HP today announced the first professional monitors of the new Z Display family as well as new entry-level Z Workstations that offer reliable and flexible workstation performance at PC-like prices. HP is continuing to drive innovation across an evolving workplace with the introduction of the HP Z22i, Z23i and Z24i IPS Displays. Offering outstanding image accuracy and mission-critical reliability, the HP Z Displays are optimized for use with HP Z Workstations. HP Z Displays are ideal for engineers, architects, designers and photographers who require image accuracy at an affordable price.

Building upon HP's award-winning Z series of workstations, the new HP Z230 Workstation, available in a tower or small form factor (SFF), is built for demanding application workloads. The HP Z230 is a great choice for knowledge workers and specialists, design engineers and creative designers who require rock-solid reliability at an affordable price. Designers using applications like Autodesk AutoCAD and photographers using Adobe Photoshop will benefit from the new functionality of the HP Z230.
"Our customers want products that are designed and engineered to meet the most demanding computing and visualization needs, and HP's Z moniker has become synonymous with meeting that challenge," said Jeff Wood, vice president, Worldwide Product Management, Commercial Solutions Business Unit, HP. "The new HP Z230 Workstations and Z Displays meet these workload demands at an affordable price, and demonstrate HP's leadership in providing solutions for professional solutions at all levels."

As the massive growth of information technology services places increasing demand on the datacenter, Intel Corporation today outlined its strategy to re-architect the underlying infrastructure, allowing companies and end-users to benefit from an increasingly services-oriented, mobile world. The company also announced additional details about its next-generation Intel Atom processor C2000 product family (codenamed "Avoton" and "Rangeley"), as well as outlined its roadmap of next-generation 14nm products for 2014 and beyond. This robust pipeline of current and future products and technologies will allow Intel to expand into new segments of the datacenter that look to transition from proprietary designs to more open, standards-based compute models.

"Datacenters are entering a new era of rapid service delivery," said Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel. "Across network, storage and servers we continue to see significant opportunities for growth. In many cases, it requires a new approach to deliver the scale and efficiency required, and today we are unveiling the near and long-term actions to enable this transformation."

WD, a Western Digital company and world leader in digital storage solutions, today unveiled the fourth generation of WD Arkeia network backup appliances, delivering an all-in-one backup and disaster recovery solution for small- and medium-sized businesses (SMBs). The new line up consists of four rack-mount appliance models with larger internal disk capacities, faster processors, increased memory, and integrated solid state drives (SSDs) to shorten backup time and accelerate data recovery. The bundled WD Arkeia v10.1 software delivers new support for "seed and feed" technology to support hybrid cloud backups. This allows companies to move backups offsite via network replication rather than shipment of tapes.

"In announcing their fourth generation of purpose-built network backup appliances, WD Arkeia is delivering comprehensive SMB backup solutions that go beyond simple raw capacity increases," said Liz Conner, senior research analyst, IDC. "WD Arkeia offers easy-to-use data protection that takes the guess work out of purchasing, configuring and managing data backup & recovery, while also embedding features such as deduplication and hybrid cloud backup for small- and medium-sized businesses or remote offices."

A system built with thousands of Intel processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers. The system, known as "Milky Way 2," includes 48,000 Intel Xeon Phi coprocessors and 32,000 Intel Xeon processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

First sighted in January, ASUS' P9X79-E WS socket LGA2011 motherboard is ready to take on the new breed of Core "Ivy Bridge-E" and Xeon "Ivy Bridge-EP" lines of processors, even if initial versions of its BIOS don't advertise that support. Based on Intel X79 Express chipset, the board is built in the 305 x 267 mm SSI-CEB form-factor. The LGA2011 socket is powered by a 10-phase VRM, with 2+2 phase memory VRM. The CPU socket is wired to eight DDR3 DIMM slots, four on its either sides, supporting up to 64 GB of quad-channel DDR3-2133 MHz memory. The board features a total of seven PCI-Express x16 slots. 4-way NVIDIA SLI and AMD CrossFireX are supported.

