GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced that the BIOS of their series motherboards, including Intel X299, C621, C232, C236, C246, 200, 300, 400, 500 lineups, as well as AMD TRX40, 300, 400, 500 motherboards are TPM 2.0 function ready, which can pass the upgraded Windows 11 OS. verification.

Windows 11 is the latest operating system from Microsoft, and features dozens of exciting new functions and Android APP support to effectively improve productivity, system security, and gaming performance. However, most of the users might be confusing that Windows 11 requires TPM 2.0 support means they need a TPM module on board for Windows 11 upgrade.

EVGA Corporation, or simply EVGA as it is known in the community, is the maker of various PC components and peripherals. As many of you are aware, EVGA has historically been focused on making products based on silicon coming from NVIDIA and Intel. The company has used NVIDIA products exclusively for its GPU portfolio and used Intel chipsets for its motherboard solutions. In the past, EVGA made motherboards for AMD processors, however, these boards used NVIDIA's chipset so they weren't technically full AMD motherboards. Starting today, that is about to change as we got some very juicy teasers from EVGA. In the nine-second video teaser on YouTube titled "A new Darkness is coming...", EVGA showcased a simple animation showing the AMD Ryzen logo surrounding EVGA's.

And of course, that only means one thing. EVGA will officially be joining the ecosystem of AMD and offering motherboards for their Ryzen processors. While the company is "one of the top NVIDIA authorized partners" in GPUs, on the CPU front it is officially joining Team Red and marking an important milestone for everyone. It is still not clear what kind of motherboard we will be getting, however, we can expect to see EVGA's best engineering applied in the form of a possible X570 Dark motherboard.Below, you can see the video teaser.

At the beginning of June, MSI presented the brand-new X570S Series motherboards during MSI's online product launch event. The unique designs and remarkable features sparked widespread discussions. Here are more in-depth concrete details regarding the MSI MAG X570S Series. In 2019, AMD's X570 platform came out and became the first chipset that supports PCIe 4.0 solution. Even now, MSI X570 Series motherboards are undoubtedly a great lineup with high specifications and aggressive designs. However, MSI can't just stop there. Our mission is to deliver the best computing experience for every gamer and creator. The new X570S Series motherboards achieved exactly that.

MSI is dedicated to product optimization so the new motherboards are made with prominent features. The MAG X570S Series is at the forefront of this launch. Inspired by military design, the MAG X570S TOMAHAWK MAX WIFI and MAG X570S TORPEDO MAX share identical looks. More excitingly, the MAG X570S TORPEDO MAX now comes in the Pacific Blue colorway, which is all the rage for our fans. Apart from the attractive designs, the imperative modification is the fanless chipset heatsink. We removed the fan to reduce dust and noise, while the ranges of the heatsink are expanded. Also, both MAG X570S TOMAHAWK MAX WIFI and MAG X570S TORPEDO MAX have M.2 Shield Frozr. The former has an All aluminium Design while the latter has an Extended Heatsink Design.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of the newest X570S AORUS series motherboards primed to unleash the potential of the recently released AMD Ryzen 5000 series desktop processors with enhanced DrMOS direct power design and 6 layers and above ultra cool PCB for higher stability. The whole series equip with a brand new passive chipset thermal design and up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III, which ensures effective heat dissipation of full operation on chipsets and 7000 MB/s high speed operating on NVMe SSDs without throttling by overheating. The brand new X570S series motherboards kick off the PCIe 4.0 era with extensive feature sets.

The flagship X570S AORUS MASTER motherboard is fitted with a 16-phase direct digital power design for the more solid power management and optimized overclocking performance. With advanced heat dissipation technology of Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II and Smart Fan 6, GIGIABYTE X570S motherboards can maintain cool and high performance under high loading operation. Furthermore, GIGABYTE Active OC Tuner technology integrated in select motherboards to provide a more flexible performance improvement.

