Welcome to the first Patch Notes of 2024 for HITMAN World of Assassination. Alongside the return of the Undying, new challenges, and curated contracts, we bring you more than 200 hundred improvements, fixes, and additions to the different areas of the game. Enjoy and happy hunting! HITMAN World of Assassination is now updated to version 3.180 on all platforms; PS5, PS4, Xbox One, Xbox Series X/S, PC, and Switch.

The Undying mission is available in the Free Starter Pack for new players and as an Elusive Target for HITMAN World of Assassination players, for a limited time only. The DLC Undying Pack is also now available, including a suit, items, Freelancer mode decorations, and access to the Undying indefinitely through the Elusive Target Arcade. Players will be able to unleash their creativity against Mark Faba, with a wide variety of tools at their disposal to accomplish their mission and make sure the Undying does not reappear again. The mission takes place in the Miami map, where Agent 47 will have to stop Mark Faba before he can utilize his expert surveillance, infiltration, and demolition skills to complete a contract at the Global Innovation Race event.

Construction of Intel's New Albany, Ohio fabrication site started back in late 2022—since then, a series of setbacks have caused anticipated timelines to slip. Team Blue's original plans included a 2025 opening ceremony—last month, this was amended to late 2026 or early 2027. New equipment deliveries have been affected by extreme weather conditions—Intel appears to be shoring up its flood prevention systems at their Licking County location. Ohio's Department of Development received a progress report at the start of this month, authored by Team Blue staffers—revised figures indicate that Fabrication sites 1 and 2 are expected to reach operational status somewhere within "2027-2028."

Jim Evers (Intel's Ohio Site Manager) stated: "we are making great progress growing the Silicon Heartland. In addition to the approximately $1.5 billion investment in completed spends through 12/31/23 referenced in the report, Intel has an additional $3 billion in contractually committed spends underway, totaling $4.5 billion committed toward our Ohio One projects." Intel committed a hefty $20 billion greenfield investment into the two Ohio wafer fab sites, but the latest progress report indicates that just under a quarter of that budget has trickled out of company coffers (so far). Evers's statement continued: "this investment is growing every day as we work to establish a new manufacturing campus to build leading-edge semiconductor chips right here in Ohio." A Tom's Hardware report reminds us about Team Blue's New Albany project receiving "over $2 billion in incentives." Industry rumors posit that the US government is readying a multi-billion dollar grant for Intel's Arizona facility.

TSMC is experiencing unprecedented demand from AI chip customers—unnamed parties have (fancifully) requested the construction of entirely new fabrication facilities. Taiwan's leading semiconductor contract manufacturer seems to concentrating on "sensible" expansions, mainly in the area of CoWoS packaging output—according to an Economic Daily report, company leadership and local government were negotiating over the construction of four new advanced packaging plants. Insiders propose that plans have been revised—an investment in excess of 500 billion yuan ($16 billion) will enable the founding of six new CoWoS-focused facilities. TSMC is expected to make an official announcement next month—industry moles reckon that construction work will start in April. Two (of the six total) advanced packaging plants could become fully operational before the conclusion of 2024.

Lately, TSMC has initiated an ambitious recruitment drive—targeting around 6000 new workers. A touring entity is tasked with the attraction of "talents with high enthusiasm for semiconductors." The majority of new recruits are likely heading to new or expanded Taiwan-based facilities. The Economic Daily report proposes that Chiayi City's technological hub will play host to TSMC's new CoWoS packaging plants. A DigiTimes Asia news piece (from January) posited that TSMC leadership anticipates CoWoS output reaching 44,000 units by the end of 2024. This predicted tally could grow, thanks to the (rumored) activation of additional factories. CoWoS packaging is considered to be a vital aspect of AI accelerators—insiders believe that TSMC's latest investment will boost production of NVIDIA H100 GPUs. The combined output of six new CoWoS plants will assist greatly in the creation of next-gen B100 chips.

Rumors from last week pointed to a possible $3.5 billion government defense-related investment—Intel was linked to this very lucrative semiconductor supply contract. Insiders posited that the US Department of Commerce was readying a rough $1 billion investment, while the Pentagon prepared around $2.5 billion. The latter has scrapped those plans, according to anonymous sources—Bloomberg believes that this: "move threatens to limit the total amount that Intel has been expecting to get in federal funding, setting up a contentious situation." The publication's moles have requested complete anonymity, due to the secretive nature of policy negotiations.

