Axiomtek - a world-renowned leader relentlessly devoted in the research, development, and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to introduce the IPC970, its new feature-rich, expandable 4-slot industrial system. This intelligent industrial computer is powered by the Intel Xeon or 10th generation Intel Core i7/i5/i3 processors (code name: Comet Lake S) with the Intel W480E chipset. The powerful edge computing system supports NVIDIA GeForce RTX 3090 graphics card with 10,496 CUDA cores and a whopping 24 GB of GDDR6X memory for powerful GPU computing capability. The ruggedized IPC970 enables simultaneous AI processing for intelligent AI computing at the edge.

The Axiomtek's IPC970 provides flexible expansion options with one I/O module slot and three PCIe slots plus one blank expansion slot. In addition, it has a full-size PCIe Mini Card slot for Wi-Fi/Bluetooth/LTE modules, one M.2 Key B 3042/3050 socket for 5G wireless connections, and one M.2 Key E 2230 socket for Wi-Fi/Bluetooth modules. Its front-facing I/O design makes it easy to access and deploy. To ensure stable and reliable operation in harsh industrial environments, the IPC970 has a wide operating temperature range of -10°C to +70°C and a power input of 24 V DC (uMin=19 V/uMax=30 V) with power-on delay function, over-voltage protection, over current protection, and reverse voltage protection.

The first mainstream Z690 boards have made an appearance online in the shape of ASUS' Prime Z690-P series. As with most of ASUS' Prime boards, these are fairly basic boards, but shouldn't leave the average user wanting for much, although ASUS has made a rather odd layout decision on these boards that we can't quite grasp.

The four models on display are the Prime Z690-P WiFi D4, Prime Z690-P D4, Prime Z690-P and Prime Z690M-Plus D4. The last model doesn't strictly belong to the Prime Z690-P family, but it follows a pretty similar overall design. The Prime Z690-P is obviously the only DDR5 SKU among the four boards, although from what we can tell, there are no other differences between it and the equivalent DDR4 model.

With the rapid development of advanced technologies, such as 5G, the Internet of Things (IoT), Artificial Intelligence (AI), and 8K, people are placing more stringent requirements on the convenience, intelligence, and functional integration of their electronics. This has given rise to new development opportunities in the storage industry. As we progress further into the digital revolution, intelligent electronics will require small-capacity storage products which feature an increased level of reliability and stability. High-temperature tolerance in storage products will be vital for customers in the intelligent and small-sized consumer electronics market.

Longsys recently launched the FORESEE DDR4, which utilizes 96-ball thin fine ball grid array (TFBGA) encapsulation. The product's manufacturing process, transmission speed, power consumption, and high-temperature reliability all perform at an industry-leading level.

If the amount of upcoming Z690 was anything to go by, one could presume that the motherboard makers are backing Intel's upcoming platform to the max, as a leaked list of what should be close to every Z690 that will hit the market, counts a total of 98 boards. The list covers ASRock, ASUS, Biostar, NZXT, Gigabyte and MSI, but not EVGA and some other smaller players.

ASUS is apparently planning no less than 30 different models/SKUs, since some are clearly DDR4/DDR5 SKUs of the same model or SKUs with or without Wi-Fi, but even so, that's a massive launch lineup. Gigabyte isn't far behind with 27, followed by MSI at 24 and ASRock at 14, if we didn't count wrong. There isn't much news in terms of details of each of the boards here though, but it's clear that the high-end SKUs are mostly DDR5, while the mid-range and standard models are mostly using DDR4. The only slight surprise here is that only ASRock has more DDR4 than DDR5 models, with ASUS having exactly half of each, but Gigabyte and MSI are going with a preference for DDR5. ASRock, ASUS and Gigabyte appear to have liquid cooled SKUs, but it's not clear if MSI will offer such a SKU of its Godlike board.

Ahead of the rumored late-October debut of Intel's 12th Gen Core "Alder Lake" processors, motherboard makers started teasing their compatible Socket LGA 1700 products. Older reports suggest that in 2021, Intel will only release unlocked "K" and "KF" SKUs, and motherboard partners will only launch boards based on the top Intel Z690 chipset. The lineup is expected to be joined by more affordable non-K SKUs in Q1-2022, along with lower chipset models such as the B660 and H670.

