As we witness Apple's generational updates of the M series of chips, the highly anticipated SKU of the 3rd generation of Apple M series yet-to-be-announced top-of-the-line M3 Ultra chip is growing speculations from industry insiders. The latest round of reports suggests that the M3 Ultra might step away from its predecessor's design, potentially adopting a monolithic architecture without the UltraFusion interconnect technology. In the past, Apple has relied on a dual-chip design for its Ultra variants, using the UltraFusion interconnect to combine two M series Max chips. For example, the second generation M Ultra chip, M2 Ultra, boasts 134 billion transistors across two 510 mm² chips. However, die-shots of the M3 Max have sparked discussions about the absence of dedicated chip space for the UltraFusion interconnect.

While the absence of visible interconnect space on early die-shots is not conclusive evidence, as seen with the M1 Max not having visible UltraFusion interconnect and still being a part of M1 Ultra with UltraFusion, industry has led the speculation that the M3 Ultra may indeed feature a monolithic design. Considering that the M3 Max has 92 billion transistors and is estimated to have a die size between 600 and 700 mm², going Ultra with these chips may be pushing the manufacturing limit. Considering the maximum die size limit of 848 mm² for the TSMC N3B process used by Apple, there may not be sufficient space for a dual-chip M3 Ultra design. The potential shift to a monolithic design for the M3 Ultra raises questions about how Apple will scale the chip's performance without the UltraFusion interconnect. Competing solutions, such as NVIDIA's Blackwell GPU, use a high-bandwidth C2C interface to connect two 104 billion transistor chips, achieving a bandwidth of 10 TB/s. In comparison, the M2 Ultra's UltraFusion interconnect provided a bandwidth of 2.5 TB/s.

A team of academic researchers has uncovered a critical vulnerability in Apple M-series CPUs targeting data memory-dependent prefetcher (DMP) that could allow attackers to extract secret encryption keys from Macs. The flaw, called GoFetch, is based on the microarchitecture design of the Apple Silicon, which means that it cannot be directly patched and poses a significant risk to users' data security. The vulnerability affects all Apple devices powered by M-series chips, including the popular M1 and M2 generations. The M3 generation can turn a special bit off to disable DMP, potentially hindering performance. The DMP, designed to optimize performance by preemptively loading data that appears to be a pointer, violates a fundamental requirement of constant-time programming by mixing data and memory access patterns. This creates an exploitable side channel that attackers can leverage to extract secret keys.

To execute the GoFetch attack, attackers craft specific inputs for cryptographic operations, ensuring that pointer-like values only appear when they have correctly guessed bits of the secret key. By monitoring the DMP's dereference behavior through cache-timing analysis, attackers can verify their guesses and gradually unravel the entire secret key. The researchers demonstrated successful end-to-end key extraction attacks on popular constant-time implementations of both classical and post-quantum cryptography, highlighting the need for a thorough reevaluation of the constant-time programming paradigm in light of this new vulnerability.

Apple's M-series chips frighten Intel, AMD, and Microsoft like nothing else can, as they have the potential to power MacBooks to grab a sizable share of the notebook market share. This is based squarely on the phenomenal performance/Watt on offer with Apple's chips. A user installed Windows 11 Arm on a virtual machine running on an M2-powered MacBook, opened up CPU-Z (which of course doesn't detect the chip since it's on a VM). They then ran a CPU-Z Bench session for a surprising result—a single-threaded score of 749.5 points, with a multithreaded score of 3822.3 points.

The single-thread score in particular is comparable to Intel's 12th Gen Core "Alder Lake" chips (their "Golden Cove" P-cores); maybe not on the fastest Core i9-12900K, but of the mid-range Core i5 chips, such as the i5-12600. It's able to do this at a fraction of the power and heat output. It is on the backs of this kind of IPC that Apple is building bigger chips such as the M3 Pro and M3 Max, which are able to provide HEDT or workstation-class performance, again, at a fraction of the power.

Apple today announced Apple Vision Pro will be available beginning Friday, February 2, at all U.S. Apple Store locations and the U.S. Apple Store online. Vision Pro is a revolutionary spatial computer that transforms how people work, collaborate, connect, relive memories, and enjoy entertainment. Vision Pro seamlessly blends digital content with the physical world and unlocks powerful spatial experiences in visionOS, controlled by the most natural and intuitive inputs possible—a user's eyes, hands, and voice.

