AMD today announced a reimagined family of AMD Athlon desktop processors with Radeon Vega graphics that have been optimized for everyday PC users: the AMD Athlon 200GE, Athlon 220GE, and Athlon 240GE processor. Combining the high-performance x86 "Zen" core and "Vega] graphics architectures in a versatile System-on-Chip (SOC) design, the Athlon desktop processors offer responsive and reliable computing for a wide range of experiences, from day-to-day needs like web browsing and video streaming through more advanced workloads like high-definition PC gaming. Complementing this news, AMD announced the availability of the commercial-grade Athlon PRO 200GE desktop processor, along with three 2nd Gen Ryzen PRO desktop processor models for the commercial, enterprise, and the public sector: the Ryzen 7 PRO 2700X, Ryzen 7 PRO 2700, and Ryzen 5 PRO 2600 processors. With these new introductions, AMD now offers a top-to-bottom line-up of professional-grade computing solutions for experiences that range from premium content creation to advanced multitasking and office productivity.

"We are proud to expand our successful "Zen" core-based consumer and commercial product portfolios today with the addition of AMD Athlon, AMD Athlon PRO, and 2nd Gen AMD Ryzen PRO desktop processors. The new Athlon desktop processors, now incorporating the advanced "Zen" core and "Vega"3 graphics architectures, energize a legendary processor brand in AMD Athlon - a brand that consumers and PC enthusiasts alike trusted throughout nearly two decades of innovation," said Saeid Moshkelani, senior vice president and general manager, Client Compute, AMD. "Additionally, we are continuing to offer business PC users more processing power than we ever have before with the launch of 2nd Gen Ryzen PRO desktop processors into the commercial market."

NEC Display Solutions of America, Inc., a leading provider of commercial displays and projectors, today announced the availability of two new desktop monitors: the MultiSync EA271Q and MultiSync P243W.

"The 27" MultiSync EA271Q significantly updates our popular E275WMi monitor, and the 24" MultiSync P243W refreshes the P242W," said Art Marshall, Senior Product Manager for Desktop Displays at NEC Display Solutions. "These two new models provide users sleeker, more productive monitors and show our ongoing commitment to technological innovation and to helping our customers improve their workflows."

GIGABYTE is ready with its Z390 Aorus Elite motherboard. The name might suggest that it's the company's flagship product based on the Z390 chipset, but in reality, it's part of the company's new nomenclature that differentiates boards from different price-points. The current "Gaming 3, Gaming 5, and Gaming 7" series is going to be replaced. The cheaper "Gaming 3" extension will be replaced by "Elite." The slightly divergent "Ultra Gaming" extension gets replaced by "PRO." The mid-tier Gaming 5, on the other hand, extension is replaced by "Ultra." The high-end Gaming 7 tier is replaced by "Master," and the flagship Gaming 9 extension by XTREME. We've already seen one of these with the recent Aorus X399 XTREME TR4 motherboard.

Moving on to the product at hand, the Z390 Aorus Elite is a somewhat entry-tier product that's probably priced around the $150-mark, owing to the high chipset price and the higher CPU VRM requirements it mandates. We already count a 13-something-phase VRM (which could include phase-doubling). The "Gaming 3" extension historically lacked NVIDIA SLI support, and that carries over to the Z390 Aorus Elite. The second PCIe x16 slot on this board is electrical x4, and wired to the PCH. Storage connectivity, besides six SATA, includes two M.2 slots with x4 wiring, one of which includes a heatsink. GIGABYTE boards are known for good onboard audio implementations, and this board is no exception. It appears to have WIMA capacitors, ground-layer isolation, EMI shield over the CODEC, which very likely could be an ALC1220. USB 3.1 connectivity, including a type-C port, and 1 GbE interface driven by an i219-V could make for the rest of it. There's minimal RGB bling on board, but you'll get 2-3 aRGB headers.

