In celebration of Pi Day, OnLogic, a global industrial computing manufacturer and solution provider known for their reliable, orange industrial PCs, has announced that their new Factor 201 Raspberry Pi-powered device is available for pre-order. In addition, they've released more details about the next model in the Factor 200 Series, the Factor 202. Both devices are powered by the Raspberry Pi Compute Module 4, which was developed specifically for industrial products.

"We're delighted that OnLogic has chosen to develop the Factor 201 around Raspberry Pi. Using Raspberry Pi Compute Module 4 with their custom-designed carrier boards and industrial enclosure has allowed OnLogic to offer their customers flexible and reliable solutions, and we see Raspberry Pi hardware being increasingly widely adopted in industry with products like this one," said Gordon Hollingworth, Chief Product Officer at Raspberry Pi Ltd.

Today Razer launched the RazerStore Rewards program, which offers gamers even more opportunities to earn Razer Silver with every purchase at Razer.com or any of the RazerStores around the world*. Razer Silver is Razer's loyalty rewards program designed for gamers worldwide. Gamers can rack up Razer Silver across multiple Razer platforms - whenever they play on Razer Cortex, recharge games with Razer Gold, and now with every spend on Razer.com and at RazerStores.

Razer Silver can be redeemed for a plethora of Razer gear as well as entertainment and gaming credits across 300+ content titles, including PUBG and Mobile Legends: Bang Bang. With the addition of RazerStore Rewards, gamers can now enjoy a more seamless redemption experience and rack up more Razer Silver to redeem prized rewards such as the Razer Iskur or Enki gaming chairs.

MediaTek today launched its Dimensity 9000 5G smartphone chip for next-generation flagship smartphones, and announced device maker adoption and endorsements from some of the world's biggest smartphone brands, including OPPO, vivo, Xiaomi and Honor. The first Dimensity 9000 powered flagship smartphones will be in the market in the first quarter of next year. The Dimensity 9000 - the world's first smartphone built on the ultra-efficient TMSC N4 (4 nm-class) production process - leads the industry in computing performance, gaming, imaging, multimedia and connectivity innovations.

"The Dimensity 9000 is a milestone for MediaTek, highlighting our rise to incredible with a true flagship 5G smartphone chip. This chip signals MediaTek and our Dimensity family has entered a new phase of innovation," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business Unit. "The Dimensity 9000 is the most powerful and energy-efficient chip to date, delivering a number of industry firsts and a full suite of features for the most discerning tech enthusiasts."

A few years ago, MediaTek decided to leave the high-end mobile device SoC space as it decided to focus on the mid-range and entry level market, but as of today, that is no longer the case. The company has announced its new flagship Dimensity 9000 SoC and it packs all the latest cutting edge mobile SoC features you'd expect to see.

The Dimensity 9000 is based entirely on the new Arm v9 architecture and the chip itself is built in TSMC's 4 nm node, which gives MediaTek a lead on all its competitors, but Apple. As for the Arm cores in question, the main core is a Cortex-X2 at 3.05 GHz, which is accompanied by three Cortex-A710 cores at 2.85 GHz and four power efficient Cortex-A510 cores at 1.8 GHz. All of these new Arm cores were only announced at the end of May this year, so MediaTek has clearly been burning the midnight oil to get the Dimensity 9000 out before its competitors' new chips based on the Arm v9 architecture.

It's been nearly six years since we unleashed the $5 Raspberry Pi Zero on an unsuspecting world. Of all the products we've launched, Zero is still the one I'm proudest of: it most perfectly embodies our mission to give people access to tools, and to eliminate cost as a barrier. We've sold nearly four million units of Zero, and its $10 wireless-enabled big brother Zero W, and they've made their way into everything from smart speakers to hospital ventilators. But where our larger products have grown steadily more powerful over the years, we've never found a way to pack more performance into the Zero form factor. Until today.

Priced at $15, Raspberry Pi Zero 2 W uses the same Broadcom BCM2710A1 SoC die as the launch version of Raspberry Pi 3, with Arm cores slightly down-clocked to 1GHz, bundled into a single space-saving package alongside 512 MB of LPDDR2 SDRAM. The exact performance uplift over Zero varies across workloads, but for multi-threaded sysbench it is almost exactly five times faster.

AAEON, an industry leader in Edge Computing solutions, announces the SRG-3352C Compact Edge IoT Gateway System. The SRG-3352C brings reliable, cost effective gateway operations with expandability and wireless communication support designed to quickly deploy edge networks in a variety of environments.
The SRG-3352C builds upon the features, durability and reliability of the SRG-3352 Edge IoT Gateway System with expanded support for more connections and wireless communications. All of this is packed into a compact form factor that makes deploying the SRG-3352C even easier, powering more flexible edge network deployments.

