Today, Far Cry 5 is getting a 60 FPS patch on Xbox Series X|S and PS5 as part of its fifth anniversary celebrations. Take down Joseph Seed and his Heralds at twice the framerate as you explore the different regions in Hope County and liberate its citizens. The 60 FPS patch applies to all of Far Cry 5's game modes, as well as its three DLCs; Hours of Darkness, Lost on Mars, and Dead Living Zombies, making now the perfect time to dive into the backstories of Wendell Redler, Nick Rye, and Guy Marvel, respectively.

In addition to a smoother visual experience, Xbox Series X|S players will receive enhanced resolution for Far Cry 5. Xbox Series X will be able to run the game with a 3840x2160 and 4K resolution, while Xbox Series S will run it at a 1920x1080. PS5 players will still be able to take out the Seed family at 2880x1620 resolution.

With Samsung Electronics announcing that the next-generation GDDR7 memory standard is in development, and Cadence, a vital IP provider for DRAM PHY, EDA software, and validation tools announcing its latest validation solution, the decks are clear for the new memory standard to debut with the next-generation of GPUs. GDDR7 would succeed GDDR6, which had debuted in 2018, and has been around for nearly 5 years now. GDDR6 launched with speeds of 14 Gbps, and its derivatives are now in production with speeds as high as 24 Gbps. It provided a generational doubling in speeds from the preceding GDDR5.

The new GDDR7 promises the same, with its starting speeds said to be as high as 36 Gbps, going beyond the 50 Gbps mark in its lifecycle. A MyDrivers report says that NVIDIA's next-generation GeForce RTX 50-series, probably slated for a late-2024 debut, as well as AMD's competing RDNA4 graphics architecture, could introduce GDDR7 at its starting speeds of 36 Gbps. A GPU with a 256-bit wide GDDR7 interface would enjoy 1.15 TB/s of bandwidth, and one with 384-bit would have a cool 1.7 TB/s to play with. We still don't know what is the codename of NVIDIA's next graphics architecture, it could be any of the ones NVIDIA hasn't used from the image below.

Axelera AI, the provider of world's most powerful and advanced solutions for AI at the Edge today announces a strategic partnership with Advantech. Combining Advantech's expertise in the embedded and industrial PCs and Axelera AI's disruptive edge AI technology, together they will bring the inference power of a data center to edge devices, enabling customers to process data in real-time, reducing latency while increasing efficiency.

At Embedded World Axelera AI will show its new products, available in a range of industry-standard form factors varying from M.2 modules to vision ready systems. The products combine powerful processing performance with Metis AIPU technology and the easy-to-use Voyager SDK software stack, just at a fraction of the cost and power consumption of today's available solutions.

For more than a decade, Intel and its partners have been on a mission to virtualize the world's networks, from the core to the RAN (radio access network) and out to the edge, moving them from fixed-function hardware onto programmable, software-defined platforms, making networks more agile while driving down their complexity and cost.

Now operators are looking to cross the next chasm in delivering cloud-native functionality for automating, managing and responding to an increasingly diverse mix of data and services, providing organizations with the intelligence needed at the edge of their operations. Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).

Yesterday, Microsoft held a conference showcasing its next-generation AI solutions in partnership with OpenAI. Among them, the company showed that it is making steady progress toward integrating Large Language Models (LLMs) in the Bing search engine, which will appear soon. What is interesting about the future release is the new functionality and capability of LLM, which Microsoft says is much more potent than an existing solution like ChatGPT. OpenAI's ChatGPT is not suited particularly well for search engines and its capabilities, which is why Microsoft's next-generation Bing will use a custom LLM called Prometheus Model, envisioned for advanced search capabilities.

As the company notes, Prometheus will show users relevant search results and allow up to 1000 character input in the chat. Even when the model doesn't know the answer, it will not hallucinate and produce false results. Instead, Prometheus will point the user to further reading, allowing for a safer and more accurate search experience. Currently, anyone can go to Bing.com and join the waitlist to try out the preview of the upcoming Bing Chat. Microsoft Consumer Chief Marketing Officer Yusuf Mehdi said, "We're going to scale the preview to millions in the coming weeks." A mobile-tailored preview is coming soon as well.