The MEG Z690 ACE appears to introduce a new design scheme with die-cast metal mesh rear I/O shrouds, and a gold+black trim. The I/O shroud design is interesting as it lets the VRM heatsink underneath breathe better. The silver-white MPG motherboard is possibly the MPG Z690 Force. MSI is probably trying to get this to rival the ROG Strix-A SKU by ASUS. The third teaser, of a brushed gunmetal shroud, is likely the MAG Z690 Tomahawk. Like most other brands, MSI appears to have an extensive lineup of Socket LGA 1700 motherboards with DDR4 memory slots, although boards with DDR4 are restricted to the MAG and entry-level PRO series. The mid-tier MPG and enthusiast-segment MEG series boards only come with DDR5.

TerraMaster, a professional brand that specializes in providing innovative storage products for home, businesses and enterprises, presents its line-up of 8-bay storage servers designed to meet the needs of modern businesses for enterprise virtualization, data-intensive applications, and service continuity. TerraMaster's Rackmount NAS Series is equipped with the latest technologies and advanced securities to deliver efficient performance with excellent data security making it ideal for business and government use.

The TerraMaster 8-Bay Rackmount NAS Series support up to 1000 user accounts with RBAC rights management and Windows ACL. This allows easy user and access rights management. The 8-Bay Rackmount NAS Series supports 2.5" and 3.5" drives and comes fitted with four RJ-45 1 GbE LAN ports. All models also come with one PCIe 3.0 X16 slot and two PCIe 3.0 x8 slots offering expansion flexibility for 10GbE NIC cards or dedicated RAID cards.

The latest IRDM modules are designed for gamers and professionals to provide not only an aesthetic experience, but also high performance. Each module is equipped with 8 LEDs and is compatible with RGB lighting control software from leading motherboard manufacturers such as ASUS, MSI, GIGABYTE, and ASRock. This ensures that the lighting effects can be programmed in many different ways, resulting in the ability to synchronize with other RGB devices like the motherboard, computer case, cooling system, keyboard, headphones, or computer mouse. Initially, the modules will be available for sale in the currently most popular kit of 2x 8 GB 3600 MHz, but the manufacturer announces that products with other specifications will soon be added to the series.

IRDM RGB DDR4 modules are built from carefully selected components and Micron memory chips. The 3600 MHz frequency at 18-22-22 timings ensures fast and stable operation of the modules, while the black heatsink built from a combination of aluminium, silicon, and magnesium perfectly dissipates heat, even during intensive use. "We are handing our customers a product that has been long-awaited and desired on the market. We are convinced that the parameters of the new IRDM memory will be appreciated by the most demanding users, especially gamers, case modders, and enthusiasts of computer sets with RGB lighting. We wanted to provide the best product in terms of both technical characteristics and a timeless design", says Wiesław Wilk, the CEO of Wilk Elektronik SA.

GIGABYTE Technology,an industry leader in high-performance servers and workstations, today announced two new W-series workstations, W771-Z00 for AMD Ryzen Threadripper PRO processors and W331-Z00 for AMD Ryzen processors, as well as a WRX80 chipset motherboard, MC62-G40, and a TRX40 chipset rack server, G182-C20. Remote work and a high level of compute for 3D design or engineering are driving factors for these new professional products.

Today's engineers and power users are focused on high demanding workloads and require a powerful workstation to enable them to work effectively and efficiently. The W771-Z00 coupled with a top-tier processor from the AMD Ryzen Threadripper PRO family, such as the 3995WX with 64 cores 128 threads, make this the most powerful workstation to date. The motherboard for this workstation is the MC62-G40. Based around the AMD WRX80 chipset, the W771-Z00 shares high-end features that are typically only found in servers.

At the COMPUTEX 2021 Virtual Expo in May, TEAMGROUP presented the core value underlying its new products in 2021: "Chill the Heat, Feel the Speed, Make it Big", representing cooling, DDR5, and large capacity, the three major focuses TEAMGROUP builds its new products and design concepts around. Tonight at 10 PM (GMT+8), everyone is sincerely invited to the TEAMGROUP Online Launch Event 2021 via official website, Facebook Page, and YouTube channel as it again takes the three focuses to the next level with its powerful new technical capabilities and innovative technologies. To celebrate the event with the world, TEAMGROUP will give away a Gaming Desktop PC and other prizes worth up to $7,000 USD. Make sure to stay tuned for the TEAMGROUP Online Launch Event 2021.

