Lexar previewed part of their CES lineup late last week—we got a quick briefing that outlined various upcoming portable SSDs, M.2 NVMe SSDs, and professional CFExpress cards. TPU staffers spent some quality time at the storage specialist's booth in Las Vegas—they have reported back that emphasis has been placed on Lexar's portable SSD products. The headliner appears to be the prominently placed ARMOR 700 Portable SSD—this boasts an extra rugged design, thus providing the level of on-the-go protection that is required by modern professionals.

The ARMOR 700 will be available in three capacities: 1 TB, 2 TB and 4 TB. Maximum read and write speeds of 2000 MB/s are advertised on Lexar's wall-mounted exhibit, with support for 6K RAW video files. The rugged and durable housing has been certified at IP65, with drop-resistant properties. The already released SL660 BLAZE Gaming Portable SSD was showcased at CES, but it was joined by a similar looking (non-RGB equipped) sibling—the new SL600 is a more sober looking option, aimed at professional types. The SL500 Portable SSD sports credentials for a wide range of purposes: mobile devices, laptops, cameras as well as gaming on current generation games consoles. Lexar states that the SL500 is powered by Silicon Motion Technology portable SSD controllers—with speeds up to 2000 MB/s read and 1800 MB/s write. Capacities noted on the exhibit wall are 1 TB, 2 TB and 4 TB—this applies to the SL600 specification as well.

Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor ASA, NXP Semiconductors, and Qualcomm Technologies, Inc., have formally established Quintauris GmbH. Headquartered in Munich, Germany, the company aims to advance the adoption of RISC-V globally by enabling next-generation hardware development.

The formation of Quintauris was formally announced in August, with the aim to be a single source to enable compatible RISC-V-based products, provide reference architectures, and help establish solutions to be widely used across various industries. The initial application focus will be automotive, but with an eventual expansion to include mobile and IoT.

Today, AMD announced the extension of its 3rd Gen AMD EPYC processor family with six new offerings providing a robust suite of data center CPUs to meet the needs of general IT and mainstream computing for businesses seeking to leverage the economics of established platforms. The complete family of 3rd Gen AMD EPYC CPUs complements the leadership performance and efficiency of the latest 4th Gen AMD EPYC processors with impressive price-performance, modern security features and energy efficiency for less technically demanding business critical workloads.

The race to deliver AI and high performance computing is creating a technology gap for IT decision-makers seeking mainstream performance. To meet the growing demand for widely deployed, cost effective and proven mainstream solutions in the mid-market and in the channel, AMD is extending the 3rd Gen EPYC CPU offering to provide excellent value, performance, energy efficiency and security features for business-critical applications. The 3rd Gen AMD EPYC CPU portfolio enables a wide array of broadly deployed enterprise server solutions, supported by trusted channel sellers and OEMs such as Cisco, Dell Technologies, Gigabyte, HPE, Lenovo and Supermicro.

MediaTek today announced the Dimensity 9300, its newest flagship mobile chip with a one-of-a-kind All Big Core design. The unique configuration combines extreme performance with MediaTek's industry-leading power efficiency to deliver unmatched user experiences in gaming, video capture and on-device generative AI processing.

"The Dimensity 9300 is MediaTek's most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design," said Joe Chen, President at MediaTek. "This unique architecture, combined with our upgraded on-chip AI Processing Unit, will usher in a new era of generative AI applications as developers push the limits with edge AI and hybrid AI computing capabilities."

