MSI is announcing today the brand-new 13th Gen Intel Core Processors will bring along a whole new series of Z790 chipset motherboards, which include the MEG Series, MPG Series, MAG Series, and PRO Series as well. MSI's Z790 motherboards paired with 13th Gen Intel Core Processors are here to bring more efficient computing and fine-tuning on the success of the last generation of CPUs. As a world-leading motherboard brand MSI's Z790 motherboards are designed to provide the very best performance for gamers, creators, and users.

13th Gen Intel Core Processors are still built on their "Intel 7" Hybrid Architecture Process Technology. This generation has increased the number of efficiency cores by bringing up to 24 Cores, 32 Threads on a single CPU. L3 Cache has also been slightly bumped up to 36 MB, but more importantly, the memory frequency will support from DDR5-5600-MHz out of the box. On launch, there will be 3 models available which are the i9-13900K, i7-13700K, and the i5-13600K.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of their latest AMD X670 motherboards, including two segments of X670E and X670 chipsets which showcase an abundance of notable features. High-end X670E models natively support PCIe 5.0 graphics cards with enhanced slot design, while mainstream X670 models adopt PCIe 4.0 graphics card slot design. The lineup supports PCIe 5.0 M.2 slots with PCIe and M.2 EZ-Latch design, which makes it easier for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, the features of 18+2+2 direct power, 105 Amps Smart Power Stage, and 8 layer PCB provide higher stability, optimal compatibility, and performance for coming AMD Ryzen 7000 Series processors. With the advanced thermal design, VRM temperature is reduced. This stabilizes the power and performance of the PCIe x16 slot and M.2 SSD, avoiding thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, the lineup takes advantage of Active OC Tuner technology and all-new GCC (GIGABYTE Control Center) software to align with GIGABYTE's new PCIe 5.0 M.2 SSD and EXPO/ XMP dual mode DDR, delivering extreme performance with more user- friendly experience.

"The new GIGABYTE X670 motherboard lineup offers exclusive features and new designs, enhancing the excellent performance and multifunctioning capabilities for AMD Ryzen 7000 Series processors," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "The AM5 platform is well-supported to bring the best-in-class experience that AMD users have come to expect."

ZOTAC launched the ZBOX edge CI342, a compact fanless mini-PC powered by an Intel Pentium N6415 "Elkhart Lake" quad-core processor clocked at speeds of up to 3.00 GHz. The ZBOX measures just 147.2 mm x 147.2 mm x 32.1 mm (WxDxH), with a passive cooling solution for the SoC that has a TDP of just 6.5 W. It offers an impressive set of connectivity options, which include DisplayPort 1.2 and HDMI 2.0b making up the display outputs; three 5 Gbps USB 3.1 ports that include a type-C, a microSD card reader, two 1 GbE wired LAN interfaces, and Wi-Fi 6E + Bluetooth 5.2 WLAN. It's still being sold as a "barebones," meaning that you add your own RAM and storage. Memory options include two DDR4 SODIMM slots (dual-channel), and the only storage interface is an M.2-2280 slot with PCI-Express 3.0 x2 wiring. ZOTAC is also offering a non-barebones complete prebuilt with Windows 11, which includes one 4 GB DDR4-3200 SODIMM stick, and a 128 GB NVMe SSD.

Leading global motherboard manufacturer, ASRock, is proud to announce its X670E motherboard series, ready for new AMD Ryzen 7000 Series processors. This first wave of AMD Socket AM5 motherboards includes Special Edition X670E Taichi Carrara, flagship X670E Taichi, high-end X670E Steel Legend, mainstream X670E PRO RS, and entry X670E PG Lightning.

"With the AM5 platform we're investing in the next generation of high-performance computing and gaming," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "With the continued support of best-in-class partners like ASRock, AMD is bringing the most advanced features and technologies to desktop. The X670 Extreme is designed to bring the best connectivity and ultimate overclocking with PCIe 5.0 support."

Today, Intel announced the Intel NUC 12 Enthusiast Mini PC and Kit (code-named Serpent Canyon). Designed for gamers and content creators, the compact mini-PC is built to include Intel Arc graphics in the smallest form factor. The NUC 12 Enthusiast features the latest 12th Gen Intel Core processors and is the first Intel NUC to include Intel Arc A-series graphics in the form of the Intel Arc A770M graphics processing unit (GPU).