In recent years, TEAMGROUP has been focusing on developing diverse cooling solutions and applying unique materials to the SSD of the Gaming product line, T-FORCE. Inspired by the four natural elements of wind, fire, water, and earth, TEAMGROUP has utilized four exclusive components of cooling to T-FORCE gaming products. The wind element can be found in TEAMGROUP's CARDEA A440 Pro M.2 PCIe SSD as further improvements are made on existing aluminium fin thermal conductivity technology for fluid ventilation and more effective cooling performance. The impressive read/write speeds of the CARDEA A440 Pro are also approaching the defined maximum speeds for Gen4 x4 by PCI-SIG at an outstanding 7,400/7,000 MB/s.

Once again, the Eurasian Economic Commission has provided us with a look into a wide range of upcoming motherboard models and this time it's Gigabyte's Z690 lineup. The company appears to be reading no less than 17 DDR5 models and 10 DDR4 models, which is simply a massive amount of motherboards. There are two models that caught our eye, firstly the Aorus Tachyon, which continues HiCookies overclocking SKU from the current Z590 Aorus Tachyon and secondly the Aorus Elite Stealth, which may or may not be a passively cooled board, suggesting the Z690 chipset might be coming with active cooling.

We'd hazard a guess and say that not all SKUs will be available at launch, since it's unlikely that there will be a demand for this many different models. A few other noteworthy mentions here include the Z690M Aorus Elite DDR4 (with or without Wi-Fi), which seems to be a higher-end mATX model and it looks like we're getting three Mini-ITX models with the Z690I Aorus Ultra, the Z690 Aero D and the Z690I A Ultra DDR4. Also gone is the Vision name, as it has been replaced with Aero, a brand Gigabyte has used for some of its AMD boards. Time will tell what actually lands in the various markets at the end, as it might be that some of these SKUs are region specific as well.

Following the peak period of production in 3Q21, the supply of DRAM will likely begin to outpace demand in 4Q21, according to TrendForce's latest investigations (the surplus of DRAM supply is henceforth referred to as "sufficiency ratio", expressed as a percentage). In addition, while DRAM suppliers are generally carrying a healthy level of inventory, most of their clients in the end-product markets are carrying a higher level of DRAM inventory than what is considered healthy, meaning these clients will be less willing to procure additional DRAM going forward. TrendForce therefore forecasts a downward trajectory for DRAM ASP in 4Q21. More specifically, DRAM products that are currently in oversupply may experience price drops of more than 5% QoQ, and the overall DRAM ASP will likely decline by about 3-8% QoQ in 4Q21.

Although WFH and distance learning applications previously generated high demand for notebook computers, increasingly widespread vaccinations in Europe and North America have now weakened this demand, particularly for Chromebooks. As a result, global production of notebooks is expected to decline in 4Q21, in turn propelling the sufficiency ratio of PC DRAM to 1.38%, which indicates that PC DRAM will no longer be in short supply in 4Q21. However, PC DRAM accounts for a relatively low share of DRAM manufacturers' DRAM supply bits, since these suppliers have allocated more production capacities to server DRAM, which is in relatively high demand. Hence, there will unlikely be a severe surplus of PC DRAM in 4Q21. It should also be pointed out that, on average, the current spot prices of PC DRAM modules are far lower than their contract prices for 3Q21. TrendForce therefore expects an imminent 5-10% QoQ decline in PC DRAM contract prices for 4Q21, with potential for declines that are even greater than 10% for certain transactions, as PC OEMs anticipate further price drops in PC DRAM prices in the future.

With the 15.6 and 17.3 inch XMG APEX gaming laptops, XMG is positioning a new model series below its own high-end range consisting of the NEO and PRO series. These new laptops combine mobile AMD eight-core processors up to the Ryzen 9 5900HX with NVIDIA GeForce RTX graphics cards up to the RTX 3070. The company is simultaneously introducing the XMG FOCUS, a new product series in the entry-level segment. Intel's Core i7-11800H and an NVIDIA GeForce RTX 3050 Ti offer decent gaming performance, while good connectivity and memory round off the overall package. All four new models feature an IPS display with 144 Hz.