Apple today announced a new MacBook Pro lineup featuring the all-new family of M3 chips: M3, M3 Pro, and M3 Max. With a next-generation GPU architecture and a faster CPU, the M3 family brings even more performance and remarkable new capabilities to MacBook Pro. The new 14‑inch MacBook Pro with M3 is not only great for everyday tasks, but also delivers phenomenal sustained performance in pro apps and games. Perfect for aspiring creatives, students, and entrepreneurs, it now starts at $1,599. The 14 and 16‑inch MacBook Pro with M3 Pro provides even greater performance and additional unified memory support, enabling more demanding workflows for users like coders, creatives, and researchers. The 14 and 16‑inch MacBook Pro with M3 Max delivers performance and capabilities that push the limits of computing. With a monster GPU and a powerful CPU, along with support for up to 128 GB of unified memory, MacBook Pro with M3 Max enables extreme workflows and multitasking across pro apps for users like machine learning programmers, 3D artists, and video editors. M3 Pro and M3 Max models also now come in space black, a gorgeous dark aluminium finish.

All MacBook Pro models feature a brilliant Liquid Retina XDR display with 20 percent brighter SDR content, a built-in 1080p camera, an immersive six-speaker sound system, and a wide array of connectivity options. With up to 22 hours of battery life, the lineup offers the ultimate in pro portability, delivering the same performance whether plugged in or on battery, so users can take their workflows anywhere. Customers can order the new MacBook Pro starting today, with availability beginning November 7.

Qualcomm Technologies, Inc. today announced two new spatial computing platforms - Snapdragon XR2 Gen 2 and Snapdragon AR1 Gen 1 - that will enable the next generation of mixed reality (MR), virtual reality (VR) devices and smart glasses. Snapdragon XR2 Gen 2 Platform: The platform brings premium MR and VR technology into a single chip architecture to unlock next level immersive experiences in thinner and more comfortable headsets, that don't require an external battery pack.

Engineered to deliver a lag free experience with breathtaking visuals and fully immersive sound, the platform allows users to blend virtual content with their physical surroundings and transition seamlessly between MR and VR experiences.

What's New: Intel today announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore's Law to deliver data-centric applications.

"After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come."
-Babak Sabi, Intel senior vice president and general manager of Assembly and Test Development

Microsoft has scheduled a special product announcement event for next week—Germany's WinFuture has likely spoiled all mystery ahead of time by revealing two next generation Surface devices. It was already speculated that Microsoft would exhibit a bunch of new portable Windows PCs at the upcoming September 21 New York City-based shindig, but this week's leak treats us to photos and initial specifications for the Laptop Studio 2 and Laptop Go 3. The former retains its predecessor's 14.4-inch 3:2 format display, with a 2400×1600 resolution and 120 Hz refresh rate. Under-the-hood improvements for the Surface Laptop Studio 2 include a jump up to 13th Gen Intel Core Raptor Lake CPUs (from 11th Gen Tiger Lake)—WinFuture reckons that two options are lined up: Core i7-13700H and and Core i7-13800H. The Surface Laptop Studio 2's discrete graphics solution is speculated to be a mobile NVIDIA GeForce RTX 4050 or RTX 4060 GPU.

A base model could rely on an iGPU based on Intel Iris Xe graphics architecture. 64 GB of LPDDR5X memory is believed to exist with some configurations, which is a nice upgrade (albeit probably a very pricey option) over the previous generation's 16 or 32 GB RAM offerings. The leaked photos indicate that a Micro-SD slot and USB Type-A connector are new additions for 2023's model. The WinFuture article presents some prices—€2249 (~$2400) for the basic iGPU model, mid-tier with RTX 4050: €2729 (~$2915), and €3199 (~$3415) for an almost top flight model sporting 32 GB RAM and RTX 4060. The Surface Laptop Go 3, meanwhile, looks a little less exciting—it is said to get a CPU bump up to Intel Core i5-1135G and Core i5-1235U processors. Otherwise it looks largely similar to its previous-gen sibling. The leak did not include images of a reported Surface Go 4, but WinFuture expects it to be presented next week, powered by an Intel N200 SoC.