Intel's upcoming LGA-7529 socket designed for next-generation Xeon processors has been pictured, thanks to Yuuki_Ans and Hassan Mujtaba. According to the latest photos, we see the massive LGA-7529 socket with an astonishing 7,529 pins placed inside of a single socket. Made for Intel's upcoming "Birch Stream" platform, this socket is going to power Intel's next-generation "Sierra Forest" Xeon processors. With Sierra Forest representing a new way of thinking about Xeon processors, it also requires a special socket. Built on Intel 3 manufacturing process, these Xeon processors use only E-cores in their design to respond to AMD EPYC Bergamo with Zen4c.

The Intel Xeon roadmap will split in 2024, where Sierra Forest will populate dense and efficient cloud computing with E-cores, while its Granite Rapids sibling will power high-performance computing using P-cores. This interesting split will be followed by the new LGA-7529 socket pictured below, which is a step up from Intel's current LGA-4677 socket with 4677 pins used for Sapphire Rapids. With higher core densities and performance targets, the additional pins are likely to be mostly power/ground pins, while the smaller portion is picking up the additional I/O of the processor.20:20 UTC: Updated with motherboard picture of dual-socket LGA-7529 system, thanks to findings of @9550pro lurking in the Chinese forums.

Comcast today announced the world's first live, multigigabit symmetrical Internet connection powered by 10G and Full Duplex DOCSIS 4.0. 10G technology will revolutionize the availability of ultra-fast speeds, by delivering multigigabit symmetrical services over the connections already installed in hundreds of millions of homes worldwide, without digging up yards or installing new connections.

For the world-first live trial, Comcast connected a business location in the Philadelphia region to its live network including a DOCSIS 4.0-enabled 10G node and multiple cable modems to deliver high speed data service to the site. Comcast engineers tested symmetrical speeds over the connection and will continue trialing 10G technologies over the next several months in preparation for offering 10G-enabled services to customers in the second half of 2023.

According to the well-known hardware leaker @momomo_us, HP is preparing the launch of its next-generation Omen 17 gaming laptops. And with a new generation of chips coming to consumers, HP accidentally made some information about laptop SKUs public. Four models are listed, and they represent a combination of Intel's 13th-generation Raptor Lake mobile processors with NVIDIA's Ada Lovelace RTX 40 series graphics cards for the mobile/laptop sector. The four SKUs are: CM2007NQ/CM2005NQ with Core i7-13700HX & RTX 4060 8 GB; CM2001NQ with Core i7-13700HX & RTX 4070 8 GB; CK2007NQ/CK2004NQ with Core i7-13700HX & RTX 4080 12 GB; CK2001NQ with Core i7-13700HX & RTX 4090 16 GB.

The most exciting find here is the appearance of the xx90 series in the mobile/laptop form factor, which has not been the case before. The GeForce RTX 4090 laptop edition is supposedly equipped with 16 GB of VRAM, and the GPU SKU should be a cut-down version of AD102 GPU adjusted for power and clock constraints so it can run within a reasonable TDP. With NVIDIA seemingly giving its clients an RTX 4090 SKU option, we have to wait and see what the CUDA core counts are and how clocks scale in a more restricted laptop environment.

AMD's next-generation Radeon RX 7900 high-end graphics cards are set to arrive next week and bring the new RDNA3 GPU architecture to the masses. However, it seems like the customers will have to fight for their purchase as the availability could be scarce at launch, leading to potentially increased prices with low stocks. According to Igor's Lab report, Germany will receive only 3,000 reference MBA (Made By AMD) units of Radeon RX 7900 series cards. In contrast, the rest of the EMEA region will receive only 7,000 MBA units. These numbers are lower than expected, so AIB partners may improve the supply once their designs hit shelves.

On the other hand, mainland China will not receive any MBA units of the new cards as a sign of increasing tension with Taiwan. Of course, AMD's board partners will supply their designs to China, and they are allowed to; however, it seems that only AMD is making a statement here. In addition to supply issues, the launch is rumored to be covered in BIOS issues such as memory leaks and the COVID-19 outbreak affecting production in closed factories. Of course, all of this information should be taken with a grain of salt, and we must wait for the official launch before making any further assumptions.

