AMD seems to be preparing a chipset refresh, and this time, it is coming straight from the top-end market. When the company launched its high-end X570 chipset, it brought the PCIe 4.0 support, which many praised due to its capability to handle much faster NVMe drives. However, it seems like the company is not satisfied with that and it needs to release an updated chipset version called X570S. According to a popular hardware leaker, TUM_APISAK, we have discovered that GIGABYTE is preparing X570S Aorus Pro AX motherboard that will use the refreshed chipset. GIGABYTE already listed several Eurasian Economic Commission (EEC) listings, so the new chipset is sure to hit the market, just at an unknown time.

The S denotes the word silent, meaning that these updated chipsets are capable of working with passive cooling and possibly having a lower TDP compared to 11 and 15 Watts of the X570 chipsets for consumer and enterprise motherboards, respectively. The test was conducted using AMD's newly announced Ryzen 7 5700G processor. The 5000-series of APUs are so far limited to OEMs, so one would guess that GIGABYTE itself made the leak by using a public entry of CPU-Z validation.

Leading memory provider TEAMGROUP challenges the SSD industry's highest speeds today with its launch of the CARDEA A440 PCIe 4.0 SSD under its gaming sub-brand T-FORCE. It features extreme read and write speeds up to 7000 MB/s and 6900 MB/s, respectively, and comes with two patented heat sinks that gamers can install and match to their needs. The SSD's blazing speeds will help players unleash their skills and venture into gaming worlds faster than ever.

The T-FORCE CARDEA A440 PCIe 4.0 SSD supports the PCIe Gen 4x4 specification and the latest NVMe 1.4 standard and is backward compatible with PCIe 3.0 interface ports. Not only does it support high read/write speeds of up to 7000/6900 MB/s, but it is also available with large capacities of 1 or 2 TB. The classic matte black CARDEA A440 features two of the industry's first interchangeable, patent-certified thermal modules. The layered and unique beveled surface of the "aluminium fins" is specially designed to increase the heat dissipation area and can reduce SSD temperature by up to 15%[1]. The "ultra-thin graphene heat sinks" consist of the best materials for thermal conductivity and can dissipate heat by up to 9%. TEAMGROUP's CARDEA A440 provides the best heat dissipation solution. Gamers no longer need to worry about encountering thermal throttling when running games at full speed, causing slowdowns. They can freely enjoy the ultimate gaming experience.

ASUS today announced Mini PC PB62, a durable computer that delivers powerful performance to provide flexibility, expandability and performance to suit a range of business applications, including digital signage, point-of-sales (POS) system, kiosks and intelligent vending machines. Mini PC PB62 is powered by the latest desktop-grade up to 11th Generation Intel Core processor and fast DDR4 3200 MHz memory.

Engineered for performance: 11th Gen Intel Core, DDR4 3200 MHz memory and Intel Optane
With the latest up to 11th Gen Intel Core i7 processors, Mini PC PB62 is caters for with support for either a 35- or 65-watt CPU - so it's ready to be specified for supreme efficiency or maximum performance. PB62 also has built-in support for Intel Optane H20 memory, the technology that greatly improves storage speeds, enables frequently-used documents, pictures, videos and applications to be accessed more quickly while improving overall system performance to maximize productivity and efficiency.

Gigabyte Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest BIOS of B560 AORUS motherboards. Enhanced by the 12+1 phases DrMOS power stage with 60 Amps for each and full coverage VRM thermal design, B560 AORUS motherboards can support Intel Core i9 11900K (F) series processors overclocking to all cores 5.1 GHz. The exclusive anti-interference design of memory circuit enables DDR4 speed raising up to XMP 4800 MHz, and overclocking performance boost to DDR4 5300 MHz. which demonstrates GIGABYTE's strong R&D strength and persistence in quality. Users can enjoy the performance boost of time-limited overclocking by simply updating to the latest BIOS to meet their special needs.1

Intel B series chipset motherboards have been always excluded from overclocking due to the product positioning. Although the memory XMP overclocking is unlocked on 500 series, the processor frequency can only reach up to 4.8 GHz by Turbo Boost. Thanks to the efforts of Gigabyte's R&D team, the processor can be overclocked to 5.1 GHz and maintain low temperature under the Prime95 no AVX burn-in test. This powerful performance benefits from the top-quality materials of GIGABYTE AORUS motherboards and product design capabilities, which include 12+1 phases/ 60Apms DrMOS power stage, 6 layers 2Oz ultra-cool PCB, full-covered VRM thermal design, and the latest Smart Fan 6 technology for temperature control. These features allow processors to have a stable and pure power supply under ultra-high frequency operation, providing the most solid backing for the CPU limited-time overclocking.