Storage connectivity on the P9X79-E WS includes two SATA 6 Gb/s ports from the X79 PCH, four SATA 6 Gb/s from a Marvell-made 4-port SATA 6 Gb/s AHCI/RAID controller, four SATA 3 Gb/s from the PCH, and an additional two eSATA 6 Gb/s from an ASMedia-made controller. There are just four USB 3.0 ports on offer, all ASMedia-made controllers. Other connectivity includes two gigabit Ethernet interfaces, both driven by Intel-made controllers, 8-channel HD audio, legacy connectivity such as PS/2 and RS232 COM (header), and a pinch of overclocker-friendly features in the BIOS and on-board. The P9X79-E WS from ASUS is priced at US $499.99.

AsRock, the renowned motherboard manufacturer, earlier today updated the CPU Support List for its LGA 2011 platform products with Intel's next generation Xeon E5 processors, using Ivy Bridge-EP silicon and scheduled for launch in Q3 this year. Along with the part number list, specifications such as clock frequency, cache size and TDP value were made public as well. Information from which we can deduce that the new chips will come in three core count versions, specifically 8 core, 10 core and 12 core parts. TDP ranges from 70 W for the E5-2650L v2, a 10 core chip running at 1.7 Ghz, to 150 W for the E5-2687W v2, also a 10 core chip but running at 3.4 Ghz.

Today Intel introduced the new Intel Xeon processor E3-1200 v3 product family based on Haswell microarchitecture and the company's 22nm manufacturing process. When deployed in cloud data center environments, the new Intel Xeon processors will help reduce costs and increase media processing capabilities for cloud-based media service providers to better support customers wanting to upload and share videos with friends across different mobile devices. In addition to a better offering for cloud media workloads than discrete graphic-based servers, new Intel Xeon processors offer exceptional energy efficiency and lowest TDP ever at 13 Watts for highly dense environments like microservers. Get the Intel Xeon processor E3-1200 v3 product family fact sheet.

GIGABYTE Technology introduces today, in coordination with Intel's official launch, two initial models of single socket server/workstation motherboards designed for the brand new Intel Xeon processor E3-1200 V3 product family (former codename Haswell). Suitable for both rack and desktop tower integration, GIGABYTE introduces here ultra-flexible products featuring the latest technologies and built to deliver all the benefits and new features of this new CPU line in many professional application scenarios.

Still based on the 22 nm tri-gate lithography, this new generation of Xeon processors is built on Intel's latest microarchitecture and brings up to 15% computing power improvement and increased L3 cache across the line. In addition, this new generation also brings to the Xeon E3 family the support of 1600MHz ECC memory, Intel Trusted Execution and Virtualization technologies, as well as AVX 2.0 and TSX instructions. Last but not least, the Xeon E3-1200 V3 processors will include the latest Intel integrated graphics, which will bring the support of OGL3.2+, DirectX 11.1, and higher frequencies over the previous generation.

Noctua today presented a new revision of its much acclaimed NH-U12DX and NH-U9DX quiet CPU coolers for Intel Xeon workstations and servers. The new i4 models support LGA2011 (both Square and Narrow ILM), LGA1356 and LGA1366 based Xeon platforms and now come with PWM fans for automatic speed control. Fitted with the professional SecuFirm2 mounting system and bundled with Noctua's industrial-grade NT-H1 thermal compound, the NH-U12DX i4 and NH-U9DX i4 form complete premium quality packages for quietly cooling Xeon based workstations and servers.

"Builders of quiet workstations and servers still have trouble finding quality cooling solutions for Intel's LGA2011 socket with Narrow ILM mounting", explains Mag. Roland Mossig (Noctua CEO), "so we've decided to update our DX line of coolers to work with both Square ILM and Narrow ILM based LGA2011 platforms. At the same time, we've added PWM control and switched the U12 version to the new, slimmer layout of the NH-U12S, which not only provides better performance but also ensures easier access to the RAM slots, which was another long time request from our industry partners."

