The next big update to Windows 10, slated for some time later this year, will have awareness to "favored cores." This leverages the ability of some of the latest processors to tell the operating system which of its cores are marginally "better" than the other, so it could push more of its single-threaded workloads to that core, for the highest boost clocks. Not all cores on a multi-core processor die are created equal, due to minor variations in manufacturing. Intel processors featuring Turbo Boost Max 3.0, as well as AMD Ryzen processors, have the ability to tell the operating system which of its cores are "better" than the other, which core is the "best" on the die, which is the "best" in a particular CCX (in case of "Zen" chips), and so on.

The best cores on a silicon are called "favored cores," and proper OS-level optimization could improve performance on 1-4 threaded workloads by "up to 15 percent," according to Intel. This, however, requires the processor to support Turbo Boost Max 3.0, which currently only HEDT processors do in the Intel camp. Over in the AMD front, Microsoft introduced more awareness to the multi-CCX and multi-die design of "Zen" processors with Windows 10 1903, and schedules workloads to make the most out of Zen's multi-core topology. "Zen" processors are able to report their best cores per CCX, per die, and per package, and the Ryzen Master software already displays this information, however, Windows hasn't been able to exploit favored cores. This will change with the upcoming major Windows 10 update.

Intel's upcoming Extreme Edition Core i9-10980XE from the Cascade Lake-X family. Cascade Lake-X (CSL-X) will be Intel's next take on the High End Desktop (HEDT) systems. The Core i9-10980XE is pegged as the flagship on that lineup, sporting an 18-core, 36-thread design, and are still based on Intel's 14 nm process node. These processors will be pin-compatible with Intel's LGA 2066 platform. Caches are expected to be set at 1.125 MB, 18 MB and 24.75 MB of L1, L2 and L3.

Base clocks set in the Geekbench 4 entry are set at 4.1 GHz, with a maximum boost of 4.7 GHz. That's a lot of frequency on a 14 nm CPU with 18 cores; if previous entries on the Intel HEDT family (such as the i9-9980XE) sported a 165 W TDP with clocks of 3.0 GHz and 4.4 GHz respectively, it seems highly unlikely that Intel will keep the same TDP for the i9-10980XE - and even if they do, power consumption will certainly be higher. Those reported clocks for the i9-10980XE may not be right, however - we don't know the conditions of the test run.

AMD just released an update on their upcoming processor launches this year. First revealed at E3, just a few months ago, the Ryzen 9 3950X is the world's first processor to bring 16-cores and 32-threads to the consumer desktop space. The processor's boost clock is rated at "up to 4.7 GHz", which we might now actually see, thanks to an updated AGESA software that AMD released earlier this month. Base clock for this $749 processor is set at 3.5 GHz, and TDP is 105 W, with 72 MB cache. While AMD said "September" for Ryzen 9 3950X back at E3, it looks like the date got pushed back a little bit, to November, which really makes no difference, in the grand scheme of things.

The second big part of today's announcement is that AMD is indeed working on "Rome"-based third generation Threadripper processors (probably the industry's worst-kept secret), and that these CPUs will also be launching in November, right in time to preempt Intel from having any success with their upcoming Cascade Lake-X processors. Official information on AMD's new HEDT lineup is extremely sparse so far, but if we go by recent leaks, then we should expect new chipsets and up to 32-cores/64-threads.AMD's full statement is quoted below.

With its 10th generation Core X "Cascade Lake-X" HEDT processor series, Intel will not bother designing models with single-digit core-counts. The series is likely to start at 10 cores with the Core i9-10900X. This 10-core/20-thread processor features a quad-channel DDR4 memory interface, and comes with clock speeds of 3.70 GHz base, a 200 MHz speed-bump over the Core i9-9900X. The chip retains the mesh interconnect design and cache hierarchy of Intel's HEDT processors since "Skylake-X," with 1 MB of dedicated L2 cache per core, and 19.3 MB of shared L3 cache.

Geekbench tests run on the chip show it to perform roughly on par with the i9-9900X, with the 200 MHz speed-bump expected to marginally improve multi-threaded performance. Where the "Cascade Lake-X" silicon is expected to one-up "Skylake-X" is its support for DLBoost, an on-die fixed function hardware that multiplies matrices, improving AI DNN building and training; and pricing. Intel is expected to price its next-generation HEDT processors aggressively, to nearly double cores-per-Dollar.