ASRock Rack, a division of ASRock dedicated to server/enterprise products, has today quietly launched a 1U short depth server, equipped with AMD's X570 motherboards, able to accommodate AMD Ryzen 5000 series of processors. The 1U2-X570/2T, as ASRock calls it, features an X570D4I-2T motherboard that is capable of housing any AMD Ryzen and Ryzen Pro 5000 series processor with TDP up to 105 Watts, paired with up to four SO-DIMMs of DDR4 ECC memory. Being a remote desktop/server type of build, the 1U case is not designed to be equipped with any powerful discrete graphics card. There is room for the motherboard, the power supply, and the HDDs located next to the motherboard.

Equipped with an 80-Plus Bronze 265 Watt PSU, the system can handle almost any CPU it is equipped with, two 3.5" drives and two 2.5" 7 mm drives. The motherboard also supports M.2 2280 SSD with PCIe 4.0 protocol support. When it comes to basic graphics output, ASRock Rack has installed an ASPEED AST2500 graphics controller to handle basic video output and display the command line, so you can operate with your server with ease. When it comes to networking, it is equipped with dual RJ45 10 GbE connectors, coming from an Intel X550-AT2 Ethernet controller. For more details, head over to the ASRock Rack 1U2-X570/2T product page.

NZXT, a leading designer of computer hardware, software, and services for the PC gaming community, today announces the release of the NZXT N7 B550 motherboard, the first AMD motherboard in NZXT's N7 motherboard lineup. NZXT is expanding the N7 lineup to bring the sleek, seamless design of the N7 ATX motherboard to more gamers. The N7 B550 has optimally placed port locations, supports the latest technology like PCIe gen 4 and WiFi 6e, and gives PC builders the tools they need to create a beautifully modern build.

The N7 B550 includes key features from our RGB and Fan Controller, allowing intuitive control of four RGB lighting channels and seven fan channels through NZXT CAM. Lighting accessories from all manufacturers are supported. The metal cover is available in white or black for a seamless look that blends into the background of any NZXT H Series case for a clean aesthetic.

Intel only just announced their 11th generation Rocket Lake-S desktop processors last week but we are already receiving information about the next generation Alder Lake-S platform which will finally make the jump to 10 nm. Intel slides for the upcoming family of processors have been leaked and they reveal some interesting information including a claimed 20% single-threaded performance increases from the new Golden Cove core design and 10 nm SuperFin node. The processors will feature Intel Hybrid Technology with a mix of small low-performance cores and large high-performance cores with a maximum of eight each for sixteen total cores. The processors will also include the latest connectivity with both PCIe 4.0 and PCIe 5.0 support along with DDR4 and DDR5 4800 MHz compatibility.

Intel will also be launching a new socket type called LGA1700 with a new package size which will render existing cooling solutions for LGA115X and LGA1200 sockets incompatible. The processors will also come with the launch of a new 600 Series chipset with PCIe 3.0 and PCIe 4.0 support along with the usual complement of USB, SATA, and networking. The entry-level 600-series motherboards will only support DDR4 memory at up to 3200 MHz while high-end Z690 motherboards will include DDR5 support. Intel has confirmed that they intend to launch Alder Lake later this year but it is yet to be known if they are referring to the desktop or mobile series.

Hewlett Packard Enterprise, the company focused on making enterprise hardware and software, has today mistakenly listed some of Intel's upcoming 3rd generation Xeon Scalable processors. Called Ice Lake-SP, the latest server processor generation is expected to launch sometime in the coming days, with a possible launch date being the March 23rd "Intel Unleashed" webcast. The next generation of processors will finally bring a new vector of technologies Intel needs in server space. That means the support for PCIe 4.0 protocol for higher speed I/O and octa-channel DDR4 memory controller for much greater bandwidth. The CPU lineup will for the first time use Intel's advanced 10 nm node called 10 nm SuperFin.

