Back in October of last year, pictures from an ASUS event in China appeared online, showing off a pair of mATX motherboards that had most of its peripheral and power connectors on the reverse side of the motherboard. Now it appears that ASUS has decided to launch such a product, in the shape of the unforgettably named TUF Gaming B760M-BTF WiFi D4. The BTF part in the model name stands Back To (the) Future, although ASUS is most likely not allowed to use that term due to copyright restrictions, so it had to make do with BTF. Regardless of naming, the interesting part here is that all of the power connectors, the four SATA ports, the USB-C and USB 3.0 headers, as well as multiple other headers and one of three M.2 slots, are on the reverse side of the motherboard. This is all done to allow for cleaner cable management.

Other noteworthy features on the board include a single PCIe 5.0 x16 slot, one PCIe 4.0 x4 and one x1 slot, three USB-C ports, of which one is capable of 20 Gbps speeds and 2.5 Gbps Ethernet. As this is a mid-range board, we presume ASUS wants to test the waters so to speak, to make sure there's a market for such a product. However, one major hurdle is the small fact that there aren't any suitable chassis in the market and the product page even mentions that "This motherboard is compatible with specific case models", without going into any details. Presumably, ASUS will offer a suitable chassis, or have some partner(s) lined up that will provide a suitable chassis. Gigabyte announced something similar in May last year, but decided to team up with system integrators, something ASUS might be planning on as well.

ASUS today announced BIOS updates for its Intel 700 and 600 series motherboards in partnership with Corsair, adding support for up to 192 GB of DDR5 memory and support for the new Corsair Vengeance DDR5 48 GB (2 x 24 GB) 7000 MT/s modules.

When builders acquire a 700 or 600 series Intel motherboard from the ROG Maximus, ROG Strix, ProArt, TUF Gaming or Prime lineups, they often have a choice to make: grab an option with support for budget-friendly last-gen DDR4 memory, or future-proof their purchase with a DDR5 model. As the market for DDR5 RAM has matured, it has become difficult for enthusiasts to ignore the performance potential of next-generation memory. With this latest BIOS update, ASUS motherboards with DDR5 support are formidable options. The entire selection of ASUS 700 and 600 series motherboards now supports the latest 24 and 48 GB DDR5 memory modules.

AAEON, a leading producer of industrial motherboards, has announced the release of the MIX-Q670A1, the most advanced Mini-ITX board it has ever produced. The first AAEON solution across any of its product ranges to support both 12th and 13th Generation Intel Core i9/i7/i5/i3/Pentium /Celeron processors (formerly Alder Lake-S and Raptor Lake-S respectively), the MIX-Q670A1 harnesses up to 24 cores, 32 threads, and a host of peripheral technologies including Intel vPro, Intel Thermal Velocity Boost, and Intel UHD Graphics 770.

AAEON believe the MIX-Q670A1 will become the gold-standard for applications requiring real-time, high-performance computing on the edge. Supporting 64 GB of dual-channel DDR5 4800 MHz system memory and a PCIe [x16] Gen 5 slot, the MIX-Q670A1 offers a 44% increase in memory speed over previous generations. Combining this speed with an I/O consisting of two LAN, two COM, and ten USB ports, the MIX-Q670A1 offers both a wealth of connectors for peripheral devices and real-time data transmittance on the edge for smart city applications.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is proud to announce the launch of four brand new motherboards - B760MZ-E PRO, B760MX2-E D4, B760MX2-E, and B760MX-E D4. These motherboards are tailored to meet the needs of a variety of target audiences, from content creators to home entertainment enthusiasts.

The B760MZ-E PRO motherboard is specifically designed for content creators who require a powerful and efficient system for photo and footage editing. This motherboard features the latest Intel B760 chipset and supports 12th/ 13th Generation Intel Core Processors. It supports DDR5 memory and PCIe 4.0, making it one of the advanced motherboards on the market. It also features 2.5 GbE LAN, Wi-Fi 6E module support for faster data transfer and connectivity. The B760MZ-E PRO also has a sleek design with LED ROCK ZONE and VIVID LED DJ RGB lighting, making it a stylish addition to any setup.

ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen 4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance thanks to the extra 64 MB cache of 3D V-Cache.