The US Department of Commerce deliberates over the nation's CHIPS Act—this fund could be utilized to "make up for the shortfall," following the Pentagon's reported last minute course change. The Department of Commerce could be forced to foot the entire bill—of $3.5 billion—if Intel's services are secured. Negotiations over a so-called "Secure Enclave" project have been ongoing since last year, according to insiders. It is possible that the "fast-moving" military spending bill set off alarms at the Pentagon—the Department of Defense's reasonings were not revealed by Bloomberg's investigation. Several media outlets have requested official comments from the two arms of government. Yesterday, Intel shares fell by 3%—as reported Investopedia—with the market reacting to rumors of cancelled plans.

TrendForce's latest analysis reveals that the downswing of DRAM contract prices, which had lasted for eight consecutive quarters since 4Q21, was finally reversed in 4Q23. Likewise, NAND Flash rebounded in 3Q23 after four quarters of decline. The persistence of this rally in memory prices during 2024 will largely hinge on suppliers' ongoing and effective control over their capacity utilization rates.

According to TrendForce Senior Research Vice President, Avril Wu, the first quarter of this year is already shaping up to be a season of growth, with TrendForce confirming its initial projections: a hike of around 13-18% QoQ for DRAM contract prices and a hike of 18-23% for NAND Flash contract prices. Despite a generally conservative outlook for overall market demand in 2Q24, suppliers in both DRAM and NAND Flash markets have begun raising their capacity utilization rates since the end of 4Q23. Furthermore, NAND Flash buyers are anticipated to complete their inventory restocking in advance in 1Q24. Due to the rise in capacity utilization rates and earlier restocking efforts, leading to a more moderated QoQ price increase of 3-8% for both DRAM and NAND Flash contract prices for 2Q24.

TrendForce investigations reveal a significant leap in the DRAM industry for 3Q23, with total revenues soaring to US$13.48 billion—marking 18% QoQ growth. This surge is attributed to a gradual resurgence in demand, prompting buyers to re-energize their procurement activities. Looking ahead to Q4, while suppliers are firmly set on price hikes, with DRAM contract prices expected to rise by approximately 13-18%, demand recovery will not be as robust as in previous peak seasons. Overall, while there is demand for stockpiling, procurement for the server sector remains tentative due to high inventory levels, suggesting limited growth in DRAM industry shipments for Q4.

Three major manufacturers witnessed Q3 revenue growth. Samsung's revenue increased by about 15.9% to US$5.25 billion thanks to stable demand for high-capacity products fueled by AI advancements and the rollout of its 1alpha nm DDR5. SK hynix showcased the most notable growth among manufacturers with a 34.4% increase, reaching about US$4.626 billion and significantly narrowing its market share gap with Samsung to less than 5%. Micron's revenue rose by approximately 4.2% to US$3.075 billion—despite a slight drop in ASP—supported by an upswing in demand and shipment volumes.

Recently, the spot market for NAND Flash chips has seen a rise in active price inquiries for certain products, a movement driven by successful increases in wafer contract prices. TrendForce reports this uptick primarily stems from negotiations in late August between NAND Flash suppliers and key Chinese module makers. These discussions led to a new wafer contract that successfully boosted the price of 512 Gb wafers by approximately 10%.

Other suppliers have also raised prices for their comparable products, signaling a shift in supplier sentiment: they are now less inclined to finalize deals at lower prices. This change has contributed to a short-term surge in the wafer spot market. Nevertheless, whether this surge in procurement is supported by actual end-user demand remains uncertain, as these orders have arisen in reaction to adjustments in supply-side pricing.

In a surprise move, Maxlinear has cancelled its close to US$4 billion takeover of Silicon Motion, despite having received approval by China to finally acquire Silicon Motion. The two companies started their merger back in May of 2022, but over a year later, Maxlinear has announced that it has "exercised its contractual rights to terminate its May 5, 2022 merger agreement". The announcement saw a drop in Maxlinear's shares of about 12 percent and a 25 percent drop for Silicon Motion.

