SK Hynix Inc. announced it has developed UFS (Universal Flash Storage) 2.0 64 GB (Gigabytes) solution based on its own 16 nm NAND Flash and in-house firmware and controller. This UFS 2.0 represents a groundbreaking leap in performance by enabling High-Speed Gear 3 interface with dual data lanes.

UFS 2.0 is the next generation of embedded flash memory to eMMC for mobile IT gadgets which drives a remarkable boost in reading/writing speed at low power and supports high density. The Company's UFS 2.0 operates at 780 MB/s(Megabytes per second) and 160 MB/s of sequential read/write speed and runs random read/write speed at 32,000 IOPS and 17,000 IOPS. As a result, it works three times faster in read speed than eMMC 5.1.

In addition, this UFS 2.0 utilizes 'Command Queue' technology used in SSD solutions to handle read and write commands simultaneously to achieve data operation efficiency by preventing buffering load in multi-tasking and ordering priorities of data works. To maximize prioritized command processing feature of UFS standard, the device employs 'Multi-Thread' read processing internally to ensure that high priority command is serviced first irrespective of other outstanding tasks, delivering fast response to time-critical host requests for best user experience. In consequence, it realizes even better performance in speed and power consumption over eMMC.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced a high-performance mobile memory storage based on Embedded MultiMediaCard (eMMC) 5.0 technology. The new 128-gigabyte (GB), 3-bit NAND-based eMMC 5.0 storage is targeted at the smartphone and tablet mass markets.

"With the introduction of our value-focused, 3-bit NAND-based eMMC 5.0 line-up, we expect to take the lead in the expansion of high-density mobile storage," said Dr. Jung-Bae Lee, Senior Vice President of Memory Product Planning and Application Engineering Team, Samsung Electronics. "We are continuing to enhance our next-generation embedded mobile memory offerings with improved performance and higher densities to meet increasing customer demand across the mobile industry."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is now mass producing the industry's first 128-gigabyte (GB) ultra-fast embedded memory based on the much-anticipated Universal Flash Storage (UFS) 2.0 standard for next-generation flagship smartphones. The new embedded memory's UFS 2.0 interface is the most advanced JEDEC-compliant, next-generation flash memory storage specification in the world.

"With our mass production of ultra-fast UFS memory of the industry's highest capacity, we are making a significant contribution to enable a more advanced mobile experience for consumers," said Jee-ho Baek, Senior Vice President of Memory Marketing, Samsung Electronics. "In the future, we will increase the proportion of high-capacity memory solutions, in leading the continued growth of the premium memory market."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD84-B51: Embedded MultiMediaCard (e.MMC), Electrical Standard (5.1). e.MMC v5.1 defines new features and updates for this embedded mass-storage flash memory that is widely used in smartphones and other mobile devices. Intended to facilitate an enhanced end user experience, the new version of e.MMC offers command queueing for the first time, and also defines important security updates. JESD84-B51 is available for free download from the JEDEC website.

The new revision of the standard defines e.MMC Command Queueing, which supports the optimized execution of commands within the device, versus the single thread protocol defined in prior versions of the standard. Command Queueing will enable the device to analyze commands before executing them, thereby maximizing effectiveness of the e.MMC memory storage. This will result in a positive effect on random read performance and read latency, thereby improving the end user experience.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is now mass producing the industry's first ePoP (embedded package on package) memory - a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC (embedded multi-media card) and a controller. For use in high-end smartphones, the extremely thin ePoP combines all essential memory components into a single package that can be stacked directly on top of the mobile processor, without taking any additional space - a distinct improvement over existing two-package eMCP memory solutions.

"By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features," Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics. "We plan to expand our line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, to further add to the growth of premium mobile market."

Micron Technology, Inc., expands its automotive storage solutions portfolio with the introduction of their M500IT solid-state drive (SSD) in densities ranging from 60GB to 240GB and embedded multimedia card (eMMC) 5.0 memory. Both solutions are specifically designed to enhance automotive applications.

Micron's M500IT solid state drive (SSD) is the industry's first automotive-grade SSD with AEC-Q100-compliant NAND flash memory components and system-level qualification in select automotive applications and conditions. The M500IT is dramatically faster than hard disk drive (HDD) technologies, enabling nearly instantaneous system response times and fast application loads that are critical to the increasingly media-rich automotive experience. The M500IT SSD also includes hardware-based encryption, data-at-rest protection against unexpected power loss and an adaptive thermal monitoring system to secure user data at extended temperatures. The M500IT SSD uses AEC-Q100-compliant NAND flash memory technology and customized firmware to provide high quality and high performance for demanding automotive applications.

