Meta today announced its next-generation AI platform, Grand Teton, including NVIDIA's collaboration on design. Compared to the company's previous generation Zion EX platform, the Grand Teton system packs in more memory, network bandwidth and compute capacity, said Alexis Bjorlin, vice president of Meta Infrastructure Hardware, at the 2022 OCP Global Summit, an Open Compute Project conference.

AI models are used extensively across Facebook for services such as news feed, content recommendations and hate-speech identification, among many other applications. "We're excited to showcase this newest family member here at the summit," Bjorlin said in prepared remarks for the conference, adding her thanks to NVIDIA for its deep collaboration on Grand Teton's design and continued support of OCP.

Furthering its mission to address future enterprise infrastructure requirements, KIOXIA America, Inc. today announced that it has expanded its broad portfolio of client, enterprise and data center SSDs with the addition of the XD7P Series. Designed for hyperscale and general server applications in the new Enterprise and Data Center Standard Form Factor (EDSFF) E1.S form factor, XD7P drives are the second generation of E1.S SSDs with Open Compute Project (OCP) Data Center NVMe SSD 2.0 specification support from KIOXIA, following its XD6 series. KIOXIA XD7P drives are now sampling to select data center customers.

"Hyperscale needs of density, power, performance and serviceability are driving PCIe 5.0, E1.S, as a form factor, and the OCP Data Center NVMe SSD specification V2.0 for the data center," said Ross Stenfort, hardware storage engineer, Meta. "The KIOXIA XD7P Series SSD supports these storage technologies to enable the next generation of hyperscale needs."

AMD (NASDAQ:AMD) today announced selected preliminary financial results for the third quarter of 2022. Third quarter revenue is expected to be approximately $5.6 billion, an increase of 29% year-over-year. AMD previously expected revenue to increase approximately 55% year-over-year at the mid-point of guidance. Preliminary results reflect lower than expected Client segment revenue resulting from reduced processor shipments due to a weaker than expected PC market and significant inventory correction actions across the PC supply chain.

Revenue for the Data Center, Gaming, and Embedded segments each increased significantly year-over-year in-line with the company's expectations. Gross margin is expected to be approximately 42% and non-GAAP(*) gross margin is expected to be approximately 50%. AMD previously expected non-GAAP gross margin to be approximately 54%. The gross margin shortfall to expectations was primarily due to lower revenue driven by lower Client processor unit shipments and average selling price (ASP). In addition, the third quarter results are expected to include approximately $160 million of charges primarily for inventory, pricing, and related reserves in the graphics and client businesses.

Goldkey Technology Corporation (TPEx : 3135), aka "Neo Forza", offers products and solutions marketed under the label Neo Forza successfully completed qualification of its server modules with Dell PowerEdge R650 and R750 series servers, which DELL loaned to Neo Forza. Following successful qualification, Neo Forza announces commercial and industrial channel partner availability of Neo Forza DDR4 RDIMM server memory in adherence to industry qualifications, ranging from DDR4 2133MT/s to 3200MT/s.

"Data center staff need to maximize platform performance and extend platform longevity. Neo Forza's qualified DDR4 server memory assures these factors are met cost-effectively," said Jess Kung, vice president of sales. "Goldkey Technology Corporation has been on the forefront of the memory industry and is an integrated-circuit (I/C) specialist with technical acumen of more than 15 years. The successful qualification program amplifies our intrinsic value to our global customers."

AMD announced that the AMD Pensando Distributed Services Card, powered by the industry's most advanced data processing unit (DPU)1, will be one of the first DPU solutions to support VMware vSphere 8 available from leading server vendors including Dell Technologies, HPE and Lenovo.

As data center applications grow in scale and sophistication, the resulting workloads increase the demand on infrastructure services as well as crucial CPU resources. VMware vSphere 8 aims to reimagine IT infrastructure as a composable architecture with a goal of offloading infrastructure workloads such as networking, storage, and security from the CPU by leveraging the new vSphere Distributed Services Engine, freeing up valuable CPU cycles to be used for business functions and revenue generating applications.