An all-new App Store provides users with access to more than 1 million compatible apps across iOS and iPadOS, as well as new experiences that take advantage of the unique capabilities of Vision Pro. Pre-orders for Apple Vision Pro begin Friday, January 19, at 5 a.m. PST. "The era of spatial computing has arrived," said Tim Cook, Apple's CEO. "Apple Vision Pro is the most advanced consumer electronics device ever created. Its revolutionary and magical user interface will redefine how we connect, create, and explore."

Apple introduced its 15‑inch MacBook Air at June's WWDC23 event—the giant multinational technology had taken feedback from its customer base, and followed through by rolling out a larger version of the existing M2-based 13-inch model. That appeasement could be a wasted effort, given the latest rumors emerging from Asia. DigiTimes has gathered information from sources within Apple's supply chain—they claim that "the 15-inch MacBook Air...reportedly didn't meet customer demand expectations. There are even calls for the supply chain to put shipments on hold."

The 15-inch MacBook Air's shipment volume for July is reportedly 50% short of the company's original projection, with a broad downturn in the global notebook market factoring in as a reason for sluggish sales. The model's $1299 starting price appears to be quite reasonable at first glance, but the entry point only gives you a spec consisting of non-upgradable 8 GB (unified) RAM and 256 GB solid state storage. A discerning buyer is semi-forced to shell out closer to $2000 for a more competitive configuration, comparable to the closest Window 11 slimline laptops. The high asking prices, on top of a mixed reception around launch time have done the 15-inch MacBook Air few favors. Apple enthusiasts are probably saving up and waiting for the arrival of upcoming M3 chipset-equipped models. DigiTimes reckons that an "upcoming announcement" regarding a next-gen MacBook Pro is due very soon.

Apple today announced M2 Ultra, a new system on a chip (SoC) that delivers huge performance increases to the Mac and completes the M2 family. M2 Ultra is the largest and most capable chip Apple has ever created, and it makes the new Mac Studio and Mac Pro the most powerful Mac desktops ever made. M2 Ultra is built using a second-generation 5-nanometer process and uses Apple's groundbreaking UltraFusion technology to connect the die of two M2 Max chips, doubling the performance. M2 Ultra consists of 134 billion transistors—20 billion more than M1 Ultra. Its unified memory architecture supports up to a breakthrough 192 GB of memory capacity, which is 50 percent more than M1 Ultra, and features 800 GB/s of memory bandwidth—twice that of M2 Max. M2 Ultra features a more powerful CPU that's 20 percent faster than M1 Ultra, a larger GPU that's up to 30 percent faster, and a Neural Engine that's up to 40 percent faster. It also features a media engine with twice the capabilities of M2 Max for blazing ProRes acceleration. With all these advancements, M2 Ultra takes Mac performance to a whole new level yet again.

"M2 Ultra delivers astonishing performance and capabilities for our pro users' most demanding workflows, while maintaining Apple silicon's industry-leading power efficiency," said Johny Srouji, Apple's senior vice president of Hardware Technologies. "With huge performance gains in the CPU, GPU, and Neural Engine, combined with massive memory bandwidth in a single SoC, M2 Ultra is the world's most powerful chip ever created for a personal computer."

Apple today unveiled Apple Vision Pro, a revolutionary spatial computer that seamlessly blends digital content with the physical world, while allowing users to stay present and connected to others. Vision Pro creates an infinite canvas for apps that scales beyond the boundaries of a traditional display and introduces a fully three-dimensional user interface controlled by the most natural and intuitive inputs possible—a user's eyes, hands, and voice. Featuring visionOS, the world's first spatial operating system, Vision Pro lets users interact with digital content in a way that feels like it is physically present in their space. The breakthrough design of Vision Pro features an ultra-high-resolution display system that packs 23 million pixels across two displays, and custom Apple silicon in a unique dual-chip design to ensure every experience feels like it's taking place in front of the user's eyes in real time.

"Today marks the beginning of a new era for computing," said Tim Cook, Apple's CEO. "Just as the Mac introduced us to personal computing, and iPhone introduced us to mobile computing, Apple Vision Pro introduces us to spatial computing. Built upon decades of Apple innovation, Vision Pro is years ahead and unlike anything created before—with a revolutionary new input system and thousands of groundbreaking innovations. It unlocks incredible experiences for our users and exciting new opportunities for our developers."