BIOSTAR, a leading brand of motherboards, graphics cards, and storage devices today, announces a refresh of their Intel H61MH series with the new H61MHV3 motherboard. Designed based on Intel's H61 single chip architecture, the new H61MHV3 motherboard from BIOSTAR breathes a fresh breath of life to older 2nd and 3rd generation processors from Intel.

Highly suited for business use and HTPC systems, the H61MHV3 motherboard comes with BIOSTAR's promised product reliability and long-lasting performance. It is capable of supporting up to 16 GB of DDR3 memory across 2 DIMM slots. USB 2.0 support with 8 USB ports provided with the motherboard for ease of use. Engineered to work well with Core i3, i5, i7, Pentium, and Celeron processors, the motherboard is designed with the latest components to provide smooth unhindered performance across all its components.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is pleased to announce a new series of coolers—TOUGHLIQUID 240/280/360 ARGB Sync All-In-One Liquid Coolers are now available for purchase.

This series of all-in-one liquid coolers are equipped with TOUGHFAN fans, a superior fan with speeds of up to 2000RPM and only 22.3 dBA and 33.2 dBA for TOUGHFAN 12 and TOUGHFAN 14 respectively; there are different sizes of fans corresponding to the different dimensions of radiators, users can choose from 240 mm, 280 mm, and 360 mm to achieve the finest cooling results in a quiet way. Besides that, there is a high-performance waterblock featuring a copper base plate, which expedites heat effectively. Plus, a high quality pump distributes a steady flow of water, keeping the copper plate continuously cool. With the low evaporation tube, the loss of coolant can be minimized; hence no refill is needed. Additionally, an exclusive built-in controller is settled on the side of the waterblock, which saves space by integrating with the waterblock and, at the same time, eliminates the cumbersomeness of routing cables.

As AI technology becomes ubiquitous, the impact of unusual weather also gains more attention. The most impressive case was the sudden weather change in Denver, the US, last September that the temperature dropped from 37°C to minus overnight. Faced with such fluctuation, the devices which maintained the daily life of the city in order, like the facilities for traffic flow analysis, surveillance, and AI visual analytics, could no longer operate normally, or even damaged, due to the lack of endurance to the extreme weathers.

Inspired by the situation, DFI brought an innovative design into the newly-released CS551, the "World's First 3.5" desktop SBC with auto heat-up". This breakthrough gives devices high performance with smaller footprint for image analysis or heavy workloads, no matter at subzero temperatures or under heat waves.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today presented two gaming systems of Intel Z590 platform with AORUS MODEL X and mini system AORUS MODEL S, which adopt the top-notch components and materials for extreme performance. Enhanced by the strict verification and leading technology, GIGABYTE provides the PC system of premium performance with optimized heat dissipation and acoustic control. The system maintains cool and quiet even under the overclocking, which balance the high performance and low temperature to keep the system acoustic under 40dB without throttling. Furthermore, the three-year warranty of full system offers reassuring and comprehensive service for users.

"When tackling the uplift of PC performance, multi-core, high frequency, and copious storage become a standard to the premium PC platform, as well as how to make the best components matrix to provide the optimized performance with reliability turns into more inevitable." indicated by Eddie Lin, Vice President of the GIGABYTE Channel Solutions. "The new AORUS system is well-tempered by multiple verification and tuning of GIGABYTE's R&D team, which provide a perfect match of cool, quiet, and powerful performance with optimized compatibility, Expandability, and three-year warranty of whole system.

MSI, the world's leading gaming motherboard brand, proudly announces the new flagship Intel Z590 MEG Series motherboards - the MEG Z590 ACE GOLD EDITION, MEG Z590 UNIFY, and MEG Z590 UNIFY-X. They're not only tailored for enthusiast gamers but also offered more possibilities to satisfy various desires - the luster of gold against endless darkness.

Gold symbolizes a unique attribute of pride and elites. The pure luster of gold, 24K presents utmost in color and luminosity. With craftsmanship and hours of dedication, the 24K gold and state-of-the-art technology have been harmonized into one. The MEG Z590 ACE GOLD EDITION boasts premium aesthetics with a brand new color scheme - the platinum color finish and genuine 24K-gold foil heatsink perfectly show off the concept of beauty.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest B560MX-E PRO and B560MH-E PRO motherboards. Designed to support Intel's 10th/11th Generation Intel Core Processors and professional graphics cards, the new B560 series motherboards are highly versatile. Powered by Intel's B560 chipset, these two new motherboards are efficient and robust in any use case.