Intel as part of its IFA Berlin client-segment presentation resorted to some very juvenile marketing tactics, inviting criticism from noted PC enthusiast Der8auer. Intel scampered to reclaim its market position in the PC gaming space with the announcement of the Core i9-9900KS 8-core processor, which armed with a 5.00 GHz all-core Turbo Boost frequency, is expected to cement the company's gaming performance leadership. The company didn't leave it at that, and went on to attack AMD's creator performance leadership.

Der8auer observed something curious about a few slides in particular that Intel used to discredit AMD's high-end desktop processors, relating to its Creator performance as tested in Maxon Cinema 4D's benchmark program, Cinebench. Intel claimed that AMD cannot use Cinebench data to represent "real-world" performance as "only 0.22 percent" of users polled by Intel's "Software Improvement Program" respondents use Maxon Cinema 4D. And who are these respondents? Close to 11 million of them, _all_ of whom are notebook and tablet users, and a majority of whom have Software Improvement Program part of OEM bloatware. This, according to Der8auer, is fundamentally dishonest on Intel's part as Maxon Cinema 4D is less likely to be used on portable computers, and more likely on premium desktops or HEDTs. You can watch Der8auer's vlog here (English) or here (German).The complete slide-deck follows.

Intel is preparing to increase core-counts across the board with its upcoming Core X "Cascade Lake-X" HEDT processor family, launching next month. The first indication of this comes from an Intel slide that claims a 1.74 to 2.09x increase in performance-per-Dollar over "Skylake-X." The "Cascade Lake" microarchitecture already made its debut in the enterprise market as Intel's 2nd generation Xeon Scalable processors, and its IPC is similar clock-to-clock, to its predecessor (Skylake).

If Intel is claiming such performance-per-Dollar increases, it only points to a significant increase in core counts to the Dollar (think 16-core at $999, 28-core at $1999, etc.). Adding value to these chips are certain new AI accelerating instruction sets, such as DLBoost, support for Optane DC Persistent Memory, increased memory clock-speeds, and higher CPU clocks across the board compared to the Core X 9000-series. The Core X "Cascade Lake-X" processor family debuts this October.

AMD is preparing to surprise Intel with its 3rd generation Ryzen Threadripper processors derived from the "Rome" MCM (codenamed "Castle Peak" for the client-platform), that features up to 64 CPU cores, a monolithic 8-channel DDR4 memory interface, and 128 PCIe gen 4.0 lanes. For the HEDT platform, AMD could reconfigure the I/O controller die for two distinct sub-platforms within HEDT - one targeting gamers/enthusiasts, and another targeting the demographic that buys Xeon W processors, including the W-3175X. The gamer/enthusiast-targeted processor line could feature a monolithic 4-channel DDR4 memory interface, and 64 PCI-Express gen 4.0 lanes from the processor socket, and additional lanes from the chipset; while the workstation-targeted processor line could essentially be EPYCs, with a wider memory bus width and more platform PCIe lanes; while retaining drop-in backwards-compatibility with AMD X399 (at the cost of physically narrower memory and PCIe I/O).

To support this diverse line of processors, AMD is coming up with not one, but three new chipsets: TRX40, TRX80, and WRX80. The TRX40 could have a lighter I/O feature-set (similar to the X570), and probably 4-channel memory on the motherboards. The TRX80 and WRX80 could leverage the full I/O of the "Rome" MCM, with 8-channel memory and more than 64 PCIe lanes. We're not sure what differentiates the TRX80 and WRX80, but we believe motherboards based on the latter will resemble proper workstation boards in form-factors such as SSI, and be made by enterprise motherboard manufacturers such as TYAN. The chipsets made their way to the USB-IF for certification, and were sniffed out by momomo_us. ASUS is ready with its first motherboards based on the TRX40, the Prime TRX40-Pro, and the ROG Strix TRX40-E Gaming.

According to VideoCardz'es sources at ASUS, they have received confirmation that ASUS is working on new motherboards for AMD's unannounced chipset offerings, X590 and possibly even X599. In ASUS'es internal documentation two motherboards are appearing with X590 name, PRIME X590-PRO and ROG STRIX X590-E.

These motherboards are named similarly as the current offering from ASUS, the PRIME X570-PRO and ROG STRIX X570-E Gaming, so even though that we don't know if these models will ever hit the market, there is great possibility. Additionally, there is another chipset refresh coming, but now for the HEDT space. ASUS is working on ZENITH II EXTREME, an update to first ZENITH EXTREME motherboard (based on X399 chipset), which is expected to feature updated X599 chipset and should support new ThreadRipper 3000 series of CPUs. For now, we don't have any details of either two chipsets nor the improvements they will bring.