"Creating our first spatial computer required invention across nearly every facet of the system," said Mike Rockwell, Apple's vice president of the Technology Development Group. "Through a tight integration of hardware and software, we designed a standalone spatial computer in a compact wearable form factor that is the most advanced personal electronics device ever."

Apple today introduced the 15-inch MacBook Air, the world's best 15-inch laptop. With an expansive 15.3-inch Liquid Retina display, the incredible performance of M2, up to 18 hours of battery life, and a silent, fanless design, the new MacBook Air brings power and portability - all in the world's thinnest 15-inch laptop. With an all-new six-speaker sound system, the 15-inch MacBook Air delivers immersive Spatial Audio, along with a 1080p FaceTime HD camera, MagSafe charging, and the power and ease of macOS Ventura for an unrivaled experience. Customers can order starting today, with availability beginning Tuesday, June 13. The 13-inch MacBook Air with M2 gets a new starting price of $1,099 - $100 less than before - to deliver even more value and choice to everyone, from upgraders to first-time Mac customers.

"We're thrilled to introduce the first 15-inch MacBook Air. With its incredible performance and striking design, the new MacBook Air is the world's best 15-inch laptop. And it's only possible with Apple silicon," said John Ternus, Apple's senior vice president of Hardware Engineering. "From its expansive Liquid Retina display and remarkably thin and fanless design, to extraordinary battery life and an immersive six-speaker sound system, the new MacBook Air has it all."

Regular readers of TPU might remember our in-depth USB4 article that we posted almost a year ago, but since then, very little has happened and ASMedia has as yet to make its ASM4242 USB4 host controller available to its partners and then ASM2464 USB4 to PCIe 4.0 bridge was suffering the same fate until May this year, when it was released to ASMedia's customers. It turns out most of it is related to USB-IF certification and the USB4 design documentation, as the certification wasn't quite ready for a third party host controller and the design documents were—shall we say—less than complete and relied too heavily on the Thunderbolt 3 spec. This meant that ASMedia had to retest and redo a lot of work they had done, due to a certain spec donator having assumed that other companies knew how it had designed its Thunderbolt products.

The good news is that we should see the ASM4242 in the market before the end of this year and ASMedia is busy testing it and its ASM2464 with a wide range of products to make sure compatibility is as good as possible. In the company suite at Computex, ASMedia was showing the ASM2464 connected to Apple's M2 silicon, as well as Intel's latest CPUs with integrated Thunderbolt 4 support. There had been some performance related issues from Apple's side, but this has apparently been resolved in a recent update from Apple. As far as Intel is concerned, there are no compatibility issues with the 13th and possibly 12th gen mobile chips, but older Thunderbolt hardware might require a firmware update, which may or may not exist. Older Intel hardware also doesn't perform as well as its most recent solutions, but it doesn't mean there will be compatibility issues outright. As for AMD, ASMedia informed TPU that there were no issues, since AMD has a USB4 implementation in its mobile products that follow the USB-IF spec.

Thanks to the latest release of the Power On newsletter from Mark Gurman, we have additional information about Apple's upcoming M3 Pro chip. Currently in testing and reported on by an App Store developer, Apple is looking to upgrade the microarchitecture of the forthcoming chip and add additional cores to the system for more performance. As the report notes, the entry-level M3 Pro chip currently in testing will have 12 CPU cores, six for efficiency and six for performance tasks, with 18 graphics cores, all manufactured on TSMC's 3 nm node. The current baseline for M2 Pro is 10 CPU cores, where four are dedicated to efficiency, and six are dedicated to performance. The current generation entry-level M2 Pro also features a 16-core GPU, which is two cores fewer than the upcoming model.

Generally, the M3 Pro chip will boost integrated memory across the board, as the sample spotted in testing shows 36 GB of memory. The M2 Pro offered 32 GB in that memory tier, so a four GB increase is inbound there. Presumably, the 16 GB version (if it exists) and 64 GB version will also get memory bumps by going the M3 Pro route. Of course, we have to wait for more information as these chips become more widely available to developers.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the launch of the MP700, its first PCIe Gen 5 M.2 SSD. Available in capacities up to 2 TB, the MP700 sets a new standard for next-generation storage, with sequential read and write performance topping out an incredible 10,000 MB/sec and 10,000 MB/sec respectively—up to 40% faster than even the best PCIe 4.0 SSDs available today (see cooling requirements below).