Until now, the XMG APEX 15 in the older E20 generation represented uncompromising desktop CPU performance, with processors up to the Ryzen 9 3950X in a laptop. Although XMG is already working on a direct successor under a slightly different name, it is unleashing the XMG APEX 15 and APEX 17 of the M21 generation for the time being with the currently fastest eight-core mobile processors from AMD. The laptops are available with an AMD Ryzen 7 5800H as well as with the slightly faster Ryzen 9 5900HX from the 54 watt TDP class, as well as with an NVIDIA GeForce RTX 3070 or RTX 3060 in the respective maximum TGP configuration (RTX 3070: 125 watts plus 15 watts Dynamic Boost 2.0; RTX 3060: 115 watts plus 15 watts Dynamic Boost 2.0).

Thermaltake released its highest-capacity dual-channel (2-module) DDR4 memory kit, the ToughRAM XG RGB R016R432GX2-3600C18A. This kit uses modules that are a swansong of DDR4 in terms of capacity—32 GB x 2. The 32 GB module is dual-rank, and only compatible with some of the later generations of Intel Core and AMD Ryzen processors that feature memory controllers with support for up to 128 GB of memory in total. On its part, Thermaltake claims that the modules were only tested to be compatible with Intel 10th Gen and 11th Gen Core; and AMD Ryzen 2000 series and above. In terms of performance, the ToughRAM XG RGB R016R432GX2-3600C18 packs an Intel XMP 2.0 profile for DDR4-3600 with 18-22-22-42 + CR2T timings, and 1.35 V module voltage. The module is aesthetically identical to the ToughRAM XG RGB series the company debuted in March 2021.

Today, we got ahold of the first picture showing Intel's upcoming Z690 chipset, the highest-end chipset offering for the Alder Lake lineup of processors. From previous leaks, we have concluded that Intel has enabled the Z690 chipset to be a very powerful offering. Featuring support for running either DDR4 or DDR5 memory, the Z690 chipset will allow motherboard AIBs to offer motherboards with both the new and current DDR standards, easing the transition to the new DDR5 memory. As far as PCIe connectivity, this high-end chipset produces 12 PCIe Gen5 lanes, along with 16 PCIe Gen3 lanes. This is, of course, just an addition to the 16 PCIe Gen5 lanes that the Alder Lake processor provides, enabling a wide portfolio of PCIe lanes for connecting SSDs and graphics cards.

Below, you can see the Z690 chipset image (热心市民描边怪 image), compared to the Z590 (AnandTech image) chipset, where there is a clear difference in size. The new Z690 chipset seems quite a lot bigger, and that is really not a surprise given the new technology stack that it brings.

Intel today released the Xeon E-2300 series enterprise processors for entry level servers, based on the 14 nm "Rocket Lake-E" silicon. These are slightly different from the Xeon W-1300 series processors targeting workstations. The E-2300 has a more server-relevant feature-set, and is designed for high uptime. You get ECC memory support, as well as vPro, SGX, and MPX (memory encryption). You still get only client-relevant AVX-512 instructions found in 11th Gen Core processors, as well as DLBoost AI acceleration.

The "Rocket Lake-E" silicon comes with up to 8 "Cypress Cove" CPU cores, each with 512 KB of dedicated L2 cache, and 16 MB of shared L3 cache. The processor features a 2-channel DDR4 memory interface that supports up to 128 GB of DDR4-3200 memory. It puts out 20 PCI-Express 4.0 lanes that can be segmented in a number of ways; as well as the Intel C250 series chipset puts out 24 PCI-Express 3.0 lanes. Chips in this series come with TDP of up to 95 W.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces the SPECTRIX D50 ROG-CERTIFIED DDR4 RGB memory module. The Republic of Gamers (ROG) -certified DDR4 RGB memory module is specifically tuned to work with ROG motherboards for uncompromised gaming performance. What's more, it also supports Intel XMP for easy overclocking and features RGB lighting for dazzling gaming flair.