In a recent interaction with the community on Chinese social platforms, Tony Yu, better known as Uncle Tony and serving as the General Manager of ASUS China, shed light on several questions concerning ASUS's products. One question that captured attention was about the ROG Z790 APEX motherboard, a premium offering from ASUS designed explicitly for overclocking. Tony clarified that the motherboard is currently out of production as ASUS gears up to unveil an updated version. This move is in line with industry trends, with rivals like Gigabyte and MSI also refreshing their respective Z790 lineups. The updated motherboards from ASUS are expected to align with Intel's next-generation Core series known as Raptor Lake Refresh, featuring incremental improvements such as WiFi-7 standard integration, new color options, enhanced power delivery mechanisms, and advancements in memory overclocking capabilities.

Launched initially in November of the previous year with a price tag of $699, the ROG MAXIMUS Z790 APEX motherboard stood out for its superior features aimed at overclocking enthusiasts. These include 24 power supply modules, dual 8Pin power connectors, AI-driven overclocking technology, and support for DDR5 memory with speeds exceeding 8000 MT/s. It also offers a plethora of connectivity options, like five M.2 interfaces, a 2.5G network card, WiFi 6E, and USB 3.2 Gen 2x2 Type-C, along with 60 W QC 4+ fast charging. This motherboard gained popularity in December when it was used to set a world record CPU frequency of 9008.82 MHz using an Intel i9-13900K processor. Looking forward, the next generation of Intel Core processors could enable even higher overclocking frequencies. Apart from this, Tony tantalizingly hinted that ASUS is experimenting with innovative design changes, such as introducing connectors on the reverse side of motherboards, although this feature may not debut in the APEX series.

IBM has formally introduced watsonx, the company's next generation enterprise-focused artificial intelligence and data platform. Global business leaders remain unclear about the real, transformative power of AI and how to leverage it. The campaign is designed to define and differentiate watsonx as a force multiplier that can accelerate impact for global business leaders as they look to apply AI solutions in new and innovative ways.

The two distinct spots feature a fast-paced, multi-media technique that aims to provide inspiration and guidance around the value proposition of watsonx, while underscoring the need to identify the right AI that will empower businesses to advance objectives and accelerate workloads. These concepts come to life through potential use cases that spotlight the importance of applying AI that is trusted, targeted, and built on the best open technology available.

Google Cloud Next—Google Cloud and NVIDIA today announced new AI infrastructure and software for customers to build and deploy massive models for generative AI and speed data science workloads.

In a fireside chat at Google Cloud Next, Google Cloud CEO Thomas Kurian and NVIDIA founder and CEO Jensen Huang discussed how the partnership is bringing end-to-end machine learning services to some of the largest AI customers in the world—including by making it easy to run AI supercomputers with Google Cloud offerings built on NVIDIA technologies. The new hardware and software integrations utilize the same NVIDIA technologies employed over the past two years by Google DeepMind and Google research teams.

At Gamescom 2023 in Cologne we had a booth for fans to play Path of Exile 2 and try out the new Druid class - a spellcaster who channels the fury of nature on the battlefield to become a walking natural disaster. Check out our Gamescom Druid gameplay walkthrough below! Thanks to everyone who has come to play Path of Exile 2 at Gamescom so far! It was great meeting you in person, and the fan meetup beforehand was fantastic. We'll be at PAX West next week. See you there! For more information about Path of Exile 2 and to see the other trailers, visit pathofexile2.com.

Path of Exile 2 is a next generation Action RPG created by Grinding Gear Games. Set years after the original Path of Exile, you will return to the dark world of Wraeclast and seek to end the corruption that is spreading. Path of Exile 2 is a free-to-play online multiplayer game with co-op for up to six players.

Qualcomm Technologies, Inc. announced the all-new Snapdragon G Series handheld gaming portfolio, built to meet the unique performance and feature demands of dedicated gaming devices. The new Snapdragon G Series unlocks a range of options for playing the most sought-after games, offering boundless ways to play virtually any game, anywhere.

"Dedicated handheld gaming devices are the best way to experience mobile games. But gamers want to be able to play all their favorite games across devices and ecosystems, be it their console, PC, or on a cloud service" said Mithun Chandrasekhar, senior director of product management, Qualcomm Technologies, Inc. "The new generation of Snapdragon G Series powered devices will be the best place for gamers to play their favorite titles, offering them the ability to choose from the cloud, console, Android, or PC while on-the-go."

