VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-P820, the first Pico-ITX form factor board to feature the high performance, 64-bit VIA Nano processor, bringing industry-leading digital multimedia performance and virtualization capabilities to the smallest of spaces with the VIA AMOS-3001 chassis system.

The choice of VIA Nano processor means that the VIA EPIA-P820 offers a range of advantages over competitor offerings, including full 64-bit software support, a high-performance superscalar architecture and full support of the latest virtualization technologies for next generation server and virtual machine applications. Paired with the VIA VX855 media system processor, the VIA EPIA-P820 is well equipped to handle smooth playback of the most demanding codecs at resolutions up to 1080p.

Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC), its subsidiary in the Americas, today announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The chip is the flagship device in a line-up of six new embedded NAND flash memory modules that offer full compliance with the latest e-MMC standard, and that are designed for application in a wide range of digital consumer products, including Smartphones, mobile phones, netbooks and digital video cameras. Samples of the 64GB module are available from today, and mass production will start in the first quarter of 2010.

The new 64GB embedded device combines sixteen pieces of 32Gbit (equal to 4GB) NAND chips fabricated with Toshiba's cutting-edge 32nm process technology, and also integrates a dedicated controller. Toshiba is the first company to succeed in combining 16 pieces of 32Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick. Full compliance with the JEDEC/MMCA Version 4.4(V4.4) standard for embedded MultiMediaCards supports standard interfacing and simplifies embedding in products, reducing development burdens on product manufacturers. Toshiba offers a comprehensive line-up of single-package embedded NAND Flash memories in densities ranging from 2GB to 64GB. All integrate a controller to manage basic control functions for NAND applications, and are compatible with the latest e-MMC standard and its new features, including defining multiple storage areas and enhanced security features.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA AMOS-5000, a specially designed chassis kit for Em-ITX form factor boards such as the VIA EITX-3000, offering fast and easy assembly of a variety of fanless, robust IPC designs.

Built using only five sections the VIA AMOS-5000 has the VIA-developed Em-ITX at its heart, offering developers a wealth of advantages including rich and versatile I/O configurations through expansive dual I/O coastlines, coupled with a variety of expansion modules for wide variety of application specific I/O configurations and a flexible EMIO bus supporting a wide range of modern and legacy bus technologies. Systems build using the VIA AMOS-5000 are shock resistant and can withstand a wide range of temperatures.

AMD announced immediate availability of a new enterprise-class embedded platform based on the Quad-Core AMD Opteron processor and new AMD SR5690/SP5100 server chipset. Seven AMD Opteron processors in three power bands, in conjunction with the new low-power chipset, allow high-end embedded vendors to enable increased performance-per-watt for edge-of-network systems such as telecom/datacom, storage, and security servers, and routers and switches.

This comprehensive platform offers:

• increased performance enabled for virtualized and multithreaded embedded applications;
• enhanced NEBS-friendly thermal specification;
• single source for design and tight technology integration support among CPUs, chipsets and GPUs;
• compatibility between processor generations and 5 year component longevity to support long-life designs;
• a high-performance, low power chipset with PCIe 2.0, HyperTransport 3 technology and advanced AMD Virtualization (AMD-V) technology and AMD-P power management features.

Intel Corporation today disclosed new information about next-generation Intel Xeon processors - codenamed "Jasper Forest" - for communications and storage applications, due in early 2010. With Jasper Forest, Intel engineers have, for the first time, integrated PCI Express (PCIe) in a dual-processing Xeon processor, which greatly facilitates dense storage and communications solutions such as IPTV, VoIP, NAS, SAN and wireless radio network controllers.

Jasper Forest maintains the outstanding performance of Intel architecture (Nehalem), while lowering system power consumption by 27 watts when compared to the Intel Xeon 5500 series processors. The dual-processing solution integrates two Jasper Forest processors with 16 PCIe Generation 2.0 lanes each and is paired with the Intel 3420 chipset platform controller hub. This integration of the I/O hub via PCIe enables significant power and space savings, resulting in one of the highest performance-per-watt Intel Xeon chips ever.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms,　today announced the VIA EPIA-P720 Pico-ITX board, which takes advantage of the latest VIA VX855 media system processor to deliver stunningly smooth playback of the latest HD video formats for next-generation digital interactive devices.