The SRG-3352C is powered by the Arm Cortex-A8 800 MHz RISC processor. This innovative processor reduces the energy requirements of the system, allowing for a more efficient system to help save electricity costs. While powerful enough to connect edge networks together, the low energy usage can help cities with achieving green energy goals, and even allow the system to operate on solar power or batteries. It also eliminates the need for dedicated heatsinks, allowing the system to operate in wider temperatures, from 0°C up to 60°C without loss in performance.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the Exynos 2100 through its first virtual event, Exynos On 2021. The new mobile processor is the company's first premium 5G-integrated mobile processor built on the most advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node.

The chip's computation and graphic processing performance have been improved and refined to surpass the power user's performance expectations. As Samsung's first 5G-integrated flagship mobile processor, the Exynos 2100 is built on an advanced 5 nm EUV process technology that allows up to 20-percent lower power consumption or 10-percent higher overall performance than the 7 nm predecessor. For further enhancement, the chip offers improved cache memory utilization and a stronger scheduler. The octa-core CPU comes in an improved tri-cluster structure made up of a single powerful Arm Cortex -X1 core that runs at up to 2.9 GHz, three high-performing Cortex-A78 cores and four power-efficient Cortex-A55 cores delivering more than 30-percent enhancement in multi-core performance than the predecessor.

In the past few years, the Windows-on-Arm (WoA) market has gotten some momentum has with companies trying to develop their WoA PCs, primarily laptops. One example of that is Microsoft. The company has launched a Surface notebook powered by a custom chip from Snapdragon, called Surface Pro X. This device is being powered by the Snapdragon SQ2 processor. However, what seemed to be missing for a while was the lack of support from the Arm itself for this type of market. That is what the company decided to change and make a brand new processor IP dedicated to "on-the-go" devices as they call it, translating into laptops.

The Cortex-A78C is a new design direction which Arm thinks is a good way for laptops, to get some more serious work done. Unlike the regular Cortex-A78 which is a heterogeneous design of big and little cores (Arm's famous big.LITTLE architecture), the new Cortex-A78C revision aims to change that. The "C" version of the processor is actually a homogeneous structure made up of all the big cores. Where you would typically use four big and four little cores for a design, Arm has decided to go all big with this design. For multithreaded purposes, this is the right decision to boost performance. The level three (L3) cache has seen a boost as well, translating to 8 MB of L3$ found on the die. We are eagerly awaiting to see the first designs based on this configuration and see how it performs.

Editor's Note: This is written by Arm vice president and general manager Paul Williamson.

Over the last year, I have been inspired by the innovators who are dreaming up solutions to improve and enrich our daily lives. Tomorrow's mobile applications will be even more imaginative, immersive, and intelligent. To that point, the industry has come such a long way in making this happen. Take app stores for instance - we had the choice of roughly 500 apps when smartphones first began shipping in volume in 2007 and today there are 8.9 million apps available to choose from.

Mobile has transformed from a simple utility to the most powerful, pervasive device we engage with daily, much like Arm-based chips have progressed to more powerful but still energy-efficient SoCs. Although the chip-level innovation has already evolved significantly, more is still required as use cases become more complex, with more AI and ML workloads being processed locally on our devices.

Today, Arm unveiled new computing solutions to accelerate autonomous decision-making with safety capability across automotive and industrial applications. The new suite of IP includes the Arm Cortex -A78AE CPU, Arm Mali -G78AE GPU, and Arm Mali-C71AE ISP, engineered to work together in combination with supporting software, tools and system IP to enable silicon providers and OEMs to design for autonomous workloads. These products will be deployed in a range of applications, from enabling more intelligence and configurability in smart manufacturing to enhancing ADAS and digital cockpit applications in automotive.

"Autonomy has the potential to improve every aspect of our lives, but only if built on a safe and secure computing foundation," said Chet Babla, vice president, Automotive and IoT Line of Business at Arm. "As autonomous decision-making becomes more pervasive, Arm has designed a unique suite of technology that prioritizes safety while delivering highly scalable, power efficient compute to enable autonomous decision-making across new automotive and industrial opportunities."

Ten years ago, Arm set its sights on deploying its compute-efficient technology in the data center with a vision towards a changing landscape that would require a new approach to infrastructure compute.