NVIDIA (NASDAQ: NVDA) today reported revenue for the second quarter ended July 31, 2022, of $6.70 billion, up 3% from a year ago and down 19% from the previous quarter. GAAP earnings per diluted share for the quarter were $0.26, down 72% from a year ago and down 59% from the previous quarter. Non-GAAP earnings per diluted share were $0.51, down 51% from a year ago and down 63% from the previous quarter.

"We are navigating our supply chain transitions in a challenging macro environment and we will get through this," said Jensen Huang, founder and CEO of NVIDIA. "Accelerated computing and AI, the pioneering work of our company, are transforming industries. Automotive is becoming a tech industry and is on track to be our next billion-dollar business. Advances in AI are driving our Data Center business while accelerating breakthroughs in fields from drug discovery to climate science to robotics.

Ansys announced that Ansys Mechanical is one of the first commercial finite element analysis (FEA) programs supporting AMD Instinct accelerators, the newest data center GPUs from AMD. The AMD Instinct accelerators are designed to provide exceptional performance for data centers and supercomputers to help solve the world's most complex problems. To support the AMD Instinct accelerators, Ansys developed APDL code in Ansys Mechanical to interface with AMD ROCm libraries on Linux, which will support performance and scaling on the AMD accelerators.

Ansys' latest collaboration with AMD resulted in a solution that, according to Ansys' tests, significantly speeds up simulation of large structural mechanical models—between three and six times faster for Ansys Mechanical applications using the sparse direct solver. Adding support for AMD Instinct accelerators in Ansys Mechanical gives customers greater flexibility in their choice of high-performance computing (HPC) hardware.

Intel today launched its Arctic Sound M line of data-center GPUs. These are not positioned as HPC processors like the "Ponte Vecchio," but GPUs targeting cloud-compute providers, with their main applications being in the realm of visual processing, media, and AI inferencing. Their most interesting aspect has to be the silicon, which are the same 6 nm "ACM-G11" and "ACM-G10" chips powering the Arc "Alchemist" client graphics cards, based on the Xe-HPG architecture. Even more interesting is their typical board power values, ranging between 75 W to 150 W. The cards are built in the PCI-Express add-on card form-factor, with their cooling solutions optimized for rack airflow.

The marketing name for these cards is simply Intel Data Center GPU Flex, with two models being offered: The Data Center GPU Flex-140, and Flex-170. The Flex-170 is a full-sized add-on card based on the larger ACM-G10 silicon, which has 32 Xe Cores (4,096 unified shaders), whereas the Flex-140, interestingly, is a low-profile dual-GPU card with two smaller ACM-G11 chips that each has 8 Xe Cores (1,024 unified shaders). The two chips appear to be sharing a PCIe bridge chip in the renders. Both models come with four Xe Media Engines that pack AV1 encode hardware-acceleration, XMX AI acceleration, real-time ray tracing, and GDDR6 memory.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers and solid-state storage devices today announces MonTitan, a PCIe Gen5 SSD solution platform perfectly suited for the most challenging Datacenter and Enterprise applications. Silicon Motion's new MonTitan platform features an entirely new, purpose-built ASIC and FW architecture, optimized for performance and QoS. Its unique Layered FW stack enables the development of customer differentiated solutions with a high degree of flexibility and accelerated time to market, all while reducing engineering cost.

"SSD storage solutions are evolving to address new challenges in data centers which demand changes in storage platforms and operating models," said Nelson Duann, Silicon Motion's Senior Vice President of Marketing and R&D. "Our MonTitan SSD solution is an innovative PCIe Gen5 SSD platform designed to satisfy the unique demands of datacenters today while providing flexibility and programmability to meet future evolving standards."