"VIA continually strives to offer customers compelling product designs that open up new worlds of possibility," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc.　"The VIA EPIA-P720 enables a new class of extremely compact embedded devices that can comfortably handle the most demanding video playback whilst remaining entirely fanless. No other compact platform currently offers these features in tandem."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest additions to the VIA AMOS series of universal chassis products; the VIA AMOS-1000 and VIA AMOS-2000 chassis are specially designed to work with VIA EPIA Mini-ITX and Nano-ITX boards and feature unique multi-story stackability.

VIA developed the VIA AMOS-1000 and VIA AMOS-2000 chassis to make complete system design as straightforward and expedient as possible. The guiding principle behind the VIA AMOS-1000 and VIA AMOS-2000 is the ability to add additional layers to the chassis, facilitating simple system expansion for optical drives, system storage and PCI or PCI Express AIBs.

AMD today announced immediate availability of two new dual-core, 18W TDP processors for the highly-scalable ASB1 BGA embedded client platform. The AMD Turion Neo X2 processor Model L625 and the AMD Athlon Neo X2 processor Model L325 deliver PC-caliber performance in a very low power envelope and with an embedded-friendly ball grid array (BGA) package.

This embedded client solution is ideal for traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage. The ball grid array (BGA) package helps alleviate potential reliability issues for systems that are deployed in rugged environments and has a low z-height that is designed to enable thin, compact enclosures.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA N700-10EW Nano-ITX board, designed for industrial and embedded applications in environments with extreme temperatures. Guaranteed to maintain absolute stability at temperatures ranging from -20 degrees C to 70 degrees C, the fanless VIA EPIA N700-10EW can be employed in environments that traditionally inhibit x86 computing. These include specialized industrial applications where machinery can create intense operating temperatures, as well as extreme climate scenarios like desert, mountain and high altitude environments.

"By expanding our range of EPIA products to include extended temperature products, VIA is addressing the broader needs of our extensive customer base," said Daniel Wu, Vice President of VIA Embedded, VIA Technologies, Inc. "Extreme thermal competency usually comes at a premium, the VIA EPIA N700-10EW will help to significantly lower that barrier."

AMD announced the ATI Radeon E4690 graphics processor unit (GPU) designed to enable a whole level of new reality for embedded graphics applications with more than triple the 3D graphics performance of prior AMD embedded products. Arcade system manufacturers will appreciate the long term support and lower cost of placing the GPU chip directly on the motherboard instead of a separate add-in graphics card. This product will enable digital signage manufacturers to decode and play multiple high-definition videos in hardware, offloading all the decoding from the CPU. Casino system manufacturers will be amazed by triple the graphics performance to help attract players while increasing overall entertainment value with incredibly realistic 3D graphics, plus two-monitor support.

Shuttle Inc. - the leading designer and manufacturer of small form factor (SFF) computers and accessories today announced the addition of its first VIA Nano-based models - XS29 and XS29F to the Embedded Slim series. Powered by the VIA Nano processors, the XS29 series ideally suit requirement of superb performance with great power efficiency. The XS29 series is geared at light PC users, Internet users, novices and office administrators.

"Consumers have long been looking for solutions that offer the best balance of compact, stylish design and functionality. It's even better with power efficient feature. Shuttle has dedicated to innovation following this concept and launched slim PCs in 2008 for the first time," said David Yu, chairman of Shuttle Inc. "This year, we reached a new milestone by rolling out the XS29 series and more embedded slim PCs which adapt VIA's processors of powerful performance and energy efficiency."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that it will be showing examples of its customized security solution service at Computex 2009, helping customers to employ a comprehensive and effective security infrastructure in all segments.

