ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel W680, Q670, and H610 chipsets. Featured as the first DDR5 ATX motherboards, the IMB-1714, IMB-X1714, and IMB-1713 are brand-new selections while encompassing upgraded support for the 12th Gen Intel CPU motherboards lineup through BIOS update. They guarantee computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to PCIe Gen 5 slots, quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 G LANs, multi-M.2 Key M, ECC memory, TPM 2.0, and more. The 13th Gen Intel CPU motherboards cover comprehensive form factors, including Mini-ITX, Micro-ATX, and ATX for diverse Edge AIoT applications, such as factory automation, kiosks, digital signage, smart cities, medical, and more.

13th Gen Intel Core Motherboards for Upgraded Performance
The upgraded motherboards feature 13th Gen Intel Core i9/i7/i5/i3 processors (Raptor Lake-S) with performance hybrid architecture, plus up to 24 cores and 32 threads that boost compute-intensive edge performance. They leap up to 1.04x/1.34x/1.25x faster in single-thread/multi-thread/CPU image classification inference performance compared to 12th Gen Intel Core processors. Leveraging its engineered flexibility and power, the new 13th Gen Intel Core motherboards run up to DDR5-5600 memory module for higher bandwidth, and PCIe 5.0 for additional expansion while supporting engaging video and digital signage experiences with Intel UHD Graphics driven by Xe architecture.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest Intel B760 series motherboards. With enhanced XMP and hardware design of memory, the full B760 DDR5 lineup can achieve superb Z790-like memory performance of DDR5-7600. Featuring up to 16+1+1 phases of 60 amps digital power VRM design with full-coverage heatsink, GIGABYTE's B760 lineup provides premium power and thermal design for the high-frequency operation of Intel 13th gen processors. Meanwhile, the innovative PCIe and M.2 EZ-Latch technology are implemented to simplify the upgrade of graphics cards and M.2 SSDs, and to avoid accidental damage to the surrounding components. Moreover, the features of 2.5 GbE LAN, Wi-Fi 6E, USB 3.2 Gen 2x2 Type C with 20 Gbps, and up to 3 sets of PCIe 4.0 x4 M.2 slots with armor on select models offer superb connectivity. Further with the latest GIGABYTE PerfDrive technology and GCC software platform, GIGABYTE delivers the outstanding B760 platform with the optimal hardware, software, and firmware which covers from DDR4 to DDR5 with full form factor options of ATX, Micro ATX, and Mini ITX.

In the Intel product plan, the "Z" chipset is the only platform to support CPU and memory overclocking. However, the B chipset with limited DDR frequency tuning offers more budget friendly options, especially those only require memory overclocking. In order to provide solid power for high-performance operation of CPU and XMP overclocking, GIGABYTE B760 AORUS motherboards are geared up to 16+1+1 power phases with 60 amps DrMOS design, while the well-received B760 AORUS ELITE features 12+1+1 power phases, and the leading power design of 14+1+1 phases on B760M AORUS PRO. These power designs allow GIGABYTE B760 AORUS motherboards of all configuration to deliver the most stable power, as well as to provide sufficient power when the CPU runs full loading. Meanwhile, enhanced by full-coverage heatsink, 5 W/mK thermal pad, and 2x copper PCB, B760 AORUS MASTER/ PRO/ ELITE/ GAMING X lineup covers from ATX to micro ATX models boast superb thermal design to improve the stability and keep the power supply area which is most likely to generate heat staying cool.

At CES, Intel is expected to launch the bulk of its 13th Gen Core "Raptor Lake" processor family, consisting of "locked" 65 W SKUs; along with two cheaper motherboard chipset options than the Z790—the B760 and H770. The Bx60 chipset options are sought after by the mainstream desktop crowd that likes to buy value sub-$250 processor SKUs, but over the years, motherboard manufacturers have been upscaling Bx60 chipset with premium onboard components, to target the crowd that likes to buy the upper tier of 65 W SKUs (think Core i5-13600, i7-13700, or the top i9-13900 non-K). With the 700-series chipset, however, it looks like the price for entry for the platform has just gone up. The cheapest MSI motherboard based on the B760 chipset, according to a leaked price-list, is USD $170, for a PRO-series motherboard SKU that's usually considered entry-level for MSI.