Today, AMD released the findings from a new survey of global IT leaders which found that 3 in 4 IT leaders are optimistic about the potential benefits of AI—from increased employee efficiency to automated cybersecurity solutions—and more than 2 in 3 are increasing investments in AI technologies. However, while AI presents clear opportunities for organizations to become more productive, efficient, and secure, IT leaders expressed uncertainty on their AI adoption timeliness due to their lack of implementation roadmaps and the overall readiness of their existing hardware and technology stack.

AMD commissioned the survey of 2,500 IT leaders across the United States, United Kingdom, Germany, France, and Japan to understand how AI technologies are re-shaping the workplace, how IT leaders are planning their AI technology and related Client hardware roadmaps, and what their biggest challenges are for adoption. Despite some hesitations around security and a perception that training the workforce would be burdensome, it became clear that organizations that have already implemented AI solutions are seeing a positive impact and organizations that delay risk being left behind. Of the organizations prioritizing AI deployments, 90% report already seeing increased workplace efficiency.

Courtesy of an SK Hynix keynote speech at the Flash Memory Summit, we now have a few more details about its upcoming 321-layer NAND Flash. PC Watch Japan who attended the industry event shared some pictures from the keynote which adds some crucial details that were missing from last week's press release. SK Hynix's officially shared performance figures tell us that we should expect up to 12 percent faster program performance, which should be the write performance and up to 13 percent improved read latency. Both of these performance metrics will obviously depend on the SSD controller the NAND is paired with, the related firmware on said controller and so forth.

PC Watch Japan also quotes a program throughput of 194 MB/s, which is 26 MB/s improvement over SK Hynix 176-layer NAND and currently the highest known program throughput of any announced NAND Flash. That said, Kioxia is expecting to hit 205 MB/s with its next generation of 300 layer NAND. SK Hynix also claims 10 percent better read power efficiency, which is really neither here nor there when it comes to modern SSDs, unless we're talking server level SSDs with a dozen of these NAND chips or more. Rather than going with two stacks of 150 plus layers each, SK Hynix went with three times 107 layer stacks, which should be compared to their current 238 layer product which has two stacks of 119 layers. This made the new NAND package easier to produce and should in the long term result in higher yields. Each NAND package is expected to deliver a memory density of 20 Gbit per square millimetre or more, which is almost twice that of its 176-layer NAND.

According to a short article released by ITHome, Machenike, a popular Chinese PC hardware company displayed several interesting Intel CPU-based systems at the Bilibili World exhibition (in Shanghai). The manufacturer confirmed (to the reporter) that their next generation hardware will be hitting the market within the next three months, which coincides with the rumored launch of Intel 14th Gen Core Raptor Lake-Refresh desktop K-series SKUs.

Exhibited material implied that Machenike's upcoming PCs—arriving in the form of a "LIGHT-05" desktop tower, mini models and laptops—could be among the first batch of systems to support PCIe Gen 5 storage (as standard). Potential buyers could be attracted to next-gen machines offering access to faster NVMe SSD, on top of rumored higher core counts provided by the Raptor Lake Refresh. ITHome believes that a number of the mini-PCs at Machenike's booth were already running on Raptor Lake Refresh or (Core rebrand) Meteor Lake processors.

Teledyne LeCroy, the worldwide leader in protocol test solutions, announced that it has received Video Electronics Standards Association (VESA) approval for testing DisplayPort 2.1 Link Training Tunable PHY Repeater (LTTPR) and Display Stream Compression (DSC) compliance with the quantumdata M42de Video Analyzer and Generator. These tests underwent extensive testing during industry workshops to ensure their accuracy and reliability and are now considered mandatory for compliance certification of DisplayPort 2.1 Ultra High Bit Rate (UHBR) capable devices.