That decade-long effort to lay the groundwork for a more efficient infrastructure was realized when we announced Arm Neoverse, a new compute platform that would deliver 30% year-over-year performance improvements through 2021. The unveiling of our first two platforms, Neoverse N1 and E1, was significant and important. Not only because Neoverse N1 shattered our performance target by nearly 2x to deliver 60% more performance when compared to Arm's Cortex-A72 CPU, but because we were beginning to see real demand for more choice and flexibility in this rapidly evolving space.

There is expected to be more than 79 zettabytes of IoT data in 2025, but the real value of this data is found in the insights it generates. The closer to the data source we can produce these insights the better, because of the improved security, latency and energy efficiency enabled. Computational storage is emerging as a critical piece of the data storage puzzle because it puts processing power directly on the storage device, giving companies secure, quick and easy access to vital information.

Our expertise and legacy in storage puts Arm in a strong position to address the changing needs of this market - with around 85% of hard disk drive controllers and solid-state drive controllers based on Arm, we are already a trusted partner for billions of storage devices. Today, we're announcing Arm Cortex-R82, our first 64-bit, Linux-capable Cortex-R processor designed to accelerate the development and deployment of next-generation enterprise and computational storage solutions.

Samsung Electronics has reportedly laid out a plan to become the number one Android application processor (AP) vendor in the industry with its plan to join forces with AMD and Arm. The report of Business Korea indicates that Samsung wants to use both company's knowledge and IP to produce the best possible silicon. In early November of last year, Samsung has decided to shut down its division responsible for making custom CPU designs, and to start licensing IP from Arm. Also last year, Samsung has announced a strategic partnership with AMD to use its RDNA graphics processors in smartphones.

So Samsung plans to license IPs from both companies and just put them in SoC that will be up to the task to deliver the best performance, as the company predicts. The CPU is reportedly going to be based on Arm's Cortex-X custom design that should deliver high-performance Samsung wants. In the past, the company had some problems with the heat-management of its CPUs as they were designed a bit inefficiently. To cover everything, Samsung also plans to increase the number of employees working on a neural processing unit (NPU) and make a good performing NPUs as well, to combine with the rest of IPs.

MediaTek, the world's 4th largest global fabless semiconductor company, today launched its newest chips in the smartphone gaming-focused G series - the MediaTek Helio G25 and G35. The latest chips feature MediaTek HyperEngine game technology for faster, smoother performance, enhanced power efficiency, and brilliant graphics.

The new chipsets always keep you connected and deliver the lowest latency gaming experience. They also offer enhanced imaging features, making these G-series chipsets a perfect fit for photography enthusiasts and gamers alike.

Last year Samsung and AMD announced their collaboration which promises to deliver smartphone chips with AMD RDNA 2 graphics at its heart. This collaboration is set to deliver first products sometime at the beginning of 2021 when Samsung will likely utilize new SoCs in their smartphones. In previous leaks, we have found that the GPU inside this processor is reportedly beating the competition form Qualcomm, where the AMD GPU was compared to Adreno 650. However, today we have obtained more information about the new SoC which is reportedly called "Ryzen C7" smartphone SoC. A new submission to a mobile phone leaks website called Slash Leaks has revealed a lot of new details to us.

The SoC looks like a beast. Manufactured on TSMC 5 nm process, it features two Gaugin Pro cores based on recently announced Arm Cortex-X1, two Gaugin cores based on Arm Cortex-A78, and four cores based on Arm Cortex-A55. This configuration represents a standard big.LITTLE CPU typical for smartphones. Two of the Cortex-X1 cores run at 3 GHz, two of Cortex-A78 run at 2.6 GHz, while four little cores are clocked at 2 GHz frequency. The GPU inside this piece of silicon is what is amazing. It features four cores of custom RDNA 2 based designs that are clocked at 700 MHz. These are reported to beat the Adreno 650 by 45% in performance measurements.

MediaTek today announced the Dimensity 820 system-on-chip (SoC) which is optimized for premium user experiences. The Dimensity 820 delivers ultra-fast 5G speeds, and is feature-packed with MediaTek's latest multimedia, AI and imaging innovations.

"Our Dimensity 1000 is already powering impressive flagship 5G devices in a number of markets. With the new Dimensity 820, we're now making 5G much more accessible," said Dr. Yenchi Lee, Assistant General Manager of MediaTek's Wireless Communications Business Unit. "The Dimensity 820 stands out beyond competitors by offering four high-performance Arm Cortex-A76 cores at 2.60 GHz within its octa-core CPU, delivering superb performance and responsiveness, among its incredible AI, gaming and photography experiences."