The MSI PRO B760M-A WiFi DDR4 Micro-ATX motherboard, according to this price-list, goes for $170, followed by the PRO B760-P WiFi DDR4 (ATX form-factor) at $180. From here begins MSI's Gaming series motherboards. There are as many as four MAG Mortar SKUs. At $180, you get the MAG B760M Mortar DDR4. At $190 you get the MAG B760M Mortar (DDR5) and MAG B760M Mortar DDR4 WiFi; followed by the MAG B760M Mortar WiFi (DDR5) at $200. With this series, MSI is introducing a couple of MAG Mortar MAX SKUs, which probably feature better VRM or onboard audio. The DDR4 version is priced at $220, and the DDR5 version at $230. Moving a notch up, we have the popular MAG Tomahawk SKUs, with the DDR4 version at $220, and the DDR5 version at $230. The only MPG series SKU is also the lineup's only Mini-ITX one—the MPG B760I Edge WiFi DDR4, priced at $210.

YEYIAN Gaming, a global leader in the design and manufacturing of innovative pre-built gaming PCs, peripherals, and computer components, is proud to announce the market launch of their brand new Micro-ATX PC Gaming Case, HUSSAR. This micro-ATX and Mini-ITX chassis fully supports the latest NVIDIA RTX 4000 and AMD Ryzen 7000 series graphics cards with up to 350 mm clearance. In addition, HUSSAR offers a perfect thermal solution allowing users to install six 120 mm cooling fans and two 240 mm AIO radiators. HUSSAR is crafted with cable management and connectivity built-in. It is an excellent choice for gamers looking for a smaller form factor PC case with a spacious interior without sacrificing any of the standard gaming rig options they've come to expect.

"There is a new trend in the market that shows an increasing number of gamers prefer smaller and more compact gaming PCs, provided they can still get uncompromised GPU power. YEYIAN HUSSAR is a gaming case created to meet this demand. The case is tiny in size but supports all of the gaming PC essentials. Such as a spacious interior supporting NVIDIA RTX 4000 and AMD Ryzen 7000 series GPU, excellent cable management, tempered glass for RGB lighting, and maximized ventilation across six cooling fans and two 240 mm radiators. In short, HUSSAR is designed to be practically compact but powerful enough for modern gaming PC builds. " said Frank Lee, the VP of YEYIAN.

BIOSTAR today introduced the Racing B650EGTQ, a Socket AM5 motherboard based on the AMD B650E chipset, in the Micro-ATX form-factor. The board offers a premium feature-set, including PCI-Express Gen 5 for both the x16 PEG slot, and the M.2 NVMe slot wired to the CPU. The board draws power from a combination of 24-pin ATX, and 8+4 pin EPS. It uses a 14-phase VRM with 90 A DrMOS to power the processor. The processor is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16, and two M.2 NVMe slots with PCI-Express 5.0 x4 wiring. Other expansion slots include a PCI-Express 4.0 x16 (electrical Gen 4 x4) wired to the B650E chipset.

Storage connectivity on the BIOSTAR Racing B650EGTQ includes two M.2 NVMe Gen 5, one M.2 NVMe Gen 4, and four SATA 6 Gbps ports. This is one of the very few motherboards to wire out both Gen 5 x4 GPP interfaces of the Socket AM5 SoC as M.2 NVMe slots. Network connectivity include a 2.5 GbE driven by a Realtek 8125B controller; and preparation for a WLAN card, although the board doesn't have any M.2 E-key slots. The onboard audio soludion features a premium Realtek ALC1220 CODEC. The company didn't reveal pricing.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the latest AMD B650 motherboards based on the success of the X670 series. The comprehensive lineup includes AORUS, AERO, and GAMING series to provide more reasonable options with notable features for users. GIGABYTE select B650 motherboards adopt PCIe 5.0 / 4.0 x16 graphics interface and PCIe 5.0 / 4.0 M.2 slots with EZ-Latch technology, making it easier than ever for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, up to 16+2+2 phase Twin Digital power, 105 Amps Smart Power Stage, and up to 12-layer PCB provide increased stability, optimal compatibility, and performance for AMD Ryzen 7000 series processors. With the advanced thermal design, VRM temperature is reduced, stabilizing the power and performance of the PCIe 5.0 slot and PCIe 4.0 M.2 SSD and avoiding performance drop due to thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, select models take advantage of Active OC Tuner technology to deliver optimized performance with a more flexible and user-friendly experience.