Today, in the leaked HPE listing, we get to see some of the Xeon models Intel plans to launch. Starting from 32-core models, all the way to 40-core models, all SKUs above 28 cores are supposed to use dual die configuration to achieve high core counts. The limit of a single die is 28 cores. HPE listed a few models, with the highest-end one being the Intel Xeon Platinum XCC 8380 processor. It features 40 cores with 80 threads and a running frequency of 2.3 GHz. If you are wondering about TDP, it looks like the 10 nm SuperFin process is giving good results, as the CPU is rated only for 270 Watts of power.

TEAMGROUP's T-CREATE brand, which gives creators around the world the tools to express their creativity and inspiration, has updated its product lines again with today's launch of the EXPERT DDR4 OC10L desktop memory, CLASSIC PCIe 4.0 SSD, and CLASSIC DDR4 10L laptop memory. T-CREATE continues to launch diverse new products with improved specifications, producing powerful hardware to meet the needs of creators.

The T-CREATE EXPERT DESKTOP DDR4 OC10L not only has up to 32 GB of capacity per module but also an overclocking feature that automatically increases its frequency to 3600 MHz, providing worry-free overclocking with stable, high-frequency performance. It comes in a titanium grey finish that exudes the tasteful minimalism of the EXPERT product line. In addition, the memory uses a 10-layer PCB with a specialized anti-noise design for better processing capability, allowing creators to work on tasks simultaneously, whether it be producing animation, video editing, or converting large files. It substantially improves work efficiency and excels in multitasking during creative projects.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 7003 Series Processor-based server platforms featuring efficiency and performance enhancements in hardware, security, and memory density for the modern data center.

"Big data has become capital today. Large amounts of data and faster answers drive better decisions. TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors enable businesses to make more accurate decisions with higher precision," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "Moving the bar once more for workload performance, EPYC 7003 Series processors provide the performance needed in the heart of the enterprise to help IT professionals drive faster time to results," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "Time is the new metric for efficiency and EPYC 7003 Series processors are the perfect choice for the most diverse workloads, helping provide more and better data to drive better business outcomes."

AMD has four weeks ago acknowledged that there was a problem with 500 series motherboard chipsets. The problem has occurred with a few chipset functions like USB connectivity, USB 2.0 audio crackling (e.g. DAC/AMP combos), and USB/PCIe Gen 4 exclusion. To fix these problems, consumers were forced to either put up with problems or lower the PCIe standard from Gen 4 to Gen 3 and switch USB protocol revision from 3.0 to 2.0. This of course wasn't the ideal solution, especially for bandwidth-heavy applications. Users have submitted many reports to AMD, and the company appears to have found a root cause of these issues. AMD has published a Reddit thread, that reports that the company found a solution to the problem and that we are going to see a fix for it in a form in AGESA BIOS update.

AMD RedditAMD has prepared AGESA 1.2.0.2 to deploy this update, and we plan to distribute 1.2.0.2 to our motherboard partners for integration in about a week. Customers can expect downloadable BIOSes containing AGESA 1.2.0.2 to begin with beta updates in early April. The exact update schedule for your system will depend on the test and implementation schedule for your vendor and specific motherboard model. If you continue to experience intermittent USB connectivity issues after updating your system to AGESA 1.2.0.2, we encourage you to download the standalone AMD Bug Report Tool and open a ticket with AMD Customer Support.

Users have recently been reporting various intermittent USB connectivity errors on AMD 500 series motherboards. AMD has acknowledged these issues in a recent Reddit post where they have asked affected users for more information to help them resolve the issues. The issues appear to be most commonly found when using VR headsets on X570 motherboards where intermittent connectivity issues are most noticeable. Some of the affected users report that the issues are most common when using a PCIe 4.0 GPU and that switching to PCIe 3.0 can sometimes resolve the issue. AMD is asking affected users to submit reports through their Online Service Request platform and will also contact users directly on Reddit to request detailed information.