Intel is embattled in the client-segment desktop processor business, with AMD's imminent launch of its 3rd generation Ryzen desktop processors. Intel's 9th generation Core processors may lose their competitiveness to AMD's offerings, and are expected to get relieved by the company's "Ice Lake" desktop processors only in 2020. Until then, Intel will market its processors through price-cuts, promotions, bundles, and focusing on their gaming prowess. The company will refresh its HEDT (high-end desktop) processor lineup some time in Q3-2019. According to Taiwan-based industry observer DigiTimes citing sources in the motherboard industry, Intel's immediate response to 3rd generation Ryzen will be a series of price-cuts to products in its client-segment DIY retail channel.

According to these sources, prices of 9th generation Core processors could be cut by a minimum of 10 percent, and a maximum of 15 percent, varying by SKUs. This could see prices of popular gaming/enthusiast SKUs such as the Core i9-9900K, the i7-9700K, and the i5-9600K, drop by anywhere between $25 to $75. AMD is launching the Ryzen 9 3900X to compete with the i9-9900K, the Ryzen 7 3800X to compete with the i7-9700K, and the Ryzen 5 3600X to take on the i5-9600K. The three SKUs, according to AMD's internal testing, match the Intel chips at gaming, and beat them at content-creation tasks. At the heart of 3rd generation Ryzen processors is AMD's new Zen 2 microarchitecture, which brings significant IPC gains. AMD is also increasing core-counts on its mainstream desktop platform with the introduction of the Ryzen 9 family of 12-core and 16-core processors in the AM4 package.

Thermaltake today rolled out one of the first few low-profile top-flow air CPU coolers that feature addressable-RGB lighting, the UX100 ARGB. The cooler features a classic "fin bunch" design, in which radially-projecting aluminium fins bunch up at the center to form the base. A 120 mm fan is suspended along a shroud over this fin-bunch, which features a silicone LED diffuser along the bore of the shroud.

There are 15 aRGB LEDs studded into this diffuser, which take in 3-pin standard input for addressable-RGB control via software. The fan features a hydraulic bearing, takes in 3-pin DC input, spinning at 1,800 RPM, pushing 38.82 CFM of air, with a noise output of 26.92 dBA. The cooler measures 122.3 mm x 122.3 mm x 66.1 mm, and can handle thermal loads of up to 65W. Among the CPU socket types supported are AM4 and LGA115x (no HEDT sockets supported). The company didn't reveal pricing.

ASUS today rolled out the latest in its series of M.2 NVMe RAID add-on cards, the Hyper M.2 x16 Card V2. A successor to a similar card ASUS released back in 2017, this one comes with improved electrical components, so each of its four slots is guaranteed to put out 14 Watts of power. The card splits a PCI-Express 3.0 x16 link to four M.2-22110 slots, each with PCI-Express 3.0 x4 wiring. There's no PCIe switch logic involved, so your motherboard is required to support PCIe lane segmentation (most HEDT motherboards since 2016 do). The card supports Intel VROC (virtual RAID on CPU), and is tested to work on AMD Ryzen Threadripper processors. ASUS didn't change the thermal solution. You still get a chunky aluminium shroud covering the whole card, and lateral-flow fan pushing air across the drives, which can be turned off. The company didn't reveal pricing.

At Computex 2019, we spotted three new socket LGA2066 motherboards from GIGABYTE, and several other manufacturers. At its Computex 2019 keynote, Intel announced that in Q3 2019, the company is launching new Core X series HEDT processor models "for creators." When combined with the handful new LGA2066 motherboard models we've spotted, it becomes highly likely that the processors Intel is launching this Fall could be LGA2066-compatible. Without further ado, the X299G Aorus Master, the X299G Aorus Xtreme Waterforce, and the X299G Designare 10G.

The X299G Aorus Master is different from the X299 Aorus Master launched last November, and the X299G Designare 10G is different from the X299 Designare EX launched way back in 2017. The X299G Aorus Xtreme Waterforce is the first "Xtreme" sub-branded LGA2066 product. What's common to these three boards is out-of-the-box support for the upcoming HEDT processor models, besides 9th generation "Skylake-X" Refresh processors, and the original "Skylake-X" chips.