Semiconductor manufacturing is a significant investment that requires long lead times and constant improvement. According to the latest DigiTimes report, the pricing of a 3 nm wafer is expected to reach $20,000, which is a 25% increase in price over a 5 nm wafer. For 7 nm, TSMC managed to produce it for "just" $10,000; for 5 nm, it costs the company to make it for the $16,000 mark. And finally, the latest and greatest technology will get an even higher price point at $20,000, a new record in wafer pricing. Since TSMC has a proven track record of delivering constant innovation, clients are expected to remain on the latest tech purchasing spree.

Companies like Apple, AMD, and NVIDIA are known for securing orders for the latest semiconductor manufacturing node capacities. With a 25% increase in wafer pricing, we can expect the next-generation hardware to be even more expensive. Chip manufacturing price is a significant price-determining factor for many products, so the 3 nm edition of CPUs, GPUs, etc., will get the highest difference.

ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE).

The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking. All ASUS liquid-cooling solutions will be demonstrated in the ASUS booth (number 3816) at SC22 from November 14-17, 2022, at Kay Bailey Hutchison Convention Center in Dallas, Texas.

Here's the first picture of the "Navi 31" GPU at the heart of AMD's fastest next-generation graphics cards. Based on the RDNA3 graphics architecture, this will mark an ambitious attempt by AMD to build the first multi-chip module (MCM) client GPU featuring more than one logic die. MCM GPUs aren't new in the enterprise space with Intel's "Ponte Vecchio," but this would be the first such GPU meant for hardcore gaming graphics products. AMD had made MCM GPUs in the past, but those have been packages with just one logic die, surrounded by memory stacks. "Navi 31" is an MCM of as many as eight logic dies, and no memory stacks (no, those aren't HBM stacks in the picture below).

It's rumored that "Navi 31" features one or two SIMD chiplets dubbed GCDs, featuring the GPU's main number crunching machinery, the RDNA3 compute units. These chiplets are likely built on the most advanced silicon fabrication node, likely TSMC 5 nm EUV, but we'll see. The GDDR6 memory controllers handling the chip's 384-bit wide GDDR6 memory interface, will be located on separate chiplets built on a slightly older node, such as TSMC 6 nm. This is not multi-GPU-a-stick, because both SIMD chiplets have uniform access to the entire 384-bit wide memory bus (which is not 2x 192-bit but 1x 384-bit), besides the other ancillaries. The "Navi 31" MCM are expected to be surrounded by JEDEC-standard 20 Gbps GDDR6 memory chips.

Micron Technology, Inc., announced today that it is shipping qualification samples of its 1β (1-beta) DRAM technology to select smartphone manufacturers and chipset partners and has achieved mass production readiness with the world's most advanced DRAM technology node. The company is debuting its next generation of process technology on its low-power double data rate 5X (LPDDR5X) mobile memory, delivering top speed grades of 8.5 gigabits (Gb) per second. The node delivers significant gains across performance, bit density and power efficiency that will have sweeping market benefits. Beyond mobile, 1β delivers the low-latency, low-power, high-performance DRAM that is essential to support highly responsive applications, real-time services, personalization and contextualization of experiences, from intelligent vehicles to data centers.

The world's most advanced DRAM process node, 1β represents an advancement of the company's market leadership cemented with the volume shipment of 1α (1-alpha) in 2021. The node delivers around a 15% power efficiency improvement and more than a 35% bit density improvement with a 16Gb per die capacity. "The launch of our 1-beta DRAM signals yet another leap forward for memory innovation, brought to life by our proprietary multi-patterning lithography in combination with leading-edge process technology and advanced materials capabilities," said Scott DeBoer, executive vice president of technology and products at Micron. "In delivering the world's most advanced DRAM technology with more bits per memory wafer than ever before, this node lays the foundation to usher in a new generation of data-rich, intelligent and energy-efficient technologies from the edge to the cloud."