It's unclear as to why Maxlinear cancelled the deal, but the two companies don't appear to have clear synergies outside some storage products. That said, Maxlinear appears to blame Silicon Motion in a press release that the company issues. Among other things, Maxlinear states that "Silicon Motion has suffered a Material Adverse Effect that is continuing, Silicon Motion is in material breach of representations, warranties, covenants, and agreements in the Merger Agreement that give rise to the right of the Company to terminate". As to what this actually means, we'll most likely never find out, but as Maxlinear also points out, the merger was supposed to have been finished by the 23rd of May 2023, which means Maxlinear had the right to cancel the merger regardless.

Three years ago, Intel announced a goal to increase global annual spending with diverse suppliers to $2 billion by 2030. We are proud to announce we reached $2.2 billion in diverse supplier spending in 2022, eight years ahead of schedule. This $2.2 billion represents nearly 15 times the annual total when our supplier diversity program launched in 2015 and double our 2019 results.

There are strong indications that Oppo is winding down its operations in France according to a report published by Frandroid last weekend, which goes against the company's denial that it was exiting several markets across the European Union, including France. Frandroid's investigative piece states that French retail workers had provided enough evidence, back in late March, for the publication to make the claim that Oppo was withdrawing from that region. The news outlet has gathered more insider information since then and now claims that a promotions company - Atmospheres - has not been contracted to help market Oppo's lastest smartphone models, including the Find N2 Flip. The agreement between the two firms was already set to end on June 30, but the promo team was expecting a renewal or extension - their boss finally admitted that it was all over and done with.

Frandroid has observed that Oppo is not updating its display material at big box stores, in particular Fnac Darty, and a salesperson confirmed that that they were only obligated to clear existing smartphone stock and related accessories. A former Oppo regional sales manager told the publication about a cessation of product training - under normal circumstances the team gets briefed about the latest products in advance, but the insider confides (under an alias): "We understood that they were leaving...We see the Find X coming out in China, oh no, it's not coming out in France. We see the new Reno phones arriving, will they be released in France? Neither. When the Find N2 Flip arrives, we are told of a store release, and then finally no, it is only available on the web store."

Samsung Electronics has announced that its sub-division, Samsung Display, is planning to invest $3.1 billion until 2026 in Asan, South Korea to manufacture advanced organic light-emitting diode (OLED) display panels. The country's ministry stated that Samsung's next generation of OLED display panels will be integrated into tablets and laptops. There are already rumors swirling that Apple has contracted with Samsung Display to produce parts for a refresh of the MacBook Pro range that is set to debut at some point before 2026.

Industry insiders are claiming that the substantial investment into the company's Asan, South Chungcheong factory will help fulfil orders placed by Apple for iPad and MacBook OLED displays - the North American company has not officially confirmed an adoption of that type of screen technology for these product ranges. Samsung is likely trying to secure a long term relationship with the Silicon Valley behemoth, and at the same time outmaneuver its competitors in South Korea as well as those in neighboring nations. It has been reported that domestic rival LG is currently unable to take on new orders, as its display factories are functioning at maximum production capacities.

Intel has awarded TSMC with some big contracts for future manufacturing of next generation GPUs, according to Taiwan's Commercial Times. As previously covered on TPU, the second generation Battlemage graphics processing units will get fabricated via a 4 nm process. According to insider sources at both partnering companies, Intel is eyeing a release date in the second half of 2024 for this Xe2-based architecture. The same sources pointed to the third generation Celestial graphics processing units being ready in time for a second half of 2026 launch window. Arc Celestial, which is based on the Xe3 architecture, is set for manufacture in the coming years courtesy of TSMC's N3X (3 nm) process node.

One of the sources claim that Intel is quietly confident about its future prospects in the GPU sector, despite mixed critical and commercial reactions to the first generation line-up of Arc Alchemist discrete graphics cards. The company is said to be anticipating great demand for more potent versions of its graphics products in the future, and internal restructuring efforts have not dulled the will of a core team of engineers. The restructuring process resulted in the original AXG graphics division being divided into two sub-groups - CCG and DCAI. The pioneer of the entire endeavor, Raja Koduri, departed Intel midway through last month, to pursue new opportunities with an AI-focused startup.

Although NAND suppliers have continued to roll back production, there is still an oversupply of NAND Flash as demand for products such as servers, smartphones, and notebooks is still too weak. Therefore, TrendForce predicts that the ASP of NAND Flash will continue to fall in 2Q23, though that decline may shrink to 5~10%. The key to supply and demand returning to a market equilibrium lies in whether NAND suppliers can cut back on production even more. TrendForce believes if demand remains stable, then the ASP of NAND Flash will have an opportunity to rebound in 4Q23; if demand is weaker than expected, then ASP will take longer to recover.