The SPECTRIX D50 ROG-CERTIFIED DDR4 RGB has passed strict ROG overclocking and compatibility tests, ensuring optimal performance with ROG Intel DDR4 motherboards. This means ROG users can enjoy excellent performance of up to 3600 MHz and a 5% clock boost without fretting over compatibility. SPECTRIX D50 ROG-CERTIFIED DDR4 RGB is also compatible with motherboards that support Intel XMP 2.0 for straightforward overclocking without the need to go into BIOS.

Corsair has recently launched two new Vengeance RGB DDR4 memory module lineups with updated heatsinks and RGB lighting. The Corsair Vengeance RGB RT modules are available in black or white and feature a new design with 10-zone RGB lighting that can be controlled with the Corsair iCUE software. The Vengeance RGB RS modules will offer a reduced 6-zone RGB lighting setup and will only be available in black. The anodized aluminium heat spreader helps keep the memory modules cool even when overclocked and Corsair has verified that all these new modules support Intel 300 Series, Intel 400 Series, Intel 500 Series, Intel X299, AMD 300 Series, AMD 400 Series, and AMD 500 Series while only the RT modules have been tested with AMD TRX40. The modules are now available to purchase and are offered in capacities of 8 GB, 16 GB, and 32 GB with speeds between 3200 MHz and 4000 MHz.

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

Lexar, a leading global brand of flash memory solutions, is proud to announce the new HADES product line of Gaming DRAM products. This is our introduction into the gaming DRAM category as Lexar expands its product portfolio. The new Lexar HADES RGB DDR4 3600/3200 Desktop Memory is for gamers looking for next-level performance and an enhanced gaming experience with customizable RGB lighting. The Lexar HADES OC DDR4 3600/3200 Desktop Memory is the perfect upgrade for gamers and content creators who want optimized performance and a next-level gaming experience or for intensive workloads.

The HADES RGB DDR4 overclocked memory allows you to level-up your gaming experience without slow-downs. And with its RGB lighting effects, the HADES RGB DDR4 memory enhances your gameplay with vibrant colors of RGB lighting effects. The RGB customization creates a lively atmosphere rendering your gameplay more realistic, and adds a touch of style to your gaming setups. It also features Lexar RGB Sync, a powerful lighting control software which allows you to customize and synchronize your lighting effects by setting color, intensity, and speed while allowing you to save your lighting effects for later use. The Lexar HADES RGB DDR4 3600/3200 is also compatible with ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light, ASRock Polychrome SYNC.

Since the end of 2020, TEAMGROUP has been at the forefront of next-generation DDR5 development, working closely with motherboard manufacturers to perform extensive validation testing. Whether it is the testing and research of DDR5's new PMIC architecture or XMP overclocking parameters, the company has achieved very fruitful results. Today TEAMGROUP is launching its brand new DELTA DDR5 Memory Series, the first DDR5 modules to be equipped with RGB lighting effect, providing gamers who enjoy visual flair with both next-level speed and eye-pleasing illumination.

The T-FORCE DELTA RGB DDR5 continues the design language of the DELTA DDR4 Series by maintaining the ultra-large spreader with wide-angled RGB edges and a minimalist geometrical surface. The overall look is further enhanced by its sleek stealth-fighter-inspired design. In addition, the color and flashing speed of each RGB LED used in DELTA RGB DDR5 can be independently controlled, offering more freedom to customize lighting effects than a typical RGB DDR4 memory. Currently samples have been sent to ASUS, GIGABYTE, MSI, ASROCK, BIOSTAR and other motherboard manufacturers for lighting tests. Players will be able to easily customize their own dazzling RGB effects through the manufacturers' lighting software.

EK, the European manufacturer of premium liquid cooling gear, and MSI, a world-leading gaming brand, have partnered up yet again, to launch an X570S-based motherboard that comes with a pre-installed Quantum design monoblock that offers unparalleled cooling for the VRM section and AMD Ryzen series CPUs. MSI's world-class engineering team and EK's industry-leading thermal engineers worked together to apply EK's technology and know-how to bring you the coolest AMD gaming motherboard. The EK-Quantum MSI MPG X570S CARBON EK X is a response to the market's desire for an out-of-the-box water-cooled motherboard for Ryzen CPUs. It allows maximum performance without the noisy environment that air coolers offer, providing countless hours of uninterrupted gameplay. As an added benefit, it looks as great as it performs.