Super Micro Computer, Inc., a global leader in enterprise computing, storage, networking, and green computing technology, is announcing future Total IT Solutions for availability with Android Cloud Gaming and Media Processing & Delivery. These new solutions will incorporate the Intel Data Center GPU, codenamed Arctic Sound-M, and will be supported on several Supermicro servers. Supermicro solutions that will contain the Intel Data Center GPUs codenamed Arctic Sound-M, include the 4U 10x GPU server for transcoding and media delivery, the Supermicro BigTwin system with up to eight Intel Data Center GPUs, codenamed Arctic Sound-M in 2U for media processing applications, the Supermicro CloudDC server for edge AI inferencing, and the Supermicro 2U 2-Node server with three Intel Data Center GPUs, codenamed Arctic Sound-M per node, optimized for cloud gaming. Additional systems will be made available later this year.

"Supermicro will extend our media processing solutions by incorporating the Intel Data Center GPU," said Charles Liang, President, and CEO, Supermicro. "The new solutions will increase video stream rates and enable lower latency Android cloud gaming. As a result, Android cloud gaming performance and interactivity will increase dramatically with the Supermicro BigTwin systems, while media delivery and transcoding will show dramatic improvements with the new Intel Data Center GPUs. The solutions will expand our market-leading accelerated computing offerings, including everything from Media Processing & Delivery to Collaboration, and HPC."

When it comes to data, everything is growing - quantity, size, format, resolution, use cases, applications, value and more. As people and businesses look for solutions to effectively and efficiently store their data in the zettabyte era, Western Digital HDDs continue to play a critical role in delivering massive capacity, performance and reliability.

Extending its innovation and technology leadership across its portfolio, Western Digital today announced that it is now shipping new 22 TB HDDs targeting three key segments: WD Gold HDDs for IT/data center channel customers; WD Red Pro for network attached storage (NAS); and WD Purple Pro for smart video/surveillance. As highlighted in its What's Next Western Digital Event, these new drives are loaded with industry-firsts, including OptiNAND technology, energy-assisted PMR (ePMR), triple-stage actuator (TSA) and HelioSeal to deliver the industry's highest areal density at 2.2 TB per platter, delivering 22 TB CMR HDDs for its customers.

Iceotope, the global leader in Precision Immersion Cooling, has announced that its chassis-level cooling system is being demonstrated in the Intel Booth at HPE Discover 2022, the prestigious "Edge-to-cloud Conference". Ku:l Data Center is the product of a close collaboration between Iceotope, Intel and HPE and promises a faster path to net zero operations by reducing edge and data center energy use by nearly a third. Once the sole preserve of arcane, high performance computing applications, liquid cooling is increasingly seen as essential technology for reliable and efficient operations of any IT load in any location. There is a pressing concern about sustainability impacts as distributed edge computing environments proliferate to meet the demand for data processing nearer the point of use, as well as growing facility power and cooling consumption driven by AI augmentation and hotter chips.

Working together with Intel and HPE, Iceotope benchmarked the power consumption of a sample IT installation being cooled respectively using air and precision immersion liquid cooling. The results show a substantial advantage in favour of liquid cooling, reducing overall power use across IT and cooling infrastructure.

PCI-SIG today announced that the PCI Express (PCIe ) 7.0 specification will double the data rate to 128 GT/s and is targeted for release to members in 2025. "For 30 years the guiding principle of PCI-SIG has been, 'If we build it, they will come,'" observed Nathan Brookwood, Research Fellow at Insight 64. "Early parallel versions of PCI technology accommodated speeds of hundreds of megabytes/second, well matched to the graphics, storage and networking demands of the 1990s.

In 2003, PCI-SIG evolved to a serial design that supported speeds of gigabytes/second to accommodate faster solid-state disks and 100MbE Ethernet. Almost like clockwork, PCI-SIG has doubled PCIe specification bandwidth every three years to meet the challenges of emerging applications and markets. Today's announcement of PCI-SIG's plan to double the channel's speed to 512 GB/s (bi-directionally) puts it on track to double PCIe specification performance for another 3-year cycle."

