in PL64 efficiently dissipates heat, enabling this mini PC to be deployed in hot environments reaching 50°C.

The Core product line takes shape with the new coolers in the usual high quality, excellent performance and functional design language. The heart of the copper cooler is an assembly of connector terminal and cooler, which is milled from one piece of copper. The fine workmanship combined with the hard and resistant chrome plating of the entire copper cooler meet the highest quality standards. The brass G1/4" threads integrated on both sides, also chrome-plated, stand out visually striking from the terminal and are one of the key points of the new design language that will be present in all products of the Core series.

The aluminium backplate matched to the design together with the terminal forms a single unit. It convinces with clear and homogeneous optics on the back of the cooler. The individually controllable lighting consists of digitally addressable RGB LEDs and enables the even and colorful illumination of the entire cooler.

According to the well-known hardware leaker @momomo_us, HP is preparing the launch of its next-generation Omen 17 gaming laptops. And with a new generation of chips coming to consumers, HP accidentally made some information about laptop SKUs public. Four models are listed, and they represent a combination of Intel's 13th-generation Raptor Lake mobile processors with NVIDIA's Ada Lovelace RTX 40 series graphics cards for the mobile/laptop sector. The four SKUs are: CM2007NQ/CM2005NQ with Core i7-13700HX & RTX 4060 8 GB; CM2001NQ with Core i7-13700HX & RTX 4070 8 GB; CK2007NQ/CK2004NQ with Core i7-13700HX & RTX 4080 12 GB; CK2001NQ with Core i7-13700HX & RTX 4090 16 GB.

The most exciting find here is the appearance of the xx90 series in the mobile/laptop form factor, which has not been the case before. The GeForce RTX 4090 laptop edition is supposedly equipped with 16 GB of VRAM, and the GPU SKU should be a cut-down version of AD102 GPU adjusted for power and clock constraints so it can run within a reasonable TDP. With NVIDIA seemingly giving its clients an RTX 4090 SKU option, we have to wait and see what the CUDA core counts are and how clocks scale in a more restricted laptop environment.

Intel Core i9-13900K processor has just been launched, and overclockers worldwide got their hand on a few samples to make history. According to the HWBot submission, a Swedish overclocker named "elmor" has pushed Intel's top-end consumer SKU to a fantastic 8.812 GHz. For more than eight years, the record for the single-highest overclocking speed was held by AMD FX-8370, from the now-bygone era of AMD Black Edition processors. The overclocking attempt was performed using liquid nitrogen (LN2) that cools the chip using its −195.8 °C temperature. Pushing core voltage to 1.850 Volts and VCCIN to 2 Volts, multiplier set to x88, and a bus speed of 100.15 MHz. In addition to the Core i9-13900K CPU, elmor used ASUS ROG Maximus Z790 APEX motherboard and 32 GB DDR5 GSKILL memory running at 4808 MT/s.

As a reminder, the FX-8370 CPU was holding the number one sport for eight years with a speed of 8.722 GHz. Beating the FX-8370 by just 90 MHz, it will be interesting to see if any of the upcoming CPU SKUs can match this overclocking record, and we are curious if any contender will come to beat elmor's current record.

Intel's upcoming 13th generation of Core processors, codenamed "Raptor Lake," is supposed to arrive in the coming days. Apparently, one user pre-ordered the CPU and got it delivered to their home. Pictured below is the box of Intel Core i9-13900KF CPU. This SKU comes without integrated graphics and boasts eight P-cores with 16 E-cores on board. This is supposed to boost performance, along with the higher frequencies Raptor Lake is advertised to bring. The user even showed screenshots of proof that the software recognizes this upcoming model, so the information seems legit. In the screenshots below, we see that the P-cores of this SKU is reaching 5.5 GHz clock speeds. We are yet to see how much this silicon is capable of; however, the frequency alone looks promising.

Yesterday Intel announced its 13th generation Raptor Lake processor lineup. The top-of-the-line model, Core i9-13900KS, features eight P-cores and 16 E-cores for a total of 24 cores in the SoC. However, that may not represent the maximum for Raptor Lake, as there appears to be another segment equipped with a Raptor Lake processor with 34 cores. According to findings of Tom's Hardware, the Intel Innovation event in San Jose had a surprise for everyone, as there was a booth to display Raptor Lake silicon wafers. After closer examination, the wafer had cutouts for dies that contained as many as 34 cores.

With all cores being the same size, it is assumed that those are P-cores interconnected on a mesh, unlike the traditional ring bus that the rest of Raptor Lake processors use. On the back of the wafer was a label stating, "Raptor Lake-S, 34 core". This suggests that the CPU is perhaps a part of the HEDT offerings that Intel will soon update with the 13th generation designs and that the company showcased a production wafer for those SKUs. We expect to hear more about this unknown 34-core configuration sometime in the future as the new Intel Core generation begins its rollout.

Today, Intel introduces a new processor for the essential product space: Intel Processor. The new offering will replace the Intel Pentium and Intel Celeron branding in the 2023 notebook product stack.

"Whether for work or play, the importance of the PC has only become more apparent as the torrid pace of technological development continues to shape the world. Intel is committed to driving innovation to benefit users, and our entry-level processor families have been crucial for raising the PC standard across all price points. The new Intel Processor branding will simplify our offerings so users can focus on choosing the right processor for their needs." -Josh Newman, Intel vice president and interim general manager of Mobile Client Platforms