On March 29th, the United States announced another round of updates to its export controls, targeting advanced computing, supercomputers, semiconductor end-uses, and semiconductor manufacturing products. These new regulations, which took effect on April 4th, are designed to prevent certain countries and businesses from circumventing U.S. restrictions to access sensitive chip technologies and equipment. Despite these tighter controls, TrendForce believes the practical impact on the industry will be minimal.

The latest updates aim to refine the language and parameters of previous regulations, tightening the criteria for exports to Macau and D:5 countries (China, North Korea, Russia, Iran, etc.). They require a detailed examination of all technology products' Total Processing Performance (TPP) and Performance Density (PD). If a product exceeds certain computing power thresholds, it must undergo a case-by-case review. Nevertheless, a new provision, Advanced Computing Authorized (ACA), allows for specific exports and re-exports among selected countries, including the transshipment of particular products between Macau and D:5 countries.

"The Earth is Blue," said Yuri Gagarin, the first human to journey into space. With two-thirds of its surface covered in water, Earth is a planet that exuberates its blue radiance in the dark space. However, today, the scarcity of water is a challenge that planet Earth is confronted with. For some, this may be hard to understand. What happened to our blue planet Earth? To put in numbers, more than 97% of the water on Earth consists of seawater, with another 2% locked in ice caps. That only leaves a mere 1% of water available for our daily use. The problem lies in the fact that this 1% of water is gradually becoming scarcer due to reasons such as climate change, environmental pollution, and population growth, leading to increased water stress. 'Water stress' is quantified by the proportion of water demand to the available water resources on an annual basis, indicating the severity of water scarcity as the stress index rises. Higher stress indexes signify experiencing severe water scarcity.

The semiconductor ecosystem, unsustainable without water
Because water stress issues transcend national boundaries, various stakeholders including international organizations and governments work to negotiate water resource management strategies and promote collaboration. UN designates March 22nd as an annual "World Water Day" to raise awareness about the severity of water scarcity running various campaigns. Now, it's imperative for companies to also take responsibility for the water resources given and pursue sustainable management.

Ryan McCurdy, President of Lenovo North America, revealed ambitious forward-thinking product roadmap during an interview with CRN magazine. A hybrid strategic approach will create an anticipated AI fast lane on future hardware—McCurdy, a former Intel veteran, stated: "there will be a steady stream of product development to add (AI PC) hardware capabilities in a chicken-and-egg scenario for the OS and for the (independent software vendor) community to develop their latest AI capabilities on top of that hardware...So we are really paving the AI autobahn from a hardware perspective so that we can get the AI software cars to go faster on them." Lenovo—as expected—is jumping on the AI-on-device train, but it will be diversifying its range of AI server systems with new AMD and Intel-powered options. The company has reacted to recent Team Green AI GPU supply issues—alternative units are now in the picture: "with NVIDIA, I think there's obviously lead times associated with it, and there's some end customer identification, to make sure that the products are going to certain identified end customers. As we showcased at Tech World with NVIDIA on stage, AMD on stage, Intel on stage and Microsoft on stage, those industry partnerships are critical to not only how we operate on a tactical supply chain question but also on a strategic what's our value proposition."

McCurdy did not go into detail about upcoming Intel-based server equipment, but seemed excited about AMD's Instinct MI300X accelerator—Lenovo was (previously) announced as one of the early OEM takers of Team Red's latest CDNA 3.0 tech. CRN asked about the firm's outlook for upcoming MI300X-based inventory—McCurdy responded with: "I won't comment on an unreleased product, but the partnership I think illustrates the larger point, which is the industry is looking for a broad array of options. Obviously, when you have any sort of lead times, especially six-month, nine-month and 12-month lead times, there is interest in this incredible technology to be more broadly available. I think you could say in a very generic sense, demand is as high as we've ever seen for the product. And then it comes down to getting the infrastructure launched, getting testing done, and getting workloads validated, and all that work is underway. So I think there is a very hungry end customer-partner user base when it comes to alternatives and a more broad, diverse set of solutions."