Samsung Electronics today unveiled its first NVMe-based portable solid state drive (SSD) - the Samsung Portable SSD X5 - achieving new levels of performance and reliability for external storage solutions. Based on the cutting-edge Thunderbolt 3 technology, the new X5 features exceptional speeds in a compact and durable form factor, making it an ideal portable storage for content creators and IT professionals on the go.

"As a leader in high-performance and reliable storage solutions, we are thrilled to continue to advance the external SSD market with the introduction of our first Thunderbolt 3 portable SSD," said Dr. Mike Mang, vice president of Brand Product Marketing, Memory Business at Samsung Electronics. "The X5 is yet another testament to Samsung's commitment to providing innovative portable storage solutions that enable faster transfer of large data files, saving users' valuable time."

GIGABYTE introduced an Aorus-branded, quasi-premium mini-ITX motherboard based on AMD B450 chipset, for socket AM4 processors, the B450-I Aorus Pro WiFi. The board draws power from a combination of 24-pin ATX and 8-pin EPS, conditioning it for the SoC with a lean 4+2 phase VRM. The AM4 SoC is wired to two DDR4 DIMM slots, supporting up to 32 GB of dual-channel DDR4 memory; and the board's lone PCI-Express 3.0 x16 slot.

Storage connectivity on the B450-I Aorus Pro WiFi includes an M.2-2280 slot with PCI-Express 3.0 x4 and SATA 6 Gbps wiring; and four SATA 6 Gbps ports. USB connectivity includes six USB 3.0 ports (four on the rear panel, two by headers); and two USB 3.1 gen 2 (both on the rear panel). With just 6-channel jacks, the onboard audio solution may look cheap, but is redeemed by Realtek ALC1220 CODEC. The Intel 9260 adapter is at the helm of wireless networking, with 802.11ac + Bluetooth 5.0, while GbE is handled by Intel i211AT. There's also some RGB LED fun to be had, with two 4-pin ARGB headers, and a small 8-pixel diffuser behind the PCB. GIGABYTE could price this board around $120.

QNAP Systems, Inc. today launched the 2-bay TS-251B NAS. Powered by an Intel J3355 dual-core processor, the TS-251B provides home and SOHO users with an excellent cross-device multimedia experience with its 4K media transcoding and streaming capabilities, 4K HDMI output, and a wide range of backup and sharing applications. The TS-251B also provides a PCIe slot to expand its core functionality.

With its PCIe slot, users can easily expand the functionality of the TS-251B. A QNAP QM2 card can be installed to add M.2 SSD caching and 10GbE connectivity; a compatible wireless adapter (e.g. QNAP QWA-AC2600) to create a wireless storage and streaming environment; a USB 3.1 Gen 2 (10Gbps) card to increase the number of USB ports; or a QNAP QXG-10G1T 10GbE network expansion card to add 10GbE connectivity.

Next level value for money meets maximum airflow and RGB illumination in the new SilentiumPC Regnum RG4T(F) RGB chassis. Based on a dual-chamber internal layout, it offers functionality and solutions for all modern system requirements, supports up to 380 mm long graphics cards and up to 159 mm tall CPU coolers.

To ensure proper cooling properties Regnum RG4T(F) RGB has a mesh-type front panel and comes equipped with three quiet 120 mm RGB case fans. The system can be extended to up to six fans in total, which can be controlled via the built-in fan controller. Liquid cooling enthusiasts will appreciate radiator mounting spots at the top (120/240) and front (120/240/360) for either various AIO solutions or custom loops. The interior is cleverly divided into two thermally independent chambers, allowing for more effective cooling. Power Supply Units and Hard Drives are mounted in the lower chamber and the other components in the main chamber on top. The Regnum RG4T(F) RGB is equipped with three pre-installed dust filters, located at the front, top and the bottom to keep the interior dust-free. Convenient cable management is achieved thanks to numerous pass-through openings and cable tie points.