Client SSD: Currently, PC OEM's have managed to liquidate most of their component inventory, and are now gearing up in preparation for mid-year sales events. Suppliers are cutting prices to clear out their inventories of PCIe Gen 3 SSDs, which are gradually being phased out. Meanwhile, prices of PCIe Gen 4 SSDs continue to face downward pressure due to a slow intake of new customer orders. The continuous decline of QLC products in 1Q23 has also dragged down the prices of TLC products, and there is relatively little room for prices to keep falling in 2Q23. While it still remains unclear whether or not demand will recover, TrendForce projects that the prices of PC client SSDs will drop 5~10% in 2Q23.

Reykjavík, Iceland - 21 March 2023 - CCP Games, creators of sci-fi spacefaring MMO EVE Online, announced today that $40M in financing has been secured from external partners. This financing will allow CCP Games to build upon the discoveries of its research & development team to enable the full-scale development of a new AAA title utilizing blockchain technology, set within the EVE Universe.

"Since its inception, CCP Games' vision has been to create virtual worlds more meaningful than real life. Now, with advancements made within blockchain, we can forge a new universe deeply imbued with our expertise in player agency and autonomy, empowering players to engage in new ways. This financing has marked an exciting frontier in our studio history as we begin our third decade of virtual world operations. We are humbled by the confidence from our partners in the development of this new title," said CCP Games CEO, Hilmar V. Pétursson.

According to TrendForce's latest survey of the global foundry market, electronics brands began adjusting their inventories in 2Q22, but foundries were unable to rapidly adapt to this development because they reside in the more upper portion of the supply chain. Moreover, revising procurement quantities of long-term foundry contracts takes time as well. Hence, only some tier-2 and -3 foundries were able to immediately respond to the changes in their clients' demand. Also, among them, 8-inch wafer foundries made a more pronounced reduction in their capacity utilization rates. As for the remaining foundries, the downward corrections that they made to their capacity utilization rates did not become noticeable until 4Q22. Hence, in 4Q22, the quarterly total revenue of the global top 10 foundries registered a QoQ decline for the first time after 13 consecutive quarters of positive growth. The quarterly total revenue of the top 10 foundries came to US$33,530 million, reflecting a drop of 4.7% from 3Q22. Moving into 1Q23, TrendForce projects that the quarterly total revenue of the top 10 will show an even steeper drop on account of seasonality and the uncertain macroeconomic situation.

According to TrendForce's research, global DRAM revenue fell by 32.5% QoQ to US$12, 281 million for 4Q22. The QoQ decline for 4Q22 is larger than the QoQ decline of 28.8% for 3Q22 and comes close to the QoQ decline of 36% for the final quarter of 2008, when the global economy was in the midst of a major financial crisis. The main cause of the steep revenue drop in 4Q22 was the plummeting overall ASP. DRAM suppliers experienced a rapid accumulation of inventory in 3Q22 due to a freeze in buyers' demand. Subsequently, suppliers were much more energetic in price negotiations for 4Q22 contracts as they were struggling for market share. Among the major categories of DRAM products, server DRAM suffered the sharpest price drop in 4Q22. Contract prices of DDR4 and DDR5 server DRAM products registered QoQ drops of 23~28% and 30~35% respectively.

Since 2022, DRAM suppliers have been adjusting their product mixes so as to assign more wafer input to server DRAM products while scaling back the wafer input for mobile DRAM products. This trend is driven by two reasons. First, the demand outlook is bright for the server DRAM segment. Second, the mobile DRAM segment was in significant oversupply during 2022. Moving into 2023, the projections on the growth of smartphone shipments and the increase in the average DRAM content of smartphones remain quite conservative. Therefore, DRAM suppliers intend to keep expanding the share of server DRAM in their product mixes. According to TrendForce's analysis on the distribution of the DRAM industry's total bit output for 2023, server DRAM is estimated to comprise around 37.6%, whereas mobile DRAM is estimated to comprise around 36.8%. Hence, server DRAM will formally surpass mobile DRAM in terms of the portion of the overall supply within this year.