SilverStone today introduced the FARA 311, a Micro-ATX tower case with room for some legacy devices, such as a 5.25-inch drive. Inside, you'll get a single-compartment layout with the PSU bay located at the top, next to the 5.25-inch bay, and the motherboard tray below. The motherboard tray serves up room for graphics cards up to 35.4 cm in length, and CPU coolers up to 15.6 cm in height. The PSU needs to be no more than 14 cm in length to not obstruct the wiring of your 5.25-inch bay. Speaking of which, the 5.25-inch bay is designed such that in the absence of a 5.25-inch drive, you can mount a 3.5/2.5-inch drive; another 3.5/2.5-inch drive below, mount a 2.5-inch along the motherboard tray, and another 3.5-inch/2.5-inch drive along the bottom panel. Ventilation includes two 120 mm front intakes (including support for 240 mm radiators), and a 120 mm rear exhaust. The case measures 410 mm x 360 mm x 183 mm (LxHxW). The company didn't reveal pricing.

SilverStone today introduced the RM44, a workstation or small-business server case, which is designed to be used both as a tower, or as a 4U rackmount. The case supports SSI-EEB, SSI-CEB, E-ATX, ATX, Micro-ATX, and Mini-ITX form-factors; a single ATX power-supply, eight full-height expansion slots, and cooling that includes two 80 mm rear exhausts, and three 120 mm front intakes. As you can see from the pics below, the case can even be used to build the most inconspicuous high-end gaming PC. A steel reinforcement running along the length of the case holds a couple of 3.5-inch drives or three 2.5-inchers, and can firmly hold your add-on cards in place. included is a stand that lets you orient the case as a tower, while rails let you mount it in a rack. The case measures 440 mm x 176 mm x 468 mm (WxHxD). Front-panel connectivity includes two USB 3.2 type-A, and a USB 3.2 type-C. The company didn't reveal pricing.

SilverStone has recently released the Milo 11 case with a total volume of 10.35 L and dimensions 330 mm x 110 mm x 285 mm. The chassis has been designed for HTPC and small-form-factor applications supporting both horizontal and vertical orientations. The Milo 11 accepts Mini-ITX and Micro-ATX motherboards along with a TFX power supply and low-profile graphics card up to 272 mm in length. The case features x4 expansion slots, x1 optical drive bay, x2 drive bays, x2 front USB 3.0, and can accommodate dual 80 mm cooling fans. SilverStone had not revealed pricing or availability information for the Milo 11 chassis at the time of writing.

ASRock Industrial launches a new range of industrial motherboards powered by 12th Gen Intel Core Processors (Alder Lake-S) with up to 16 cores and 24 threads, supporting the new Intel 600 Series W680, Q670, and H610 chipsets. Featuring high computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 GbE LANs with real-time TSN, multi M.2 Key M, ECC memory, plus TPM 2.0, and wide voltage support. The new series covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards for diverse applications, such as factory automation, kiosks, digital signage, smart cities, medical, and Edge AIoT applications.

Sharkoon Technologies, an international supplier of high-performance quality PC components and peripherals, has now introduced the MS-Y1000 and the MS-Z1000. These are two micro-ATX PC cases made of steel, each with a front panel that is elegantly designed with a pattern of Y-formed or Z-formed airflow openings. Four pre-installed fans should enable an optimal cooling, while the air-permeable front panel provides a constant flow of air into the case. Despite the compact design, large components such as a 240-millimeter radiator can be installed in the top of the case. The MS-Y1000 and MS-Z1000 are available in either black or white.

The cases appear with a unique design in two variations, whereby the MS-Z1000 gets its name from the Z-shaped openings on the steel front panel, and the MS-Y1000 gets its name from the Y-shaped openings. The simple black or white color scheme allows the case to blend into almost any surroundings. The side panel on the left of the case has two parts: a tempered glass window and a grille. Each part can be swapped in its position and mounted either on the top or the bottom of the case.

COLORFUL, presents its Intel B660 micro-ATX motherboard line-up which consists of the CVN Series and Battle-AX Series models. These are the CVN B660M GAMING FROZEN V20, CVN B660M GAMING PRO V20, and the BATTLE-AX B660M-HD DELUXE V20 motherboards. Based on the Intel B660 chipset for the 12th generation Intel Core processors, the COLORFUL B660M motherboards offer PCIe 5.0 support and the use of older generation but cheaper DDR4 memory in a compact micro-ATX motherboard form-factor. These motherboards are the budget-friendly options compared to the premium Z690 motherboard models, offering PC builders to opportunity to adopt the latest Intel Core processors at a lower cost.