Phison Electronics Corp., a global leader in NAND flash controller and storage solutions, today unveiled two new PCIe Gen4x4 Enterprise Class SSDs: the EPR3750 in M.2 2280 form factor and the EPR3760 in M.2 22110 form factor. The EPR3750 and EPR3760 SSDs are backward compatible in PCIe Gen3 M.2 slots at even faster speeds while offering significant performance enhancements when matched with PCIe Gen4 chipsets. Also, the EPR3750 and EPR3760 SSDs provide a faster quality of service (QoS) command execution with Enterprise SSD firmware. Workstation and Server boot applications require consistent and predictable performance from storage. Phison's new SSDs are ideal to use as boot drives in workstations, servers, and in Network Attached Storage (NAS) and RAID environments.

Ayar Labs, the leader in chip-to-chip optical connectivity, is developing with NVIDIA groundbreaking artificial intelligence (AI) infrastructure based on optical I/O technology to meet future demands of AI and high performance computing (HPC) workloads. The collaboration will focus on integrating Ayar Labs' technology to develop scale-out architectures enabled by high-bandwidth, low-latency and ultra-low-power optical-based interconnects for future NVIDIA products. Together, the companies plan to accelerate the development and adoption of optical I/O technology to support the explosive growth of AI and machine learning (ML) applications and data volumes.

Optical I/O uniquely changes the performance and power trajectories of system designs by enabling compute, memory and networking ASICs to communicate with dramatically increased bandwidth, at lower latency, over longer distances and at a fraction of the power of existing electrical I/O solutions. The technology is also foundational to enabling emerging heterogeneous compute systems, disaggregated/pooled designs, and unified memory architectures that are critical to accelerating future data center innovation.

Today Solidigm is expanding its performance-optimized D7 Product Series with new solid-state storage drives (SSDs)—the D7-P5520 and the D7-P5620—for data center and enterprise use. These drives are optimized for real-world compute and storage server workloads and are available in an extended range of form factors and capacities. They offer accelerated performance and reduced total cost of ownership (TCO) by enabling a smaller storage footprint and lower power consumption. The D7-P5520 (designed for read-intensive and light mixed workloads), and the D7-P5620 (designed for mixed workloads), are the first family of products being introduced by Solidigm, which launched as a standalone company in December 2021.

The D7 Series comprises the industry's most advanced PCIe 4.0 SSD family of products given their capacity offerings, breadth of form factors and optimized performance capabilities. These SSDs are optimized for real-world workloads and reflect insights gained from deep technical engagements with leading cloud service providers, OEMs, and storage innovators. Designed and tested with zero tolerance for data errors, consistently durable IOPS and QoS, and with near-zero lifetime performance degradation, they can be deployed with the utmost confidence.

Intel showed off the video encode acceleration capabilities of its upcoming Data Center GPU codenamed "Arctic Sound M," which features AV1 video encode hardware-acceleration. Intel has been pushing for AV1 to be adopted as the streaming video standard for some years now, as it offers comparable bitrate savings and quality to H.265, but is royalty free, resulting in tens of millions of Dollars of royalty savings for streaming content providers such as Netflix, as well as consumer electronics manufacturers, particularly smart TV makers.

Intel's accelerator is a single-slot, full-height add-on card with a PCI-Express x16 interface. It relies on rack airflow for cooling, and features a metal-channel heatsink. Power is drawn from a single 8-pin PCIe power connector. There are no encoding performance numbers put out, except the 30% bitrate savings AV1 offers compared to the current industry standard, H.264. This 30% saving adds up in a big way for a streaming content provider.Intel's video presentation follows.

Fungible, Inc., the composable infrastructure company, today announced a new product offering, Fungible GPU-Connect (FGC ), an innovative solution engineered to revolutionize how data processing power is accessed in enterprise and service provider infrastructures. Fungible GPU-Connect solves the challenges caused by the growing demand for AI/ML, especially in Edge Data Centers with stranded and underutilized GPUs. FGC leverages the Fungible DPU to dynamically compose GPU and CPU resources across an Ethernet network. This provides significant economic benefits and agility to organizations that provision, allocate, and manage expensive GPU resources. For the first time, organizations can create a GPU-powered infrastructure free from the physical limitations of PCIe.