MSI announced today a new lineup of AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen processors include the AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D which will have a TDP of 120 W while increasing its L3 Cache by 50% compared to the regular Ryzen 7000 processors. Even with a slightly lower TDP of 120 W, these AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology processors have up to 16 cores and 32 threads while still being able to hit their theoretical max boost clock of up to 5.70 GHz.

With the latest AGESA COMBO PI-1.0.0.5c BIOS from MSI will be ready and have the most performance-optimized patch for the new AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology. However, previous BIOS versions are still compatible with any MSI's X670 and B650 motherboards as well. With the latest launch of AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D processors, MSI is proud to announce the MAG X670E TOMAHAWK WIFI to our AMD Series lineup of the motherboard and will support all AMD Ryzen 7000 Series processors at launch. Inspired by military concept, the design MAG X670E TOMAHAWK WIFI is shown as a symbol of robust and durability that allow the users to have the optimal experience.

ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today introduces two of their latest commercial motherboards, the TZ590-PRO DUO and the TZ590-PRO. Designed on Intel's Z590 single chip architecture, both TZ590-PRO series motherboards are optimized to extract the highest performance out of 10th / 11th Generation Intel Core processors.

With DDR4 RAM base and Intel 11th generation CPU, the TZ590-PRO and TZ590-PRO DUO have superior stability to handle the most demanding tasks, ideal for businesses, 3D content creators, AI integration systems and more. As ATX-based boards, the TZ590-PRO and PRO DUO offer a variety of features and functionality including 8 PCIe 3.0 slots, one PCIe 4.0 x16 slot, and an excellent power delivery system that provides users with seemingly limitless expansion capability. Additionally, the TZ590-PRO DUO supports up to 4 M.2 slots and 10 SATA III connectors (6 Gb/s) for reliable storage capability as well as business NAS setup.

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.

Yes, you read that correctly, ASUS didn't launch just one, but two W790 based LGA-4677 motherboards today, namely the Pro WS W790-Sage SE and the Pro WS W790-Ace. The main difference here is that the Sage supports up to seven PCIe 5.0 x16 slots—one is a x8 slot electrically—and is designed for the Xeon W-3400 series, whereas the Ace supports five PCIe 5.0 x16 slots and is in turn designed for the Xeon W-2400 series. One downside of these boards is that they might not fit in a standard ATX case, as the Sage follows the SSI-EEB form factor and the Ace the SSI-CEB form factor, both of which are a fair bit wider than an ATX motherboard and with different mounting holes.

The Pro WS W790-ACE also sports eight DDR5 DIMM slots that operate in quad-channel and supports up to 2 TB of RAM if ECC R-DIMMs are used. Furthermore, ASUS has kitted out the Ace with a pair of PCIe 4.0 M.2 slots, one 2280 and one 22110 slot, four SATA ports, three slim SAS ports, a Marvell 10 Gbps and an Intel 2.5 Gbps Ethernet interface, a single USB 3.2 Gen 2x2 20 Gbps USB Type-C port around the back and an internal header for a second, case mounted port. Finally the board has four USB 3.2 Gen 2 10 Gbps Type-A ports around the back and a header for a further two., as well as eight USB 2.0 ports around the back and audio courtesy of a Realtek S1220A based solution with optical S/PDIF out.

Leading global motherboard manufacturer, ASRock, proudly announces its new ASRock W790 WS motherboard for workstations for Intel Xeon W-3400/W-2400 series processors (LGA4677). The ASRock W790 WS features up to 2 TB DDR5 ECC RDIMM support, PCI-Express 5.0 expansion slots, USB4/Thunderbolt 4 and Dual 10 Gbps Ethernet. A flagship-class 14-layer PCB and 20+2 phase CPU VRM ensures ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

Supports New 4th Generation Xeon Processor
The W790 WS chipset is optimized for new Intel Xeon W-2400 series (LGA4677) processors and is compatible with W-3400 series processors with up to 56 cores also. The ASRock W790 WS provides a quad-channel DDR5 design with 2DPC over 8 DIMM slots, maximizing memory performance, potential memory pool capacity and supports ECC RDIMMs to ensure data reliability.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that its Intel 700 and 600 series DDR5 motherboards can support 24 GB and 48 GB memory modules without BIOS update. This boosts the maximum RAM support from 128 GB to 192 GB on four DIMMs, and 64 GB to 96 GB on two DIMMs. The maximum speed runs up to XMP 7000 on 2 DIMMs 24 GB configuration.

