Intel is set to introduce a series of eight-core Xeon server processors later this month, that are capable of running in four-socket servers. With HyperThreading technology enabled, each core can handle two threads, taking the logical CPU count on such servers up to 64. Each Nehalem-EX chip has 8 CPU cores with dedicated L2 caches of 256 KB, a shared L3 cache of 24 MB, and Turbo Boost technology that helps conserve power while also stepping up performance when needed. The die also features a memory controller with four DDR3 memory channels. Being based on the Nehalem architecture, the chips are built on the 45 nm HKMG process.

In related news, Intel will also introduce Westmere-EP processors later this month. These chips will be based on the 32 nm Westmere architecture, and are likely to have 6 cores, up to 12 logical CPUs per chip, 12 MB of L3 cache and three DDR3 memory channels. These chips will be suited for two-socket servers and workstations.

At the 2010 Mobile World Congress, GLOBALFOUNDRIES and ARM today unveiled new details on their leading-edge System-on-Chip (SoC) platform technology for powering the next generation of wireless products and applications. The new chip manufacturing platform is projected to enable a 40 percent increase in computing performance, a 30 percent decrease in power consumption, and a 100 percent increase in standby battery life. The new platform includes collaboration on two GLOBALFOUNDRIES process variants: 28nm super low power (SLP) for mobile and consumer applications and 28nm high performance (HP) for applications requiring maximum performance.

"The success of the next generation of mobile products will be increasingly dependent on their ability to deliver PC-class performance, a highly integrated rich media experience and longer battery life," said GLOBALFOUNDRIES chief operating officer Chia Song Hwee. "These demands are going to require a strong technology foundation and close collaboration between industry leaders to enable an increasing number of design companies to unlock this innovation. We are working closely with ARM to optimize the physical IP and implementation of the Cortex-A9 processor with our proven manufacturing experience in high-volume, advanced technology products, to deliver a fully integrated platform for leading-edge wireless products and applications."

Intel today gave a go ahead for the media to publish reviews of its brand new dual-core processors under the Core i5 6xx and Core i5 6x1 series. The processors are based on the new "Clarkdale" processor die, and make use of the company's 32 nm next generation HKMG manufacturing process. Unlike conventional processor packages based on the Nehalem/Westmere architecture, the new processors move the northbridge component of the system onto the processor package, only that it is based on a separate 45 nm die within the package. The 32 nm processor die houses two processor cores along with up to 4 MB of L3 cache, while it is wired to a larger iGPU die which houses the dual-channel DDR3 memory controller, a graphics core, PCI-Express root complex, along with other components traditionally found on northbridge chips.

The first three models in the new Core i5 series are the 3.20 GHz Core i5 650, 3.33 GHz Core i5 660 and 661 (latter has a faster iGPU), and 3.46 GHz Core i5 670. These processors have the LGA-1156 package and are compatible with existing P55 Express chipset (albeit without the iGPU feature), along with the company's new H55 Express and H57 Express chipsets that support the Flexible Display Interface that provides connectivity to the processors' iGPUs. The new processors feature HyperThreading Technology, with which it provides the operating system with four logical CPUs (threads) to deal with, TurboBoost technology which powers down a core and overclocks the other when the task load is low. Pricing and availability will surface when the processors are formally announced, a little later this month. Meanwhile, motherboard manufacturers are ready with boatloads of new motherboard models based on Intel's two new chipsets. A compilation of links to major reviews on the internet can be found in the day's reviews list on the homepage.

Intel's Core i7 LGA-1366 performance segment processors is in for another update, past the recent introduction of the Core i7 960 (3.20 GHz). The newest entry replaces the popular Core i7 920, and leverages the company's socket LGA-1366 platform as the ultimate high-performance desktop platform. The Core i7 930, like all processors in the Core i7 900 series, runs on motherboards with the Intel X58 Express chipset. The processor comes with a clock speed of 2.88 GHz. Assuming it retains the base frequency of 133 MHz, we're not entirely sure how 2.88 GHz is worked out with a bus multiplier value that is a whole number. Since the Core i7 930 replaces the i7 920, it is expected to seat itself at the same price point of $299. Since this release comes slightly ahead of that of Intel's "Gulftown" 6-core processor, in Q1 2010, it remains to be seen if this processor continues to be built on the 45 nm HKMG process, or the newer 32 nm one.

ARM and GLOBALFOUNDRIES today announces a long-term strategic relationship to provide their mutual customers with an innovative SoC enablement program. To support the long-term relationship, GLOBALFOUNDRIES and ARM have signed a broad agreement on processor implementation and circuit optimization to provide mutual customers with a robust enablement program geared towards next-generation applications.

The SoC enablement program, built around a full suite of ARM Physical IP, Fabric IP and Processor IP, will deliver customers unparalleled design flexibility on GLOBALFOUNDRIES' most advanced HKMG semiconductor manufacturing capabilities. The collaborative efforts of the partnership will initially focus on enabling SoC products which use the low power and high performance ARM Cortex -A9 processor on GLOBALFOUNDRIES 28nm HKMG process. The characteristics of GLOBALFOUNDRIES 28nm "Gate First" HKMG technology is optimized for high performance processing with minimal leakage making it an ideal choice for advanced mobile solutions.

As the semiconductor industry begins its transition to the next technology node, GLOBALFOUNDRIES is on track to take its position as the foundry technology leader. On October 1 at the Global Semiconductor Alliance Emerging Opportunities Expo & Conference in Santa Clara, Calif., GLOBALFOUNDRIES (Booth 321) will provide the latest details on its technology roadmap for the 32nm/28nm generations and its innovative "Gate First" approach to building transistors based on High-K Metal Gate (HKMG) technology.

"With each new technology generation, semiconductor foundries are increasingly challenged with the economics to sustain R&D and the know-how to bring these technologies to market in high-volume," said Len Jelinek, director and chief analyst, iSuppli. "With a heritage of rapidly ramping leading-edge technologies to high volumes at mature yields, combined with aggressive investments in capacity and technology, GLOBALFOUNDRIES is uniquely-positioned to challenge for next-generation foundry leadership."