On top of the impressive sequential throughput, the random read and write performance of up to 1.5 million read and 1.7 million write input/output operations per second (IOPS) put the MP700 way ahead of the best PCIe Gen 4 drives. The MP700 is backward compatible with PCIe 4.0 motherboards, making this an upgrade that will last you for years to come. Native support for Microsoft DirectStorage ensures that you'll get the most from the latest games, while copying files in Windows and loading applications has never felt so fast.

Don't forget to check out the TechPowerUp Review of the CORSAIR MP700 2 TB SSD

Conflicting reports are flying around about Apple's next generation MacBook Air lineup, mostly surrounding suggestions of a firm release date or debut reveal at WWDC 2023. 9to5Mac claims that its insider sources have pointed to a new range of M3 chipset powered MacBook Air extra thin laptops offered up in two different screen sizes: 13-inch and 15-inch. An insider claimed last month that Apple's upcoming laptop lineup was in an advanced stage of production, and was far along enough to warrant an "imminent" launch window. A Taiwanese publication has presented new evidence this week, and it posits that Apple could drop M3 chipset-based laptops from announcement presentations organized for this year's Worldwide Developers Conference, which is set to take place from June 5 to 9.

According to the financial section of Taiwan's UDN news site, Apple's key decision makers could be in favor of fielding laptops based on its current generation M2 SoC, instead of an entry-level M3-based range, due to delays and changes in priority for the N3B node at TSMC foundries. This is seen as an odd move given reports from earlier this month of Apple requesting a reduction in factory output for its M2 chips, following a slump in demand. Apple could be changing its strategy with regards to the alleged surplus of M2 silicon - the article theorizes that the company will spend more time fitting the older generation chipsets into a new range of laptops and desktop computers. An M3-based product line could be delayed into late 2023, and it is alleged that TSMC has been instructed to concentrate mostly on manufacturing Apple's Bionix A17 mobile chipset via the cutting edge 3 nm FinFet technology process (N3B) - earmarked to debut on the iPhone 15 Pro in autumn 2023.

Reports from supply chain partners suggests that Apple cut off production of their current generation M2 SoC lineup in the months of January and February following significantly decreased demand for Mac computers containing the chips. The details trace back to partners in Outsourced Semiconductor Package Test, or OSAT, which is many different companies in the supply chain that contribute to assembly and testing of the final packaged SoC. OSAT partners claim they received zero M2 wafers from TSMC during both months, and that shipments have only resumed at half of the previous capacity in the month of March. The breadth of this shutdown touched many different suppliers, from the packaging facilities in Korea, to the solder ball suppliers in Taiwan, the TIM suppliers in Germany, and die underfill material suppliers from Japan. Many of these parts can be specific to the type of chip being produced, as M2 features a different packaging method to Apple's normal A-Series mobile SoCs; a lack of M2 silicon led to a full shutdown of this supply chain. An industry insider for Amcona states, "It is impossible to do other packaging work on the M2 line, the so-called 'Apple line' installed in Amcona chip packs."

In their Q1 2023 earnings conference Apple reported a sharp revenue drop in Mac sales from $10.85B down to $7.74B. "The PC market is facing a very challenging situation," stated Tim Cook, Apple's CEO, "I think we have an advantage with silicon but it will be very difficult in the short term." Apple began production of M2 well over a year ago when demand for Apple silicon equipped MacBooks was still sky high, and likely had large reserves of finished chips and machines stockpiled for the launch of M2 Pro and M2 Max in January. With demand dipping up to the launch of the new MacBook models it would certainly justify slowing down production, but outright halting it for multiple months suggests demand far undershot Apple's expectation.

Apple today unveiled the new Mac mini, supercharged by M2 and the all-new M2 Pro. With the M2 chip, Mac mini is even more powerful, capable, and affordable with a new starting price of just $599. The new M2 Pro chip delivers pro-level performance to Mac mini for the first time, enabling users to run high-performance workflows that were previously unimaginable in such a compact design. Mac mini with M2 and M2 Pro delivers faster performance, even more unified memory, and advanced connectivity, including support for up to two displays on the M2 model, and up to three displays on the M2 Pro model. Paired with Studio Display and Magic accessories, along with the power and ease of macOS Ventura, Mac mini provides a phenomenal desktop experience that will take users' productivity and creativity to the next level. Customers can order the new Mac mini models today, with availability beginning Tuesday, January 24.