Users can enjoy an effortless overall boost of memory capacity and system performance on both Intel XMP and AMD EXPO platforms, as well as a productivity uplift for multitasking gamers and RAM demanding users. Get your GIGABYTE motherboards now and enjoy the boost. To avail this, update to the latest BIOS on your compatible motherboard.

The PC industry has been hit hard by the current market conditions and economic downturns, as the entire industry has seen sales of new PCs drop to new lows. Equally so, the PC motherboard makers have experienced a crash in sales, where collectively, they delivered ten million units less in 2022 compared to 2021. Thanks to the information by DigiTimes, we have information that major motherboard makers, ASUS, Gigabyte, MSI, and ASRock, have seen their sales plummet to new lows and reflect how much of a drop the market experienced in the middle of economic uncertainty that the year 2022 brought.

In 2021, ASUS delivered more than 18 million motherboard units; in 2022, it is down to 13.6 million, representing a 25% difference. GIGABYTE shipped 11 million units in 2021, whereas in 2022, the company delivered around 9.5 million motherboards. GIGABYTE has experienced the smallest drop with "only" 14% lower sales. MSI used to deliver 9.5 million motherboards in 2021, and in 2022 its sales plummeted by 42% to 5.5 million units. The worst drop in sales is the one by ASRock, where the company saw its sales go from around 6 million units in 2021 to just 2.7 million units in 2022. This is the report's most significant recorded drop, equaling 55% lower sales in 2022.

Today MSI is announcing the support of 48 GB and 24 GB DDR5, non-binary memory across Intel 700 and 600 Series motherboards, including MEG, MPG, MAG, and PRO Series products. Namely, the maximum memory capacity support is increased to 192 GB for 4 DIMMs motherboards and 96 GB for 2 DIMMs motherboards. MSI has committed to providing performance and compatibility to DIY enthusiasts.

It is unnecessary to update motherboard BIOS for supporting 48 GB based memory modules. Just install the new memory module to enjoy a more efficient system with more productivity, especially for those multi-tasking gamers and users.

Although we haven't been able to confirm these specs, full specifications of AMD's upcoming A620 chipset was posted on Twitter by @g01d3nm4ng0, who has proven to have solid details in the past. This is supposedly the cut-down version of the B650 chipset, due to the rumored delays of the actual A620 chipset. The A620 chipset will be identical to the B650 chipset when it comes to PCIe lane counts, but rather than PCIe 4.0 lanes, the chipset will only offer PCIe 3.0 lanes. What is unclear is if the PCIe 3.0 of the B650 chipset will remain or not, as they're not included in the leaked specs.

If not, then the A620 chipset will only have a total of eight usable PCIe lanes, but four lanes that are connected to the CPU, which will apparently also be limited to PCIe 3.0 speeds. There's also no mention of SATA port configurations. AMD has trimmed the amount of USB 3.x ports significantly, with the A620 chipset only getting two 10 Gbps and two 5 Gbps ports. USB 2.0 ports remain the same at a total of six. A620 motherboards will apparently also be limited to PCIe 4.0 for the lanes from the CPU, but this should be less of an issue for most consumers. As rumored, CPU overclocking is also said to be missing, but RAM overclocking will still be present.

Colorful Technology Company Limited, a world-renowned manufacturer of desktop components, laptops, desktops, AIO PCs, and storage, launches the B760 Series motherboards for the 13th Gen and 12th Gen Intel Core processors. The Intel B760 Series motherboards are ideal gaming and content creation with DDR5 and DDR4 memory support depending on model.

COLORFUL introduces the CVN B760M FROZEN WIFI D5 and CVN B760I FROZEN WIFI motherboards for gamers and enthusiasts. Coming in a compact micro-ATX and Mini-ITX form factors, both motherboards feature PCIe 5.0 x16 slot to support the latest high-end graphics cards. The CVN B760 motherboards also come with Wi-Fi 6, three PCIe 4.0 M.2 slots for the CVN B760M FROZEN WIFI D5 and two PCIe 4.0 M.2 slots for the CVN B760I FROZEN WIFI Mini-ITX motherboard. COLORFUL also presents the BATTLE-AX B760M-F PRO motherboard with DDR4 memory support and two PCIe 4.0 M.2 slots.