Intel is giving final touches to a new generation of pre-built NUC (next unit of computing) kits codenamed "Bean Canyon." These tiny desktops are based on the company's new wave of "Coffee Lake-U" SoCs. The family includes five models, two each based on the Core i3-8109U and Core i5-8259U, and one based on the Core i7-8559U. The NUC8i3BEH, NUC8i5BEH, and NUC8i7BEH are more compact, with just an M.2-2280 (with both PCIe x4 and SATA wiring) slot in charge of storage, while the NUC8i3BEK and NUC8i5BEK are slightly taller, with room for a 2.5-inch SATA drive in addition to the M.2-2280 slot.

What's common between all five models is the display connectivity, which not just includes an HDMI 2.0b, but also a USB 3.1 type-C port with Thunderbolt 3.0 (40 Gbps) and DisplayPort 1.2 wiring. Networking, which includes a 1 GbE interface driven by the trusty i219-V, and a new-generation Intel 9260 WLAN card with 802.11ac and Bluetooth 5.0 wireless networking. Prices for the Core i3 model could start at $299, the Core i5-based ones could be $399, and the Core i7 based one at $599.

In Win Development Inc., one of the leading manufacturers of innovative PC enclosures, today unveils its latest E-ATX tower enclosure, the 915. The elegant curves on the front and back are the first to catch your eye. Here, the back has an additional alternative, the clean cable management away from the case. The tempered glass cover can be lifted mechanically to expose the ventilation slots. Thus, the warm air can escape directly at the top with the help of up to three 140-millimeter fans. After shutting down the system, the cover closes with a 15 second delay to drain the residual heat out of the system.

The front connectors include a reversible USB 3.1 Gen 2 Type-C port, two USB 3.0 ports and a 3.5mm headphone and microphone jack. Up to nine fans or four radiators can be accommodated in the 915. These help, following the natural convection, to create a flow of air from bottom to top in the housing. Magnetic dust filters keep the inside dust-free and can be easily removed for cleaning.

GIGABYTE today announced its flagship socket TR4 motherboard for AMD Ryzen Threadripper processors, with out-of-the-box compatibility with 2nd generation 32-core Threadrippers. The new Aorus X399 XTREME board is part of a new breed of X399-TR4 motherboards launched/unveiled in the past few months, with reinforced VRM to cope better with the upcoming 250W TDP 24-core and 32-core processors, such as the MSI MEG X399 Creation. A brochure of this board was leaked to the web last month, and now we see it in the flesh. Technically still an ATX board, the Aorus X399 Xtreme is slightly broader, and is recommended to be installed in EATX-capable cases. Power is drawn from a 24-pin ATX, two 8-pin EPS, and an optional 6-pin PCIe power. A 10-phase VRM powers the CPU.

Expansion includes four PCI-Express 3.0 x16 slots (x16/NC/x16/NC or x16/NC/x8/x8 or x8/x8/x8/x8), and an x1 slot. Storage connectivity includes three M.2 slots with gen 3.0 x4 wiring, each; and six SATA 6 Gbps ports, from which four come directly from the CPU. The onboard audio is top of the line, with an ESS Sabre DAC working the main stereo out, and a Realtek ALC1220VB handling the other 8 channels. The Sabre is slaved to the ALC1220VB, so the system only sees one audio controller. There are four network interfaces - a 10 GbE driven by an Aquantia-made controller, two 1 GbE pulled by Intel i219-V, and an 802.11ac driven by an Intel 9260 WLAN card, which also handles Bluetooth 5.0. There are 10 USB 3.1 ports at the integrated rear panel (eight running at 5 Gbps, and two at 10 Gbps, one of which is type-C). Four other 5 Gbps ports are wired internally. Of course there's the full-shebang of RGB lighting and control. Available from 8th August, the board will be priced at USD $499.99.