"The Intel NUC 12 Enthusiast Kit is one of the most exciting NUC's to launch because it's the first to pair an Intel processor with discrete Intel graphics. The system provides a strong combination of high performance in content creation and gaming usages, and wide array of I/O - typically found in larger systems - all in a small form-factor design. More importantly, this NUC features helpful technologies like Intel Thread Director and Intel Deep Link that make it perfect for anyone trying to create and game in the convenience of a truly compact design," said Brian McCarson, Intel vice president and general manager of the NUC Group.

Comcast today announced it has begun a nationwide rollout of multi-gig Internet speeds - that will reach more than 50 million homes and businesses before the end of 2025 - making it the largest- and fastest-ever multi-gig deployment in the United States. New speeds will be paired with Comcast's multi-gig Wi-Fi experience, which delivers the industry's best combination of speed, coverage, and control, powered by one of the world's first Wi-Fi 6E Gateways.

As part of this initiative, Comcast is accelerating the transformation of its network to a virtualized cloud-based architecture that is fully prepared for 10G and DOCSIS 4.0. Comcast will begin offering 10G-enabled multi-gig symmetrical services in 2023.

Qualcomm Technologies, Inc. announces Snapdragon 6 Gen 1 and Snapdragon 4 Gen 1 Mobile Platforms, providing advanced technology solutions to address the mid-tier and mass-volume segment. The Snapdragon 6 Gen 1 provides illuminating capture, hard-hitting game play, and intuitive AI assistance. It extends users' reach with expansive connectivity and sustained, efficient power and performance across the board. The latest 4-series platform, Snapdragon 4 Gen 1, offers impressive performance and AI to make interactions seamless and intuitive. Plus, this platform provides advanced photography features to enable striking capture, as well as improved connectivity so users can share endlessly.

"Both Snapdragon 6 and Snapdragon 4 provide upgrades in their respective series to enable advancements in capture, connectivity, entertainment, and AI. These new mobile platforms help our customers to deliver advanced solutions for consumers," said Deepu John, senior director, product management, Qualcomm Technologies, Inc.

TP-Link, a leading global provider of consumer and business networking products, today announced the all new Deco XE75 Pro AXE5400 Tri-Band Mesh Wi-Fi 6E System, featuring robust Wi-Fi 6E features, tri-band structure and multi-gig connections, bringing warp speeds without congestion for more WiFi devices. At an unbeatable $399.99 for a 2-pack set, the Deco XE75 Pro brings customers true Gigabit + WiFi performance and a whole home seamless roaming WiFi experience, making it the clear choice for those looking for a premium WiFi solution.

Powered by next-gen Wi-Fi 6E and tri-band technology, the Deco XE75 Pro delivers up to 5400 Mbps combined WiFi speed with six streams to ensure a blazing fast network, ideal for 8K streaming, virtual reality gaming and more. The powerful 6 GHz band delivers a dedicated and stronger backhaul to fully utilize the benefits of Wi-Fi 6E as default. Additionally, it can manually set open to connect a Wi-Fi 6E device for maximum speed.

Acer unveiled today the new Acer Chromebook Vero 514 - the first Chromebook in its line of eco-conscious Vero devices that reflects the company's commitment to sustainability by offering consumers and commercial customers more options that allow them to reduce their ecological footprint. The new Acer Chromebook Vero 514 (CBV514-1H/T) features a thoughtful design that takes the entire product lifespan into consideration, since it is easy to upgrade, repair, disassemble and recycle. It also uses recycled materials in most areas of the product including 30% post-consumer recycled (PCR) plastic in the chassis and 50% PCR plastic in the keycaps, 100% ocean-bound plastics on the touchpad surface and 90% recycled paper packaging.

"The simplicity, security and speed of Chromebooks are the ideal complements to our Vero line's focus on delivering powerful devices that keep an eye on the environment," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "The new Acer Chromebook Vero 514 is the next step in embodying our Earthion mission by developing eco-friendlier products that have a positive ecological impact on our customers' businesses, homes and schools."