For those that don't remember the early days of ASRock, the company started out making some rather unusual motherboards, often with some wild and wacky upgrade paths, such as both a slot and a socket for a CPU or both AGP and PCIe graphics card slots. Since then, ASRock has become a much more mainstream motherboard maker, but the company appears to have gone back to its roots with what the company calls the X670 Xpansion Kit. Right now, the expansion card appears to be working with the B650 LiveMixer motherboard and it's unknown if it's compatible with other models from ASRock. It seems to be limited to ASRock motherboards only, due to the fact that the add-in card requires not only a x4 PCIe slot with all lanes attached, on the motherboard, but also a custom cable that is most likely for "low-speed" I/O's such as I2C, SPI and so on.

As the name suggests, the X670 Xpansion Kit allows B650 motherboards to be turned into X670 motherboards, more or less. The card is home to a second chipset, which enables not only two additional M.2 slots for PCIe 4.0 NVMe SSDs, but it also features two SATA ports, a 10 Gbps USB-C port, three USB-A ports and—maybe most interestingly—a 10 Gbps Ethernet interface. It's unclear if this will be a retail product, but the card provided to Level1Techs doesn't appear to be an engineer unit, but a full retail ready product. It's definitely an interesting upgrade path for those that have invested in a B650 motherboard and there's no real reason why this shouldn't work as well as having the second chipset on the motherboard, especially as ASRock appears to have fitted a signal re-driver on the add-in card to make sure the PCIe signals are handled properly.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to announce the brand new B760M-SILVER motherboard. Constructed around the INTEL LGA1700 socket, which supports 12th / 13th Generation Intel Core processors, the B760M-SILVER carries BIOSTAR's RACING pedigree, with visual flair and innovative features strategically picked to enhance the user's overall experience.

The B760M-SILVER features the MicroATX form factor, which makes it ideal for space and cost-conscious applications, coupled with the BIOSTAR-certified 10+1+1 Phase / 70 A power delivery solution great for gaming and entertainment builds. It comes further equipped with BIOSTAR's DIGITAL PWM technology, which provides exceptionally precise power delivery across all its components.

AMD's entry-level A620 chipset for Socket AM5 motherboards is nearing launch, as manufacturers such as GIGABYTE and ASUS have started regulatory filing their upcoming products with the Eurasian Economic Commission (EEC). These would hopefully bring the starting prices of AM5 motherboards down to the USD $125 figure AMD promised. AMD will sufficiently differentiate A620 from the B650, using specs such as the lack of CPU overclocking capabilities, only a handful PCIe Gen 3 downstream lanes, and the lack of PCIe Gen 5 on both the PEG and CPU-attached M.2 slots (which could at least be limited to Gen 4 if not Gen 3).

While the motherboards themselves may be cheap, the overall platform costs may still end up higher than Intel's H610 or upcoming H710 chipsets; as Socket AM5 lacks DDR4 memory support, and even at the entry-level you'll be forced to buy DDR5. That said, what A620 promises is platform longevity, that the platform will support future processor generations that launch even beyond 2025. AMD dropped a major hint on A620 chipset motherboards availability in its 2023 CES Keynote address, when it pointed to "65 W CPUs and entry-level motherboards" alongside each other. The 65 W Ryzen 7000 series processors are already out, which means A620 should be just around the corner. February 2023 is when AMD looks to launch its high-end Ryzen 7000X3D processors.

ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel W680, Q670, and H610 chipsets. Featured as the first DDR5 ATX motherboards, the IMB-1714, IMB-X1714, and IMB-1713 are brand-new selections while encompassing upgraded support for the 12th Gen Intel CPU motherboards lineup through BIOS update. They guarantee computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to PCIe Gen 5 slots, quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 G LANs, multi-M.2 Key M, ECC memory, TPM 2.0, and more. The 13th Gen Intel CPU motherboards cover comprehensive form factors, including Mini-ITX, Micro-ATX, and ATX for diverse Edge AIoT applications, such as factory automation, kiosks, digital signage, smart cities, medical, and more.

13th Gen Intel Core Motherboards for Upgraded Performance
The upgraded motherboards feature 13th Gen Intel Core i9/i7/i5/i3 processors (Raptor Lake-S) with performance hybrid architecture, plus up to 24 cores and 32 threads that boost compute-intensive edge performance. They leap up to 1.04x/1.34x/1.25x faster in single-thread/multi-thread/CPU image classification inference performance compared to 12th Gen Intel Core processors. Leveraging its engineered flexibility and power, the new 13th Gen Intel Core motherboards run up to DDR5-5600 memory module for higher bandwidth, and PCIe 5.0 for additional expansion while supporting engaging video and digital signage experiences with Intel UHD Graphics driven by Xe architecture.