If you've been dreaming of an external HDD that could sync its RGB goodness with that of your PC case for the ultimate in bling synchronicity, ASUS has you covered. Its new FX external HDD lineup does just that - deliver a Strix-like design with a very angular base, with detailed accents etched onto the brushed aluminum enclosure. And did I mention there is full AURA Sync support?

The FX external HDDs boast of secure 256-bit AES encryption and data compression, and has a built-in back-up software solution. Connection (both for data transfer and AURA Sync) is done via a USB 3.1 Gen1 x 1 connector via the ASM1153E controller. The FX external HDDs measure 128 x 80 x 16.3 mm and only weigh 145 grams in 1TB and 2TB capacity, while the EHD-A2T model provides 2TB of storage.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today launched the UD230 and UD330 USB Flash drives. Featuring a capless, folding-cover design and a large lanyard hole for attaching to straps and keychains, they are easy-to-use and well-suited for on the go. The UD230 works in USB 2.0 and offers up to 64GB of storage, while the UD330 works in USB 3.1 and comes with up to 128GB storage. Both models are manufactured with the Chip-On-Board (COB) process, whichallows them to be more compact in size and more resistant to impact, water, and dust. ADATA remains committed to its USB Flash drive global leadership role and will continue releasing new models as market needs evolve.

Sporting a folding-cover design, the UD230 and UD330 remedy the universal dilemma of misplaced caps. The USB connector can be stored in the cover while not in use. This simple yet intuitive design helps make the UD230 and UD330very satisfying to use on the go.In addition, both models come with a large lanyard hole for convenience and personalization, allowing users to attach them to lanyard straps or keychains for easy carrying.

MSI, the leading motherboard manufacturer, is proud to announce that MSI B450 motherboards are on shelf now. To satisfy all kinds of gamers and users, MSI has prepared motherboards in Performance GAMING, Arsenal GAMING and PRO Series. With more MSI exclusive features and hardware improvements, MSI B450 motherboards allow users to maximize performance and gain better gaming experiences.

According to MSI OC Lab, we are proud to achieve CPU frequency up to 5.7 GHz with three of MSI B450 motherboards. With highly optimized design and premium layout and MSI exclusive feature, Core Boost, the B450 GAMING PLUS, B450 TOMAHAWK, and B450M MORTAR all push AMD Ryzen 2600X CPU frequency rate over 5.7 GHZ by using LN2, with 5781 MHz, 5752 MHz, and 5771 MHz respectively. This is an incredible result to show that MSI B450 motherboards are perfect with higher performance.

AMD today announced the B450 motherboard chipset for socket AM4 processors and APUs. Positioned as the mid-range option from AMD's 400-series chipset family, the B450 will power motherboards priced anywhere between $70 to $160, and packs certain high-end features that could let you save money over choosing pricier X470-powered boards. To begin with, the B450, like the X470, has a lower TDP and power-draw, so it runs cooler, and can make do with lighter heatsinks. It comes with slightly improved reference CPU VRM and memory wiring specifications that AMD introduced with the X470. The B450, like the X470, also supports XFR 2 "Enhanced" and Precision Boost Overdrive (that lets you tinker with boost frequencies without arbitrarily setting a high clock speed).

The B450 is recommended by AMD for both Ryzen 5 series and Ryzen 7 series, provided you don't need multi-GPU, as motherboards based on B450 aren't allowed to have PEG lane bifurcation. You still get multiplier-unlocked CPU overclocking support (something the competing Intel B360 platform lacks), as well as memory overclocking. The B450 packs out of the box support for AMD StoreMI, a storage virtualization feature that stripes a portion of your memory, your fast SSD, and slower HDD, into a single volume, and juggles hot data in and out of the faster media in the background. You can have any brand of drives to use StoreMI. B350 motherboards support StoreMI through BIOS updates.

(Editor's Note: Naturally, the adoption of such a standard does imply that graphics card manufacturers will have to start fitting USB 3.1 connectors on their graphics card outputs. This opens up a proverbial can of worms on backwards compatibility of this new data delivery protocol, however, in that even current top-of-the-line graphics cards lack such a port - meaning that this protocol will only be compatible with eventual, future GPU releases.)