Intel late-Tuesday (16/08) announced the NUC 12 Pro "Wall Street Canyon" line of compact desktops as enclosed prebuilt mini PCs, and bare motherboards. These are based on the 12th Gen Core "Alder Lake-P" (2P+8E) mobile processors paired typically with up to 16 GB of dual-channel DDR4 memory, up to 512 GB of M.2 NVMe Gen 4 SSD storage, an additional Gen 4 M.2 slot, and come with preinstalled Windows 11. Certain variants feature a slightly larger chassis with room for a 2.5-inch SATA 6 Gbps drive. Select SKUs come with Thunderbolt 4 ports, 20 Gbps USB 3.2x2 ports, 2.5 GbE, and Wi-Fi 6E networking. and certain SKUs even offer vPro management features for commercial environments.A video-presentation by SimplyNUC follows.

A possible PCB layout diagram of the ASUS ROG Crosshair X670E APEX motherboard was leaked to the web. We could tell it's the APEX, looking at its 1DPC (one DIMM per channel) memory layout. The ROG APEX line of motherboards are geared toward extreme overclocking, with 1DPC being the best possible memory topology. We could make out several features from this diagram. The board draws power from a combination of 24-pin ATX, two 8-pin EPS, and a 6-pin PCIe. A mammoth 26-phase VRM powers the CPU. The board appears to have its power connectors and onboard buttons angled sideways, making it most suitable for bench rigs.

The AMD Socket AM5 is wired to two DDR5 DIMM slots (one DIMM per channel, with two sub-channels, each); and a PCI-Express 5.0 x16 slot. This splits to a second slot in x8 mode. The third slot is electrical x8, and wired to the X670E chipset. While there are three M.2 slots onboard, this is likely Gen 4 x4. The board's main Gen 5 M.2 slots are located on an included DIMM.2 daughterboard that inserts into a proprietary slot next to the DIMM slots. It's likely that the board offers USB4 connectivity, besides SupremeFX HD audio, Wi-Fi 6E, 2.5 GbE, and an abundance of USB 3.x connectivity in various forms.

EnGenius Technologies Inc., a worldwide manufacturer of future-proof enterprise networking solutions, today announced that their very first Wi-Fi 6E access point designed for the SMB market is shipping now—despite persistent supply chain shortages affecting industries worldwide. Powered by Qualcomm, the EnGenius Cloud ECW336 Wi-Fi 6E indoor ceiling mount tri-band access point has been developed for use in the recently unleashed 6 GHz spectrum. The ECW336 AP marks the company's first venture into 6E territory.

Experts predict that as many as 500 million Wi-Fi 6E compatible devices will spill onto the market in the next two years, enjoying massive, pristine Wi-Fi real estate. While the 2.4 and 5 GHz bands offer a total of 560 MHz of spectrum and 27 channels, 6 GHz alone offers 1200 MHz of spectrum and 59 channels. With its 6E capability, the ECW336 AP easily supports the ever-growing bandwidth demands of densely congested environments such as corporate workspaces, multi-family units, senior living, student housing, retail, medical centers, and resorts. Business professionals and consumers alike will experience much faster connection speeds without the lag, buffering, and endless download delays experienced within the saturated 2.4 and 5 GHz bands. The future of lightning fast, unimpeded Wi-Fi is finally here.

Durabook, the global rugged mobile solutions brand owned by Twinhead International Corporation, today announced significant updates to its R11 fully rugged tablet, achieving a world-first with its 11.6" fully rugged tablet featuring the latest 12th Gen Intel processor and architectural innovations to elevate the user experience.

"Durabook designs devices to meet the demanding needs of field service workers who rely on rugged technology to streamline workflows and improve productivity in even the harshest environments," said Twinhead CEO Fred Kao. "The updated R11 employs the latest technology to meet the ever-changing needs of workforces operating in some of the most demanding sectors, including warehouse, field service, law enforcement, and logistics."

As devices and gaming consoles are increasingly connected to home networks, consumers desire to improve the quality and performance of their Wi-Fi network and they can do that by upgrading their network to Wi-Fi 6E. A global leader in home networking solutions, CommScope is entering the retail Wi-Fi 6E market by offering two new ARRIS SURFboard solutions. These enable customers to upgrade their network quickly and easily without replacing any of their existing equipment.

"Augmented reality, virtual reality, and gaming consoles are establishing baselines of latency and jitter performance that are driving consumers to upgrade their home networks and improve their overall connectivity performance," stated Evan Groat, Senior Vice President, Smart Home Solutions and Retail Products, CommScope. "One way to accomplish this is by upgrading to Wi-Fi 6E technology which is exactly what these two new ARRIS SURFboard solutions achieve. Each allows consumers to connect more devices to their home network simultaneously with consistent speed and reliability, while also improving their gaming and streaming performance," Groat continued.