PCI-e 4.0 and PCIe M.2 4.0 & M.2 Cooling, among other cutting-edge technology, adds up to a great platform, tailor-made for business or even casual use. The two new motherboards support up to 128 GB of DDR4 memory across 4 DIMM with an overclocking capability of up to 4000+(OC)MHz. Backed by BIOSTAR's proprietary Digital PWM technology, the new B560MX-E PRO, and B560MH-E PRO motherboards are safe and long-lasting, capable of supporting the best hardware with ease. Both motherboards pack all the essentials in their rear I/O panel with almost identical layouts on a Micro-ATX form factor.

When governments need a hardware upgrade, they will usually take the route of exploring options with security in mind. However, if you happen to have some engineering talent to employ on a new project, why wouldn't you just build a custom motherboard for your own purposes. Today, GS Group Holding and Philax, have announced that they are starting the manufacturing of Russia's first motherboard based on a B450 chipset from AMD. Looking at the motherboard, which you can see below, you might find it very similar to those of ASRock. And that is because Philax has a licensing agreement with ASRock to use the design of the B450M Pro4 motherboard, with the addition of a TPM module which is often used by government agencies, to produce this board.

Producing around 40,000 pieces, these motherboards are expected to handle anything from 4000 series to 5000 series of AMD processors. As far as the specifications go, the board is coming in a standard Micro-ATX form factor. It is equipped with four DDR4 memory slots that can take a memory with up to 3200 MHz speed. There are two PCIe 3.0 x16 slots and one PCIe 2.0 x1 slot, which are of course limited by CPU choice. The motherboard enables four SATA III and two M.2 ports for storage expansion. When it comes to I/O, the board features HDMI, D-Sub, DVI-D, four USB 3.1 Gen1, two USB 2.0, one USB Type-C, and one USB 3.1 Gen2 Type-A port. GS Group Holding and Philax also have a partnership that goes beyond just motherboards. They also plan to produce about 50,000 custom monitors for government purposes as well.

MSI, the world leading gaming motherboard brand, will release optimized BIOS updates for AMD 500-Series and 400-Series motherboards. From now on, the BIOS based on AM4 Combo PI V2 1.2.0.2 for all MSI 500 and 400 series motherboards will be available for download until the end of April. Please refer to the following.

• Optimized compatibility for AMD 500-Series and 400-Series motherboards
• Improved USB device compatibility

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest B550MX/E PRO and B550MH/E PRO motherboards. Built on AMD's B550 single chip architecture, the latest B550 series motherboards are designed to support AMD Ryzen 3rd Gen (Matisse/Renoir) and 4th Gen (Vermeer) processors. Ideal for business and casual use, the new B550 series motherboards from BIOSTAR are packed with all the latest essentials for a long-lasting user experience.

Both new motherboards come with the capability to support up to 128 GB of DDR4 fast-paced memory with an overclocking capability of 4933+ OC. PCIe 4.0 and PCIe M.2 4.0 provide excellent connectivity for graphics and storage expansion for all occasions with BIOSTAR's proprietary Digital PWM technology providing safe stable power management across all components.

CPU-Z, the CPU monitoring tool used to gather information about the processor your system is running on, has been updated with version 1.96. This new update doesn't change the software much but rather brings support for new hardware. Starting from this revision, Intel's upcoming Alder Lake CPUs have received preliminary support in the tool. To go along with CPUs, the software is now also enabled to recognize Intel's Z6xx motherboards that pair with Alder Lake processors. Alongside that, the software now also brings support for next-generation DDR5 memory, which is supposed to feature speeds anywhere from 4800 to 8400 MT/s. When it comes to AMD, the tool received an update that enables it to read information about AMD's Ryzen 5700G, 5600G, and 5300G APUs, and Radeon RX 6900 XT, 6800 (& XT), 6700 XT GPUs.Download CPU-Z Version 1.96 Here.