A new industry consortium led by NVIDIA, Oculus, Valve, AMD, and Microsoft today introduced the VirtualLink specification - an open industry standard that enables next-generation VR headsets to connect with PCs and other devices using a single, high-bandwidth USB Type-C connector, instead of a range of cords and connectors.

Blackmagic Design today announced the Blackmagic eGPU, a high performance graphics processor for pro creative software such as DaVinci Resolve, 3D games and VR. Designed in collaboration with Apple, the Blackmagic eGPU features a built-in Radeon Pro 580, two Thunderbolt 3 ports, HDMI 2.0, 85W of charging power and four USB 3.1 connections. It comes in an integrated design that brings high-end desktop class graphics processing to MacBook Pro for professional video workflows, 3D games and immersive VR. And, the Blackmagic eGPU is the first to support Thunderbolt 3 displays. The Blackmagic eGPU is available now for only US $699 exclusively on Apple.com and in select Apple Retail stores worldwide.

Designed to address the needs of professional video editors, Hollywood colorists and visual effects artists who need to remain mobile, but want the power of a desktop class GPU added to their MacBook Pro, the Blackmagic eGPU is incredibly flexible and simply plugs in via Thunderbolt 3, so users can benefit from improved graphics performance and acceleration of computational tasks. It's perfect for speeding up professional creative application workflows including editing, color correction and visual effects with DaVinci Resolve. The Blackmagic eGPU adds the performance customers need to make the latest 3D games and VR look more realistic than ever. That means customers will get higher resolution images, higher frame rate gameplay, better lighting and more detailed textures for truly immersive experiences, even on a laptop computer.

ASUS expanded its mid-range TUF Gaming motherboard lineup with a new micro-ATX socket LGA1151 motherboard, the TUF B360M-Plus Gaming S. Built with the characteristic black+yellow color scheme and the polygonal shape, this board takes in 8th generation Core processors. It draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the CPU with a 4+3 phase VRM. The CPU is wired to four DDR4 DIMM slots, and a reinforced PCI-Express 3.0 x16 slot. Two other PCI-Express 3.0 x1 slots, and three M.2 PCIe slots make for the rest of the expansion.

Storage connectivity includes two M.2-2280 slots with PCIe gen 3.0 x4 wiring, one of which also has SATA 6 Gbps wiring; and six SATA 6 Gbps ports. The third M.2 slot is 30 mm long, has PCIe 3.0 x1 wiring, and is meant for CNVi WLAN cards. Networking is handled by an Intel i219-V controller driving a GbE interface. The onboard audio solution combines an entry-level Realtek ALC887 codec with 6-channel output, audio-grade capacitors, and ground-layer isolation. USB connectivity includes two USB 3.1 gen 2 (both type-A), four USB 3.1 gen 1 (three type-A, one type-C), two USB 3.1 gen 1 front-panel ports by header; and a number of USB 2.0 ports. The board features an RGB LED ornament at the top-right corner, and a 4-pin RGB LED header, controlled by Aura Sync RGB software. The board is expected to be priced around USD $120.

Thermaltake, a leading premium gaming tower manufacturer, has launched its latest Thermaltake Core P5 Tempered Glass Ti Edition ATX Wall-Mount Chassis, an upgrade to the predecessor Core P5. Constructed with 5mm tempered glass panel plus stainless steel panels for secure mechanism, four USB 3.0 data transfer ports, a motherboard tray and fully modular design that allows flexibility for 3-way placement layouts (Wall mount, Horizontal and Vertical), dual GPU layout locations (Horizontal and Vertical) and placement locations for liquid cooling components. Uncover greatness with the Core P5 TG Ti's panoramic viewing angle with its full tempered glass window; designed to protect and display your stunning liquid cooling system.