ASRock has recently released two new products to upgrade the network connectivity on compatible AMD & Intel motherboards with the latest Wi-FI 6E and Bluetooth 5.2 standards. The AMD upgrade kit includes a M.2 2230 PCIe module most likely featuring the MediaTek MT7921K chipset which debuted in the AYANEO handheld last year. The Intel version also includes a M.2 2230 module but featuring the CNVIo2 interface with either a AX211 or AX411 chipset limiting support to ASRock 600-Series motherboards.

These modules both support Dual Band 2x2 Wi-Fi 6E and Bluetooth 5.2 connectivity with the AMD version certified for AM4 motherboards going back to the ASRock A320TM-ITX. The upgrade kits each feature a set of two antennas and extension cables along with a plastic cover and mounting screw for the modules. The listings don't contain any pricing information and retailers haven't listed either kit for purchase yet.

MediaTek today announced the Dimensity 9000+, an enhancement to the company's top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient.

The new Dimensity 9000+ system-on-chip (SoC) integrates Arm's v9 CPU architecture with a 4 nm octa-core process, combining one ultra-Cortex-X2 core operating at up to 3.20 GHz (compared to 3.05 GHz with the Dimensity 9000) with three super Cortex-A710 cores and four efficiency Cortex-A510 cores. The advanced CPU architecture and Arm Mali-G710 MC10 graphics processor built into the new chipset provide more than a 5% boost in CPU performance and more than 10% improvement in GPU performance.

One of the biggest dividends of the Arc discrete graphics lineup for Intel is getting to use its own GPUs in its NUC desktops. The next-generation NUC 12 "Serpent Canyon" desktop sees the 11th Gen Core "Tiger Lake" quad-core + RTX 2060 "Turing" combination replaced by advanced 12th Gen Core "Alder Lake" 6P+8E processor, and the Arc "Alchemist" A770M discrete GPU. Intel's choice of mobile versions of "Alchemist" and "Alder Lake" may have to do with not just lower TDP, but possibly also an implementation of the Intel Deep Link feature.

The A770M maxes out the 6 nm ACM-G11 silicon, packing 32 Xe Cores (512 execution units, or 4,096 unified shaders), and has 16 GB of 256-bit GDDR6 memory. When paired with the 14-core "Alder Lake-H" processor, the duo could make for a formidable performance-gaming and creator machine. "Serpent Canyon" also sees the integration of Thunderbolt 4, SDXC UHS-II, Wi-Fi 6E, and 2.5 GbE interfaces, along with a number of USB 3.2 ports. Although its marketing images are leaked to the web on Chinese social media, there's no release date for the thing yet, but it could be just around the corner.

Getac Technology Corporation, a leading producer of rugged technology today announced the launch of its X600 and X600 Pro, two powerful new 15.6" fully rugged mobile workstation variants designed to deliver comprehensive mobile C3 planning for professionals requiring optimal performance, security and data transmission capabilities and exceptional reliability across a wide range of operationally challenging environments.

The X600 is designed to enable users to achieve mission-critical tasks quickly and efficiently. Running the latest Windows 11 Pro operating system (OS) and featuring an Intel Core 11th gen i5/i7/i9 H-Series (High Performance Optimized for Mobile) processor with integrated Intel UHD Graphics, delivering exceptional performance in a diverse range of data and or graphically-intensive operational scenarios, such as C3 for defense, railway track inspection and oil & gas sensor analysis even in harsh environments. Offering 16 GB DDR4 RAM memory as standard (with up to 128 GB optional) ensures lightning-fast processing speeds, while an optional NVIDIA Quadro RTX 3000 discrete graphics controller can elevate the graphical performance to even higher standards if required.

NZXT, a leading designer of computer hardware, software, and services for the PC gaming community, today announces the release of the NZXT N7 & N5 Z690 motherboard, their latest Intel-based ATX motherboard with both the features and aesthetic that builders love.

The NZXT N7 Z690 improves on the experience builders have come to expect from NZXT. With Intel's newest chipset, support for Intel's 12th generation Alder Lake CPUs, PCIe Gen 5.0, and Wi-Fi 6e and Bluetooth V5.2, giving it all the features that make up a powerful gaming PC. The new N5 brings all features of the N7 but without the metal cover to give users all the features, but at a lower price. Giving people more options so that they can build a gaming PC to fit their needs.