SilverStone today unveiled the CS351, a unique Micro-ATX case that lets you build a gaming or creation PC with hot-swappable storage, or a DIY NAS. This case is significantly larger than typical 5-bay NAS you find in the market, but that's because it packs room for a fully-fledged Micro-ATX setup, including room for a high-end triple-slot graphics card up to 36.8 cm in length. For creators, this means room for a top-grade Quadro RTX or Radeon PRO graphics card; for gamers it means room for any air-cooled RTX 3090 or RX 6900 XT.

The most striking feature has to be the five 3.5-inch hot-swappable lockable caddies, each with SATA 6 Gbps backplanes (optionally SAS 12 Gbps). The cage is ventilated from the inside with an 80 mm fan, and uses a 4-pin Molex input for power. Each of the 5 bays has an individual SATA 6 Gbps connection to your motherboard. Internal bays include one 2.5-inch mount, or the ability to mount up to seven 2.5-inch drives by eating into the room meant for graphics cards. Active ventilation includes three 40 mm rear exhausts, two 80 mm top exhausts, and an internal 80 mm conveyor for the 5-bay drive cage. Measuring 265 mm (W) x 209 mm (H) x 411 mm (D), the case weighs about 5 kg. The company didn't reveal pricing.

AeroCool today introduced the Evo Mini line of Micro-ATX tower cases. These are available in black and white color variants, both with all-black interiors. A key design element is a set of vertical ARGB LED diffusers that symmetrically run along the height of the case. The left-side panel is made of tempered glass, and opens up interiors that position the PSU on top of the motherboard tray. The tray serves up room for graphics cards up to 26 cm in length (you'll have to remove one of the front fans for maximum headroom); and CPU coolers up to 15.6 cm in height.

Ventilation includes two 120 mm front intakes, which can mount a 240 mm x 120 mm radiator; and a 120 mm rear exhaust. Storage options include two each of 3.5-inch and 2.5-inch mounts. Front panel connectivity includes one USB 3.0 port, two USB 2.0 ports, and HDA jacks. The case measures 195 mm x 385.4 mm x 314.8 mm (W x H x D). The company didn't reveal pricing.

Antec Inc., a leading provider of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself market, presents the latest Micro-ATX case of the Dark Phantom Series: the DP31. The chassis features both visual and functional highlights such as distinct claw-shaped air intakes and ARGB strips for striking looks. The DP31 provides the best building experience with its small yet powerful body structure. It's the best choice for gamers who favor small cases and ARGB showcases. The case is now commercially available from 59€ (suggested retail price including VAT).

The new Antec case measures 378 x 212 x 398 mm (DxWxH) and is compatible with Micro-ATX and Mini-ITX motherboards. In terms of fan support, the case accommodates two 120 mm in the front, two 120 mm / two 140 mm fans on top as well as one 120 mm fan in the rear (preinstalled). The magnetic tempered glass side panel allows for an easy as well as satisfying build experience, while the screw-free design and steel covers keep the case sturdy. Six motherboard fixings are pre-installed to make the installation more convenient.

Thermaltake, the leading PC DIY premium brand for Case, Cooling, Gaming peripherals and enthusiast memory solutions, reveals the new Divider 200 series with TG Air and TG editions, the former stands for better airflow and the latter represents the classic tempered glass edition. Additionally, both the Divider 200 TG Air and TG come in black and snow versions.

The Divider 200 series is a cubed-shaped micro chassis that features symmetrical triangular pieces with steel panels and tempered glass on the left and right sides. The Divider 200 series comes in a Micro-ATX form factor, and the front I/O ports are designed with two USB 3.0 and one Type-C. Additionally, the Divider 200 series is equipped with one preinstalled 200 mm front fan and one 120 mm standard rear fan to ensure outstanding cooling performance. The airflow is also improved by the built-in triangular side panel that includes side ventilation. Furthermore, the Divider 200 micro case provides users space arrangement flexibility both internally and externally. Through its chambered design and flat motherboard tray, users have more cable management possibilities while displaying their hardware at the top. In terms of exterior placement, the Divider 200 micro case is an ideal option for users with limited space thanks to its compact size.