By practicing and incorporating the idea of "maker movement" as well as 3D printing, Thermaltake designs the open frame panoramic viewing chassis for anyone to access and do his/her own mods as well as print out his/her own ideas using available liquid cooling components and manuals without boundaries.

QNAP Systems, Inc. (QNAP) today announced the launch of the TS-1635AX NAS - the successor of the landmark TS-1635 NAS. With 16 drive bays (twelve 3.5-inch and four 2.5-inch) and dual 10GbE SFP+ ports, the TS-1635AX is further boosted with a high-performance Marvell ARMADA 8040 ARMv8 Cortex-A72 64-bit quad-core 1.6 GHz processor and two M.2 SATA SSD slots (2280 form factor) and supports Linux virtualization, SSD caching, and Qtier 2.0. The TS-1635AX sets a new standard for ARM-based NAS and marks a new milestone for high-capacity and affordable desktop NAS models.

The TS-1635AX supports QNAP's proprietary Qtier 2.0 for automatic tiered storage and provides a cache-like mechanism in volumes and LUNs to boost the performance of applications where high-efficiency data access is necessary (such as virtualization). The TS-1635AX also supports containerized virtualization (LXC and Docker ) and Linux command-line interface (CLI) virtual machines* for deploying virtualization applications to fully realize the potential of the Marvell ARMADA 8040 processor.

Intel is rumored to have shelved the iteration of its upcoming Z390 Express chipset as earlier publicized, the one which had certain new hardware features. It could now re-brand the existing Z370 Express as Z390 Express and probably bolster its reference design with heftier CPU VRM specifications, to cope better with its upcoming 8-core LGA1151 processors. The Z370 Express is similar in feature-set to the brink of being identical to its predecessor, the Z270 Express. This move could impact certain new hardware features that were on the anvil, such as significantly more USB 3.1 gen 2/gen1 ports directly from the PCH, integrated WiFi MAC, and Intel SmartSound technology, which borrowed certain concepts from edge-computing to implement native speech-to-text conversion directly on the chipset, for improved voice control latency and reduced CPU overhead.

The reasons behind this move could be a combination of last-minute cost-benefit analyses by Intel's bean-counters, and having to mass-produce Z390 Express on the busier-than-expected 14 nm silicon fabrication node, as opposed to current 300-series chipsets being built on the 22 nm node that's nearing the end of its life-cycle. Intel probably needed the switch to 14 nm for the significant increases in transistor-counts arising from the additional USB controllers, the WiFi MAC, and the SmartSound logic. Intel probably doesn't have the vacant 14 nm node capacity needed to mass-produce the Z390 yet, as its transition to future processes such as 10 nm and 7 nm are still saddled with setbacks and delays; and redesigning the Z390 (as we knew it) on 22 nm may have emerged unfeasible (i.e. the chip may have ended up too big and/or too hot). The Z390 Express chipset block-diagram, which we published in our older article has been quietly removed from Intel's website. It's also rumored that this move could force AMD to rethink its plans to launch its Z490 socket AM4 chipset.

ASUS today introduced the WS X299 SAGE/10G, a step up variant of the WS X299 SAGE it launched back in Q4-2017. As you can tell from the model name, this board's star-attraction is 10 Gbps Ethernet. It features not one, but two 10 GbE interfaces, replacing the dual 1 GbE interfaces of the original. These interfaces aren't backed by low-cost controllers, but the Intel X550-AT2 "Sageville," which is an $80 chip by itself, and drives both interfaces.

ASUS also used the opportunity to improve the CPU VRM a bit. Although it's still the same combination of chokes and MOSFETs, pulling power from two 8-pin EPS connectors, ASUS improved the secondary VRM heatsink, which pulls heat from the main heatsink over a flattened heat-pipe. This heatsink is now made of a dense aluminium fin-stack like the main heatsink, a section of which protrudes all the way to the rear I/O shield. The rear I/O now consists of four USB 3.1 gen 1 ports, two USB 3.1 gen 2 ports (including a type-C port), and the 8-channel HD audio cluster, besides the two 10 GbE ports. The rest of the board's feature-set is unchanged from the original. We expect a $100 premium over the original's price.

