Over a year ago, EK Water Blocks introduced its first mainstream CPU water block, designed explicitly for delidded Intel CPUs. Since its debut, there has been a significant increase in users opting to delid their CPUs to enhance performance. Building on this trend, EK just recently released the market's first-ever All-In-One CPU cooler tailored for delidded Intel CPUs, a product that has received highly positive feedback and reception. EK, as the market leader in high-performance PC liquid cooling, is committed to constant innovation and bringing the best user experience on the market. They're reaffirming this commitment by announcing several upcoming products designed for direct die cooling. For those unfamiliar with delidding and direct die cooling, we recommend checking out EK's blog post on the topic.

First up is the highly anticipated EK Direct Die solution for Socket AM5 AMD Ryzen CPUs. Countless hours of engineering and testing were invested into these products to ensure consistent performance results and a user-friendly installation process. Unlike other solutions that require modifying an existing cold plate, this water block features a cold plate specifically designed for delidded AM5 Ryzen 7000 Series CPUs. The mounting mechanism differs from the Velocity² Direct Die water block, as it relies on standoffs at the four corners of the water block instead of the cold plate making contact with the die guard. The entire fin structure has been adjusted to direct 100% of the flow over the chiplets themselves, but more details on this topic will be available in the following days when these AMD-specific Direct Die CPU water blocks become available for order.

Wieland AIO CPU cooler is a prototype closed-loop liquid CPU cooler that lacks a pump, or any form of active coolant flow between the heat-source (the CPU block), and the sink (the radiator). The cooler works on the principle of thermosiphon, where the temperature differential between the source and sink cause coolant flow. This is essentially how solar water heaters work, as they drive coolant (water) between the heating panels and a storage tank. It's not like the cooler is without any moving parts, the radiator still needs ventilation from fans.

Der8auer tested a prototype Wieland cooler, and compared its cooling performance to that of a typical 240 mm AIO CLC (with a pump), on a machine with an AMD Ryzen 9 7950X processor with a 170 W TDP. During a 20-minute Cinebench R23 multithreaded stress test, the 240 mm AIO held temperatures to around 70 °C, while the Wieland AIO managed 78 °C. The power draw with the regular 240 mm AIO was higher, as the processor probably utilized the lower temperature to hold onto higher boost frequencies.

EK, the renowned leader in computer cooling technology, is proud to announce a groundbreaking addition to its AIO lineup: the EK-Nucleus AIO CR360 Direct Die D-RGB - 1700. This trailblazing product, a first-of-its-kind in the industry, marks a significant milestone in cooling solutions. The latest Direct Die AIO, while closely resembling the acclaimed 360 mm Lux model in many ways, stands apart with its unique application—it's expertly designed for direct die cooling. This innovative pump-block combo distinguishes itself with a custom-designed cold plate, exclusively engineered for cooling delidded Intel LGA 1700 socket CPUs. EK's latest offering expands its esteemed AIO portfolio and sets a new benchmark in specialized cooling performance.

This unique AIO cooling solution is bringing the advantages of direct die cooling to more PC enthusiasts since delidding was mainly reserved for custom loop liquid cooling applications. It required a complete custom loop setup, which was not affordable or attractive to every user. With the launch of the latest AIO, EK is bringing direct die cooling to the mainstream market. The Direct Die AIO now guarantees a seamless experience and a more budget-friendly entry into direct die liquid cooling. Key elements of the new AIO, like its backplate and die-guard, were co-developed with Der8auer, the famous German overclocker and a pioneer in extreme CPU cooling.

ASUS today announced that an international group of elite overclockers has set nine world records and achieved sixteen first-place finishes in a variety of performance benchmarks with ASUS Pro WS WRX90E-SAGE SE and ASUS Pro WS TRX50-SAGE WIFI workstation motherboards. The motherboards leveraged AMD Ryzen Threadripper PRO 7000 WX-Series and AMD Ryzen Threadripper 7000 series processors which featured up to 96 cores and 192 threads. The group of overclockers included Der8auer, Elmor, Massman, OGS, Safedisk, Seby and Shamino.

Ready for CPU and memory overclocking
For AMD Threadripper 7000 series workstations and high-end desktop (HEDT) models, AMD offers CPU and DRAM overclocking options. To fully leverage the performance of the AMD processors, ASUS has incorporated an innovative dual power supply design on Pro WS WRX90E-SAGE SE and Pro WS TRX50-SAGE WIFI motherboards. Along with robust power delivery and advanced cooling modules, these boards exhibit rock-solid stability during overclocking.

Overclocking expert Roman "der8auer" Hartung has unveiled the new Ryzen 7000 direct die water block, the AM5 Mycro Direct Die cooler. The new direct die water block promises significantly lower temperatures compared to all-in-one (AiO) liquid coolers.

Of course, users will have to remove the Ryzen 7000 series IHS in order for the block to be in direct contact with the processor, or more precisely, chiplets on the AMD Ryzen 7000 series CPUs. It works with Der8auer's high-performance heatspreader. As tested on the AMD Ryzen 9 7900X CPU, the new Mycro Direct Die cooler can lower the temperature down to 65°C, which is significantly lower than standard 280 mm AiO coolers. The Mycro Direct Die cooler shows its true cooling potential on overclocked CPUs, offering up to 28°C lower temperatures.

ASUS has released an official statement regarding the recently discovered issues with AMD Ryzen 7000 series CPUs, especially the Ryzen 7000X3D series. ASUS has also released EFI updates on Friday, that include thermal monitoring mechanism to protect motherboards and CPUs and is working on new updates that should be available soon and define new rules for AMD Expo and SoC voltage, which appear to be the main issue related to the CPU VDDIO/MC voltages.