At a media event in China, MSI unveiled a handful new products it hasn't yet launched globally. These include the ATX MEG Z590 Unify series, and the new Spatium line of high-end M.2 NVMe SSDs. The company already launched the MEG Z590I Unify Mini-ITX motherboard, which will soon be joined by the larger MEG Z590 Unify and the MEG Z590 Unify-X, in the standard ATX form-factor. Both these Unify motherboards are targeted at professional overclockers, and are armed with powerful 16+2 phase CPU VRM solutions that use 90 A DrMOS, 8-layer PCBs, a trio of PCIe Gen 4 M.2 slots (possibly using PCIe segmentation of the x16 PEG slot); and the company's latest Audio Boost 5 onboard audio solution.

What sets the MEG Z590 Unify apart from the Unify-X is that the latter features just two DDR4 DIMM slots, or one DIMM per memory channel. This is the most desirable topology for memory overclocking (and a reason why memory OC records are usually set on Mini-ITX motherboards). Next up, the company unveiled the Spatium series of high-end M.2 NVMe SSDs. Available with a number of heatsink (options?), these drives take advantage of PCI-Express 4.0 x4 host interface, and come in capacities of up to 4 TB. They use 3D TLC NAND flash, and offer sequential transfer rates of up to 7000 MB/s reads, with up to 6900 MB/s writes.

In the course of our Core i5-11400F "Rocket Lake" processor review, we discovered that the Gear 2 memory mode has the potential to offer higher performance than Gear 1. The Gear 1 mode runs the memory frequency and memory controller frequency in 1:1 sync, while the Gear 2 mode runs them at 1:2, meaning that the memory controllers run at half the memory frequency, allowing you additional memory overclocking headroom. At lower, more stable, memory frequencies, it should be logical to use Gear 1. Our testing springs some surprising results.

Overall, a stock Core i5-11400F paired with DDR4-3733 MHz memory, was found to be 1.5% faster with Gear 2, when averaged across all our CPU tests, compared to Gear 1 at the same 3733 MHz frequency. Gear 2 was 3.42% faster in Cinebench R23 multi-threaded, and a staggering 6% in MySQL. Across rendering and media workloads that scale across all cores, we find Gear 2 faster by 1-3%. It's only with less parallelized workloads such as gaming, where we see Gear 2 lag behind Gear 1, though not by much. In our i5-11400F review, we show that by running your processor in Gear 2, you're making your memory controllers pull less power, freeing up power budget for the CPU cores, translating into the nT performance gains we see here. We discovered that the uncore can pull anywhere between 5 to 10 W more power in Gear 1 mode. This is valuable power eating into the already constrained power-budget of this 65 W TDP chip.

Read the Intel Core i5-11400F TechPowerUp Review

The leading global motherboard manufacturer, ASRock, proudly announces the return of its OC Formula motherboard lineup with the overclocker-designed Z590 OC Formula built for Intel's 11th-generation desktop processors. For years, ASRock has set the standard for overclocking with its previous OC Formula motherboards and its engineers have learnt from world-renowned overclocker Nick Shih, diligently studying what they need to break world records and perform their best. "As Intel launches its Z590 chipset to power the 11th Gen Intel Core processors, ASRock once again is your partner in conquering the overclocking world with the Z590 OC Formula," said Chris Lee, general manager of ASRock motherboard business unit.

Back by popular demand from overclockers, the ASRock Z590 OC Formula is filled with overclocking-friendly specs such as SMD Type DIMM Slots, a 12-layer server-grade low loss PCB, and 16 power phase 90 A smart power stage technology. ASRock's SMD DIMM Slots help reduce signal loss, as well as improve RAM stability under high frequency so you can maximize your memory overclocking potential. The 12-layer server-grade PCB prevents PCB bending and improves signal integrity, giving higher performance as well as system stability. Smart power stage technologies are optimized for monitoring the current and temperature of each power phase which means the CPU gets a smooth supply of power resulting in enhanced overclocking performance and capability.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, presents the CVN Z590M GAMING PRO micro-ATX motherboard for the 11th generation Intel Core processors. The CVN Z590M GAMING PRO features larger heatsinks and M.2 heatsink armor for improved heat dissipation. The motherboard supports PCIe 4.0 technology, enabling the motherboard to support the latest PCIe Gen4 solid-state drives.