AMD just officially confirmed that its upcoming Radeon RX 7000 series next-generation graphics card will not use the 12+4 pin ATX 12VHPWR connector across the product stack. Scott Herkelman. SVP and GM of the AMD Radeon product group, confirmed on Twitter that the current RX 6000 series and future GPUs based on the RDNA3 graphics architecture, will not use this power connector. This would mean that even its add-in board (AIB) partners won't find the connector as a qualified part by AMD to opt for. This would mean that Radeon RX 7000 series will stick with 8-pin PCIe power connectors on the card, each drawing up to 150 W of power. For some of the higher-end products with typical board power of over 375 W; this will mean >2 8-pin connectors. AMD is expected to debut RDNA3 on November 3, 2022.

AMD appears to like to play coy when it comes to new product announcements, or at least the reveal of upcoming product announcements. Just as with its November 3rd event, the company has put out a miniscule teaser for its November 10th announcement of what the company is simply calling "the unveiling of our next-gen server processors" on Twitter. The event will kick off at 10 am Pacific time and it appears there will be a live stream, as AMD is inviting people to watch the event online. It's highly likely that we're talking about new EPYC parts here, as the event is called "together we advance_data centers".

Meta today announced its next-generation AI platform, Grand Teton, including NVIDIA's collaboration on design. Compared to the company's previous generation Zion EX platform, the Grand Teton system packs in more memory, network bandwidth and compute capacity, said Alexis Bjorlin, vice president of Meta Infrastructure Hardware, at the 2022 OCP Global Summit, an Open Compute Project conference.

AI models are used extensively across Facebook for services such as news feed, content recommendations and hate-speech identification, among many other applications. "We're excited to showcase this newest family member here at the summit," Bjorlin said in prepared remarks for the conference, adding her thanks to NVIDIA for its deep collaboration on Grand Teton's design and continued support of OCP.

Furthering its mission to address future enterprise infrastructure requirements, KIOXIA America, Inc. today announced that it has expanded its broad portfolio of client, enterprise and data center SSDs with the addition of the XD7P Series. Designed for hyperscale and general server applications in the new Enterprise and Data Center Standard Form Factor (EDSFF) E1.S form factor, XD7P drives are the second generation of E1.S SSDs with Open Compute Project (OCP) Data Center NVMe SSD 2.0 specification support from KIOXIA, following its XD6 series. KIOXIA XD7P drives are now sampling to select data center customers.

"Hyperscale needs of density, power, performance and serviceability are driving PCIe 5.0, E1.S, as a form factor, and the OCP Data Center NVMe SSD specification V2.0 for the data center," said Ross Stenfort, hardware storage engineer, Meta. "The KIOXIA XD7P Series SSD supports these storage technologies to enable the next generation of hyperscale needs."

Apple today announced the new iPad Pro with the M2 chip, delivering the ultimate combination of portability, versatility, and unbelievable performance. The new iPad Pro features a next-level Apple Pencil hover experience and superfast wireless connectivity, along with the world's most advanced mobile display, pro cameras, Face ID, Thunderbolt, and a four-speaker audio system. New features in iPadOS 16—including Stage Manager, full external display support, desktop-class apps, and Reference Mode—take pro workflows on iPad even further. Enabled by its advanced hardware and iPadOS 16, iPad Pro has an incredible ecosystem of powerful pro apps unlike any other device of its kind. The new iPad Pro is available to order starting today, and in stores beginning Wednesday, October 26.

"The next-generation iPad Pro pushes the boundaries of what's possible on iPad, bringing even more versatility, power, and portability to the ultimate iPad experience," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Powered by the M2 chip, the new iPad Pro features incredible performance and the most advanced technologies, including a next-level Apple Pencil hover experience, ProRes video capture, superfast wireless connectivity, and powerful iPadOS 16 features. There's nothing else like it."