3DMakerpro, a pioneer in consumer-friendly 3D scanning technology, announces the launch of the Moose Series, beginner-friendly 3D scanners with AI visual tracking technology. The Moose series is 3DMakerpro's latest consumer-grade 3D scanner line-up offering, designed to handle real-world medium-sized objects into 3D models with remarkable efficiency and precision. Powered by a set of AI features and in collaboration with Oqton, developers of Geomagic Wrap, 3DMakerpro aspires to make 3D scanning easier and more accessible to beginners and advanced users in the creative field.

"The Moose series brings consumer 3D scanning to new heights of accuracy and allows more users to benefit from the convenience of 3D scanning," said Tianshi Yuwen, Global Marketing Director of 3DMakerpro. "Our dedication to innovation empowers us to democratize high-precision 3D scanning and push beyond the boundaries of making all creative visions a reality."

Cervoz brings its new storage solution to industrial applications with the launch of its new T425 Series M.2 NVMe SSDs-M.2 2230 (B+M) and M.2 2242 (B+M). Available in the compact 2230 and 2242 form factors, these PCIe Gen3x2 SSDs pack impressive performance into small footprints. Engineered for reliability and efficiency, the T425 Series provides industrial-grade solutions for embedded systems and space-constrained applications.

Space-Saving Form Factors for Seamless Integration
The tiny size of the T425 Series SSDs enables easy integration into small, fanless devices where internal space is limited. From in-vehicle systems and handheld scanners to medical equipment and industrial PCs, these SSDs allow seamless upgrades without compromising capacity or performance.

Yesterday, AMD announced that its cutting-edge adaptive computing technology was selected by Sony Semiconductor Solutions (SSS) for its newest automotive LiDAR reference design. SSS, a global leader in image sensor technology, and AMD joined forces to deliver a powerful and efficient LiDAR solution for use in autonomous vehicles. Using adaptive computing technology from AMD significantly extends the SSS LiDAR system capabilities, offering extraordinary accuracy, fast data processing, and high reliability for next-generation autonomous driving solutions.

In the rapidly evolving landscape of autonomous driving, the demand for precise and reliable sensor technology has never been greater. LiDAR (Light Detection and Ranging) technology plays a pivotal role in enabling depth perception and environmental mapping for various industries. LiDAR delivers image classification, segmentation, and object detection data that is essential for 3D vision perception enhanced by AI, which cannot be provided by cameras alone, especially in low-light or inclement weather. The dedicated LiDAR reference design addresses the complexities of autonomous vehicle development with a standardized platform to enhance safety in navigating diverse driving scenarios.

Construction of Intel's New Albany, Ohio fabrication site started back in late 2022—since then, a series of setbacks have caused anticipated timelines to slip. Team Blue's original plans included a 2025 opening ceremony—last month, this was amended to late 2026 or early 2027. New equipment deliveries have been affected by extreme weather conditions—Intel appears to be shoring up its flood prevention systems at their Licking County location. Ohio's Department of Development received a progress report at the start of this month, authored by Team Blue staffers—revised figures indicate that Fabrication sites 1 and 2 are expected to reach operational status somewhere within "2027-2028."

Jim Evers (Intel's Ohio Site Manager) stated: "we are making great progress growing the Silicon Heartland. In addition to the approximately $1.5 billion investment in completed spends through 12/31/23 referenced in the report, Intel has an additional $3 billion in contractually committed spends underway, totaling $4.5 billion committed toward our Ohio One projects." Intel committed a hefty $20 billion greenfield investment into the two Ohio wafer fab sites, but the latest progress report indicates that just under a quarter of that budget has trickled out of company coffers (so far). Evers's statement continued: "this investment is growing every day as we work to establish a new manufacturing campus to build leading-edge semiconductor chips right here in Ohio." A Tom's Hardware report reminds us about Team Blue's New Albany project receiving "over $2 billion in incentives." Industry rumors posit that the US government is readying a multi-billion dollar grant for Intel's Arizona facility.

Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America's first fan-out wafer-level packaging (FOWLP) research and development center.

The new Center for Advanced Wafer-Level Packaging Applications and Development is set to catalyze innovation in the United States, expanding domestic semiconductor manufacturing capabilities and driving advancements in cutting-edge fields such as artificial intelligence, machine learning, automotive electronics and high-performance computing.