UNISOC, a leading global supplier of mobile communication and IoT chipsets, today officially launched its new-generation 5G SoC mobile platform - T7520. Using cutting-edge process technology, T7520 enables an optimized 5G experience with substantially enhanced AI computing and multimedia imaging processing capabilities while lowering power consumption.

T7520 is UNISOC's second-generation 5G smartphone platform. Built on a 6 nm EUV process technology and empowered by some of the latest design techniques, it offers substantially enhanced performance at a lower level of power consumption than ever.

Today, Arm announced significant additions to its artificial intelligence (AI) platform, including new machine learning (ML) IP, the Arm Cortex -M55 processor and Arm Ethos -U55 NPU, the industry's first microNPU (Neural Processing Unit) for Cortex-M, designed to deliver a combined 480x leap in ML performance to microcontrollers. The new IP and supporting unified toolchain enable AI hardware and software developers with more ways to innovate as a result of unprecedented levels of on-device ML processing for billions of small, power-constrained IoT and embedded devices.

MediaTek today unveiled Dimensity, MediaTek's family of powerful 5G system-on-chips (SoCs) offering an unrivaled combination of connectivity, multimedia, AI and imaging innovations for premium and flagship smartphones.

The MediaTek Dimensity 5G chipset family brings smart and fast together to power the world's most capable 5G devices. Dimensity represents a step toward a new era of mobility - the fifth dimension - to spur industry innovation and let consumers unlock the possibilities of 5G connectivity.

Logitech has announced an upgraded, improved model of their legendary G502 mouse, in a Lightspeed edition. Ignoring the quantum implications of having a mouse that moves at lightspeed on your palm, the new, updated G502 features Logitech's Latest, in-house Hero 16K sensor: up to 16,000 DPI processed by a 32-bit ARM Cortex-M-based SoC. Logitech says their wireless performance in their proprietary Lightspeed technology is comparable to that of a wired solution, offering 1 ms lag through special, purpose-designed features of the mouse.

Magnetic charging technology available in Logitech's mouse mats mean you'll never be out of juice, with the G502's battery supporting 800 charge cycles before degradation starts to set in. 11 programmable buttons, adjustable weight (starting at 114g up to 130g) and quality of life additions to the mouse's structure, such as rubberized compounds and the G502 Lightspeed's RGB lighting bring this particular rodent up to a $149 pricing.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its strategic foundry collaboration with Arm will be expanded to 7/5-nanometer (nm) FinFET process technology to remain a step ahead in the era of high-performance computing. Based on Samsung Foundry's 7LPP (7nm Low Power Plus) and 5LPE (5nm Low Power Early) process technologies, the Arm Artisan physical IP platform will enable 3GHz+ computing performance for Arm's Cortex -A76 processor.

Samsung's 7LPP process technology will be ready for its initial production in the second half of 2018. The first extreme ultra violet (EUV) lithography process technology, and its key IPs, are in development and expected to be completed by the first half of 2019. Samsung's 5LPE technology will allow greater area scaling and ultra-low power benefits due to the latest innovations in 7LPP process technology.

QNAP Systems, Inc. today released the new TS-832X 8-bay quad-core NAS with two built-in 10GbE SFP ports, providing users with a budget-friendly, high-speed network storage solution. It is also an ARM-based NAS that supports Qtier technology for auto-tiering, and its PCIe slots allow for the installation of peripheral cards like 10GbE NICs, QM2 cards, USB 3.1 10Gbps expansion cards, or wireless network cards to enhance the NAS with greater application potential.

"The TS-832X is a step up from the TS-831X, featuring an advanced 64-bit Cortex -A57 processor and DDR4 memory while also delivering computing power of 32K DMIPS to benefit performance upgrade by 40%," said Dan Lin, Product Manager of QNAP, continuing "Coupled with the 10GbE connectivity and PCIe expandability, it provides a highly cost-efficient private cloud NAS solution."

Intel today announced it has begun shipping its Intel Stratix 10 SX FPGA - the only high-end FPGA family with an integrated quad-core ARM* Cortex*-A53 processor. With densities greater than 1 million logic elements (MLE), Intel Stratix 10 SX FPGAs provide the flexibility and low latency benefit of integrating an ARM processor with a high-performance, high-density FPGA needed to tackle the design challenges of next-generation, high-performance systems.

By integrating the FPGA and the ARM processor, Intel Stratix 10 SX FPGAs provide an ideal solution for 5G wireless communication, software defined radios, secure computing for military applications, network function virtualization (NFV) and data center acceleration.