Each year we look forward to the next big fanless PSU. Seasonic did not disappoint this year, with the new Prime Fanless TX-700. This replaces the Prime Titanium Fanless 600W as the company's most powerful PSU of its kind. Its connectivity is updated to include two 4+4 pin EPS connectors, up to six 6+2 pin PCIe power, and up to twelve SATA power connectors. The best part? It holds onto its >94% 80 Plus Titanium efficiency even at 115VAC. Ripple noise suppression has been tightened to 20 mV, and micro-tolerance load regulation to 0.5%. Seasonic picked the choicest aluminium electrolytic capacitors, and worked on improving the thermals even further. The company backs their design effort with a 12-year warranty.

Seasonic also unveiled the compact 12 cm-long Prime Fanless PX-500 if your requirements aren't too steep. This 500W unit boasts of a respectable 80 Plus Platinum efficiency, the same ripple suppression and and MTLR features as its bigger sibling, and the same electrical/thermal protections. And you still get the 12-year warranty so the PSU outlasts everything else in your rig. The PX-500 has enough juice and straws for HEDT, with two 4+4 pin EPS, and four 6+2 pin PCIe.

EK Water Blocks, the leading premium liquid cooling manufacturer, is releasing a new Quantum Line series EK-Velocity sTR4 water block lineup specifically designed for HEDT AMD Ryzen Threadripper processors. The cooling engine is utilizing a 3rd generation design with the cold plate covering the IHS of the AMD Ryzen Threadripper processor while the fin structure is covering the entire multi-die CPU layout. This brings further improvements to the cooling performance and heat transfer compared to previous generations.

The release of higher core count HEDT processors opened new opportunities and challenges for cooling solutions. The primary goal in designing the new EK-Velocity sTR4 water block was to completely redesign the cooling engine to achieve even better performance than the previous generations. A dense micro-fin structure counts 91 wide grooves to enable superb heat transfer.

Prices of PC DDR4 memory modules are normalizing to 3-year lows as the pre-Summer PC upgrade season looms and several AAA game launches line up. 8 GB (2x 4 GB) dual-channel DDR4 memory kits have dropped to around USD $50 on popular PC component retailers such as Newegg, 16 GB (2x 8 GB) kits can be had for $80 at DDR4-2667 speeds. Premium 16 GB dual-channel kits (DDR4-3200 and above) start at $99. Premium 16 GB kits with RGB embellishments now typically start at $120.

Perhaps the biggest news from these memory price drops come in the form of capacity. 32 GB dual-channel (2x 16 GB) memory kits now start for as little as $144, for a kit with two dual-rank DDR4-2667 modules. Premium 32 GB kits, with RGB lighting and speeds as high as DDR4-3000 now start at $180. HEDT builders also have reason to cheer, as 32 GB quad-channel (4x 8 GB) kits start for as little as $150, and premium kits with DDR4-3000 frequency can be had for as little as $184. Newegg and the US aren't the only places you can find sharp drops in memory prices. Even across the big pond in Germany, we've been tracking significant drops in memory prices, with 16 GB dual-channel kits starting at 79€, premium 16 GB kits around 100€, 32 GB kits at 160€, and premium 32 GB kits around 190€.

Intel is rumored to refresh its high-end desktop (HEDT) platforms this Summer with new products based on the "Cascade Lake" microarchitecture. Intel now has two HEDT platforms, LGA2066 and LGA3647. The new "Cascade Lake-X" silicon will target the LGA2066 platform, and could see the light of the day by June, on the sidelines of Computex 2019. A higher core-count model with 6-channel memory, will be launched for the LGA3647 socket as early as April. So if you've very recently fronted $3,000 on a Xeon W-3175X, here's a bucket of remorse. Both chips will be built on existing 14 nm process, and will bring innovations such as Optane Persistent Memory support, Intel Deep Learning Boost (DLBOOST) extensions with VNNI instruction-set, and hardware mitigation against more variants of "Meltdown" and "Spectre."

Elsewhere in the industry, and sticking with Intel, we've known since November 2018 of the existence of "Comet Lake," which is a 10-core silicon for the LGA1151 platform, and which is yet another "Skylake" derivative built on existing 14 nm process. This chip is real, and will be Intel's last line of defense against AMD's first 7 nm "Zen 2" socket AM4 processors, with core-counts of 12-16.

In a sign of just how arid the DIY retail channel has become for Intel, Tom's Hardware reports that the new socket flagship LGA2066 HEDT processor model Intel sneaked into its product-stack, the Core i9-9990XE, is restricted to the OEM/SI (system integrator) channel. Even to OEMs, ordering a tray of i9-9990XE chips isn't as simple as ordering other chips, such as the i9-9900K. Apparently, Intel has been running secret online auctions that are OEM-only, for these chips. OEMs get to bid on the per-chip price in n-unit tray quantities.