Silicon Box, a cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6 billion (€3.2 billion) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility. This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028. The multi-year investment will replicate Silicon Box's flagship foundry in Singapore which has proven capability and capacity for the world's most advanced semiconductor packaging solutions, then expand further into 3D integration and testing. When completed, the new facility will support approximately 1,600 Silicon Box employees in Italy. The construction of the facility is also expected to create several thousand more jobs, including eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval of planned financial support by the Italian State.

As well as bringing the most advanced chiplet integration, packaging, and testing to Italy, Silicon Box's manufacturing process is based on panel-level-production; a world leading, first-of-its-kind combination that is already shipping product to customers from its Singapore foundry. Through the investment, Silicon Box has plans for greater innovation and expansion in Europe, and globally. The new integrated production facility is expected to serve as a catalyst for broader ecosystem investments and innovation in Italy, as well as the rest of the European Union.

At MWC Barcelona 2024, Huawei launched the Huawei OptiXtrans DC908 Pro, a new platform for Data Center Interconnect (DCI) designed for the intelligent era. This innovative platform ensures the efficient, secure, and stable transmission of data between data centers (DCs), setting a new standard for DCI networks. As AI continues to proliferate across various service scenarios, the demand for foundation models has intensified, leading to an explosion in data volume. DCs are now operating at the petabyte level, and DCI networks have evolved from single-wavelength 100 Gbit/s to single-wavelength Tbit/s.

In response to the challenges posed by massive data transmission in the intelligent era, Huawei introduces the next-generation DCI platform, the Huawei OptiXtrans DC908 Pro. Compared to its predecessor, the DC908 Pro offers higher bandwidth, reliability, and intelligence.

The NVIDIA H100 Tensor Core GPU was last year's hot item for HPC and AI industry segments—the largest purchasers were reported to have acquired up to 150,000 units each. Demand grew so much that lead times of 36 to 52 weeks became the norm for H100-based server equipment. The latest rumblings indicate that things have stabilized—so much so that some organizations are "offloading chips" as the supply crunch cools off. Apparently it is more cost-effective to rent AI processing sessions through cloud service providers (CSPs)—the big three being Amazon Web Services, Google Cloud, and Microsoft Azure.

According to a mid-February Seeking Alpha report, wait times for the NVIDIA H100 80 GB GPU model have been reduced down to around three to four months. The Information believes that some companies have already reduced their order counts, while others have hardware sitting around, completely unused. Maintenance complexity and costs are reportedly cited as a main factors in "offloading" unneeded equipment, and turning to renting server time from CSPs. Despite improved supply conditions, AI GPU demand is still growing—driven mainly by organizations dealing with LLM models. A prime example being Open AI—as pointed out by The Information—insider murmurings have Sam Altman & Co. seeking out alternative solutions and production avenues.

EdgeCortix, the Japan-based fabless semiconductor company focused on energy-efficient AI processing, announced today that the Acquisitions, Technology and Logistics Agency (ATLA), Japan Ministry of Defense, will include the groundbreaking edge AI startup alongside an elite group of leading Japanese companies to represent Japan's air and defense innovation landscape at ATLA's booth at the Singapore Airshow to be held February 20 - 25. The Singapore Airshow is one of the largest and most influential shows of its kind in the world, and the largest in Asia, seeing as many as 50,000 attendees per biennial show. Over 1,000 companies from 50 countries are expected to participate in the 2024 show.

EdgeCortix's flagship product, the SAKURA-I chip, will be featured among a small handful of influential Japanese innovations at the booth. SAKURA-I is a dedicated co-processor that delivers high compute efficiency and low latency for artificial intelligence (AI) workloads that are carried out "at the edge", where the data is collected and mission critical decisions need to be made - far away from a datacenter. SAKURA-I delivers orders of magnitude better energy efficiency and processing speed than conventional semiconductors (ex: GPUs & CPUs), while drastically reducing operating costs for end users.

WARBONDS: Supporting the Galactic War Effort—Getting geared up for the battlefield in Helldivers 2. What would a Helldiver be without their equipment? Our Deputy Game Director, Sagar Beroshi, sat down to talk to PlayStation Studios about the Warbond system in Helldivers 2! What is a Warbond? "We're trying to model a unique type of live service with the Warbonds. They're like getting a treasure chest full of toys," Sagar says. And he's right: the Warbonds are your ticket to fighting the Galactic War in style with lots of unlockable gear, but they reflect the changing tides of war on Super Earth as well. "It's been a century since the last game, and Super Earth is starting to get its military-industrial complex churning again. And to whom would it be better to offer gear than the Helldivers?" The items available will each have unique features that can offer a variety of tactics for play. "You're going to see some really cool items in the game, each one giving you different ways to approach problems within missions. So, get ready to armor up, drop in, and erase some enemy scum."