We've been to many editions of Computex, and it would often be Lian Li with the year's most outrageously imaginative case design. Over the past few years, In Win picked up that mission, and succeeded even this year, with the Z-Frame. This case is a work of art, and anyone taking it to their local BYO eSports event is bound to get the most attention, or maybe even make it to the local daily's picture. Its design is more alien than Alienware ever came up with - twisted blocks of cast aluminium converging at the base, with an open-air E-ATX motherboard tray inside, and mounts for an ATX PSU, and two each of 3.5-inch and 2.5-inch drives.

The Z-Frame can take in E-ATX (or smaller) motherboards, graphics cards up to 34 cm in length, and CPU coolers up to 17 cm in height, and has 8 expansion slots. Like all "Frame" cases from In Win, the Z-Frame is open-air, and doesn't have too many fan mounts, but you get room for three 120 mm along the top panel, letting you mount a 360 mm x 120 mm radiator. Front-panel connectivity includes type-C USB 3.1, in addition to type-A USB 3.0, and HDA jacks. The Z-Frame comes in two color options, chrome-silver, and glossy black, both of which are made of the highest density cast aluminium. The case weighs a staggering 40 kg, not counting what you install inside it. In Win will do a limited production run for this case, and it could be yours for a little over USD $10,000.

Phanteks unveiled its next flagship chassis, the Evolv X. This dual-system chassis can simultaneously house an E-ATX motherboard, and a mini-ITX motherboard, and is ideally paired with the company's own Revolt X dual-system PSU. It retains the signature design of Phanteks' Enthoo Evolv series, but is darker, has a more premium sandblasted 3 mm-thick aluminium paneling, and a silicone RGB LED diffuser surrounding the front fascia, with addressable RGB LEDs. Storage options include either ten 3.5-inch drives over detachable drive-cages, and up to nine 2.5-inch drives mounted behind the motherboard tray.

Cooling options of the Phanteks Evolv X include three 140 mm front intakes, three 140 mm top exhausts, and a 140 mm rear exhaust. You can mount 420 mm x 140 mm radiators on the front, and 280/360 mm x 140/120 mm radiators along the top. Front panel connectivity includes a USB 3.1 type-C port, two USB 3.1 type-A, HDA jacks, and RGB LED control. The case is halfway between mid-tower and full-tower in terms of dimensions. The case is slated for release this August, priced at USD $199, or 199€.

At Computex, PNY unveiled its Elite-X series portable SSDs. Built with an aluminium body, the drive comes in capacities of 240 GB, 480 GB, and 960 GB, and takes advantage of 10 Gbps USB 3.1 gen 2, with a single type-C cable handling both power and host connectivity. The drive uses that bandwidth to offer sequential transfer rates of up to 800 MB/s reads, with up to 660 MB/s writes, that's faster than any SATA SSD. Pricing of the drive will be revealed closer to its July 2018 launch.

QNAP Systems, Inc. today released the new TS-832X 8-bay quad-core NAS with two built-in 10GbE SFP ports, providing users with a budget-friendly, high-speed network storage solution. It is also an ARM-based NAS that supports Qtier technology for auto-tiering, and its PCIe slots allow for the installation of peripheral cards like 10GbE NICs, QM2 cards, USB 3.1 10Gbps expansion cards, or wireless network cards to enhance the NAS with greater application potential.

"The TS-832X is a step up from the TS-831X, featuring an advanced 64-bit Cortex -A57 processor and DDR4 memory while also delivering computing power of 32K DMIPS to benefit performance upgrade by 40%," said Dan Lin, Product Manager of QNAP, continuing "Coupled with the 10GbE connectivity and PCIe expandability, it provides a highly cost-efficient private cloud NAS solution."