FGC allows data centers to centralize their existing GPU assets into a single resource pool to be attached to servers on demand. Instead of dedicated GPUs sitting idle most of the time, data centers can provide new users with access to the GPU pool, making greater use of existing assets. This disaggregated solution also removes the constraints of having GPUs and CPUs physically co-located. They can be located anywhere within the same data center, eliminating the stranding of expensive GPU resources. The Fungible DPU creates a secure, virtual PCIe connection between the GPU and the server that is transparent to the server and to applications - no special software or drivers are needed. This connection is managed in hardware by the DPU, ensuring a high-performance and low latency connection. This transparency means FGC can be easily retrofitted into existing environments, and can scale with growing demand, ensuring GPUs are always available when they are needed.

AMD today announced a definitive agreement to acquire Pensando for approximately $1.9 billion before working capital and other adjustments. Pensando's distributed services platform includes a high-performance, fully programmable packet processor and comprehensive software stack that accelerate networking, security, storage and other services for cloud, enterprise and edge applications.

"To build a leading-edge data center with the best performance, security, flexibility and lowest total cost of ownership requires a wide range of compute engines," said Dr. Lisa Su, AMD chair and CEO. "All major cloud and OEM customers have adopted EPYC processors to power their data center offerings. Today, with our acquisition of Pensando, we add a leading distributed services platform to our high-performance CPU, GPU, FPGA and adaptive SoC portfolio. The Pensando team brings world-class expertise and a proven track record of innovation at the chip, software and platform level which expands our ability to offer leadership solutions for our cloud, enterprise and edge customers."

GIGABYTE Technology, today announced participation in KDDI's one-phase immersion cooling proof of concept that demonstrates how alternative cooling solutions in data centers are needed and should be environmentally minded. Through this joint venture it is possible to sustain high-performance, improve the environmental impact, and reduce costs; all while doing so in a self-contained portable container. KDDI approached technology partners, such as GIGABYTE, to explore ways to bridge various disciplines to achieve the goal of an environmentally sustainable data center. GIGABYTE was keen to assist and had been monitoring and developing immersion cooling systems over the last decade.

Staring data centers in the face is one of their great challenges, and that is how to rectify the increasing power density in traditional data centers and deploy edge computing solutions. Companies are increasing reliant on cloud services and consumers expect fast streaming media and real-time results, but all of this adds work in the data center. Even if the power density reaches an acceptable balance with performance and cooling, can it be implemented in data centers with a higher consideration for the environment and operate more efficiently? That is the crux of the matter as more novel solutions must come out or the problem will only be compounded. Using liquid immersion cooling it is possible to achieve a PUE (power usage effectiveness) of 1.2-1.3, which is far better than the PUE of 1.7 found in air-cooled data centers today. PUE is an important metric to use as it determines the energy efficiency of a data center. If a data center is able to reach a PUE of 1.2-1.3 then it can reduce power consumption by 30-50%.

According to TrendForce research, corporate demand for digital transformation including artificial intelligence and high-performance computing has accelerated in recent years, which has led to increasing adoption of cloud computing. In order to improve service flexibility, the world's major cloud service providers have gradually introduced ARM-based servers. The penetration rate of ARM architecture in data center servers is expected to reach 22% by 2025.

In the past few years, ARM architecture processors have matured in the fields of mobile terminals and Internet of Things but progress in the server field has been relatively slow. However, companies have diversified cloud workloads in recent years and the market has begun to pay attention to the benefits ARM architecture processing can provide to data centers. TrendForce believes that ARM-based processors have three major advantages. First, they can support diverse and rapidly changing workloads and are more scalability and cost-effective. Second, ARM-based processors provide higher customization for different niche markets with a more flexible ecosystem. Third, physical footprint is relatively small which meets the needs of today's micro data centers.