How do they work?
Warbonds give you access to multiple pages of unlockable content that can be obtained in a couple of different ways. Apart from the first Warbond—Helldivers Mobilize—which has been graciously gifted to you by Super Earth, you can unlock new Premium Warbonds using Super Credits. Super Credits can either be purchased from the in-game store or discovered in missions by exploring points of interest. Once you own a Warbond, you spend your hard earned medals to unlock your desired toys. Medals are awarded by completing objectives, missions, and operations. Medals can also be found the old-fashioned way by exploring the battlefield. Do you hate FOMO? We do! Sagar wants to be clear about the monetization in Helldivers 2: "At Arrowhead, we're gamers too, and we want these Warbonds to feel modern, fun, and in line with the Arrowhead style. This is important to us: the Warbonds are NOT a pay-to-win, FOMO-driven system. Instead, the gear in the Warbonds just keeps accumulating. We will not retire earlier Warbonds as new ones are released - you can pick them up and complete them at any time!"

Get ready to embark on a thrilling scientific adventure in Expeditions: A MudRunner Game. Saber Interactive, the renowned studio behind MudRunner and SnowRunner, has revealed an exciting new trailer that gives an overview of all the ways to overcome the immense wilderness awaiting you on March 5, 2024 on PlayStation 5, PlayStation 4, Xbox One, Xbox Series X|S, Nintendo Switch, and PC. To overcome all the challenges, select carefully the tools that will accompany you. Each successful mission also earns you a sum of money, which you can invest in new, even more efficient vehicles, or in a wide range of parts to improve them. Be forward-thinking and creative!

Pre-order the Supreme Edition, Year 1 Edition, or Standard Edition now on PlayStation 5, PlayStation 4, Xbox Series X|S, Xbox One, Steam or Epic Games Store for exclusive content. For more information, visit the official Focus Store page. Players getting the Supreme Edition or the Year 1 Edition will be able to play ahead of the release on March 1st.Embark on scientific expeditions with this new off-road adventure from the creators of MudRunner and SnowRunner. Lead research missions as you drive a variety of all-terrain vehicles, using high-tech tools and managing your camp and crew to ensure your success in the wild.

Dai Nippon Printing Co., Ltd. (DNP) has successfully developed a photomask manufacturing process capable of accommodating the 3-nanometer (10-9 meter) lithography process that supports Extreme Ultra-Violet (EUV) lithography, the cutting-edge process for semiconductor manufacturing.

Background
DNP has continually responded to the demands of semiconductor manufacturers in terms of performance and quality. In 2016, we became the world's first merchant photomask manufacturer to introduce the multi-beam mask writing tool (MBMW). In 2020, we developed a photomask manufacturing process for 5 nm EUV lithography processes, and have been supplying masks that meet the needs of the semiconductor market. In this latest development, in order to meet the needs of further miniaturization, we have developed a photomask for EUV lithography capable of supporting 3 nm processes.

Thanks to the TMTPost interview with the Global Vice President and China President of ASML, Shen Bo, the Dutch semiconductor equipment manufacturer has revealed that around 1,400 of its deep ultraviolet (DUV) lithography and metrology machines are currently installed in China. The company is expected to achieve a global output of 600 DUV equipment units by the end of 2025. Shen Bo stated that the company aims to install 500-600 units of DUV machinery in China by late 2025 or early 2026. The growth in ASML's Chinese revenues was notably high, with China contributing 46% of the company's system sales in 3Q 2023, representing an 82% revenue increase from the previous quarter.

China plans to build 25 12-inch wafer fabs in the next five years, covering logic wafers, DRAM, and MEMS production. ASML currently has a substantial presence in China, with 16 offices, 12 warehouses, distribution centers, development centers, training centers, and maintenance centers. The company employs over 1,600 people for its China operations. Despite the export restrictions imposed by the US government, ASML anticipates that the new measures will have little impact on its financial outlook for 2023 as it strives to meet the growing demand for semiconductor manufacturing equipment in the global market.