AMD today unveiled its next-generation Ryzen 7000 desktop processors, based on the Socket AM5 desktop platform. The new Ryzen 7000 series processors introduce the new "Zen 4" microarchitecture, with the company claiming a 15% single-threaded uplift over "Zen 3" (16-core/32-thread Zen 4 processor prototype compared to a Ryzen 9 5950X). Other key specs about the architecture put out by AMD include a doubling in per-core L2 cache to 1 MB, up from 512 KB on all older versions of "Zen." The Ryzen 7000 desktop CPUs will boost to frequencies above 5.5 GHz. Based on the way AMD has worded their claims, it seems that the "+15%" number includes IPC gains, plus gains from higher clocks, plus what the DDR4 to DDR5 transition achieves. With Zen 4, AMD is introducing a new instruction set for AI compute acceleration. The transition to the LGA1718 Socket AM5 allows AMD to use next-generation I/O, including DDR5 memory, and PCI-Express Gen 5, both for the graphics card, and the M.2 NVMe slot attached to the CPU socket.

Much like Ryzen 3000 "Matisse," and Ryzen 5000 "Vermeer," the Ryzen 7000 "Raphael" desktop processor is a multi-chip module with up to two "Zen 4" CCDs (CPU core dies), and one I/O controller die. The CCDs are built on the 5 nm silicon fabrication process, while the I/O die is built on the 6 nm process, a significant upgrade from previous-generation I/O dies that were built on 12 nm. The leap to 5 nm for the CCD enables AMD to cram up to 16 "Zen 4" cores per socket, all of which are "performance" cores. The "Zen 4" CPU core is larger, on account of more number-crunching machinery to achieve the IPC increase and new instruction-sets, as well as the larger per-core L2 cache. The cIOD packs a pleasant surprise—an iGPU based on the RDNA2 graphics architecture! Now most Ryzen 7000 processors will pack integrated graphics, just like Intel Core desktop processors.

As Computex 2022 is largely an online event, MSI announced its upcoming AMD X670 and X670E boards shortly after AMD's keynote earlier today. Although the official press release didn't go into too many details, VideoCardz got their hands on more detailed information from MSI, which also brings some additional clarity to the platform as a whole. The most interesting slide is the one that lists the AM5 CPU's as having 28 PCIe 5.0 lanes, rather than the 24 PCIe lanes AMD mentioned in its presentation. This makes sense based on the fact that some X670/E boards have multiple PCIe 5.0 M.2 slots for NVMe drives. MSI's X670E Godlike and X670E Ace even feature three PCIe 5.0 x16 slots, although it's likely that this is in a x8/x8/x4 configuration, as these boards only have a single PCIe 5.0 M.2 slot. The same slide also mentions that all Raphael based CPUs will have support for HDMI 2.1 as well as DisplayPort 2.0, which will also work over USB Type-C Alt Mode. Interestingly it seems like not all AM5 CPUs will support DisplayPort 2.0, based on a footnote from MSI.

Other interesting titbits include a minimum CMOS chip size of 32 MB, which hopefully means we won't be seeing a repeat of the issue that the AM4 platform had, where AMD ran out of space for the AGESA, which led to multiple UEFI versions depending on the CPU used with the board. As far as MSI specific features goes, at least the high-end models will be getting eight to 10 layer PCBs and MSI will offer up to 24+2 power phases with improved heatsinks. MSI is also promising 60 W USB PD support for the front USB-C header. Just like ASUS, MSI will also offer an add-in card for more M.2 NVMe drives and MSI calls it the Xpander-Z Gen5 Dual. A common feature among all four boards is that they'll feature AMD's RZ616 WiFi 6E module, which is technically a MediaTek solution.

MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6 GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas. The Dimensity 1050 combines mmWave 5G and sub-6 GHz to fluidly migrate between network bands, and is built on the ultra-efficient TSMC 6 nm production process with an octa-core CPU. Supporting 3CC carrier aggregation on sub-6 (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum, the Dimensity 1050 will be capable of delivering up to 53 percent faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone. The SoC integrates two premium Arm Cortex-A78 CPUs with speeds reaching 2.5 GHz and the latest Arm Mali-G610 graphics engine.