Update Mar 9th:

AMD has provided some official guidance for affected users asking them to follow the solutions provided by Reddit such as disabling global C-States and switching to PCIe 3.0 mode if general troubleshooting has failed. AMD has reaffirmed that they were aware of the issue and that their engineers are actively working on a fix.

Exxact Corporation, a leading provider of high-performance computing (HPC), artificial intelligence (AI), and data center solutions, announced their new line of Valence and TENSOREX Workstations featuring the new AMD Ryzen Threadripper PRO Processors. These professional grade workstations geared towards engineers, visual graphic artists, and scientists provide game changing single and multithreaded performance and provide unrivaled memory bandwidth1. Exxact has positioned itself to be one of the first system integrators to provide workstations equipped with these powerful new processors.

"The new AMD Ryzen Threadripper PRO Processors are a massive leap forward for engineers, designers, architects, any professional who demands ultimate performance and security from their workstation," said Jason Chen, Vice President at Exxact Corporation. "By being one of the first companies to offer these workstations, our customers can gain the competitive edge in their industry," added Jason.

All of the MSI Z490 motherboards will be supporting PCIe 4.0 with the coming Intel 11th Gen Intel Processors. Through an update to the latest BIOS, MSI Z490 motherboards offer great bandwidth and performance for PCIe 4.0 M.2 SSDs and graphics cards.

To be PCIe 4.0 compatible, several components on the motherboards are necessary, including PCIe 4.0 ready clock generator, lane switch, redriver, PCIe slots, and M.2 connectors. Thanks to the complete PCIe 4.0 solutions, MSI Z490 motherboards provide the most stable design for PCIe 4.0 and unlock the full performance of PCIe 4.0 devices.

The Sony PlayStation 5 comes with an internal 825 GB PCIe 4.0 SSD which offers around 667 GB of usable storage for games and other content. With new games such as the latest Call Of Duty easily taking over 100 GB the need for more storage has never been more evident. Sony has prepared for this eventuality by including an internal M.2 drive bay on the PS5 to expand the available storage. The shift to ultra-fast storage on this latest generation of consoles has limited their ability to support external storage as new games developed for the consoles will expect a certain level of performance. Sony will reportedly enable software support for the M.2 slot with a limited selection of tested PC drives to ensure these minimum performance requirements are achieved. The approach by Sony differs from that of Microsoft who has created a proprietary connector for storage upgrades.

In the latest round of rumors, we have today received some really interesting news regarding Intel's upcoming lineup of desktop processors. Thanks to HKEPC media, we have information about the launch date of Intel's Rocket Lake-S processor lineup and Alder Lake-S details. Starting with Rocket Lake, Intel did not unveil the exact availability date on these processors. However, thanks to HKEPC, we have information that Rocket Lake is landing in our hands on March 15th. With 500 series chipsets already launched, consumers are now waiting for the processors to arrive as well, so they can pair their new PCIe 4.0 NVMe SSDs with the latest processor generation.

When it comes to the next generation Alder Lake-S design, Intel is reported to use its enhanced 10 nm SuperFin process for the manufacturing of these processors. This would mean that the node is more efficient than the regular 10 nm SuperFin present on Tiger Lake processors, and some improvements like better frequencies are expected. Alder Lake is expected to make use of big.LITTLE core configuration, with small cores being Gracemont designs, and the big cores being Golden Cove designs. The magic of Golden Cove is expected to result in 20% IPC improvement over Willow Cove, which exists today in Tiger Lake designs. Paired with PCIe 5.0 and DDR5 technology, Alder Lake is looking like a compelling upgrade that is arriving in December of this year. Pictured below is the LGA1700 engineering sample of Alder Lake-S processor.

With the debut of PCIe 4.0 standard, SSD manufacturers have started launching a new generation of storage devices, with unseen speeds before. Today's PCIe 4.0 SSDs can reach up to 8.0 GB/s reads and writes, all thanks to the bandwidth-heavy PCIe protocol. However, enterprise workloads are always requiring more and more bandwidth to satisfy their needs. Data is being moved in immense quantities and faster hardware is always welcome. The previous PCIe 4.0 standard is about to kneel to its successor - PCIe 5.0 protocol. Having double the amount of bandwidth, the new standard is set to bring unseen speeds.