The Chinese semiconductor industry is advancing, and interestingly, it is growing rapidly under sanctions, even with the blacklisting of companies by the US government. China's semiconductor industry is mainly represented by companies like Semiconductor Manufacturing International Corp (SMIC) and Huawei Technologies, who are leading the investment and progress in both chip manufacturing and chip design. According to the latest interview with Bloomberg, former TSMC Vice President Burn J. Lin said that the US government and its sanctions can not stop the advancement of Chinese semiconductor companies. Currently, Lin notes that SMIC and Huawei can use older machinery to produce more advanced chips.

Even so, SMIC could progress to 5 nm technology using existing equipment, particularly with scanners and other machinery from ASML. Development under sanctions would also force China to experiment with new materials and other chip packaging techniques that yield higher performance targets. SMIC has already developed a 7 nm semiconductor manufacturing node, which Huawei used for its latest Mate 60 Pro smartphone, based on Huawei's custom HiSilicon Kirin 9000S chip. Similarly, the transition is expected to happen to the 5 nm node as well, and it is only a matter of time before we see other nodes appear. "It is just not possible for the US to completely prevent China from improving its chip technology," noted Burn J. Lin.

Today, the US authorities published the updated version of the advanced computing and semiconductor manufacturing equipment rule, imposing additional restrictions on export of advanced chip manufacturing technology. These regulations will become effective after a period of 30 days. Given the length and complexity of the regulations, ASML will need to carefully assess any potential implications. However, as to our business, from the information we received, it is our understanding that the new regulations will be applicable to a limited number of fabs in China related to advanced semiconductor manufacturing.

These export control measures will likely have an impact on the regional split of our systems sales in the medium to long term. However, we do not expect these measures to have a material impact on our financial outlook for 2023 and for our longer-term scenarios for 2025 and 2030, as communicated during our Investor Day in November 2022. ASML will seek further clarification from the US authorities on the scope of these new regulations. ASML is fully committed to comply with all applicable laws and regulations including export control legislation in the countries in which we operate.

As autumn continues, we have another week of big game releases to look forward to, hopefully with something that'll suit most gamers here. This week's AAA title involves a lot of sand, wars and monuments. As for the rest of this week's new games, you can be a tycoon, a driver of very expensive motor vehicles, craft your own stick, pretend to be a starship captain or you could be a monster slayer. Let us know if any of these tickle your fancy in the poll.

Total War: Pharaoh / This week's AAA title / Wednesday 11 October
In Total War: Pharaoh, the newest entry in the award-winning grand strategy series, immerse yourself in ancient Egypt at the zenith of its power and experience the dramatic events that threaten its destruction. With dynamic real-time battles and incredible turn-based empire management, can you rise above your adversaries to become Egypt's last great Pharaoh and stand against the collapse of an iconic civilisation?

Reuters appears to be following every (internal) step that TSMC takes—their latest report suggests that company leadership has "told its major suppliers to delay the delivery of high-end chip making equipment." Two anonymous sources believe that execs are anxious about a predicted decrease in customer demand, and cost control plans have been implemented as a temporary measure. ASML is allegedly one of the vendors affected by TSMC's decision making.

Reuters conducted an interview with ASML CEO Peter Wennink a week prior—he acknowledged that some orders for high-end tools had been pushed back, without naming specific client identities, but the situation should resolve itself shortly. He stated that it was a mere "short-term management" issue: "we've had several (news) reports about fab readiness. Not only in Arizona... but also in Taiwan." ASML is reported to be operating at maximum capacity, and overall sales are forecast to grow 30% this financial year.

China has sharply increased imports of semiconductor manufacturing equipment in recent months, customs data reveals. The country's purchases of chip production tools surged to record highs of nearly $5 billion in June and July, a 70% increase versus the same period last year, which amounted to $2.9 billion. The spike comes right before export restrictions on advanced chipmaking equipment are implemented by the U.S. and its allies. The moves aim to slow China's technological advancement, but Chinese chipmakers are stockpiling to avoid disruptions. Much of the equipment comes from the Netherlands and Japan, which have imposed licensing requirements on certain tool exports. While it's unclear how many are affected, the rush suggests China wants to expand production capacity and buffer against supply chain issues.