The DisplayPort specification was updated to version 2.1 in October of 2022 and brought significant changes to link training and LTTPR operation. Design and test engineers are faced with incrementally more testing as DisplayPort chipsets add support for the new link training and other advanced features. "The need to drive higher video resolutions and frame rates raises the bar for vendors seeking VESA logo approval. Compliance testing is a key factor in delivering a robust DisplayPort technology ecosystem and outstanding customer experiences," said Bill Lempesis, executive director of VESA, which develops and administers the DisplayPort standard and compliance logo program. "Reaching this level of comprehensive test coverage so quickly after the DisplayPort 2.1 specification was released is only possible due to the close collaboration between test vendors like Teledyne LeCroy and our VESA member companies."

Qualcomm Technologies, Inc. and Meta are working to optimize the execution of Meta's Llama 2 large language models directly on-device - without relying on the sole use of cloud services. The ability to run generative AI models like Llama 2 on devices such as smartphones, PCs, VR/AR headsets, and vehicles allows developers to save on cloud costs, and to provide users with private, more reliable, and personalized experiences.

As a result, Qualcomm Technologies plans to make available on-device Llama 2-based AI implementations to enable the creation of new and exciting AI applications. This will allow customers, partners, and developers to build use cases, such as intelligent virtual assistants, productivity applications, content creation tools, entertainment, and more. These new on-device AI experiences, powered by Snapdragon, can work in areas with no connectivity or even in airplane mode.

Global LiFi technology firms pureLiFi and Fraunhofer HHI welcome the release of IEEE 802.11bb as the latest global light communications standard alongside IEEE 802.11 WiFi standards. The bb standard marks a significant milestone for the LiFi market, as it provides a globally recognised framework for deployment of LiFi technology.

LiFi is a wireless technology that uses light rather than radio frequencies to transmit data. By harnessing the light spectrum, LiFi can unleash faster, more reliable wireless communications with unparalleled security compared to conventional technologies such as WiFi and 5G. The Light Communications 802.11bb Task Group was formed in 2018 chaired by pureLiFi and supported by Fraunhofer HHI, two firms which have been at the forefront of LiFi development efforts. Both organisations aim to see accelerated adoption and interoperability not only between LiFi vendors but also with WiFi technologies as a result of these standardisation efforts.

Chinese tech tipster Enthusiast Citizen (ECSM) has once again posted about upcoming Intel CPU product launches—according to an inside info post (published via Bilibili), Team Blue has possibly scheduled their Raptor Lake Refresh/14th Gen Core K-series for a release window around the 42nd week of 2023 (October 17 - 23). ECSM posits that non-K models will arrive during the first week of 2024, coinciding with January's CES trade event. The Core i7-14700K model is said to feature a new configuration of 8 Performance and 12 Efficiency cores, and current LGA1700 motherboards will most likely require a firmware upgrade to run this specific SKU.

ECSM also seems to have insider information regarding motherboard chipsets for desktop Arrow Lake/15th Gen Core, although they cannot determine an accurate time frame for the (fully new) product launch. Intel Z890, B860 and H810 chipsets are named as possible upcoming candidates for proper next generation CPUs, with H870 allegedly dropped from development. ECSM claims that a competing AMD Zen 5 lineup is not arriving this year—prior insider information was perhaps fabricated. They believe that Storm Peak (Zen 4 Threadripper) is scheduled for Q4 2023, with two unnamed chipsets lined up to accompany this next-gen HEDT platform.

Last week Micron Technology CEO, Sanjay Mehrotra, announced during an investors meeting that the company's next generation GPU memory—GDDR7—will be arriving next year: "In graphics, industry analysts continue to expect graphics' TAM compound annual growth rate (CAGR) to outpace the broader market, supported by applications across client and data center. We expect customer inventories to normalize in calendar Q3. We plan to introduce our next-generation G7 product on our industry-leading 1ß node in the first half of calendar year 2024." His proposed launch window seems to align with information gleaned from previous reports—with NVIDIA and AMD lined up to fit GDDR7 SGRAM onto their next-gen mainstream GPUs, although Team Green could be delaying their Ada Lovelace successor into 2025.