Arctic announced the Alpine 20 Plus CO, a low-profile CPU cooler specifically designed for socket LGA2011. It could provide an inexpensive air-cooling option for Core i7 LGA2011 desktops, and Xeon LGA2011 workstations. The cooler is a fan-heatsink, with a dense aluminum heatsink being ventilated by a 92 mm PWM-controlled fan, which spins at speeds of 600-2,200 RPM. The cooler measures 99 mm x 95 mm x 80 mm (LxWxH), weighing about 440 g. Backed by a six-year warranty, the Alpine 20 Plus CO is priced at 14.50?.

Intel has announced the production release of the Intel SDK for Open CL Applications XE 2013 that launched as a beta program in December. The new SDK broadens options for developers on Intel architecture and includes tools, optimization guides and training.

The SDK helps OpenCL developers improve performance and efficiency on Intel Xeon Phi coprocessors and Intel Xeon processors as well as create highly parallel applications for high performance computing workstations, data analytics and other uses. Download the Intel SDK for OpenCL Applications XE 2013 here.

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont. The technology is aimed squarely at low-power requirements in market segments from smartphones to the data center. Silvermont will be the foundation for a range of innovative products beginning to come to market later this year, and will also be manufactured using the company's leading-edge, 22nm Tri-Gate SoC manufacturing process, which brings significant performance increases and improved energy efficiency.

"Silvermont is a leap forward and an entirely new technology foundation for the future that will address a broad range of products and market segments," said Dadi Perlmutter, Intel executive vice president and chief product officer. "Early sampling of our 22nm SoCs, including "Bay Trail" and "Avoton" is already garnering positive feedback from our customers. Going forward, we will accelerate future generations of this low-power microarchitecture on a yearly cadence."

Advantech, a global embedded platform manufacturer, today unveiled the new ASMB-822I server-grade motherboard powered by Intel Xeon processor E5-2600 family technology. This new technology comprises 64-bit multi-core processors, PCI Express Gen3 high speed communications, and DDR3 memory with total capacity up to 96GB. ASMB-822I is perfect designed for high performance demands such as NVR, DVR and also target to video wall, video conferencing, surveillance and other mission-critical applications.

"Advantech is committed to providing a full spectrum of embedded systems with advanced and intelligent built-in technology, from fanless and ruggedized to high-performance solutions," said Linda Tsai,Director of Advantech Embedded Systems Group. The ASMB-822I is an ATX server board equipped with LGA 2011 Intel Xeon processor E5-2600 series and Intel C602J series chipset. It supports six DDR3 registered DIMM slots for a 96 GB total capacity and dual GbE LANs using Intel controllers.

During her keynote at the Intel Developer Forum today in Beijing, Diane Bryant, senior vice president and general manager of Intel's Datacenter and Connected Systems Group, discussed how her company is helping users harness powerful new capabilities that will improve the lives of people by building smarter cities, healthier communities and thriving businesses.

Bryant unveiled details of upcoming technologies and products that show how Intel aims to transform the server, networking and storage capabilities of the datacenter. By addressing the full spectrum of workload demands and providing new levels of application optimized solutions for enterprise IT, technical computing and cloud service providers, unprecedented experiences can be delivered.

Definitely, 2013 starts with a big boom at Thecus. After the launch of the N12000PRO and N16000PRO, the announcement of the 64 bit ThecusOS 6.0, the unveiling of the N2520/N4520 and Intelligent NAS utility at CeBIT 2013, it's time for the NVR family to impress the world with 7 new devices with updated architecture to offer superior performances.

We here by present you in tower format the V2510, V4510, V5510 and V6810; and for the rackmount category, we have the new V4510U, V8810U and V16810U. All equipped with the VisoGuard security system management software developed in partnership with Netavis, these new NVR will offer better performances than ever for all type of users with needs of 2, 4, 5, 6, 8 or 16 bays of storage.

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, will present its cutting-edge GPU supporting platform during the NVIDIA GTC 2013. Ranging from 2U to 4U and compatible with1 to 8 GPUs. TYAN offers a full product portfolio to customers which are compatible with NVIDIA Tesla K Series GPU Accelerators. The TYAN S7055 and S7056 motherboard will be showcased as well as TYAN TA77-B7061 and FT48-B7055 barbones at TYAN's booth (#503) during the GTC 2013.