The CVN Z590M GAMING PRO also features Resizable BAR technology that allows the processor to access graphics card memory to boost overall performance. The motherboard is equipped with a 10+2 hybrid digital power phase design, capable of delivering stable overclocks for up to an Intel Core i9 processor. It also comes equipped with metal-reinforced PCIe slots to support heavy high-performance graphics cards. The rear I/O includes a high-speed USB 3.2 Gen1 Type-C port. The motherboard also has an integrated rear I/O shield.

All of the MSI Z490 motherboards will be supporting PCIe 4.0 with the coming Intel 11th Gen Intel Processors. Through an update to the latest BIOS, MSI Z490 motherboards offer great bandwidth and performance for PCIe 4.0 M.2 SSDs and graphics cards.

To be PCIe 4.0 compatible, several components on the motherboards are necessary, including PCIe 4.0 ready clock generator, lane switch, redriver, PCIe slots, and M.2 connectors. Thanks to the complete PCIe 4.0 solutions, MSI Z490 motherboards provide the most stable design for PCIe 4.0 and unlock the full performance of PCIe 4.0 devices.

LIAN LI Industrial Co. Ltd., a leading manufacturer of aluminium chassis and PC accessories, hosts its second online event with the LIAN LI 2021 DIGITAL EXPO, which premiers February 18th, 9 am EST on YouTube (here). The 2021 DIGITAL EXPO unveils soon to be launched products, with new editions of the O11D MINI and UNI FANS, as well as exclusive looks at four prototypes. Each prototype will receive an in-depth look from case reviewers.

Q58: The Q58, a 14.3L SFF case, is equipped with split hinged panels made of tempered glass and aluminium mesh, and a dual-tone front solid aluminium panel. With support for MINI-ITX, 320 mm long GPUs, and up to 280 mm radiators, the Q58 is capable of supporting a variety of configurations with SFX PSUs or ATX PSUs due to an adjustable motherboard tray that can be moved for more clearance.

In a controversial move that baffles our technical understanding of how processor+chipset (platforms) work, Intel has decided to restrict the mid-tier B460 and entry-level H410 desktop motherboard chipsets from supporting 11th Gen Core "Rocket Lake-S" processors. A BIOS Updates Support page for Intel 400-series chipsets on the company website mentions "Motherboards based on Intel B460 or H410 chipsets are not compatible with upcoming 11th Gen Intel Core processors."

The company states that only the top Intel Z490 and next-best H470 chipsets support "Rocket Lake-S" from the 400-series, and such motherboards require a BIOS update from the motherboard manufacturer or pre-built OEM. We're having a hard time figuring out why the B460 or H410 have been excluded. With the H410, an argument can be made on insufficient CPU VRM capabilities of most motherboards; but the same can't be made for the B460, with several motherboard manufacturers having developed premium DIY motherboards with capable VRM solutions (eg: the ROG B460-F Gaming, or B460 AORUS Elite). Those looking to save some dough on mid-tier motherboards to use with "Rocket Lake" should now wait for Intel to launch the B560 chipset.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the launch of their new H510 series motherboards designed to run the latest Intel 11th gen Rocket Lake-S processors. Introduced to the market in two Micro-ATX models, the H510MH/E 2.0 and the H510MX/E 2.0 motherboards are designed to be the best choice for business and casual use. Based on Intel's H510 single chip architecture, these motherboards are ready to unleash the true potential of the latest Intel 11th gen processors.