The PCIe 5.0 protocol offers 32 GT/s per lane, making up to 64 GB/s in the full x16 implementation. However, when it comes to SSDs, as they use x4 lanes, it will increase the maximum speed to 16 GB/s, doubling the previous bandwidth. Silicon Motion, the maker of NAND flash controllers, has announced that the company is going to debut a PCIe 5.0 controller next year. "We are excited about enterprise-grade PCIe Gen5 controller, which we will have taped out early next year and sample in the second half of 2022", said Wallace Kuo, chief executive of Silicon Motion, during a conference call. Launching just in time to pair with Intel's Sapphire Rapids Xeon processors that support the PCIe 5.0 protocol, Silicon Motion is probably expecting to grab its market share there.

At the beginning of 2021, MSI, a would-leading motherboards brand, had announed the latest Intel 500 series platforms will launch soon. Through few weeks of waiting, on January 27th, MSI Intel 500 series motherboards are officially launched.

As MSI official announcement mentioned, all of MSI 500 series motherboards with 11th Gen Intel Core processors support PCIe 4.0, and all of Z590 Wi-Fi motherboards have at least one 2.5G LAN and the latest Wi-Fi 6E solution which extends to 6 GHz spectrum providing remarkble user experience when streaming, gaming and even working from home.

The Corsair MP600 PRO Gen4 (CSSD-F1000GBMP600PRO) was recently spotted on Amazon Germany before being taken down. The MP600 PRO is the successors to Corsair's MP600 SSD featuring Phison's second-generation PCIe 4.0 PS5018-E18 SSD controller and boasting sequential read/write speeds of up to 7000 MB/s, and 6850 MB/s respectively. These are some very significant generational speed improvements over the already blazing fast advertised read/write speeds of the MP600 at 4950 MB/s and 4250 MB/s.

The drive is also listed as carrying a warranty of 3,600 TBW which is likely for the 2 TB model. These new second-generation PCIe 4.0 SSDs are nearing the limits of the PCIe 4.0 x4 interface which offers maximum speeds of ~8000 MB/s. It should also be noted that these performance improvements offer very limited practical benefits to the end-user in typical use-cases over a basic PCIe 3.0 NVMe drive. Pricing and availability for the drive were not published but we expect Corsair to officially announce the drive soon.

PNY announces the launch of XLR8 CS3140 M.2 NVMe Gen4 x4 Solid State Drive, the "CS3140", delivering speeds never seen before. PNY's quest to continuously deliver cutting-edge technology for the most demanding applications has led to the development of the company's fastest M.2 NVMe SSD yet. The CS3140 sets new standards that enable 4K and 8K content creators, high-intensive application users, gamers, and others to experience a whole new level of speed, performance, and productivity.

Optimized for the latest NVMe Gen 4.0 protocol, which continues to gain adoption from motherboard manufacturers and users, the CS3140 delivers outstanding sequential speeds of up to 7,500 MB/s read and up to 6,850 MB/s write speeds, redefining possibilities and paving the road to a whole new world of content creation, gaming, and so much more.

A number of upcoming Z590 ASUS motherboards have recently been pictured. The four upcoming motherboards include the ASUS ROG Maximus XIII Extreme Glacial, ASUS ROG Maximus XIII Hero, ASUS Prime Z590-A, and the ASUS TUF Z590-PLUS WIFI. These new motherboards feature an LGA1200 socket the same one found on existing Z490 boards and are targeted towards Intel's upcoming 11th generation processors. The new Rocket Lake-S processors will introduce support for PCIe 4.0 which should be fully supported on these new boards.

The Z590 MAXIMUS XIII EXTREME GLACIAL is a high-end premium motherboard with integrated monoblock from EK. The board is similar to the Z490 GUNDAM and comes in an E-ATX form factor. The 13th edition ASUS ROG Maximus XIII Hero includes dual EATX12V 8-pin power connectors an upgrade from the 8+4 pin configuration found on the Z490 series. These new motherboards are expected to be announced in the coming days during CES.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that all Z490 motherboards featuring PCIe 4.0 hardware design can support the 11th Gen. Intel Core processors perfectly by update to the latest F20 BIOS, and provide the extreme bandwidth and performance for PCIe 4.0 graphics cards and SSDs. With a snap update of the latest BIOS from GIGBAYTE's official site, users can enjoy the full pack of advantages and unlock the Resizable BAR function on GIGABYTE Z490 and H470 motherboards.