The EK-Quantum monoblock design aesthetically blends in with the motherboard, giving it a unique look that sets it apart from the rest. The sleek, stealthy look accompanied by the carbon fiber pattern is there to remind all hard-core gamers that pushing the limit is what gaming is all about. A powerful 14+2 Duet Rail Power System with 75 A power stages provides stable power to the Ryzen CPU. The massive power delivery system allows for high overclocks and, by proxy, a great boost in performance. The only downside is increased heat generation. This is where the EK monoblock with an integrated flow indicator kicks in - to cool down not just the CPU, but the power delivery system as well.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, unveils the brand new Z590A-SILVER motherboard. Designed to support Intel's 10th/11th Generation Intel Core Processors and High-end graphics cards, the new Z590A-SILVER motherboard is highly versatile. Powered by Intel's Z590 single-chip architecture this new motherboard is highly efficient and robust in any use case.

Modern features like PCIe 4.0 and PCIe M.2 4.0 and other cutting-edge functionality add up to a great platform tailor-made for gaming and content creation. With the support of up to 128 GB of DDR4 memory across 4 DIMM slots and an overclocking capability of up to 5000+(OC) MHz, the Z590A-SILVER motherboard can handle all high-intensive tasks thrown at it.

MSI, a world leader in high-performance and innovative computing solutions, has announced the PRO DP20Z 5M Business & Productivity PC. It comes in both barebone and full system solutions. Featuring a powerful processor, exclusive software, and various IO ports, the PRO DP20Z 5M is designed with efficiency and productivity in mind.

Everything you need for business is already in the 2.6L sized business & productivity PC - PRO DP20Z 5M. Inspired by the natural bamboo and its perseverance, transformation & refinement, the design of PRO DP20Z represents durability, reliability, and stability. It would have sustained its life as it grew only when it develops a strong foundation. Its barebone and full system solution makes it more flexible for different users and enterprises. The full system solution featuring the latest AMD Ryzen 5000 Series APU will be coming soon. Featuring up to Ryzen 7 5700G APU and DDR4 3200 MHz 64 GB memory, it can help users experience a better and faster computing performance during data analyzing and when gaming amusement is needed. It can support up to three displays and 4K resolution at 60 Hz, allowing users to connect advertising board to display their products or use it as a powerful home theater PC. Its portable size and sufficient features fully meet the needs of various scenarios.

Now that most negotiations over contract prices of PC DRAM for 3Q21 have concluded, DRAM suppliers' low inventories and the arrival of the peak season for DRAM procurement have resulted in a 3-8% QoQ increase in PC DRAM contract prices for 3Q21, although this is a relatively muted growth compared to the 25% increase experienced in 2Q21, according to TrendForce's latest investigations. However, demand for PC DRAM in the spot market began to show signs of bearish movement in early July ahead of time, as DRAM suppliers continued to lower prices in order to adjust their DRAM inventories. Regarding the contract market, PC OEMs currently carry relatively high levels of DRAM inventory because they substantially stocked up on PC DRAM beforehand in anticipation of an upcoming shortage. Not only has PC OEMs' high DRAM inventory put downward pressure on possible price hikes for PC DRAM, but the gradual lifting of COVID-related restrictions in Europe and the US will also likely lower the overall demand for notebook computers, thereby pulling down the overall demand for PC DRAM. TrendForce therefore forecasts a 0-5% QoQ decline in PC DRAM contract prices for 4Q21.

Corsair DIY Marketing Director, George Makris recently confirmed in a recent video that DDR5 memory could "conceivably could run much hotter than DDR4" due to voltage regulation being moved to the memory modules from the motherboard. This was reiterated by Corsair Memory Product Manager, Matt Woithe, who notes that they are prepared to handle this increased heat in Corsair DDR5 modules using their Dual-path Heat Xchange (DHX) technology. The next generation of memory also mandates the inclusion of on-die EEC which while not confirmed by Corsair will also add to the power budget of the modules. Corsair is expecting to release their first DDR5 memory modules towards the end of this year which will coincide with the launch of Intel's 12th Generation Alder Lake processors. AMD fans will need to wait until 2022 with the launch of Zen 4 to take advantage of the new DDR5 memory modules.