"With incredible capabilities and a wide array of connectivity in its compact design, Mac mini is used in so many places, in so many different ways. Today, we're excited to take it even further with M2 and M2 Pro," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Bringing even more performance and a lower starting price, Mac mini with M2 is a tremendous value. And for users who need powerful pro performance, Mac mini with M2 Pro is unlike any other desktop in its class."

Apple today announced the new 14- and 16-inch MacBook Pro featuring M2 Pro and M2 Max, Apple's next-generation pro silicon that brings even more power-efficient performance and battery life to pro users. With M2 Pro and M2 Max—the world's most powerful and efficient chip for a pro laptop—MacBook Pro tackles demanding tasks, like effects rendering, which is up to 6x faster than the fastest Intel-based MacBook Pro, and color grading, which is up to 2x faster. Building on the unprecedented power efficiency of Apple silicon, battery life on MacBook Pro is now up to 22 hours—the longest battery life ever in a Mac. For enhanced connectivity, the new MacBook Pro supports Wi-Fi 6E, which is up to twice as fast as the previous generation, as well as advanced HDMI, which supports 8K displays for the first time. With up to 96 GB of unified memory in the M2 Max model, creators can work on scenes so large that PC laptops can't even run them. Rounding out the unrivaled features of MacBook Pro are its renowned Liquid Retina XDR display, extensive array of connectivity, 1080p FaceTime HD camera, six-speaker sound system, and studio-quality mics. When combined with macOS Ventura, the MacBook Pro user experience is unrivaled. Customers can order the new 14- and 16-inch MacBook Pro today, with availability beginning Tuesday, January 24.

Apple today announced M2 Pro and M2 Max, two next-generation SoCs (systems on a chip) that take the breakthrough power-efficient performance of Apple silicon to new heights. M2 Pro scales up the architecture of M2 to deliver an up to 12-core CPU and up to 19-core GPU, together with up to 32 GB of fast unified memory. M2 Max builds on the capabilities of M2 Pro, including an up to 38-core GPU, double the unified memory bandwidth, and up to 96 GB of unified memory. Its industry-leading performance per watt makes it the world's most powerful and power-efficient chip for a pro laptop. Both chips also feature enhanced custom technologies, including a faster 16-core Neural Engine and Apple's powerful media engine. M2 Pro brings pro performance to Mac mini for the first time, while M2 Pro and M2 Max take the game-changing performance and capabilities of the 14-inch and 16-inch MacBook Pro even further.

"Only Apple is building SoCs like M2 Pro and M2 Max. They deliver incredible pro performance along with industry-leading power efficiency," said Johny Srouji, Apple's senior vice president of Hardware Technologies. "With an even more powerful CPU and GPU, support for a larger unified memory system, and an advanced media engine, M2 Pro and M2 Max represent astonishing advancements in Apple silicon."

Apple's ongoing pursuit of leading performance in custom silicon packages continues with each new generation of Apple Silicon. Today, we have alleged Geekbench performance figures of the upcoming M2 Max chip, designed for the upcoming Mac devices. Featuring the same configuration with two E-cores and eight P-cores, the chip is rumored to utilize TSMC's 3 nm design. However, that is yet to be confirmed by Apple, so we don't have the exact information. In the GB5 single-thread test, the CPU set a single-core performance target of 1899 points, while the multi-core score was 8737. While last year's M1 Max chips can reach 1787 single-core and 12826 multi-core scores, these configurations are benchmarked in a Mac Studio, which has better cooling and allows for higher clocks to be achieved.

Apples to apples (pun intended) comparison with the M1 Max chip inside of a MacBook Pro version with presumably the same cooling capacity, which gets 1497 single-core and 11506 multi-core score, the new M2 Max chip is 19.4% faster in single-core results. Multi-core improvements should follow, and this M2 Max result should be different from the final product. We await more benchmarks to confirm this performance increase and the correct semiconductor manufacturing node.

Apple today announced the new iPad Pro with the M2 chip, delivering the ultimate combination of portability, versatility, and unbelievable performance. The new iPad Pro features a next-level Apple Pencil hover experience and superfast wireless connectivity, along with the world's most advanced mobile display, pro cameras, Face ID, Thunderbolt, and a four-speaker audio system. New features in iPadOS 16—including Stage Manager, full external display support, desktop-class apps, and Reference Mode—take pro workflows on iPad even further. Enabled by its advanced hardware and iPadOS 16, iPad Pro has an incredible ecosystem of powerful pro apps unlike any other device of its kind. The new iPad Pro is available to order starting today, and in stores beginning Wednesday, October 26.