The latest 11th Gen. Intel Core processors will be launched on March 2021. The new processors keep the same architecture as the previous generation but they enable the PCIe 4.0 support, which meet a range of needs for users who expect broad bandwidth and super high transfer speed of PCIe 4.0 on the Intel platform. For those who own one of the current generation motherboards, it would be a great deal to enjoy the performance uplift on Z490 motherboards with PCIe 4.0 function and 11th Gen. Intel Core processors support.

In the upstream semiconductor industry, the major foundries such as TSMC and UMC are reporting fully loaded capacities, while in the downstream, the available production capacity for OSAT is also lacking, according to TrendForce's latest investigations. Given this situation, suppliers of NAND Flash controller ICs such as Phison and Silicon Motion are now unable to meet upside demand from their clients. Not only have many controller IC suppliers temporarily stopped offering quotes for new orders, but they are also even considering raising prices soon because the negotiations between NAND Flash suppliers and module houses over 1Q21 contracts are now at the critical juncture. The potential increases in prices of controller ICs from outsourced suppliers (IC design houses) are currently estimated to be the range of 15-20%.

With regards to the demand side, demand has risen significantly for eMMC solutions with medium- and low-density specifications (i.e., 64 GB and lower), for which NAND Flash suppliers have mostly stopped updating the NAND Flash process technology, while maintaining support with the legacy 2D NAND or the 64L 3D NAND process. This is on account of strong sales for Chromebook devices and TVs. As older processes gradually account for a lowering portion of bit output proportions from NAND Flash suppliers, these companies are exhibiting a lowered willingness to directly supply such eMMC products to clients. As a result, clients now need to turn to memory module houses, which are able to source NAND Flash components and controllers, to procure eMMC products in substantial quantities.

Intel needs a platform refresh to battle the competition, mainly speaking to battle AMD and its Ryzen 5000 series processors. That is why the company is developing 500 series of chipsets covering the low-end (H510), mid-range (B560), and high-end markets (Z590) that pair with the upcoming Rocket Lake-S processor generation. Dubbed 11th generation of Core processors, the 11th generation of Intel Core CPUs are going to be built on Intel's refined 14 nm process. The CPUs are supposed to feature a Cypress Cove core, which is a backport of Golden Cove found in Ice Lake. The 500 series motherboards are the last in the DDR4 generation, launching in the timeframe when DDR5 is supposed to take over in the coming years.

Today, thanks to Weixin, a Chinese media outlet that posted a short story on the WeChat platform, we have information about the launch date of these new chipsets. According to the source, we are allegedly going to see these new chipsets on January 11th, the day that Intel CES 2021 event is supposed to happen. The platform will include a range of motherboards from Intel's partners and is supposed to bring support for the much-needed PCIe 4.0 protocol. The launch date should be taken with a grain of salt, of course, before taking it as a fact.

Samsung's latest 980 Pro SSD is not unlike the hypercar of solid state storage: ridiculously fast, ludicrously expensive. The company had announced that a 2 TB version would be available sometime near these holidays, and Scan.co.uk has just listed one such 2 TB part. If you want one of the best PCIe 4.0 SSDs money can buy, and one of the only ones based on TLC (Triple Layer Cell) technology, then you might be in luck.

The reseller is listing the 2 TB version of the 980 Pro for a cool £443 (including tax), which translates to about $590. That's more than double the pricing of some very interesting PCIe 4.0 solutions. Considering the 1 TB version ticks at read speeds up to 7,000 MB/s and write speeds at up to 5,000 MB/s with an endurance of 600 TBW, expect the 2 TB version to be even faster and more consistent. Maybe improve your storage subsystem while we are faced with the current gaming hardware shortages? Consider, however, that delivery is estimated for early January 2021.