Workstation integrator Puget Systems was able to score itself some i9-9990XE inventory at USD $2,300 per chip. Puget Systems last week received its first batch of chips from Intel, and released performance benchmarks. At this price, the i9-9990XE is being sold at a 21% premium over the retail-channel SEP price of the i9-9980XE, and a whopping 65% premium over the i9-9940X. Intel can't shake off comparisons between the i9-9990XE and the i9-9940X because both chips are 14-core/28-thread with 19.25 MB shared L3 cache, with the i9-9990XE only offering significantly higher clock-speeds, but at an astounding TDP of 255W. The i9-9990XE was shown beating the 18-core i9-9980XE in a variety of HEDT-relevant benchmarks.

Intel is giving final touches to a new socket LGA2066 high-end desktop processor with an interesting model number for its specifications. The new Core i9-9990XE is positioned above the current flagship i9-9980XE. Normally you'd expect it to be the same 18-core "Skylake-X" chip with a speed-bump, however, the i9-9990XE is a unique proposition. It sheds cores in favor of significantly higher clock-speeds than the i9-9980XE.

The i9-9990XE is a 14-core/28-thread processor, based on a binned "Skylake-X" HCC (high core count) die, and uses STIM (soldered thermal interface material) between the die and integrated heatspreader (IHS). It features some aggressive clock-speeds, with 4.00 GHz nominal clock-speeds, and a massive 5.10 GHz maximum Turbo Boost frequency that beats even the Core i9-9900K. Besides 14 cores, the i9-9990XE is configured with 19.25 MB of shared L3 cache, and 1 MB of L2 cache per core. The four disabled cores alone don't help Intel's efforts to dial up clock-speeds. Intel has increased the chip's rated TDP all the way up to 255 Watts!

At CES 2019, Silverstone updated its portfolio of unique short-length high-Wattage PSUs with the new Strider Titanium 1550W (ST1550-Ti) and Strider Platinum 2000W (ST2000-Pt). Their biggest USP is their high power density and short lengths, in the 18-19 cm range. The ST1550-Ti, as its name suggests, boasts of 80 Plus Titanium efficiency. It's a minor update to the ST1500-Ti the company launched in 2017. The ST2000-Pt, on the other hand, puts out 2000 Watts of power using a single 166A +12V rail. Owing to its short length, it ends up with a stellar 861 Watts/liter power density. Both models feature a large number of PCIe and EPS connectors to power heavily overclocked HEDT builds with multiple graphics cards.

SilverStone today released what it calls the world's smallest Kilowatt-class PSUs. The new Strider Platinum series ST1200-PTS and ST1000-PTS are fully-modular PSUs with a physical depth of only 14 cm. You typically find 650~750W PSUs this small. As their model names suggest, these units pack a wallop, with 1200W and 1000W continuous outputs, respectively. Both units are HEDT-friendly, with two 4+4 pin EPS power connectors, in addition to a 24-pin ATX, and eight 6+2 pin PCIe power connectors. You also get up to eight SATA power and six 4-pin Molex.

Under the hood, the units feature a single +12V rail design, with 80 Plus Platinum efficiency, active PFC, ±3% regulation and low ripple, and most common electrical protections, against over/under-voltage, over/under-current, overheat, overload, surge, and short-circuit. The units are cooled by a 120 mm hybrid ceramic bearing fan, which spins below 1000 RPM up to 50% load, with a minimum noise output of 18 dBA, and only then begins to ramp up. SilverStone is including a dust-filter to go with the air-intakes of these PSUs. The 1000W model is priced at USD $209.99, and the 1200W model at $239.99.

In Win today introduced the Compact Series 700-Watt power-supply in the SFX form-factor. At 125 mm x 100 mm x 63 mm (WxDxH), this PSU is firmly sticks to the SFX specification, and not SFX-L. There's still enough juice on tap to power a compact build with a flagship graphics card, such as the RTX 2080 Ti, or TITAN V. The CS700W from In Win achieves its Wattage through a single +12V rail design, which boasts of 80 Plus Gold efficiency. The unit features Active PFC, and most common electrical protections, against over/under-voltage, overload, overheat, and short-circuit.