MONTECH and TechPowerUp bring you a chance to win one of nine pieces of hardware to help your rig Keep Cool. Open to contestants from the Continental United States, Nine lucky winners get a chance to win from a prize-pool of three MONTECH Air 100 ARGB Black cases, three MONTECH Air 100 Lite White cases, and three MONTECH Air Cooler 210. The Air 100 series of MONTECH offer premium features and room for a top-performing Micro-ATX gaming PC build. The Air 100 ARGB Black includes four addressable-RGB fans; while the 100 Lite White comes with all-white interiors, and two included fans, and plenty of room to grow from. To participate, simply fill up a short form that helps us get back to you if you've won. Good Luck!

MONTECH and TechPowerUp Keep Cool Giveaway

Cougar today rolled out the MG140 Air RGB, an eye-catching mini-tower case characterized by its horizontally partitioned outer design scheme that blends with its inner partitioning. The upper part is darker, with a tinted tempered-glass side panel, and a perforated black front panel, while the bottom half is matte silver/gray. The upper compartment offers room for graphics cards up to 35 cm in length, and CPU coolers up to 16 cm in height. The case supports Micro-ATX and Mini-ITX motherboards.

The bottom half of the Cougar MG140 Air RGB has the drive- and PSU bays, with room for two 3.5-inch/2.5-inch drive trays. Ventilation options include two 140 mm or 120 mm front intakes, two 140 mm or 120 mm top exhausts, and a rear 120 mm exhaust. 280 mm x 140 mm radiators can be mounted along the front panel. Three ARGB-illuminated fans come included with the case, which include the 120 mm exhaust, and two 140 mm intakes. Also included, is a 6-channel ARGB controller. The case measures 205 mm x 410 mm x 420 mm (WxHxD), dry weighing 5.45 kg. The company didn't reveal pricing.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest B560MX-E PRO and B560MH-E PRO motherboards. Designed to support Intel's 10th/11th Generation Intel Core Processors and professional graphics cards, the new B560 series motherboards are highly versatile. Powered by Intel's B560 chipset, these two new motherboards are efficient and robust in any use case.

PCI-e 4.0 and PCIe M.2 4.0 & M.2 Cooling, among other cutting-edge technology, adds up to a great platform, tailor-made for business or even casual use. The two new motherboards support up to 128 GB of DDR4 memory across 4 DIMM with an overclocking capability of up to 4000+(OC)MHz. Backed by BIOSTAR's proprietary Digital PWM technology, the new B560MX-E PRO, and B560MH-E PRO motherboards are safe and long-lasting, capable of supporting the best hardware with ease. Both motherboards pack all the essentials in their rear I/O panel with almost identical layouts on a Micro-ATX form factor.

When governments need a hardware upgrade, they will usually take the route of exploring options with security in mind. However, if you happen to have some engineering talent to employ on a new project, why wouldn't you just build a custom motherboard for your own purposes. Today, GS Group Holding and Philax, have announced that they are starting the manufacturing of Russia's first motherboard based on a B450 chipset from AMD. Looking at the motherboard, which you can see below, you might find it very similar to those of ASRock. And that is because Philax has a licensing agreement with ASRock to use the design of the B450M Pro4 motherboard, with the addition of a TPM module which is often used by government agencies, to produce this board.

Producing around 40,000 pieces, these motherboards are expected to handle anything from 4000 series to 5000 series of AMD processors. As far as the specifications go, the board is coming in a standard Micro-ATX form factor. It is equipped with four DDR4 memory slots that can take a memory with up to 3200 MHz speed. There are two PCIe 3.0 x16 slots and one PCIe 2.0 x1 slot, which are of course limited by CPU choice. The motherboard enables four SATA III and two M.2 ports for storage expansion. When it comes to I/O, the board features HDMI, D-Sub, DVI-D, four USB 3.1 Gen1, two USB 2.0, one USB Type-C, and one USB 3.1 Gen2 Type-A port. GS Group Holding and Philax also have a partnership that goes beyond just motherboards. They also plan to produce about 50,000 custom monitors for government purposes as well.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the launch of their new H510 series motherboards designed to run the latest Intel 11th gen Rocket Lake-S processors. Introduced to the market in two Micro-ATX models, the H510MH/E 2.0 and the H510MX/E 2.0 motherboards are designed to be the best choice for business and casual use. Based on Intel's H510 single chip architecture, these motherboards are ready to unleash the true potential of the latest Intel 11th gen processors.