HP today expanded the innovative HP Stream line-up of thin and light Windows products that leverage the cloud and make it easy to work and play from more places with the addition of two new notebook PCs and two new tablets.

"Today's consumers demand mobile products that fit their personal style and allow them to work and play wherever they are," said Mike Nash, vice president, Product Management, Consumer Personal Systems, HP. "The HP Stream products announced today hit the mark with sleek design, portability, access to free cloud storage, and the familiarity of Windows and Office 365."

Since this product was introduced in April, LIVA Mini PC Kit by Elitegroup Computer Systems, ECS, has received all the positive feedback from users as well as many awards from media globally. In order to fulfill more applications and expectations, ECS proudly introduces LIVA Mini PC Kit White Edition / eMMC 64 GB which will be available in August, 2014. With the simplicity of the color of white and the upgrade of storage, the new member of family, LIVA White Edition 64 GB, will be the focus in the market of mini PC.

Plextor, a leading developer of high-performance digital storage technology, announces the launch of M6 Pro and PlexTurbo at Computex 2014. The show will also mark the debut of other new consumer SSDs from Plextor, who will showcase their IPC and enterprise ranges. Debuting at Computex is the high-performance Plextor M6 Pro SATA SSD. With hardware operating at the maximum 6 Gbps throughput limit of the SATA interface, the M6 Pro sets new standards for reliability, stability, and performance. With guaranteed stability, the Plextor M6 Pro is the first consumer SSD from Plextor to pass its new ultra-strict enterprise-grade Zero Error standard of 400 units surviving 1008 hours (up from 500 hours). The introduction of DEVSLP mode reduces power consumption.

PlexTurbo is intelligent SSD caching software, which uses a combination of system RAM, the SSD DRAM cache, and SSD storage. It delivers additional storage speed for real-world applications, intelligently extends flash life, and prevents data loss if power is interrupted. By taking a more intelligent approach to RAM caching, the PlexTurbo is able to outperform competing software whist minimizing RAM use. PlexTurbo will initially only be available with the Plextor M6 Pro. Live demos will show the stability and incredible performance of Plextor's latest M6 generation of products. Attendees will experience the performance and advantages of the brand new Plextor M6 Pro with PlexTurbo. They will also have the chance to see the power of the M6e in HHHL and M.2 form factors. This SSD has already won numerous awards by bypassing the limitations of SATA to deliver highly stable RAID-like performance using cutting-edge components and the PCIe interface.

Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduces new additions to its Ferri portfolio with single-package Ferri-eMMC and ultra-high performance SATA 6 Gb/s FerriSSD embedded memory solutions supporting industrial and commercial grade temperatures. Silicon Motion will be showcasing and demonstrating these new products at the upcoming EE Live! Conference and Expo in San Jose, CA from April 1 to 3.

Ferri-eMMC is designed for a wide range of embedded applications and is fully compliant with JEDEC-standard eMMC 4.5 protocol. With a 100-ball 1.0 mm pitch BGA package, Ferri-eMMC provides for more flexible PCB design and low-cost manufacturing. Ferri-eMMC delivers market leading data integrity and protection capabilities featuring Silicon Motion's advanced NAND management technologies including error correction, bad block management and NAND health monitoring.

Ahead of its launch, pictures of ECS Liva mini-PC were posted by the Japanese media. Designed to take on the likes of Intel NUC (Atom) and Gigabyte Brix, the Liva runs Intel's "Bay Trail-M" SoC, which allows a great deal of cost-cutting, and lets it make the Liva fan-less. A big metal-ridge heatsink cools the SoC. The compact system board has a great deal of onboard connectivity, including D-Sub and HDMI display outputs; gigabit Ethernet, Wi-Fi, Bluetooth, USB 3.0, and stereo HD audio. The board comes with its own 2 GB of DDR3L onboard RAM, and 32 GB of eMMC storage. Measuring 118 mm x 70 mm x 56 mm, the Liva weighs in at 190 g. It's expected to be priced under $200.

Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, is now mass producing its eMMC NANDrive embedded solid state drives (SSDs). The GLS85VM devices operate at full industrial temperatures between -40 and +85 degrees Celsius, giving customers data storage in a small, ball grid array (BGA) form factor that can withstand the most severe conditions.

All eMMC NANDrive SSDs have the same footprint in a 14 mm x 18 mm, 100-ball package, with 1 mm ball pitch for increased long-term reliability. GLS85VM devices are compatible with JEDEC eMMC 4.4x and 4.3 standards. With a focus on meeting stringent customer requirements, Greenliant's fabless manufacturing operations are ISO 9001:2008 certified and eMMC NANDrive is manufactured in ISO/TS 16949:2009 facilities.