"The next-generation iPad Pro pushes the boundaries of what's possible on iPad, bringing even more versatility, power, and portability to the ultimate iPad experience," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Powered by the M2 chip, the new iPad Pro features incredible performance and the most advanced technologies, including a next-level Apple Pencil hover experience, ProRes video capture, superfast wireless connectivity, and powerful iPadOS 16 features. There's nothing else like it."

Apple has removed the final remaining Intel components from its latest M2 MacBooks with the Intel JHL8040R USB4 timer chips being replaced with a pair of custom U09PY3 chips. This change was discovered by iFixIt during a recent teardown and documented by Twitter user SkyJuice with the exact reason for the change unknown. This move towards alternative USB4 chips is also present with AMD's latest Rembrandt laptops switching to retimers such as the KB8001 'Matterhorn' from Swiss startup Kandou who claim to supply five of the six largest PC OEMs with such chips.

The recently announced Apple M2 processor which is set to feature in the new MacBook Air and 13-inch MacBook Pro models has been benchmarked. The processor appeared in numerous Geekbench 5 CPU & GPU tests where the chip scored a maximum single-core result of 1919 points and 8928 points in multi-core representing an 11% and 18% CPU performance improvement respectively from the M1. The chip brings significant GPU performance increases achieving a Geekbench Metal score of 30627 points which is a ~42% increase from the M1 partially due to a larger 10-core GPU compared to the 8-core GPU on the M1. These initial numbers largely align with claims from Apple of an 18% CPU and 35% GPU improvement over the original M1.

Apple today introduced a completely redesigned MacBook Air and an updated 13-inch MacBook Pro, both powered by the new M2 chip—which takes the breakthrough performance and capabilities of M1 even further. MacBook Air takes everything users love about the world's best-selling laptop to the next level. With an all-new, strikingly thin design and even more performance, MacBook Air also features a larger 13.6-inch Liquid Retina display, a 1080p FaceTime HD camera, four-speaker sound system, up to 18 hours of battery life, and MagSafe charging. It is now available in four finishes—silver, space gray, midnight, and starlight. M2 also comes to the 13-inch MacBook Pro, the world's second best-selling laptop—delivering incredible performance, up to 24 GB of unified memory, ProRes acceleration, and up to 20 hours of battery life, all in a compact design. The new MacBook Air and updated 13-inch MacBook Pro join the even more powerful 14- and 16-inch MacBook Pro with M1 Pro and M1 Max to round out the strongest lineup of Mac notebooks ever offered. Both laptops will be available next month.

"We're so excited to bring our new M2 chip to the world's two most popular laptops—the MacBook Air and 13-inch MacBook Pro," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Completely redesigned around M2, MacBook Air is thinner, lighter, and faster with a bigger display, better camera, and all-day battery life, in four beautiful finishes. Only with Apple silicon can you build such a thin and light notebook with a fanless design, and this combination of performance and capabilities. M2 also comes to the 13-inch MacBook Pro, featuring incredible performance, ProRes acceleration, up to 24 GB of memory, and up to 20 hours of battery life—making our most portable pro notebook even better."

Apple today announced M2, beginning the next generation of Apple silicon designed specifically for the Mac. Built using second-generation 5-nanometer technology, M2 takes the industry-leading performance per watt of M1 even further with an 18 percent faster CPU, a 35 percent more powerful GPU, and a 40 percent faster Neural Engine. It also delivers 50 percent more memory bandwidth compared to M1, and up to 24 GB of fast unified memory. M2 brings all of this—plus new custom technologies and greater efficiency—to the completely redesigned MacBook Air and updated 13-inch MacBook Pro.
"M2 starts the second generation of M-series chips and goes beyond the remarkable features of M1," said Johny Srouji, Apple's senior vice president of Hardware Technologies. "With our relentless focus on power-efficient performance, M2 delivers a faster CPU, GPU, and Neural Engine. And along with higher memory bandwidth and new capabilities like ProRes acceleration, M2 continues the tremendous pace of innovation in Apple silicon for the Mac."

The system-on-a-chip (SoC) design of M2 is built using enhanced, second-generation 5-nanometer technology, and consists of 20 billion transistors—25 percent more than M1. The additional transistors improve features across the entire chip, including the memory controller that delivers 100 GB/s of unified memory bandwidth—50 percent more than M1. And with up to 24 GB of fast unified memory, M2 can handle even larger and more complex workloads.