Equipped with all the essential features, the new H510 series comes from an immensely popular lineage of motherboards from BIOSTAR used all over the world in many offices that combine cutting edge technology with proven durability for smart business solutions. Designed to optimize any professional workflow, the H510 series motherboards bring the latest technology for users like PCIe 4.0 and WiFi 6 optimized to perfection with the protection and stability of BIOSTAR's proprietary Super Hyper PWM technology. Both motherboards support dual-channel DDR4 memory, optimized to run up to 64 GB and a maximum clock speed 2933 MHz.

Here's the first picture of the MSI MPG Z590 Gaming Force, an interesting new product from MSI slotted in its upper-mid tier MPG line of motherboards. This Socket LGA1200 motherboard based on the Intel Z590 chipset is characterized by a Hip Hop design language that's a break away from the company's other MPG Z590 motherboards, with a dash of neon-noir colors. A pair solid ridged heatsinks cool the board's 16-phase CPU VRM. Another set of three heatsinks cover its three M.2 NVMe slots, one of which is PCIe Gen 4 and wired to the LGA1200 socket, and the other two to the Z590 PCH.

Expansion slots on the MPG Z590 Gaming Force include two PCI-Express 4.0 x16 (x8/x8 with both populated), an x16 (electrical PCI-Express 3.0 x4) slot that's wired to the PCH, and a pair of x1 slots. The rest of the board's feature set appears to roughly match the MPG Z590 Gaming Carbon, including a 6-pin PCIe power input to supplement the two 8-pin EPS and 24-pin ATX power inputs, POST debug readout, a fairly premium onboard audio solution, and other connectivity that possibly includes 2.5 GbE.

The Z590 motherboard lineups for both MSI and ASUS have just released and... They are interesting, to say the least. MSI will have as many as 12 different motherboard solutions, with the top one, the über-high-end MEG Z590 GODLIKE, retailing for as much as €999 ($1019). The MEG GODLIKE has faced a deep redesign compared to its predecessor, and there are two new MEG products directly under it - the MEG Z590 ACE and MEG Z590 UNIFY which are priced in a slightly less outrageous way (€479 for the MEG ACE, €379 for the MEG UNIFY). The cheapest MSI option stands as the Z590-A PRO, as €189.

As for ASUS, well... Things are looking pricey as well throughout its 13 models. The company's flagship model Z590 ROG MAXIMUS XIII EXTREME GLACIAL will go for a cool, not-at-all-collected €1516 (but that pricing does include a custom liquid-cooling monoblock designed in collaboration with EK). Descend a couple of steps down the ASUS product line ladder and you'll find the ROG MAXIMUS XIII EXTREME (€960) and the ROG MAXIMUS XIII HERO/APEX motherboards for €505. The cheapest ASUS motherboard mimics MSI's pricing at €189; for those euros, you'll snag yourself a PRIME Z590M-PLUS motherboard (check ASUS' entire lineup after the break). Is it just me, or it's getting pricier to keep DIY desktop construction as a hobby?

In a move that's possibly triggered by the MSI MEG B550 Unify X, GIGABYTE unveiled a limited edition variant of its X570 AORUS Master motherboard targeting overclockers—the X570 AORUS Master OC. This board does away with much of its aesthetic cladding, sheds the rear I/O shroud, and exposes its bare PCB for the most part. A much simpler fan-heatsink cools the X570 chipset. The CPU VRM area is cooled by a pair of aluminium fin-stack heatsinks that are joined by what looks like a flattened heat-pipe.

Perhaps the biggest design change with the GIGABYTE X570 AORUS Master OC has to be its memory set-up. The board has just two DDR4 DIMM slots, or one DIMM per memory channel. From a memory overclocking standpoint, this is the most optimal memory topology, and the reason why memory overclocking records are usually set on Mini-ITX motherboards (that have 1DPC memory configuration). Elsewhere we see a pair of PCI-Express 4.0 x16 slots wired to the CPU (x8/x8 with both populated), a third PCI-Express 4.0 x16 (electrical Gen 4 x4, wired to the X570 chipset), and three M.2 NVMe slots, each with PCI-Express 4.0 x4 wiring.