Over the past few weeks, the legal dispute between Arm Ltd. and Qualcomm Inc. has been warming up the eyes of the entire tech community. However, as per the latest court filing, Arm could change its licensing strategy and shift its whole business model into a new direction that would benefit the company directly. Currently, the company provides the intellectual property (IP) that chip makers can use and add to designs mixed with other IPs and custom in-house solutions. That is how the world of electronics design (EDA) works and how many companies operate. However, in the Qualcomm-Arm legal battle, Qualcomm's counterclaim has brought new light about Arm's plans for licensing its hardware designs past 2024.

According to Dylan Patel of SemiAnalysis, who examined court documents, Arm will reportedly change terms to use its IP where the use of other IP mixed with Arm IP is prohibited. If a chip maker plans to use Arm CPU IP, they must also use Arm's GPU/NPU/ISP/DSP IPs. This would result in devices that utilize every design the UK-based designer has to offer, and other IP makers will have to exclude their designs from the SoC. By doing this, Arm directly stands against deals like the Samsung-AMD deal, where AMD provides RDNA GPU IP and would force Samsung to use Arm's Mali GPU IP instead. This change should take effect in 2025 when every new license agreement has to comply with new rules.

As reported by BusinessKorea, Apple, one of the largest companies in the world, will source its 3D NAND from Chinese memory maker Yangtze Memory Technologies Corp (YMTC). Known for supplying 3D NAND to Chinese SSD makers, YTMC's reported contract with Apple will fuel the upcoming iPhone 14 SKU manufacturing. Whether or not this partnership will expand to other products, it is essential to have as many storage sources as possible, as Apple sells millions of devices per year. YTMC is on track to deliver 3D NAND flash with the latest Xstacking 3.0 six-plane architecture that provides triple-level cell storage with I/O speeds of 2400 MT/s.

YTMC has joined the list of 3D NAND flash vendors that Apple works with, including SK Hynix, Samsung, Kioxia, and possibly others. This partnership also highlights that the Chinese memory output is sufficient and significant enough to break into more markets worldwide, not remaining exclusive to domestic use.

Based on a report by Susquehanna, the lead time for what can be called ancillary semiconductors, i.e. the kind that are paired up with processor, SoCs and GPUs, now have a lead time of over six months. This is based on data from the distribution channel and as such, it's unlikely to affect large companies that have long-term contracts with their suppliers. However, smaller companies, or semiconductor manufacturers that solely rely on the distribution channel for sales of the parts, are not in a good place right now. Obviously this doesn't affect everything equally and many parts are also in stock with the big distributors, but sometimes at inflated prices compared to a couple of years ago.

Susquehanna is pointing towards several reasons for the increase in lead times, although the big ones include the Russia's war on Ukraine, an earthquake in Japan (on the 16th of March) as well as the more recent lockdowns in several cities in the PRC which are key to the production of everything from semiconductors to finished consumer goods. At the latter half of 2020, the lead time was less than 14 weeks, but has since then increased to almost 27 weeks and it looks like it's likely to continue to increase for the time being. The worst hit components are said to be analogue chips, so things like signal amplifiers, power control oscillators and the like, which had the lead times increased by 18 over the space of a month. The report says that Broadcom has increased its shipping times by as much as 30 weeks and its backlog of orders just keeps growing. This is quite surprising, as earlier reports mentioned that the WiFi makers were reasonably unaffected by the increase in lead times, but Broadcom does make a wealth of other products too, so this could be unrelated. On a more positive note, it seems like the lead time for passive components has improved by a couple of days, with an average lead time of 25 weeks.

Yesterday, NVIDIA announced its next-generation Hopper architecture designed for data center applications and workloads. There is always a question of availability, as the previous period showed everyone that the supply chain is overbooked and semiconductors are in very high demand. During the Q&A press session today, NVIDIA's CEO, Jensen Huang, tried to answer as many questions as possible. However, an exciting topic arose regarding the potential collaboration with Intel. As a part of Intel's IDM 2.0 strategy, the company plans to offer its chip manufacturing capabilities to the third-party companies willing to make efforts and port their designs to Intel's semiconductor nodes. NVIDIA, one of the largest TSMC customers, could be a new Intel customer. Below, we compiled a few quotes that highlight Jensen Huang's opinions, taking the quotes from Tom's Hardware.