The In Win CS700W offers fully modular cabling, with flat bunched ribbon-type cables that are easier to bend. Its connectivity is HEDT-friendly: you get one 24-pin ATX, two 4+4 pin EPS, four 6+2 pin PCIe power, eight SATA power, four Molex, and one Berg. The unit is cooled by a 92 mm fluid bearing fan, with a typical noise output of 18 dBA. The CS700W is backed by a 5-year warranty, the company didn't reveal pricing.

Intel could very soon fork its high-end desktop platform into two, with the introduction of the new Z399 socket LGA2066 chipset later this quarter; and the fabled X599 chipset powering LGA3647 processors. The move is probably triggered by AMD's introduction of new 24-core and 32-core Ryzen Threadripper processors that wipe out competitiveness of its existing "Basin Falls" X299 platform. The X599 could essentially be a C629 with the addition of some client-segment features (and the subtraction of some enterprise-segment ones), whereas the Z399 is a whole different beast.

With the introduction X599 and LGA3647, Intel could restore competitiveness at the >$1,500 market segment with new 24-core, 26-core, and 28-core "Skylake-X" XCC (extended/extreme core count) processors; whereas the introduction of Z399 could be necessitated with a that of a new 22-core chip for the LGA2066 socket, from which Intel can carve out new 20-core and 22-core SKUs. Existing Skylake-X LCC and HCC chips could be forwards-compatible with Z399, and X299 motherboards could still be eligible for supporting new 20-core and 22-core processors via BIOS updates. The Z399 could introduce a handful of new client-segment features Intel is introducing with the Z390.

ASUS today launched the Republic of Gamers (ROG) Ryujin line of all-in-one liquid CPU coolers for AMD Ryzen Threadripper processors. Positioned above the ROG Ryuo series, which opened to pre-orders earlier this month, the Ryujin was first showcased at the 2018 Computex. These coolers are characterized by a somewhat square pump-block design that resembles a that of a chipset heatsink; but is embedded with a 1.77-inch color OLED display that shows an animated ROG logo by default, but can be reprogrammed to show just about anything, such as clan logos, live CPU temperature/load monitoring, etc. Another innovation that sets the Ryujin pump-block apart from every other Asetek cooler out there, is a tiny lateral-blower fan embedded into the block, which ASUS claims can bring down CPU VRM and M.2 SSD temperatures by up to 20°C.

The Ryujin series comes in two variants based on radiator size, the Ryujin 240 (120 mm x 240 mm radiator), and Ryujin 360 (120 mm x 360 mm radiator). These are 27 mm-thick aluminium radiators, which are ventilated by matte-black Noctua IndustrialPPC 120 mm PWM fans that are part of the package. These fans each spin between 450 to 2,000 RPM, pushing up to 121.8 CFM of air, with noise output up to 31 dBA. As we mentioned earlier, the product pages for both models mentions that the coolers only support AMD socket TR4, with full coverage for the AMD Ryzen Threadripper integrated heatspreader. This could help ASUS command a slightly high price, given that it's catering only to the market that can afford HEDT processors.

With the arrival of its 2nd generation Ryzen Threadripper HEDT processors, AMD cut prices of the socket-compatible first-generation parts. A highlight of this move is the availability of the 12-core/24-thread Threadripper 1920X at $399. This chip trades blows with the Core i9-7900X in multi-threaded tasks, and considering stores are still listing Intel's 6-core/12-thread Core i7-7800X at $390 and the 8-core/16-thread i7-7820X at $469, could make for a better alternative, with more PCIe lanes. The 8-core/16-thread Threadripper 1900X is now down to $299, or less than the SEP price of the Ryzen 7 2700X. The 1900X still gives you 64-lane PCIe and quad-channel memory.

AMD is known for some of the most quirky retail packaging. It sold its first FX-series processor in tin boxes, and its first Ryzen Threadripper HEDT processors came in an unusually shaped box that made unpacking the processor an experience unto itself. With its second generation, AMD is poised to introduce new 24-core and 32-core SKUs, presenting the company with an opportunity to make its retail boxes even more grandiose on store shelves.

The new box features a rounded-rectangular front and rear side. A large acrylic window dominates the front, with polygonal bellows leading up to an inner case that shows off the processor as if its a piece of jewelry. This window opens up like an airtight Tupperware box, with a lock on the top, and a hinge at the bottom. Inside, there's a small orange LED lightshow powered by a couple of 2032 button cells. The reverse side also has an acrylic window looking up to the translucent orange back of the inner case, showing you the LGA of the chip. The product logo is unchanged, but a catchphrase has been added - Unlocked, Unrestrained, Uncompromising.