Giga Computing is an industry leader in high-performance servers and workstations, today announced the next-generation of GIGABYTE servers and server motherboards for the new 4th Gen Intel Xeon Scalable processor to achieve efficient performance gains with built-in accelerators. The new processors have the most built-in accelerators of any processor on the market to help maximize performance efficiency for emerging workloads; and do so while boosting virtualization and AI performance. Generational improvements make this platform ideal for AI, cloud computing, advanced analytics, HPC, networking, and storage applications. For these markets, Giga Computing has announced fourteen new series that constitute seventy-eight configurations for customers to choose from. And all these new GIGABYTE products support the full portfolio of 4th Gen Intel Xeon Scalable processors, including those with high bandwidth memory (HBM) in the Intel Xeon Max Series.

GIGABYTE displayed their latest motherboards and graphics cards at the 2023 International CES, covering their Socket LGA1700 Intel 700-series chipset; and Socket AM5 AMD 600-series chipset. The Z790 AORUS Tachyon is the company's top-grade LGA1700 motherboard targeting the professional overclocking crowd. The board is designed to chase down CPU and memory overclocking world records, featuring the company's most powerful CPU VRM solution, and a 1 DIMM-per-channel DDR5 memory setup that preferred by overclockers for supporting the highest memory overclocks with the tightest timings. There are several overclocker-friendly features besides the onboard buttons—dual-BIOS ROMs, angled connectors for bench cases, consolidated voltage measurement points, and a feature-packed BIOS setup program.

Over in the AMD side, GIGABYTE's top Socket AM5 motherboard is the X670E AORUS Xtreme, which is a feature-packed motherboard with possibly the strongest CPU VRM solutions in the market for Ryzen 7000 processors, and with the best VRM cooling. In addition to the PCIe Gen 5 M.2 slot wired to the AM5 SoC, you get additional Gen 5 slots that subtract from the x16 PEG slot. The AORUS Xtreme also has the most feature-rich BIOS available among GIGABYTE's AM5 lineup. The B650I AORUS Ultra is a premium Mini-ITX Socket AM5 motherboard based on the AMD B650 chipset. Despite its compact size, it gives you a PCI-Express 4.0 x16 PEG slot, a Gen 5 M.2 slot, and two additional Gen 4 M.2 slots, besides the latest wired- and wireless connectivity. We also snapped the B650 AERO G motherboard targeting creators, and the mainstream B650 AORUS Elite AX.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to announce the brand new B760A-SILVER motherboard. Constructed around the Intel LGA1700 Socket, which supports both 12th and 13th-generation Intel processors, the B760A-SILVER motherboard is a jack of all trades, highly suitable for gamers and content creators who look for the most advanced features with a tolerable price tag.

Based on BIOSTAR's globally acclaimed RACING DNA, it offers efficient, reliable functionality typically found only on top-shelf motherboard offerings from market competitors. Signature RGB features, including the RGB ROCK ZONE, give any build a new level of depth and futuristic appeal that complements any color, style, or theme. The B760A-SILVER motherboard supports dual-channel DDR5 memory powered by advanced features like support for both AMD and Intel XMP RAM modules designed to facilitate unparalleled hardware acceleration and performance.

MSI announcing today a new lineup of AMD Ryzen 7000 Series processors that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen CPU will include the AMD Ryzen 9 7900, Ryzen 7 7700, and the Ryzen 5 7600 which will have a default TDP of 65 W. Even with a lower TDP, these CPUs will up to 12 cores and 24 threads as their respective CPUs and be able to hit their theoretical max boost clock of over 5 GHz. All X670 and B650 motherboards from MSI will be compatible and ready at launch with the newest BIOS version "AGESA COMBO PI-1.0.0.4" update.

MSI has 3 unique features to help users to overclock their systems which are called Performance Switch, PBO Thermal Point, and Config TDP with the new launch of AMD Ryzen 7000 Series processors. Earlier this year, MSI introduced a brand-new function called Performance Switch within the MSI BIOS. Performance Switch provides 3 levels of preset and an advanced option for users to choose from. Then combines both AMD's default PBO "Precision Boost Overdrive" and MSI's OC settings to provide a much higher CPU performance in both single-core and multi-core.