At Intel's 2022 Investor Meeting, Chief Executive Officer Pat Gelsinger and Intel's business leaders outlined key elements of the company's strategy and path for long-term growth. Intel's long-term plans will capitalize on transformative growth during an era of unprecedented demand for semiconductors. Among the presentations, Intel announced product roadmaps across its major business units and key execution milestones, including: Accelerated Computing Systems and Graphics, Intel Foundry Services, Software and Advanced Technology, Network and Edge, Technology Development, More: For more from Intel's Investor Meeting 2022, including the presentations and news, please visit the Intel Newsroom and Intel.com's Investor Meeting site.

Intel's upcoming Alder Lake-S lineup of processors is shaping up to be a rather good generational improvement. With wonders of the Intel 7 process, previously called 10 nm Enhanced SuperFin (10ESF), the processor lineup will deliver new hybrid technology, mixing new big and small cores into one package. Today, some new CPU-Z validation tests have shown up for the Intel Core i5-12600K CPU, which directly replaces the previous Core i5-11600K Rocket Lake model. With six high-performance Golden Cove and four efficient Gracemont cores, the Core i5-12600K CPU is a ten-core design with 16 threads. And compared to the 6C/12T i5-12600K CPU, the performance is much higher.

According to CPU-Z scores, the new Alder Lake processor scored 7220 and 7156 points for a multi-threaded benchmark in two tests. Compare this to the previous-generation model, which scores 4731 points, and the new chip is almost 50% faster. According to CPU-Z, the new CPU achieved this while running at a boost frequency of 4.5 GHz to 4.7 GHz.

The 12th Gen Core "Alder Lake" microarchitecture will see Intel unify its desktop- and mobile processor IP, back to the way things were up to the 9th Gen. With its post-14 nm silicon fabrication nodes in their infancy, Intel had diverged the client processor IP across its 10th and 11th Gen Core. With 10th Gen, the company introduced "Ice Lake" for ultra-portable platforms (28 W and below), while retaining 14 nm "Comet Lake" for mainstream notebooks (28 W to 45 W); while keeping desktop exclusively with 14 nm "Comet Lake." For 11th Gen, the story is mostly similar. Cutting-edge 10 nm "Tiger Lake" now covers all mobile categories, while desktop receives an IPC upgrade, thanks to the 14 nm "Rocket Lake." The 12th Gen will see a common microarchitecture, "Alder Lake," span across all client segments, from 7 W ultra mobile, to 125 W enthusiast desktop.

This, however, doesn't mean that Intel has a one-size fits all silicon that it can carve SKUs out of. The company has developed as many as three physical dies based on "Alder Lake," which vary in CPU core counts, the size of the iGPU, and other on-die components. "Alder Lake" is a hybrid processor with a combination of larger "Golden Cove" P-cores, and smaller "Gracemont" E-cores. The P-cores are spatially large, and along with their L3 cache slices, take up a large share of the compute portion of the silicon. The E-cores come in clusters of 4 cores each.

Intel, in a move comparable to its competitors' Performance Rating system from the 1990s, has invented a new naming scheme for its in-house foundry nodes to claim technological parity with contemporaries such as TSMC and Samsung, that are well into the sub-10 nm class. Back in the i586 era, when Intel's competitors such as AMD and Cyrix, couldn't keep up with its clock-speeds yet found their chips to be somewhat competitive, they invented the PR (processor rating) system, with a logical number attempting to denote parity with an Intel processor's clock-speed. For example, a PR400 processor rating meant that the chip rivaled a Pentium II 400 MHz (which it mostly didn't). The last that the PR system made sense was with the final generation of single-core performance chips, Pentium 4 and Athlon XP, beyond which, the introduction of multi-core obfuscated the PR system. A Phenom X4 9600 processor didn't mean performance on par with a rival Intel chip running at an impossible 9.60 GHz.

Intel's new foundry naming system sees its 10 nm Enhanced SuperFin node re-badge as "Intel 7." The company currently builds 11th Gen Core "Tiger Lake" processors on the 10 nm SuperFin node, and is expected to build its upcoming 12th Gen Core "Alder Lake" chips on its refinement, the 10 nm Enhanced SuperFin, which will now be referred to as "Intel 7." The company is careful to avoid using the nanometer unit next to the number, instead signaling the consumer that the node somehow offers transistor density and power characteristics comparable to a 7 nm node. Intel 7 offers a 10-15 percent performance/Watt gain over 10 nm SuperFin, and is already in volume production, with a debut within 2021 with "Alder Lake."

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

"Building on Intel's unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025," Intel CEO Pat Gelsinger said during the global "Intel Accelerated" webcast. "We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore's Law and our path to innovate with the magic of silicon."