"The Dimensity 1050, and its combination of sub-6 GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity and superior power efficiency to meet everyday user demands," said CH Chen, Deputy General Manager of Wireless Communications Business Unit at MediaTek. "With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makes to differentiate their smartphone product lines." In addition to 5G optimizations, the Dimensity 1050 offers Wi-Fi optimizations alongside MediaTek's HyperEngine 5.0 gaming technology to ensure lower-latency connections with the new tri-band - 2.4 GHz, 5 GHz and 6 GHz - that extends game time and performance. Additionally, high-end UFS 3.1 storage and LPDDR5 memory ensure ultra-fast data streams to accelerate apps, social feeds and faster FPS in games.

AMD and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, today announced a collaboration to optimize the Qualcomm FastConnect connectivity system for AMD Ryzen processor-based computing platforms, starting with AMD Ryzen PRO 6000 Series processors and the Qualcomm FastConnect 6900. With the FastConnect 6900 system, the latest AMD Ryzen processor-powered business laptops feature Wi-Fi 6 and 6E connectivity, including advanced wireless capabilities enabled with Windows 11.

In collaboration with Microsoft, next-generation Windows 11 PCs, such as the Lenovo ThinkPad Z Series and HP EliteBook 805 Series, can harness the full potential of Windows 11 Wi-Fi Dual Station through Qualcomm 4-Stream Dual Band Simultaneous. Multiple Wi-Fi bands outperform traditional single band connections for improved video conferencing experiences, reduced latency, and enhanced connection robustness. Leveraging the 6 GHz band, next-gen laptop users can take full advantage of its bandwidth and speed improvements without competing with any non-6E devices.

MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products. MediaTek Genio is a complete platform stack for the AIoT with powerful and ultra- efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools. This all-in-one platform makes it easy for brands to develop innovative consumer, enterprise and industrial smart applications at the premium, mid-range and entry levels, and bring these devices to market faster. With MediaTek Genio, customers have access to all the hardware, software and resources needed to go from concept to design and manufacturing.

Customers can choose from a range of Genio chips to suit their product needs, and then use MediaTek's developer resources and the Yocto Linux open platform SDK to customize their designs. MediaTek also makes it easy for customers to access its partners' system hardware and software, and leverage partners' networks and sales channels. By offering an integrated, easy-to-use platform, MediaTek Genio reduces development costs and speeds up time to market, while providing long-term support for operating system updates and security patches that extend the product lifecycle. "Today MediaTek powers the most popular AIoT devices on the market. As the industry enters the next era of innovation, MediaTek's Genio platform delivers flexibility, scalability and development support brands need to cater to the latest market demands," said Jerry Yu, MediaTek Corporate Senior Vice President and General Manager of MediaTek's Computing, Connectivity and Metaverse Business Group. "We look forward to seeing the new user experiences brands bring to life with the Genio 1200 and its powerful AI capability, support for 4K displays and advanced imaging features."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the Z690I AORUS ULTRA PLUS gaming motherboard with Double Connect Technology (DCT) which continues the highlights of Z690I AORUS ULTRA, and adds PCB to 12 layers for optimized heat dissipation. These two models are launched in two SKUs of DDR4 and DDR5, and amazes users with full features of 10+1+2 phases digital power VRM design which each phase holding up to 105 amps by its Smart Power Stage design, improved thermal design, Intel Killer Wi-Fi AX1690 Wi-Fi 6E, 2.5 Gbit Ethernet, and high quality audio. Meanwhile, GIGABYTE also provide users an economic option of Z690I AORUS ULTRA LITE with PCIe 3.0 and Wi-Fi 6 supported.

Z690I AORUS ULTRA PLUS builds in Intel Killer Wi-Fi AX1690 Wi-Fi 6E controller with DCT (Double Connect technology ), which supports multiple Wi-Fi radios and set division task for gaming and others. Instead of spectrum congestion due to single connection, 2.4 GHz &5/6 GHz Wi-Fi bands can be connected simultaneously, which the faster 6 GHz band is prioritized for gaming while using the 2.4 GHz band for other task. It also detects and prioritizes gaming traffic to drive down on-line gaming latency, as well as provides smoother gaming and VR experience. In comparison to the 802.11ac 1x1 network, Wi-Fi 6E DC delivers 7 times high-speed throughput. Along with 2.5 Gb Ethernet, Z690I AORUS ULTRA PLUS provides the most complete and flexible network options.