VIA Nano, VIA C7 and VIA Eden processor platforms are the only processors that currently offer a built-in Advanced Cryptographic Engine. In order to better help customers access this unique feature, VIA is now offering a comprehensive security solution service that can accurately meet the security needs of individual customers across a range of embedded segments.

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced shipment of its 32-Gigabyte (GB) moviNAND, the highest density embedded memory card utilizing advanced 30-nanometer (nm) class process technology. Use of high-density embedded memory improves the performance of high-end phones and other mobile consumer electronics when processing and storing large amounts of multimedia content such as videos, video games and TV broadcasts.

The 32 GB moviNAND is the first embedded memory card to use 32 Gigabit (Gb) NAND devices produced with 30nm-class process technology. The new Samsung card doubles the density of the previous generation of moviNAND that is now being produced with 16 Gb 40nm-class NAND chips.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announces the VIA VB8002 Mini-ITX board targeted at media server markets. The VIA VB8002 brings the superior performance efficiency of the VIA Nano processor to consumer-focused server products that require the right blend of power efficiency and raw processing performance.

The VIA VB8002 Mini-ITX board continues VIA's drive into compact, power-efficient multimedia server markets and is designed to meet the needs of consumers who not only want to securely store, manage and share their media libraries, but also stream high quality content in their homes.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its entry into the design manufacturing service business to offer provide flexible system hardware solutions, starting with the new VIA NSD7200 home storage and media server.

Building on its success as a pioneer of system level innovation in small form factor and IPC markets, VIA can provide OEM and ODM customers with customized versions of home and SOHO storage platforms targeting specific markets. By combining energy-efficient processor platforms and high quality chassis designs with a full design manufacturing service and comprehensive engineering support, VIA enables customers to more accurately address the needs of system integrators and retailers by speeding up product cycles and reducing production costs.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the first expansion HD module for the VIA EPIA-P710, the VIA P710-HD. Featuring the powerful 4300E embedded graphics processor from S3 Graphics, this first Pico-I/O module for stackable Pico-ITXe boards delivers Hi-Def video playback and advanced graphics in an extremely low power, compact form factor.

With multiple display support including dual DVI and HDMI, the VIA P710-HD module opens up a new realm of possibilities to system integrators of multimedia intensive embedded applications. Sophisticated digital signage, arcade gaming, kiosk and POI applications can now take advantage of multiple digital display configurations and cutting edge Hi-Def playback of resolutions up to and beyond 1080p.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms will showcase the VIA EITX-3000 Em-ITX board at ESC Silicon Valley 2009. Designed for ultra-thin, high-performance, fanless embedded systems at temperatures ranging from -10o to 70o Celsius, the VIA EITX-3000 uses unique processor placement to deliver leading performance in remarkably hot and cold environments.

The VIA EITX-3000 places the energy-efficient VIA Nano processor and VIA VX800 media system processor on the reverse side of the board, making greater real-estate available for passive cooling apparatus and thus negating the need for system fans. This makes the VIA EITX-3000 an exceptional choice for high performance systems in always-on applications such as high-end POS, Kiosk, ATM, HMI, factory automation, POI and digital signage.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today released the VIA IVP-7500 board, the first in a series of dedicated x86 in-vehicle platforms for developers of car PCs and intelligent transportation devices.

The continued evolution of the PC as a multimedia playback device for audio and video entertainment means that car owners are now demanding access to their digital media library whilst on the road. In-vehicle PCs offers access to intelligent global satellite positioning services for accurate location tracking, route planning and navigation.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest board form factor for embedded system developers; the Em-ITX form factor. Offering embedded developers a compact, versatile and highly integrated board form factor, VIA's Em-ITX establishes an off-the-shelf standard for ultra-slim embedded devices.