Chinese firms like SMIC and YMTC rely heavily on U.S., Dutch, and Japanese suppliers for cutting-edge manufacturing equipment. They are utilizing imported tools to boost the output of mature chips not subject to controls, particularly for electric vehicles, renewable energy, and industrial applications. Significantly, imports from the Netherlands doubled as lithography machines were delivered to Chinese foundries. Purchases from Japan also rose as companies procured etching tools and wafer coaters after 2020 U.S. restrictions. Newly established foundries backed by local governments contributed as Beijing pushed chip production expansions. Despite export control challenges, China aims to keep advancing its semiconductor capabilities. The import spike highlights intensified efforts to build self-sufficiency using older technology not covered by current limits.

With sequential IC sales declines beginning to moderate, the global semiconductor industry appears to be nearing the end of a downcycle and is expected to begin to recover in 2024, SEMI, in partnership with TechInsights, reported in the Semiconductor Manufacturing Monitor. In Q3 2023, electronics sales are projected to post healthy quarter-on-quarter growth of 10%, while memory IC sales are expected to log double-digit growth for the first time since the downturn started in Q3 2022. Logic IC sales are predicted to remain stable and improve as demand gradually recovers.

Headwinds will continue for the semiconductor manufacturing sector in the second half of the year, SEMI and TechInsights reported. Drawdowns of high inventory at integrated device manufacturer (IDM) and fabless companies will continue to suppress fab utilization rates to much lower levels than those in the first half of 2023. The weakness is projected to extend declines in capital equipment billings and silicon shipments for the rest of the year despite stable results in the first half of 2023.

On June 30th, the Netherlands introduced new export restrictions on advanced semiconductor manufacturing equipment. Despite facing export controls from the US, Japan, and the Netherlands, TrendForce anticipates the market share of Chinese foundries in terms of 12-inch wafer production capacity will likely increase from 24% in 2022 to an estimated 26% in 2026. Moreover, if the exports of 40/28 nm equipment eventually receive approval, there's a chance that this market share could expand even further, possibly reaching 28% by 2026. This growth potential should not be dismissed.

Several manufacturing processes including photolithography, deposition, and epitaxy will be subject to these recent export restrictions. Beginning September 1st, the export of all controlled items will require formal authorization. TrendForce reports that Chinese foundries have been primarily developing mature processes like 55 nm, 40 nm, and 28 nm. Furthermore, demand for deposition equipment can be largely met by local Chinese vendors, meaning concerns regarding expansion and development are minimal. The main limiting factor, however, remains the equipment used in photolithography.

Huawei announced they will launch a complete set of commercial 5.5G network equipment in 2024 at the 5G Advanced Forum during MWC Shanghai 2023. Huawei's Director and President of ICT Products & Solutions Yang Chaobin who made the announcement said the company intends for this launch to mark the beginning of the 5.5G era for the ICT industry.

5G deployment progressed rapidly over the past four years and is already yielding significant financial gains. Today, there are more than 260 commercial 5G networks worldwide, serving over 1.2 billion users, and there are already 115 million gigabit F5G users. With service models and content continuously evolving, breakthroughs in technologies like glasses-free 3D are creating unprecedented immersive experiences for users. However, these new services continue to require stronger 5G network capabilities. The industry has widely agreed that 5.5G will be a key milestone in 5G evolution, and that it is fast approaching.

Today, the U.S. Department of Commerce shared the Biden-Harris Administration's strategic vision to strengthen the semiconductor supply chain through CHIPS for America investments. To advance this vision, the Department announced a funding opportunity and application process for large semiconductor supply chain projects and will release later in the fall a separate process for smaller projects. Large semiconductor supply chain projects include materials and manufacturing equipment facility projects with capital investments equal to or exceeding $300 million, and smaller projects are below that threshold.

The announcement leads into the Biden-Harris Administration's Investing in America tour, where Secretary Raimondo and leaders in the Administration will fan across more than 20 states to highlight investments, jobs, and economic opportunity driven by President Biden's Investing in America agenda and the historic legislation he's passed in his first two years in office, including the bipartisan CHIPS and Science Act.