The S20 Slider 2, the ideal mobile work station and leisure companion, just hit the market. Its elegant streamlined exterior, all-in-one design, Intel's 4th generation Haswell Core i5 processor, and all-weather, long-life battery meet are designed to meet your work and leisure needs and make the S20 Slider 2 stand out from the crowd of other ultrabooks.

Another MSI ingenious design, the S20 Slider 2 not only offers all the audio, visual, multimedia, reading, and gaming enjoyment of a tablet, it also sports a keyboard, USB, and HDMI capabilities of a mobile office notebook. This chicly mobile machine satisfies the needs of both on-the-go business people and students and the extended battery power ensures that you have plenty of time to do what you're doing. Ideal for Internet browsing, social networking, and word processing, the S20 Slider 2 is the perfect choice for anybody on the go. The S20's design with keyboard and sliding cover eliminates the limitations most people feel when they use tablets. MSI's innovative, user-friendly design have you the user in mind.

KINGMAX, a vertically integrated RAM/memory card module manufacturer, is happy to announce that it has developed a complete range of storage products catering specifically to the industrial PC sector. While the IPC and industrial control market is poised to grow further on the back of ever-expanding applications, KINGMAX will keep up its innovative R&D to meet the rapidly growing demand.

Leveraging more than 20 years of R&D and manufacturing expertise, KINGMAX now stands out as a premium one-stop supplier of industrial-grade FLASH storage products: SSDs, eMMC/eMCP/eSSDs, SD/CF cards and DRAMs. They not only come with state-of-the-art specifications but also have undergone the most stringent performance tests and safety verification.

Lenovo today announced several new touch-enabled Windows laptops, along with Lenovo Miix, a platform-bending multi-mode device that adapts to a user's every need. As a 10.1-inch tablet that converts instantly into a fully-functioning, Windows 8 laptop, the Lenovo Miix combines versatility and power in one touch-enabled device. The IdeaPad S400 Touch, S500 Touch, S210 Touch, U330 Touch and U430 Touch all hail from the company's S Series and U Series, which are notable for their thin and lightweight designs.

The new Lenovo Miix, S Series and U Series devices demonstrate Lenovo's commitment to "touch" as a defining trend in consumer computing. Research analyst firm IDC expects the penetration rate of touch laptops, which now sits at close to 15 percent, to double next year. Leading that trend, Lenovo is innovating across traditional technology segments - such as desktop and laptop PCs - with its new multi-mode, touch-enabled devices.

SK Hynix Inc. announced that it has developed the world's first 8 Gb(Gigabit) LPDDR3 (Low Power DDR3) using its advanced 20nm class process technology. This product is a top-performance mobile memory solution which features high density, ultrahigh speed and low power consumption.

The new products can be stacked up and realize a high density of maximum 4 GB(Gigabytes, 32 Gb) solution in a single package. In addition, the height of this package becomes dramatically thinner than the existing 4 Gb-based one. In terms of its high density and competitive package height, it is suitable for the newest trend of the mobile applications.

Innodisk, a designer and manufacturer of SSDs for commercial and industrial applications, announces a release of the industrial-embedded industry's first SATA device in accordance to SATA µSSD standards - nanoSSD.

Through the integration of a control chip, flash memory and peripheral power components into a single ball grid array (BGA) package, Innodisk has managed to reduce the size of the nanoSSD to approximately 1% the size of a 2.5" SSD. With dimensions of only 16 x 20 x 2 mm (WxLxH), a weight of only 1.5g, SATA III support, capacities ranging from 4 to 64 GB and both x86 and ARM compatibility, nanoSSD can be incorporated into a wide variety of applications where a small form-factor and high transfer rates are important, including industrial mobile devices, embedded systems, tablets, high-end smart phones and Ultrabooks.

Toshiba Corporation today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.

Toshiba has used the new generation technology to develop the world's smallest 2-bit per-cell 64 gigabit NAND memory chips, with an area of only 94 square millimeters. Using a unique high speed writing method, the next generation chips can achieve a write speed of up to 25 megabytes a second - the world's fastest class* in 2-bit-per-cell chips.

Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, has begun volume production of its industrial temperature SATA and PATA interface NANDrive embedded solid state drives (SSDs) using 2-bits-per-cell (MLC) NAND flash memory. Overcoming the temperature sensitivity risk of MLC NAND, industrial temperature (I-temp) SATA and PATA NANDrive operate between -40 and +85 degrees Celsius.