Targeting from mainstream applications to the most complicated high performance computing, TYAN develops a rich product portfolio of GPU based platforms. These products offer flexible and scalable performance as well as maximum efficiency in order to help customers deploying an ideal GPU cluster solutions. All the TYAN GPU platforms are under-validation with industry-leading companies' GPU products. The TYAN TA77-B7061, FT48-B7059 and FT77-B7059 GPU platforms passed the validation and are fully compatible with NVIDIA Tesla K Series GPU Accelerators. The bundled product portfolios of TYAN GPU platforms and NVIDIA Tesla K Series will be widely available in Q2.

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, launched the TYAN TA77-B7061, its latest and flexible 2U GPU supported platform; the S7042, entry-level dual socket motherboard; GT62A-B5512 and the GT20A-B7040, the cost-effective 1U server during the CeBIT. TYAN welcomes customers to visit the TYAN website for more detail product information during CeBIT or experience the latest products at ISS EMEA in Dublin, Ireland from April, 10-12.

TYAN TA77-B7061 is the ideal platform designed for users who are looking for accelerated data-processing and efficient computing performance. Supporting up to four GPUs in a 2U server chassis, it is a high performance option that also offers outstanding computing density, saving both time and server/rack space in conjunction with industry-leading companies' GPU products such as Intel Xeon Phi processors, NVIDIA Tesla K20 Series and ATI FirePro. The non-compromised TA77-B7061 will be displayed at TYAN booth at ISS EMEA (Intel Solution Summit) in Dublin, Ireland from April, 10-12. TYAN TA77-B7061 supports (2) Intel Xeon E5-2600 Series Processors, (8+8) DDR-III R/U/LR-DIMM, (4) PCI-E x16 G3 slots, (1) PCI-E x8 G3 slots, (2) GbE ports and (8) 2.5" HDDs. Customers could enjoy more flexible and upgradeable computing performance to tailor to their own computing environment with TYAN's TA77-B7061 server platform.

Apple's high-performance desktop Mac Pro will get its long overdue specifications overhaul this spring. The Mac Pro is being pulled off shelves in Europe due to lack of compliance with local regulations; but a French retailer believes the pull out is temporary, and that a new, rehashed Mac Pro will be reintroduced in Spring (March-April). The new Mac Pro pole-vaults Sandy Bridge-EP Xeon processor line to Intel's next-generation Xeon "Ivy Bridge-EP" dual-socket processors, SSDs being standard equipment, and the latest generation NVIDIA GeForce or AMD Radeon graphics cards. It's also quite likely that Apple to refresh its display lineup to support higher resolutions.

GIGABYTE is proud to announce two new models of workstation motherboards and one new model dedicated to mission critical server applications. All of them being based on the Intel Xeon processors E5-2600 product family, these new models are designed to answer demanding needs for computing resources across various usage models, form factors and scales. While these products have been naturally thought for scenarios requiring heavy computing power through GPUs or GPGPU / co-processors cards, from CAD/CAE to rendering, simulation and modeling, their most notable advantage relies in their unique memory performance capability. GIGABYTE motherboards support DDR3-1600 MHz speeds with 16 GB 1.35V RDIMMs.

Achieved through GIGABYTE's capabilities in design, PCB layout and BIOS fine-tuning, this feature will be most appreciated in the many workstation applications where improvements in memory frequency result in speeding up the user's productivity and in all the industries relying on server applications where each incremental improvement in memory performance results in significant benefits, such as in finance.

According to a new market research report, "Global Micro Servers Market (2013 - 2018), By Processor Type (Intel, Arm, Amd), Component (Hardware, Software, Operating System), Application (Media Storage, Data Centers, Analytics, Cloud Computing) & Geography (North America, Europe, Asia Pacific, Row)", published by MarketsandMarkets, the total market for next generation memory is expected to reach $26.55 billion by 2018 at an estimated CAGR of 62.3% from 2013 to 2018.