Micron already counts these big players as key clients for its current GDDR6 and GDDR6X video memory offerings, but Samsung could be vying for some of that action with its own GDDR7 technology (as announced late last year). Presentation material indicated that Samsung is anticipating data transfer rates in the range of 36 Gbps, with usage of PAM3 signalling. Cadence has also confirmed similar numbers for its (industry first) GDDR7 verification solution, but the different encoding standard will require revising of memory controllers and physical interfaces.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its latest foundry technology innovations and business strategy at the 7th annual Samsung Foundry Forum (SFF) 2023. Under the theme "Innovation Beyond Boundaries," this year's forum delved into Samsung Foundry's mission to address customer needs in the artificial intelligence (AI) era through advanced semiconductor technology.

Over 700 guests, from customers and partners of Samsung Foundry, attended this year's event, of which 38 companies hosted their own booths to share the latest technology trends in the foundry industry.

AMD today announced the AMD Versal Premium VP1902 adaptive system-on-chip (SoC), the world's largest adaptive SoC. The VP1902 adaptive SoC is an emulation-class, chiplet-based device designed to streamline the verification of increasingly complex semiconductor designs. Offering 2X the capacity over the prior generation, designers can confidently innovate and validate application-specific integrated circuits (ASICs) and SoC designs to help bring next generation technologies to market faster.

AI workloads are driving increased complexity in chipmaking, requiring next-generation solutions to develop the chips of tomorrow. FPGA-based emulation and prototyping provides the highest level of performance, allowing faster silicon verification and enabling developers to shift left in the design cycle and begin software development well before silicon tape-out. AMD, through Xilinx, brings over 17 years of leadership and six generations of the industry's highest capacity emulation devices, which have nearly doubled in capacity each generation.

Pursue your dream of an aviation career with Microsoft Flight Simulator 2024. This brand-new simulator is designed to take advantage of the latest technologies in simulation, cloud, machine learning, graphics and gaming to create the most sophisticated, immersive and awe-inspiring flight simulator of all time. To achieve this unprecedented level of accuracy, Microsoft Flight Simulator 2024 is powered by the significantly evolved Asobo Studio engine.

Available day one on Xbox Game Pass, PC Game Pass, Xbox Cloud Gaming, Windows 10/11, and Steam. Coming 2024. We look forward to sharing more information about Microsoft Flight Simulator 2024 in the future.

The Korea Intellectual Property Rights Information Service (KIPRIS) has been processing a bunch of trademark applications in recent weeks, submitted by Samsung Electronics Corporation. News outlets pointed out, earlier on this month, that the South Korean multinational manufacturing conglomerate was attempting to secure the term "Snowbolt" as a moniker for an unreleased HBM3P DRAM-based product. Industry insiders and Samsung representatives have indicated that high bandwidth memory (5 TB/s bandwidth speeds per stack) will be featured in upcoming cloud servers, high-performance and AI computing - slated for release later on in 2023.

A Samsung-focused news outlet, SamMobile, has reported (on May 15) of further trademark applications for next generation DRAM (Dynamic Random Access Memory) products. Samsung has filed for two additional monikers - "Shinebolt" and "Flamebolt" - details published online show that these products share the same "designated goods" descriptors with the preceding "Snowbolt" registration: "DRAM modules with high bandwidth for use in high-performance computing equipment, artificial intelligence, and supercomputing equipment" and "DRAM with high bandwidth for use in graphic cards." Kye Hyun Kyung, CEO of Samsung Semiconductor, has been talking up his company's ambitions of competing with rival TSMC in providing cutting edge component technology, especially in the field of AI computing. It is too early to determine whether these "-bolt" DRAM products will be part of that competitive move, but it is good to know that speedier memory is on the way - future generation GPUs are set to benefit.