Compared to significantly more expensive 1-bit-per-cell (SLC) NAND-based SSDs, I-temp MLC NANDrive offers cost-effective, ball grid array (BGA) products that meet quality and reliability requirements-such as avoiding uncorrectable errors and data retention issues-when the MLC NAND is operating at extremely low and high temperatures. NANDrive combines Greenliant's internally developed NAND controller with NAND flash die for a fully integrated SSD in a multi-chip package.

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ARMOS-800, an ultra-compact, fanless system designed around the tiny VIA VAB-800 Pico-ITX board. The VIA ARMOS-800 provides embedded customers with a ruggedized system that delivers advanced multimedia features in an extremely power efficient design for a diversified range of embedded applications.

Featuring an 800MHz Freescale ARM Cortex-A8 SoC with two integrated GPUs for dual display support, the VIA ARMOS-800 is optimized for both performance and power to meet the high-end demands of advanced industrial and in-vehicle applications. Boasting a ruggedized, fanless system design with a wide operating temperature range from -40°C up to 80°C, the VIA ARMOS-800 delivers a typical power consumption of a mere 3.14W TDP.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced a next-generation 64 GB embedded multimedia card (eMMC) using 10 nanometer (nm)-class process technology. The new 64 Gb NAND memory went into production late last month.

Myungho Kim, vice president of Memory marketing, Device Solutions, Samsung Electronics noted, "The new high-speed, small form factor eMMC reinforces Samsung's technology leadership in storage memory solutions. We look forward to expanding our line-up of embedded memory solutions in conjunction with the new chip's design, in pursuing a system-level adoption of application processors and other key components that form the foundation for the most advanced mobile platforms. This will allow us to better attend to time-to-market demands enabling the design of more convenient features for next-generation mobile applications."

Samsung Electronics Co., Ltd. today announced revenues of 52.18 trillion Korean won on a consolidated basis for the third quarter ended September 30, 2012, a 26-percent increase year-on-year. For the quarter, the company's consolidated operating profit reached an all-time high of 8.12 trillion won, representing a 91-percent increase year-on-year. Consolidated net profit for the July-September period was 6.56 trillion won.

In its earnings guidance disclosed on October 5, Samsung estimated third quarter consolidated revenues would reach approximately 52 trillion won with consolidated operating profit of approximately 8.1 trillion won. Samsung's solid performance is mainly attributed to increased sales of handheld phones and stronger demand for display panels. The Mobile Communications Business posted 26.25 trillion won in revenue for the quarter, accounting for more than half of Samsung's total revenue. As for the display panel segment, increased shipments of Organic Light-Emitting Diode (OLED) and Liquid Crystal Display panels used in tablets and smartphones, as well as TVs drove up profitability.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun volume production of 128-gigabyte (GB) embedded memory for next-generation smartphones, tablets and other mobile devices. Samsung started producing the new 128GB eMMC (embedded multimedia card) Pro Class 1500 in late August, which is only one month after it started delivering eMMC Pro products in 16-, 32- and 64-GB densities, rapidly completing the industry's widest line-up of eMMC products.

"By doubling the highest density of its previous eMMC products, Samsung expects to contribute significantly to a timely release of leading-edge mobile devices," said Wanhoon Hong, executive vice president, Memory Sales & Marketing, Samsung Electronics. "The higher data storage and faster data transmission will bring a range of benefits to users that compare to those of ultra-slim notebook PCs."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has now begun volume production of an ultra-fast embedded memory for smartphones, tablets and other mobile devices in 16-, 32- and 64-gigabyte (GB) densities.

The new Samsung eMMC (embedded multimedia card) Pro Class 1500 delivers the industry's fastest speeds for an embedded memory device, reading data sequentially at up to 140 megabytes per second (MB/s) and writing it at up to 50 MB/s. For random reading and writing, it can process up to 3500/1500 IOPS (inputs and outputs per second), four times the speed of previous eMMC solutions.

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA VAB-800 Pico-ITX embedded ARM board. Featuring a choice of an 800MHz or a 1GHz Freescale ARM Cortex-A8 processor, the VIA VAB-800 combines a wide operating temperature range with extremely low power consumption to meet the demands of high-end industrial and in-vehicle fanless embedded applications.

Based on the industry standard 10 cm x 7.2 cm Pico-ITX form factor created by VIA, the VIA VAB-800 Pico-ITX board combines a rich I/O set with superb multimedia performance, supporting playback of the most demanding video formats in resolutions up to 1080p. Leveraging VIA's hardware design expertise, the VIA VAB-800 delivers the highest I/O integration on the Pico-ITX form factor for an ultra compact yet highly flexible platform for the latest embedded devices.