NVIDIA today announced NVIDIA Spectrum -4, the next generation of its Ethernet platform which enables the extreme networking performance and robust security needed for data center infrastructure at scale. The world's first 400 Gbps end-to-end networking platform, NVIDIA Spectrum-4 provides 4x higher switching throughput than previous generations, with 51.2 terabits per second. It consists of the NVIDIA Spectrum-4 switch family, NVIDIA ConnectX -7 SmartNIC, NVIDIA BlueField -3 DPU and the DOCA data center infrastructure software to supercharge cloud-native applications at scale.

Built for AI, NVIDIA Spectrum-4 arrives as data centers are growing exponentially and demanding extreme performance, advanced security and powerful features to enable high-performance, advanced virtualization and simulation at scale. The Spectrum-4 Ethernet platform includes key features needed for the uncompromising requirements of these technologies.

AMD today announced a new addition to the Instinct MI200 family of accelerators. Officially titled Instinct MI210 accelerator, AMD tries to bring exascale-class technologies to mainstream HPC and AI customers with this model. Based on CDNA2 compute architecture built for heavy HPC and AI workloads, the card features 104 compute units (CUs), totaling 6656 Streaming Processors (SPs). With a peak engine clock of 1700 MHz, the card can output 181 TeraFLOPs of FP16 half-precision peak compute, 22.6 TeraFLOPs peak FP32 single-precision, and 22.6 TFLOPs peak FP62 double-precision compute. For single-precision matrix (FP32) compute, the card can deliver a peak of 45.3 TFLOPs. The INT4/INT8 precision settings provide 181 TOPs, while MI210 can compute the bfloat16 precision format with 181 TeraFLOPs at peak.

The card uses a 4096-bit memory interface connecting 64 GBs of HMB2e to the compute silicon. The total memory bandwidth is 1638.4 GB/s, while memory modules run at a 1.6 GHz frequency. It is important to note that the ECC is supported on the entire chip. AMD provides an Instinct MI210 accelerator as a PCIe solution, based on a PCIe 4.0 standard. The card is rated for a TDP of 300 Watts and is cooled passively. There are three infinity fabric links enabled, and the maximum bandwidth of the infinity fabric link is 100 GB/s. Pricing is unknown; however, availability is March 22nd, which is the immediate launch date.

AMD places this card directly aiming at NVIDIA A100 80 GB accelerator as far as the targeted segment, with emphasis on half-precision and INT4/INT8 heavy applications.

KIOXIA America, Inc., today announced that it is sampling its 2nd generation PCIe 5.0 SSD for enterprise and data center customers. After being the first vendor to offer a drive using the PCIe 5.0 interface, KIOXIA has now introduced the new CD8 Series data center NVMe SSD family. CD8 SSDs double the bandwidth per lane over PCIe 4.0 SSDs from 16 gigatransfers per second (GT/s) to 32GT/s and are optimized for hyperscale data center and enterprise server-attached workloads.

"Today, PCIe 4.0 SSDs are considered at the forefront in terms of delivering the highest levels of drive performance," commented Greg Wong, founder and principal analyst, Forward Insights. "Next generation PCIe 5.0 SSDs provide twice the level of performance, and will continue to propel the PCIe/NVMe SSD market - which is expected to grow at a CAGR of over 20% out to 2026."

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today announced availability of high-performance server platforms supporting new 3rd Gen AMD EPYC Processors with AMD 3D V-Cache technology for the modern data center. "The modern data center requires a powerful foundation to balance compute, storage, memory and IO that can efficiently manage growing volumes in the digital transformation trend," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology give our customers better energy efficiency and increased performance for a current and future of highly complex workloads."

"3rd Gen AMD EPYC processors with AMD 3D V-Cache technology continue to drive a new standard for the modern data center with breakthrough performance for technical computing workloads due to 768 MB of L3 cache, enabling faster time-to-results on targeted workloads. Fully socket compatible with our 3rd Gen AMD EPYC platforms, customers can adopt these processors to transform their data center operations to achieve faster product development along with exceptional energy savings," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD.