The Taiwanese Ministry of Economic Affairs (MOEA) managed to herd government representatives and leading Information and Communication Technology (ICT) industry figures together for an important meeting, according to DigiTimes Asia. The report suggests that the main topic of discussion focused on an anticipated growth of Taiwan's ICT industry—current market trends were analyzed, revealing that the nation absolutely dominates in the AI server segment. The MOEA has (allegedly) determined that Taiwan has shipped 90% of global AI server equipment—DigiTimes claims (based on insider info) that: "American brand vendors are expected to source their AI servers from Taiwanese partners." North American customers could be (presently) 100% reliant on supplies of Taiwanese-produced equipment—a scenario that potentially complicates ongoing international tensions.

The report posits that involved parties have formed plans to seize opportunities within an evergrowing global demand for AI hardware—a 90% market dominance is clearly not enough for some very ambitious industry bosses—although manufacturers will need to jump over several (rising) cost hurdles. Key components for AI servers are reported to be much higher than vanilla server parts—DigiTimes believes that AI processor/accelerator chips are priced close to ten times higher than general purpose server CPUs. Similar price hikes have reportedly affected AI adjacent component supply chains—notably cooling, power supplies and passive parts. Taiwanese manufacturers have spread operations around the world, but industry watchdogs (largely) believe that the best stuff gets produced on home ground—global expansions are underway, perhaps inching closer to better balanced supply conditions.

In developing the OPX1000, a controller fit for the ever-growing quantum processors counting 1,000 qubits and beyond, we had to think deeply about every detail that impairs scalability. Our recently unveiled OPX1000 module for microwave generation (MW-FEM) generates pulses up to 10.5 GHz directly, without analog oscillators or mixers. The choice of technology to reach microwave frequencies is not trivial. We choose cutting-edge direct digital synthesis (DDS) for very specific reasons, and we believe it will enable scalability and performance to an even greater degree. In this blog, we dive deeper into the considerations for going this route and existing alternatives. So stick around, whether you like mixers or hate them, this will be an interesting ride.

Summary of Technologies for Microwave Operation
The control signals for qubit drive and readout often fall in the microwave range, which is outside the range of baseband controllers. Many qubit labs have solved the issue with solutions based on mixing, including single sideband mixers, IQ-mixers, or more complicated schemes such as double super-heterodyne (DSH) conversion. Mixer-based solutions make use of analog local oscillators (LOs) that are multiplied by the signal of a controller or an AWG. IQ-mixers naturally suffer from two main spurs (affectionate name for unwanted signals), the LO leakage and the mixer image, which require non-trivial calibration to be removed. Other schemes, such as double super-heterodyne, offer a zero-calibration solution but use many more components. Additionally, mixing schemes require having an LO source per mixer if different drive frequencies are used. Having a low phase source per mixer is very expensive, and in order to cut prices, will probably include a phase-lock loops (PLL), leading to phase differences between channels, which is detrimental for multi-qubit systems. In other words, while mixers can be useful, we need to be aware of the pros and cons involved.

In Sept. 2023, Quantum Machines (QM) unveiled OPX1000, our most advanced quantum control system to date - and the industry's leading controller in terms of performance and channel density. OPX1000 is the third generation of QM's processor-based quantum controllers. It enhances its predecessor, OPX+, by expanding analog performance and multiplying channel density to support the control of over 1,000 qubits. However, QM's vision for quantum controllers extends far beyond.

OPX1000 is designed as a platform for orchestrating the control of large-scale QPUs (quantum processing units). It's equipped with 8 frontend modules (FEMs) slots, representing the cutting-edge modular architecture for quantum control. The first low-frequency (LF) module was introduced in September 2023, and today, we're happy to introduce the Microwave (MW) FEM, which delivers additional value to our rapidly expanding customer base.

Samsung, SK hynix, and Micron are considered to be the top manufacturing sources of High Bandwidth Memory (HBM)—the HBM3 and HBM3E standards are becoming increasingly in demand, due to a widespread deployment of GPUs and accelerators by generative AI companies. Taiwan's Commercial Times proposes that there is an ongoing shortage of HBM components—but this presents a growth opportunity for smaller manufacturers in the region. Naturally, the big name producers are expected to dive in head first with the development of next generation models. The aforementioned financial news article cites research conducted by the Gartner group—they predict that the HBM market will hit an all-time high of $4.976 billion (USD) by 2025.

This estimate is almost double that of projected revenues (just over $2 billion) generated by the HBM market in 2023—the explosive growth of generative AI applications has "boosted" demand for the most performant memory standards. The Commercial Times report states that SK Hynix is the current HBM3E leader, with Micron and Samsung trailing behind—industry experts believe that stragglers will need to "expand HBM production capacity" in order to stay competitive. SK Hynix has shacked up with NVIDIA—the GH200 Grace Hopper platform was unveiled last summer; outfitted with the South Korean firm's HBM3e parts. In a similar timeframe, Samsung was named as AMD's preferred supplier of HBM3 packages—as featured within the recently launched Instinct MI300X accelerator. NVIDIA's HBM3E deal with SK Hynix is believed to extend to the internal makeup of Blackwell GB100 data-center GPUs. The HBM4 memory standard is expected to be the next major battleground for the industry's hardest hitters.

TrendForce's latest analysis reveals that the downswing of DRAM contract prices, which had lasted for eight consecutive quarters since 4Q21, was finally reversed in 4Q23. Likewise, NAND Flash rebounded in 3Q23 after four quarters of decline. The persistence of this rally in memory prices during 2024 will largely hinge on suppliers' ongoing and effective control over their capacity utilization rates.

According to TrendForce Senior Research Vice President, Avril Wu, the first quarter of this year is already shaping up to be a season of growth, with TrendForce confirming its initial projections: a hike of around 13-18% QoQ for DRAM contract prices and a hike of 18-23% for NAND Flash contract prices. Despite a generally conservative outlook for overall market demand in 2Q24, suppliers in both DRAM and NAND Flash markets have begun raising their capacity utilization rates since the end of 4Q23. Furthermore, NAND Flash buyers are anticipated to complete their inventory restocking in advance in 1Q24. Due to the rise in capacity utilization rates and earlier restocking efforts, leading to a more moderated QoQ price increase of 3-8% for both DRAM and NAND Flash contract prices for 2Q24.

At the CES 2024 show, Thermaltake announced new additions to its cooling lineup—the TOUGHLIQUID EX Pro all-in-one liquid coolers and TOUGHFAN EX Pro high static pressure fans. The new releases incorporate Thermaltake's latest MagForce 2.0 magnetic quick-connect system for simplified installation and flexible component layouts. Available in a range of sizes spanning 240 mm to 420 mm radiator sizes, the TOUGHLIQUID EX Pro leverages large copper radiators and industrial mirror finish water blocks to tame high-TDP CPUs like Intel's 14th gen Core i9 models. TOUGHFAN EX Pro series fans complement the liquid coolers with detachable blades, allowing flow direction swapping based on mounting orientation.

For example, chassis top-mounted radiator fans can be inverted to intake cool air rather than recirculate hot interior air. The TOUGHFAN EX Pro uses enhanced steel motor hubs and copper motor housing for robust performance under pressure. Models push over 70 CFM airflow at noise levels under 30 dBA. By using evolving magnetic-based modular cooling, Thermaltake aims to simplify complex builds and accommodate flexible orientations that are not feasible with wired connections. Combined with extreme static pressure fans, the new TOUGHLIQUID EX Pro and TOUGHFAN Pro EX enable users to cool today's most powerful components efficiently without compromising system aesthetics. The TOUGHFAN EX12 Pro - Swappable Edition comes with an MSRP of $79.99/$89.99 and TOUGHLIQUID 240/280/360/420 Pro ARGB comes at $119.99/$129.99/$139.99/$169.99 pricing structure. The OLED-enabled TOUGHLIQUID OLED 360 Pro comes with a slight premium and is priced at $299.99.

During the CES 2024, Thermaltake announced the CTE E600 MX series of cases, in addition to the Tower 300 micro-ATX design shown at the company booth. Firstly, The Thermaltake CTE E600 MX mid-tower chassis focuses on exceptional cooling, customization, and tidy cable management. Its dual-chamber layout separates hot components from cables, with 12 potential fan mounts and 420 mm radiator support. Interchangeable front panels allow configuring for either maximum airflow or sleek tempered glass viewing. A bundled 400 mm PCIe 4.0 riser cable uniquely enables three GPU orientation options - standard, vertical, or a "floating" centered mount showcasing your graphics card. Anchor points and included ties facilitate organizing wiring neatly out of sight in the partitioned cable chamber. With outstanding flexibility tailoring both form and function, the CTE E600 MX empowers users to build their perfect customized system matching individual style and cooling demands. The CTE E600 comes with an MSRP of $179.99.

The recent attacks on cargo ships in the Red Sea are affecting not only oil shipments, but also cargo ships from Asia to Europe. All major carriers such as CMA CGM, Cosco, Evergreen, Hapag-Lloyd, Maersk, MSC and so forth are affected and all have delayed their shipments through the area. A coordinated security action called Operations Prosperity Guardian which includes over half a dozen nations so far, is getting ready to guide shipments through the affected area by Yemen, but it'll lead to slower shipments through the area.

TechPowerUp has already received reports from sources in Taiwan that their products are on some of these ships that are now stuck waiting for naval escorts through the area. However, it appears that there might be shortages of some computer components for the foreseeable future, alongside many other products that are being shipped this route and onwards via the Suez Canal. According to the BBC, it takes 25.5 days on average to ship goods from Taiwan to the Netherlands via the Red Sea and Suez Canal whereas the only alternative route via the Cape of Good Hope takes 34 days and adds extra fuel costs. Regardless of the extra shipping times and costs, it appears some shipping companies are willing to take the longer route to avoid being attacked. This is likely to have a knock on effect on prices for a lot of consumer goods in Europe, so if you haven't bought that hardware you've been holding off getting, now might be as good a time as any.

Binarly's research team has discovered a collection of security vulnerabilities known as "LogoFAIL", which affects image parsing components within the UEFI firmware of a wide array of devices. These vulnerabilities are especially concerning because they are embedded within the reference code provided by Independent BIOS Vendors (IBVs), affecting not just a single vendor but a broad spectrum of devices that utilize this code. LogoFAIL is particularly dangerous because it allows attackers to bypass crucial security measures such as Secure Boot and Intel Boot Guard by executing a payload during the device's boot process. This is achieved by storing malicious images on the EFI System Partition or within unsigned sections of firmware updates. This method can compromise system security deeply without altering the runtime integrity of the bootloader or firmware, unlike other threats such as BlackLotus or BootHole.

The potential reach of LogoFAIL vulnerability is rather wide, with millions of consumer and enterprise-grade devices from various vendors, including ones like Intel, Acer, and Lenovo, being vulnerable. The exact list of affected devices is still undetermined, but the prevalence of the IBVs' code across numerous devices suggests that the impact could be widespread, with both Windows and Linux users being affected. Only PCs that don't allow any logotype displayed in the UEFI during the boot process are safe. Apple's Macs are secure as they don't allow any add-on images during boot, and some OEM prebuilt PCs, like the ones from Dell, don't allow images in the UEFI. Some makers like Lenovo, AMI, and Insyde have already published notes about cautiously uploading custom images to the UEFI and providing BIOS updates. Consumers and enterprises must check with their OEMs and IBVs for BIOS microcode updates to patch against this vulnerability.Below, you can see the proof of concept in a YouTube video.

Yangtze Memory Technologies Corp (YMTC), China's biggest NAND flash memory manufacturer, has successfully raised billions of US Dollars in new capital to adapt to challenging US restrictions. According to the report from Financial Times, YMTC, which was added to a trade blacklist in December and barred from procuring US equipment to manufacture chips, exceeded its funding target. However, the exact amount remains undisclosed. The capital increase became necessary due to YMTC's substantial spending on finding alternative equipment and developing new components and core chipmaking tools. This financing round was oversubscribed by domestic investors, reflecting support for YMTC amid tightening US restrictions.

Last year, YMTC managed to raise 50 billion Chinese Yuan or about 7 billion US Dollars for equipment. Spending it all on the supply chain, the company is now looking to bolster its offerings with additional equipment for its memory facilities. One of the investors in the funding rally for YMTC has made a statement for Finanical Times: "If Chinese companies have equipment that can be used, [YMTC] will use it. If not, it will see if countries other than the US can sell to it. If that doesn't work, YMTC will develop it together with the supplier." This statement indicates that the company is looking into several options, where one is simply developing its custom machinery with the suppliers.

Jabil Inc., a global leader in design, manufacturing, and supply chain solutions, today announced it will take over the manufacture and sale of Intel's current Silicon Photonics-based pluggable optical transceiver ("module") product lines and the development of future generations of such modules.

"This deal better positions Jabil to cater to the needs of our valued customers in the data center industry, including hyperscale, next-wave clouds, and AI cloud data centers. These complex environments present unique challenges, and we are committed to tackling them head-on and delivering innovative solutions to support the evolving demands of the data center ecosystem," stated Matt Crowley, Senior Vice President of Cloud and Enterprise Infrastructure at Jabil. "This deal enables Jabil to expand its presence in the data center value chain."

Intel and Submer, a company specializing in immersion cooling, are set to unveil a creative immersion cooling system at the OCP Global Summit. This system can efficiently dissipate 1,000 W of power in a single-phase liquid cooling setup designed for deployment in data centers. Unlike traditional water cooling, immersion cooling systems offer higher efficiency and reliability. The solution developed by Submer and Intel is based on a Forced Convection Heat Sink (FCHS) and leverages a heat exchanger for heat transfer with a second liquid. The primary advantage of immersion cooling is its lack of active components on the cooling element, making it possible for immersed systems to operate without them for extended periods.

In this new system, a copper cooler is housed with two fans at one end to enhance liquid flow through the heat sink using forced convection. However, this active cooling component contradicts the traditional passive concept of immersion cooling based on natural convection. In its initial phase, Submer and Intel utilized Xeon processors with an 800 W TDP, with plans to increase that figure to 1,000 W in the next step. This Forced Convection Heat Sink (FCHS) offers the advantages of easy manufacturing and cost-effective usage while effectively dissipating up to 1,000 W of waste heat, making it a compelling option for immersion cooling. There are even possibilities of being 3D printed, according to Submer, and the plan is to achieve cooling of 1kW+ chip. We expect to hear more about the system during the OCP Global Summit, running from October 17 to 19, as currently, we only have a lower-resolution image from Submer's press release.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its range-wide compatibility and readiness for Intel's new 14th Generation Intel Core processors. With a enormous range of tested and validated components such as DDR5 memory, all-in-one liquid CPU coolers, innovative and reliable power supplies, and blazing fast M.2 SSDs, you can be confident that CORSAIR components will pair exceptionally with the latest in Intel processors to help your PC reach its full potential.

The latest Core processors utilize Intel's new Performance Hybrid Architecture, featuring more efficiency-cores for the best gaming experience—even while streaming and encoding video. Other features, such as Intel Thread Director to keep background tasks from slowing down games and Smart Cache for smoother gameplay and faster load times, make 14th Gen Core processors a great choice for PC gaming. But it's not enough to just have the CPU; you need to complete your system with components that can keep up and tap into its full potential, and that's where CORSAIR comes in.

According to the editorial blog post published on the Samsung blog by SangJoon Hwang, Executive Vice President and Head of the DRAM Product & Technology Team at Samsung Electronics, we have information that High-Bandwidth Memory 4 (HBM4) is coming in 2025. In the recent timeline of HBM development, we saw the first appearance of HBM memory in 2015 with the AMD Radeon R9 Fury X. The second-generation HBM2 appeared with NVIDIA Tesla P100 in 2016, and the third-generation HBM3 saw the light of the day with NVIDIA Hopper GH100 GPU in 2022. Currently, Samsung has developed 9.8 Gbps HBM3E memory, which will start sampling to customers soon.

However, Samsung is more ambitious with development timelines this time, and the company expects to announce HBM4 in 2025, possibly with commercial products in the same calendar year. Interestingly, the HBM4 memory will have some technology optimized for high thermal properties, such as non-conductive film (NCF) assembly and hybrid copper bonding (HCB). The NCF is a polymer layer that enhances the stability of micro bumps and TSVs in the chip, so memory solder bump dies are protected from shock. Hybrid copper bonding is an advanced semiconductor packaging method that creates direct copper-to-copper connections between semiconductor components, enabling high-density, 3D-like packaging. It offers high I/O density, enhanced bandwidth, and improved power efficiency. It uses a copper layer as a conductor and oxide insulator instead of regular micro bumps to increase the connection density needed for HBM-like structures.

Fueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to US $38.1 billion, marking a 12.5% quarterly increase. In this rising tide, NVIDIA seized the crown, officially dethroning Qualcomm as the world's premier IC design house, while the remainder of the leaderboard remained stable.

AI charges ahead, buoying IC design performance amid a seasonal stocking slump
NVIDIA is reaping the rewards of a global transformation. Bolstered by the global demand from CSPs, internet behemoths, and enterprises diving into generative AI and large language models, NVIDIA's data center revenue skyrocketed by a whopping 105%. A deluge of shipments, including the likes of their advanced Hopper and Ampere architecture HGX systems and the high-performing InfinBand, played a pivotal role. Beyond that, both gaming and professional visualization sectors thrived under the allure of fresh product launches. Clocking a Q2 revenue of US$11.33 billion (a 68.3% surge), NVIDIA has vaulted over both Qualcomm and Broadcom to seize the IC design throne.

Cooler Master, a global leader in designing and manufacturing innovative gaming peripherals and computer components, is thrilled to announce a historic partnership with CAPCOM to launch an exclusive line of Street Fighter 6-themed components and peripherals. This collaboration celebrates the launch of the latest addition to the Street Fighter franchise. Inspired by the game's new characters and universe, Cooler Master has meticulously designed a range of peripherals incorporating iconic character colors and RGB lighting for an immersive gaming experience.

"Cooler Master and Capcom share nearly the same rich history and longevity in our respective fields, making this partnership a natural blend of talent, innovation, and a deep understanding of our audience," said Jimmy Sha, CEO, Cooler Master. "With Capcom, we've created products that reflect the heart and soul of Street Fighter 6, offering fans a unique opportunity to incorporate their love for the game into their gaming setups."

Sony Semiconductor Solutions Corporation (SSS) today announced that it has developed an energy harvesting module that uses electromagnetic wave noise energy. The new module applies technology that SSS has cultivated in the tuner development process to generate power from electromagnetic wave noise with a high level of efficiency. For example, this technology can use the constant electromagnetic wave noise generated by robots inside factories, monitors and lighting in offices, monitors and TVs in stores and homes, and the like to provide the stable power supply needed to run low-power consumption IoT sensors and communications equipment.

With attention on the challenge of providing power to the increasing number of IoT devices as they grow in popularity and sophistication, this highly efficient energy harvesting technology shows promise for a wide range of applications. SSS aims to employ the new technology as part of its effort to build a power circulation model, thereby contributing to the development of a sustainable IoT society.

Intel recently updated its website to highlight interposers used for testing upcoming chips before their actual product integration. A specific webpage now showcases components used by various tools, notably the "Gen5 VR," which stands for CPU Voltage Regulator in this context. The highlight of the update reveals at least four yet-to-be-announced products: Battlemage (BMG), Arrow Lake (ARL), and Lunar Lake (LNL), slated for launch in 2024. Particularly interesting are the two Battlemage interposers: BGA2362-BMG-X2 and BGA2727-BMG-X3. This hints that a Battlemage GPU could have more pins than Intel's current top-tier GPU from the Alchemist series, known as DG2, which features 2660 pins (BGA2660-DG2-512EU).

This unveiling could indicate Intel's plans to introduce two GPUs in its new series or potentially two different package sizes. Manufacturers often use consistent package sizes for multiple GPUs, granting flexibility to interchange processors with similar specifications and presenting a feasible production strategy. Another notable mention is the Arrow Lake-HX, intended for premium desktop/laptop hybrids.. While there was some buzz about the ARL-HX series before, this update provides clear confirmation from Intel. Lastly, the reveal includes an interposer for the Lunar Lake-M series (LNL-M), which is expected to be Intel's most energy-efficient line. Drawing parallels from the Alder Lake series, such chips were designed for tablets with power consumption between 5 to 7 watts.

Corsair Gaming, Inc. ("Corsair" or the "Company"), a leading global provider and innovator of high-performance gear for gamers, streamers, content-creators, and gaming PC builders, today announced financial results for the second quarter ended June 30, 2023, and reiterated its financial outlook for the full year 2023.

Second Quarter 2023 Select Financial Metrics

• Net revenue was $325.4 million compared to $283.9 million in the second quarter of 2022, an increase of 14.6%. Gaming components and systems segment net revenue was $246.7 million compared to $194.9 million in the second quarter of 2022, while Gamer and creator peripherals segment net revenue was $78.8 million compared to $89.0 million in the second quarter of 2022.
• Net income attributable to common shareholders was $1.1 million, or net income of $0.01 per diluted share, compared to a net loss of $59.4 million, or a net loss of $0.62 per diluted share, in the second quarter of 2022.
• Adjusted net income was $9.8 million, or net income of $0.09 per diluted share, compared to adjusted net loss of $19.0 million, or a net loss of $0.20 per diluted share, in the second quarter of 2022.
• Adjusted EBITDA was $17.8 million, compared to a loss of $11.0 million in the second quarter of 2022.
• Cash and cash equivalents were $184.0 million as of June 30, 2023.

Worldwide silicon wafer shipments increased 2.0% quarter-over-quarter to 3,331 million square inches in the second quarter of 2023, down 10.1% from the 3,704 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

"The semiconductor industry continues to work through excess inventory in various market segments, necessitating that fabs operate below full capacity," said Anna-Riikka Vuorikari-Antikainen, Chairman of SEMI SMG and Chief Commercial Officer at Okmetic. "As a result, silicon wafer shipments are lagging their 2022 peak. Second-quarter wafer shipments held steady quarter-on-quarter with 300 mm showing quarterly growth among all wafer sizes."

The Financial Times believes that Apple is running into major production issues related to its Vision Pro mixed reality headset—insider sources claim that the mega-sized multinational technology company is adjusting internal sales goals for the $3499 AR/VR "spatial computer." Leadership had set an ambitious internal target of 1 million units sold in 2024, but the complexity of the system's design has apparently caused major setbacks for manufacturing partners. Apple is reported to have signed up with Luxshare, a Chinese contract manufacturer, to assemble Vision Pro headsets—insiders within both organizations reckon that only 400,000 units will be ready for sale throughout 2024. This number seems to be fairly optimistic given that Trendforce predicted that a mere 200,000 would be shipped next year.

FT gathered information from two other sources placed within the Chinese supply chain—they claim that Apple and Luxshare could encounter major component shortages in 2024, resulting in a production shortfall—with an estimated 130,000 to 150,000 finalized units. The article points out that the most complex (and costly) aspect of the headset lies in its micro-OLED display setup, that also includes outward facing lenses. TSMC and Sony are reported to be the suppliers of these parts (as featured on the prototypes), but Apple is allegedly not satisfied with low production numbers, and not enough batches are "free of defects." A cheaper version of the Vision Pro is apparently now on the backburner, since Apple is unlikely to recoup—factoring in R&D expenses—within the first year of the intial product's launch.

TrendForce reports that explosive growth in generative AI applications like chatbots has spurred significant expansion in AI server development in 2023. Major CSPs including Microsoft, Google, AWS, as well as Chinese enterprises like Baidu and ByteDance, have invested heavily in high-end AI servers to continuously train and optimize their AI models. This reliance on high-end AI servers necessitates the use of high-end AI chips, which in turn will not only drive up demand for HBM during 2023~2024, but is also expected to boost growth in advanced packaging capacity by 30~40% in 2024.

TrendForce highlights that to augment the computational efficiency of AI servers and enhance memory transmission bandwidth, leading AI chip makers such as Nvidia, AMD, and Intel have opted to incorporate HBM. Presently, Nvidia's A100 and H100 chips each boast up to 80 GB of HBM2e and HBM3. In its latest integrated CPU and GPU, the Grace Hopper Superchip, Nvidia expanded a single chip's HBM capacity by 20%, hitting a mark of 96 GB. AMD's MI300 also uses HBM3, with the MI300A capacity remaining at 128 GB like its predecessor, while the more advanced MI300X has ramped up to 192 GB, marking a 50% increase. Google is expected to broaden its partnership with Broadcom in late 2023 to produce the AISC AI accelerator chip TPU, which will also incorporate HBM memory, in order to extend AI infrastructure.

TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

The price of GDDR6 memory has continued to fall sharply - over recent financial quarters - due to an apparent decrease in demand for graphics cards. Supply shortages are also a thing of the past—industry experts think that manufacturers have been having an easier time acquiring components since late 2021, but that also means that the likes of NVIDIA and AMD have been paying less for VRAM packages. Graphics card enthusiasts will be questioning why these savings have not been passed on swiftly to the customer, as technology news outlets (this week) have been picking up on interesting data—it demonstrates that spot prices of GDDR6 have decreased to less than a quarter of their value from a year and a half ago. 3DCenter.org has presented a case example of 8 GB GDDR6 now costing $27 via the spot market (through DRAMeXchange's tracking system), although manufacturers will be paying less than that due to direct contract agreements with their favored memory chip maker/supplier.

A 3DCenter.org staffer had difficulty sourcing the price of 16 Gb GDDR6 VRAM ICs on the spot market, so it is tricky to paint a comparative picture of how much more expensive it is to equip a "budget friendly" graphics card with a larger allocation of video memory, when the bill-of-materials (BoM) and limits presented by narrow bus widths are taken into account. NVIDIA is releasing a GeForce RTX 4060 Ti 16 GB variant in July, but the latest batch of low to mid-range models (GeForce RTX 4060-series and Radeon RX 7600) are still 8 GB affairs. Tom's Hardware points to GPU makers sticking with traditional specification hierarchy for the most part going forward: "(models) with double the VRAM (two 16 Gb chips per channel on both sides of the PCB) are usually reserved for the more lucrative professional GPU market."

Raijintek's exhibit at Computex 2023 was a captivating showcase of their innovative products for water-cooling enthusiasts. The company turned heads with its all-black brushed aluminium finish components, beautifully augmented with RGB lighting. Raijintek started off with their CPU water blocks, engineered to provide efficient cooling for high-performance CPUs. The RGB lighting breathed life into the elegant all-black blocks, rendering them both practical and stylish. Also featured was their state-of-the-art pump and reservoir combinations, with the same design ethos and a spotlight on efficient operation. Using the same black design, Raijintek extended their design to their radiators, with efficient heat dissipation to keep systems cool. Furthermore, their distribution plates continued to impress with their sleek designs, offering optimal flow paths for cooling fluid. There was a Chinese-inspired mod that showed usage of the company's components in the modded build.