In a simpler terminology, micro servers can be termed as servers that multiple mobile processor chips, consume low power, use less space and are specifically used by small to medium - sized businesses. Micro servers find their major application in media storage and internet data centre especially for applications like lightweight web serving, simple content delivery nodes and low end dedicated hosting. It was identified that cloud computing and analytics are some other applications of micro servers which are growing rapidly. Micro servers presently account for 2.3% of the total server sales however looking at the current growth rate, in the next five years it is expected to reach 25 to 30% per cent of the global server market.

Intel Corporation announced a collaboration with Facebook to define the next generation of rack technologies used to power the world's largest data centers. As part of the collaboration, the companies also unveiled a mechanical prototype built by Quanta Computer* that includes Intel's new, innovative photonic rack architecture to show the total cost, design and reliability improvement potential of a disaggregated rack environment.

"Intel and Facebook are collaborating on a new disaggregated, rack-scale server architecture that enables independent upgrading of compute, network and storage subsystems that will define the future of mega-datacenter designs for the next decade," said Justin Rattner, Intel's chief technology officer during his keynote address at Open Computer Summit in Santa Clara, Calif. "The disaggregated rack architecture includes Intel's new photonic architecture, based on high-bandwidth, 100 Gbps Intel Silicon Photonics Technology, that enables fewer cables, increased bandwidth, farther reach and extreme power efficiency compared to today's copper based interconnects."

In an interview with DigiTimes, ASUS general manager of motherboard business Joe Hsieh commented on reports of Intel abandoning CPU sockets in favor of processors being hardwired to motherboards in BGA packages. Hsieh said that the issue will not be as bad as people think and Intel could find a strategy that allows both soldered and socketed processors to be sold, which is much like today, except that hardwired processors are limited to notebooks (Core i3 and i5 processors in the BGA1224 package) and low-end Atom-driven desktop motherboards.

What lends Hsieh's statement weight, apart from the fact that he leads the biggest PC motherboard design team, is that Intel recently denied those reports, saying it would provide socketed CPUs for "the foreseeable future." Last month, Japanese publication PC Watch, credited for generally accurate tech predictions based on information at hand, reported that following its 22 nm Core "Haswell" CPU family, Intel could transform its entry-, mainstream-, and performance-segment client CPUs to hardwired BGA packages, probably leaving socketed CPUs only to HEDT (high-end desktop) and enterprise Xeon processor lines. Other PC motherboard vendors DigiTimes spoke with echoed ASUS' opinion, they don't believe Intel could "suddenly" completely change the way processors are sold to consumers.

Intel Corporation introduced the Intel Atom processor S1200 product family today, delivering the world's first low-power, 64-bit server-class system-on-chip (SoC) for high-density microservers, as well as a new class of energy-efficient storage and networking systems. The energy-sipping, industrial-strength microprocessor features essential capabilities to achieve server-class reliability, manageability and cost effectiveness.

"The data center continues to evolve into unique segments and Intel continues to be a leader in these transitions," said Diane Bryant, vice president and general manager of the Datacenter and Connected Systems Group at Intel. "We recognized several years ago the need for a new breed of high-density, energy-efficient servers and other datacenter equipment. Today, we are delivering the industry's only 6-watt SoC that has key datacenter features, continuing our commitment to help lead these segments."

EUROCOM Panther 4.0 supercomputer laptop delivers unmatched 2D/3D capabilities for heavy duty 3D and 2D applications, like CAD (Computer-Aided Design), CAE (Computer-Aided Engineering), DCC (Digital Content Creation), visualization, and simulation. It is ideal for Engineering on the Go, Rapid Engineering Deployment Teams and for Server on the Go applications.

Marking a new era in high-performance computing, Intel Corporation introduced the Intel Xeon Phi coprocessor, a culmination of years of the research and collaboration, to bring unprecedented performance for innovative breakthroughs in manufacturing, life sciences, energy and other areas.

The ability to quickly compute, simulate and make more informed decisions has propelled the growth of high performance computing (HPC) and analytics. This has been driven by global business and research priorities to more accurately predict weather patterns, create more efficient energy resources, and develop cures for diseases among many other pressing issues. With the breakthrough performance per watt and other new attributes of Intel Xeon Phi coprocessor, the industry will have even greater reliability in generating accurate answers, help proliferate high-performance computing beyond laboratories and universities and achieve maximum productivity.