NVIDIA CEO Jensen HuangOur strategy is to expand our supply base with diversity and redundancy at every single layer. At the chip layer, at the substrate layer, the system layer, at every single layer. We've diversified the number of nodes, we've diversified the number of foundries, and Intel is an excellent partner of ours[…]. They're interested in us using their foundries, and we're very interested in exploring it. [...] I am encouraged by the work that is done at Intel, I think this is a direction they have to go, and we're interested in looking at their process technology. Our relationship with Intel is quite long; we work with them across a whole lot of different areas, every single PC, every single laptop, every single PC, supercomputer, we collaborate. [...] We have been working closely with Intel, sharing with them our roadmap long before we share it with the public, for years. Intel has known our secrets for years. AMD has known our secrets for years. We are sophisticated and mature enough to realize that we have to collaborate.[...] We share roadmaps, of course, under confidentiality and a very selective channel of communications. The industry has just learned how to work in that way.

The output value of the world's top 10 foundries in 4Q21 reached US$29.55 billion, or 8.3% growth QoQ, according to TrendForce's research. This is due to the interaction of two major factors. One is limited growth in overall production capacity. At present, the shortage of certain components for TVs and laptops has eased but there are other peripheral materials derived from mature process such as PMIC, Wi-Fi, and MCU that are still in short supply, precipitating continued fully loaded foundry capacity. Second is rising average selling price (ASP). In the fourth quarter, more expensive wafers were produced in succession led by TSMC and foundries continued to adjust their product mix to increase ASP. In terms of changes in this quarter's top 10 ranking, Nexchip overtook incumbent DB Hitek to clinch 10th place.

TrendForce believes that the output value of the world's top ten foundries will maintain a growth trend in 1Q22 but appreciation in ASP will still be the primary driver of said growth. However, since there are fewer first quarter working days in the Greater China Area due to the Lunar New Year holiday and this is the time when some foundries schedule an annual maintenance period, 1Q22 growth rate will be down slightly compared to 4Q21.

In 4Q21, NAND Flash bit shipments grew by only 3.3% QoQ, a significant decrease from the nearly 10% in 3Q21, according to TrendForce's investigations. ASP fell by nearly 5% and the overall industry posted revenue of US$18.5 billion, a QoQ decrease of 2.1%. This was primarily due to a decline in the purchase demand of various products and a market shift to oversupply causing a drop in contract prices. In 4Q21, with the exception of enterprise SSD, the supply of which was limited by insufficient upstream components, the prices of other NAND Flash products such as eMMC, UFS, and client SSD, all fell.

TrendForce's summary of NAND Flash market sales performance in 2021 is as follows: although there have been signs of weakening since 2H21, thanks to remote services and cloud demand driven by the pandemic, revenue performance still grew significantly compared to 2020. Revenue reached US$68.6 billion, up 21.1% YoY, the second-biggest increase since 2018.

Just a few days ago, we reported that Intel is preparing to unveil the company's first application-specific integrated circuit (ASIC) dedicated to mining cryptocurrency. To be more specific, Intel plans to show off its "Bonanza Mine" ASIC at the 2022 ISSCC Conference, describing the chip as "ultra low-voltage energy-efficient Bitcoin mining ASIC." We have yet to see how this competes with other industry-made ASICs like the ones from Bitmain. However, it seems like the startup company GRIID, valued at around $3.3 billion, thinks that the Bonanza Mine ASIC is the right choice and has entered a definitive supply agreement with Intel.

According to the S-4 filing, GRIID has "entered into a definitive supply contract with Intel to provide ASICs that we expect to fuel our growth. The initial order will supply units to be delivered in 2022 and GRIID will have access to a significant share of Intel's future production volumes." There are a few other mentions of Intel in the document, and you can see another exciting tidbit below.

Intel and TSMC are positioning themselves as two competing foundries for a significant period. However, as the difficulties in semiconductor manufacturing rise, the collaboration of the two seems inevitable. Not because Intel is eyeing TSMC's clients, but because of the race to produce the most minor and best possible semiconductor node. We already know that Intel plans to use some of TSMC's nodes for its Ponte Vecchio accelerator that contains 47 tiles. However, we didn't realize just how big the contract between the two companies was. According to the latest report from DigiTimes, Intel is supposed to become one of the top three clients at TSMC.

As the report notes, the collaboration should extend to at least TSMC's 2 nm node, expected in 2025. After that, the state of semiconductors is unknown. Intel has a solid chance to be in the top three customers in 2023 and become one of the primary sources of profit for the Taiwanese giant. We are excited to see how this prediction plays out and hope to hear more from both in the future.