The Em-ITX form factor is a new open industry standard defined by VIA, and is 30% more compact than Mini-ITX, yet offers 200% more I/O real estate. At 12cm x 17cm, the Em-ITX form factor includes unique dual I/O coastlines and an exclusive Em-IO expansion bus to bring unrivalled flexibility and scalability. Benefits also include reduced time-to-market cycles for developers and access to a scalable processor platform that includes the latest 64-bit VIA Nano processor.

Advancing innovation around the Intel Atom processor with a goal to target additional market segments, Intel Corporation today announced four unique versions of processors and two new system controller hub additions to the company's "embedded" business division product line-up. The new products for the Intel Atom processor Z5xx series include industrial-temperature options, as well as different package-size choices better suited for in-car infotainment devices, media phones, eco-technologies and other industrial-strength applications.

SiS Group Company- LinkVast Technologies Inc. today announced the first generation solid-state drive (SSD) memory controllers - LVT820 and LVT815 which manage the latest solid-state memory devices and support external DRAM interfaces to meet the advanced SSD hard drive performance requirements. In addition to standard size of Hard Disk Drive in Desktop PC, LVT820 and LVT815 also can be applied in various forms and sizes for different devices for Notebook/Netbook PC, Embedded system and specific application system markets.

With SATAII interface design, the data transfer rate of LVT820 and LVT815 up to 3Gbps. They support 8 channels (64bit/64CE) and 4 channels (32bit/32CE) memory systems respectively for the flexible and diverse capacity SSD hard drive usage. By designing with the architecture of 16-bit ECC technology, that ensures data transfer accuracy and achieve the reliability and longevity to SSD hard drive with built-in the Advanced Dynamic & Static Wear Leveling technology supporting.

Today's users want an always-connected device for social media applications such as Facebook and YouTube, as well as great multimedia performance for recording and watching HD movies and videos on the go.

NVIDIA Corporation, the inventor of the graphics processor, today introduced a new platform, based on the NVIDIA Tegra 600 Series computer-on-a-chip that enables a $99, always-on, always-connected HD mobile internet device (MID) that can go days between battery charges.

This platform will enable OEMs to quickly build and bring to market devices that carriers can offer for as low as $99 -bringing broadband connectivity and all of the Web's HD content to the masses.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA NSR7800 2U rackmount server for network storage solution providers. Powered by a 1.5GHz VIA C7 processor, the VIA NSR7800 offers system integrators the opportunity to provide unparalleled power and energy-efficient server solutions to today's energy-conscious small and medium sized business customers.

With eight 3.5" S-ATA II hard drive bays, the VIA NSR7800 is the perfect balance of power-efficiency, performance and capacity, an ideal starting point for a variety of rackmount server applications including email, file and web server products. The VIA NSR7800's drive bays are easily accessible through lockable front levers that allow hard drives to be securely installed in moments. Dual Gigabit LAN ensures fast data transfer speeds.

Fairly invisible to the retail buyer, the Geode processor platform has been AMD's embedded computing product for several years in continuity. The Geode chip still finds use in embedded machines. Although the processor isn't in shortage and is available in both new-old stock or available on order by the chip-maker itself, the dated DDR memory it supports seems to be in short supply. To maintain memory compatibility with current memory standards, AMD added support for DDR2 memory.

The compatibility is brought about by a memory adapter and a new BIOS. The newer DDR2 memory will not enhance performance. It will make DDR2 memory operate at the data-rates of the older DDR standard, but will certainly keep the platform alive with support for the memory standard that's easily available in the market presently. The use of DDR2 memory is also expected to marginally reduce power consumption.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA ARTiGO A2000 barebone storage mini-server. The perfect balance of size and space, the ARTiGO A2000 packs terabytes of storage capacity within a stylish, compact, low power and low noise system.

Today's users are seeing their PCs filling up with gigabytes and even terabytes of locally stored media, and the proliferation of home DVD projects and high definition video downloads means file sizes are on the rise. The VIA ARTiGO A2000 consumes far less power and space than a regular desktop, yet provides ample storage for large home media libraries of music, photos and HD video. It can also serve as a headless Network Attached Storage box or media storage and streaming device in home server applications.