Equipped with all the essential features, the new H510 series comes from an immensely popular lineage of motherboards from BIOSTAR used all over the world in many offices that combine cutting edge technology with proven durability for smart business solutions. Designed to optimize any professional workflow, the H510 series motherboards bring the latest technology for users like PCIe 4.0 and WiFi 6 optimized to perfection with the protection and stability of BIOSTAR's proprietary Super Hyper PWM technology. Both motherboards support dual-channel DDR4 memory, optimized to run up to 64 GB and a maximum clock speed 2933 MHz.

Today CHIEFTEC introduces a new multifunctional cube case that can find its purpose in all settings from the office to home media systems. Featuring an elegant design combining brushed aluminium and airflow-friendly mesh, this is a case that combines a timeless style with high functionality.

The CI-02B-OP joins CHIEFTEC's Mesh Series in a compact m-ATX cube format. Despite its very compact dimensions, this case is extremely flexible in terms of hardware compatibility, supporting ATX PSU's up to 16 cm in length, graphics cards up to 320 mm in length, and CPU coolers up to 160 mm in height. Furthermore, the installation of components is made very easy thanks to the folding mechanism known from the CI-01B-OP.

MSI updated the entry-level of its AMD 500-series chipset motherboard product stack with two interesting additions. The new MAG A520M Bazooka WiFi is essentially based on the same board design as the MAG B550M Bazooka, but uses the cheaper A520 chipset; while the new MAG B550M Vector WiFi is based on the same design as the MAG A520M Vector WiFi that the company debuted its A520 motherboard lineup with.

The A520M Bazooka is a well spaced-out 240 x 240 mm Micro-ATX board with a 7+2 phase CPU VRM solution that uses a large heatsink to cool the Vcore MOSFETs; four DDR4 DIMM slots, expansion slots that include a PCI-Express 3.0 x16, and two Gen 2 x1 slots; and an entry-level combination of audio CODEC and Ethernet PHY (Realtek ALC887 + RTL8111H). The B550M Vector will be the most affordable B550 offering from MSI, thanks to its narrow Micro-ATX footprint, and just two DIMM slots. Unlike the A520M Vector, this board gives you PCI-Express 4.0 x16 and a Gen 4 NVMe slot. The onboard audio+Ethernet combination is the same as the Bazooka. Both boards offer dual-band 802.11ac WLAN + Bluetooth 4.2, put out by an Intel Wireless-AC 3168 WLAN solution. The company didn't reveal pricing.

SilverStone today rolled out the FARA H1 M, a Micro-ATX tower case (model: SST-FAH1MB). It shares much of its design language with the ATX FARA B1 from 2019, but incorporates an airy mesh front-panel, with a fine steel outer mesh, and a sturdy hexagonal inner lattice. The case features a conventional horizontally-partitioned layout, with the upper compartment having room for graphics cards up to 32 cm in length, and CPU coolers up to 16 cm in height. Storage options include two 3.5-inch bays that can each hold 2.5-inch; and two additional 2.5-inch mounts.

Ventilation options on the SilverStone FARA H1 M include two 140 mm / 120 mm front intakes, two 120 mm top exhausts, and a 120 mm rear exhaust. You can mount a 240 mm x 120 mm radiator along the front panel. Front-panel connectivity includes a USB 3.0 port, two USB 2.0/1.1 ports, and HDA jacks. The case measures 210 mm (W) x 392 mm (H) x 366 mm (D), and is made of SECC steel with ABS plastic bits. The company didn't reveal pricing.

DeepCool today introduced the MATREXX 40 Micro-ATX tower case. Its design is characterized by vertical ridges along the front panel, with air inlets between the ridges, which conceal a mesh, and two 140 mm / 120 mm front intakes, which can hold radiators up to 280 mm x 140 mm in size. Other ventilation options include two 140 mm / 120 mm top exhausts (which again, can hold radiators up to 280 mm in size); and a 120 mm rear exhaust.

The DeepCool MATREXX 40 features a conventional horizontally-partitioned interior, with the upper compartment serving up room for graphics cards up to 32 cm in length, and CPU coolers up to 16.5 cm in height. Storage options include two 3.5-inch / 2.5-inch drive bays in the bottom compartment, and two 2.5-inch mounts behind the motherboard tray, where there's a 2 cm crawl-space for cable-management. The case comes with a tempered glass left side panel. The front-panel I/O, located at the top, includes one each of USB 3.0 type-A, USB 2.0, and HDA jacks. The case measures 400 mm x 215 mm x 431 mm; and is made mostly of SECC steel and ABS plastic. The company didn't reveal pricing.