We have already covered the first reports of damaged Ryzen 7000X3D series CPUs that suffered physical damage, and some motherboard manufacturers have already released new BIOS updates, including MSI. In the meantime, Roman "Der8auer" Hartung has also discovered that the issue might not be just limited to the Ryzen 7000X3D series, but could also impact the Ryzen 7000 X-series CPUs. Although there were no earlier reports on such issues, AMD Expo appears to be the main source of the problem and users can either disable it or manually set the SoC voltage, at least until motherboard makers come up with new BIOS updates or we hear an official statement from AMD.

EK, the premium liquid cooling gear manufacturer, is releasing the EK-Quantum Velocity² ILM Replacement - 1700, a product that replaces the motherboard's Integrated Loading Mechanism (ILM) with a frame that bolsters the structural rigidity of the socket, motherboard, and even the CPU. It is used for cooling 12th and 13th generation Intel Core CPUs with regular EK-Quantum Vector² CPU water blocks, not Direct Die models.

Due to the rectangular and elongated design of these CPUs and the way the stock ILM holds the CPU down, the Intel 12th and 13th-gen CPUs are prone to warping caused by uneven pressure. The new contact frame from EK mitigates this issue as it prevents any warping or bending of the CPU and its surrounding area. This improves the cooling efficiency due to more even pressure applied on the CPU. As a result, the bending is removed and the CPU's center that contains the heat source is no longer concave, enabling improved contact with the cooler.

EK, the premium liquid cooling hardware manufacturer, is launching the Direct Die product series aimed at delidding and achieving the ultimate cooling of the LGA 1700 socket-based Intel CPUs from the 12th generation Alder Lake and 13th gen Raptor Lake families. Kitguru teamed up with EK to investigate the potential benefits of direct die cooling for Intel's Alder Lake CPUs to achieve the best possible thermal performance on a daily basis. After publishing the first video announcing this collaboration, EK was overwhelmed by the response from Kitguru's audience. In order to bring these products to market, EK reached out to Der8auer, a renowned expert in delidding and direct die applications.

EK has prepared a total of four products to start this Direct Die series: two CPU water blocks (one Limited Edition), a delidding tool, and an upgrade kit for existing EK-Quantum Vector² LGA1700 water blocks. So far, these products are aimed at Intel's LGA1700 socket and 12th and 13th-generation Intel Core CPUs. Delidding is the process of removing the integrated heatspreader (IHS) to reduce the distance between the CPU core die and the coldplate of the CPU cooler. Another benefit involves the removal of an entire layer of thermal transfer from the CPU die to the IHS. The delidding process enables a direct heat transfer from the CPU core to the water block. All this results in a significant reduction in overall thermals and less thermal difference between CPU cores. The procedure is typically performed by experienced enthusiasts because it involves a physical modification of the product that voids the CPU warranty. For a more in-depth explanation, please refer to this EK's blog post on delidding.

Thermal Grizzly has developed a new Contact Frame designed specifically to fix bending issues present with Intel's latest 12th Gen, Alder Lake CPUs. Developed in partnership with overclocking extraordinaire Der8auer, the new Contact Frame promises to lower operating temperatures on Intel's Alder Lake. According to the company, this improvement is achieved by fixing that platform's independent loading mechanism (ILM), which has been proven to slightly deflect the integrated heatspreader (IHS), reducing its heat transfer capability.

As tested by Igor's Lab, the new contact frame for LGA 1700 reduced the operating temperature of Intel's Core i9-12900K by as much as 10.19 °C - from 70.48 °C without the Contact Frame and towards 60.29 °C after it was installed. The CPU was configured to run popular stress test Prime95, with Small FFT at a fixed 5 GHz frequency on its P-cores. The processor's E-cores were deactivated so as not to compromise the results, while the memory subsystem was run at DDR5-7000. Thermal Grizzly's Contact Frame isn't the only product in this category, and the company is introducing their product at €39.90 for the German and European markets (~$36). Enthusiasts have likely spent more in cooling upgrades that delivered a lesser final operating temperature improvement.

Der8auer has picked up Intel's latest TEC cooler, built in conjunction with EKWB, and unceremoniously plopped it right into an AMD Ryzen 9 5950X CPU. Well, not completely unceremoniously - there were many accommodations that had to be made in order to achieve this. For one, as this is a solution designed specifically for Intel CPUs and sockets, Der8auer had to Frankenstein his way through a number of cooling parts to be able to adapt the TEC solution to the AM4 socket. Not only that, but Intel's TEC requires deep software control for it to work properly - software control which only works with Intel silicon, of course. Der8auer thus had to have a second machine running an Intel 10900K CPU to control the software on the Intel cryo cooler.

All in all, the results were interesting, to say the least. The 16-core, 32-thread Ryzen 9 5950X saw single-core-load CCD temperatures in the 90 °C department with the TEC solution disabled - which promptly dropped down to only 50 °C with the cryo cooler actually operating. With a game load, the 5959X achieved up to 5.050 GHz in single-cores on its automatic boost profile. The entire chip often boosted to 4.8 - 4.9 GHz on all cores at once (with variances between the CCDs) whilst under this cooling solution and workload. With the TEC operating in its unregulated mode - which means, with no considerations for CPU operating temperature and power usage for the cooling process - saw the Ryzen 9 5950X achieving 2 °C core temperature results, and boosted frequencies up to a staggering 5323 MHz on all cores - before crashing. An interesting piece of work which you catch on video after the break; one can rest assured that most PC cooling specialists are already working on their own TEC-based cooling solutions following Intel's achievement in this field.