Thermaltake, the leading PC DIY premium brand for Case, Cooling, Gaming peripherals, and enthusiast memory solutions, is excited to announce their latest addition to the PSU lineups, the Toughpower SFX series, which is designed to meet ATX 3.0 standards and is PCIe Gen 5.0 ready. Designed to run with the RTX 40-series series graphics cards and the latest Intel CPUs, the Toughpower series comes with an SFX-sized form factor and fits in the mainstream ATX and ITX cases, which is essential for users looking to put together a smaller-footprint build. The following are the Toughpower SFX series's dimension for your reference. 750 W & 850 W: 125 mm (W)x63.5 mm (H)x100 mm (D); 1000 W: 125 mm (W)x63.5 mm (H)x126 mm (D).

The Toughpower SFX series is fully modular and compatible with Intel's ATX 3.0 specifications, which allows users to run the latest RTX 40-series series graphics cards natively via the new 12+4 pin PCIe Gen 5 connector. In addition, it can pump up to 600 W of power over a single 12+4 cable, providing you with reliable and uninterrupted power. It is also worth noting that the Toughpower SFX series's components have been massively upgraded this time to meet ATX 3.0 standards, guaranteeing up to 70% efficiency at 2% load and complies with power supply timing standards, ensuring a silky smooth experience even at full load. In terms of its build quality, packed with 100% high-quality 105 °C Japanese capacitors, the SFX series is made even more durable and stable than ever before.

AMD (NASDAQ:AMD) today announced selected preliminary financial results for the third quarter of 2022. Third quarter revenue is expected to be approximately $5.6 billion, an increase of 29% year-over-year. AMD previously expected revenue to increase approximately 55% year-over-year at the mid-point of guidance. Preliminary results reflect lower than expected Client segment revenue resulting from reduced processor shipments due to a weaker than expected PC market and significant inventory correction actions across the PC supply chain.

Revenue for the Data Center, Gaming, and Embedded segments each increased significantly year-over-year in-line with the company's expectations. Gross margin is expected to be approximately 42% and non-GAAP(*) gross margin is expected to be approximately 50%. AMD previously expected non-GAAP gross margin to be approximately 54%. The gross margin shortfall to expectations was primarily due to lower revenue driven by lower Client processor unit shipments and average selling price (ASP). In addition, the third quarter results are expected to include approximately $160 million of charges primarily for inventory, pricing, and related reserves in the graphics and client businesses.

Today, the Windows 11 2022 Update rolls out in 190+ countries. The last few years have brought enduring changes in the ways we live, work and learn, with the PC playing a more critical role in our daily lives. Online options that didn't previously exist for meetings, appointments, everyday tasks and access to entertainment emerged out of necessity, but remain due to convenience and efficiency. We formed new habits; and they stuck. The PC has fundamentally connected us in more emotional ways than ever before.

The rapid move to more flexible work and life also dramatically increased security threats for individuals and businesses, with 921 password attacks every second. With last year's launch of Windows 11 we gave the PC a modern refresh, making it faster and easier for you to accomplish the tasks you have relied on your PCs for most. We added foundational security built into Windows at home and at work to help keep you safe and with Windows 365, we took Windows to the cloud, empowering organizations to stream the full Windows experience on any device. More people are using Windows and spending more time on their PCs. In fact, Windows 11 is the most used and most loved version of Windows ever.

AMD's upcoming Radeon RX 7000-series GPUs based on the RDNA3 graphics architecture, are rumored to be capable of engine clocks (GPU clocks) close to 4 GHz. This is plausible, given that the current-gen RX 6000-series can hit 3 GHz. AMD's play against the RTX 4090 will hence be a product with +50% performance/Watt gain over the previous generation, a significantly increased shader-count, an over 70% increase in memory bandwidth (384-bit memory running at 20 Gbps or more), faster/larger Infinity Cache, and to top it all off, engine clocks approaching 4 GHz.

Rockstar Games responded to the recent leaks of its next "Grand Theft Auto" game in development, which was splattered all over YouTube over the weekend. The studio sent takedown-notices to several popular news sites re-posting the found-footage, and YouTube dutifully took videos from the major channels down, but the Internet never forgets. The footage has been re-posted by thousands of smaller, non-commercial users on YouTube and other social media. The game itself doesn't "look" too next-gen, because Rockstar is still designing its mechanics, and will probably work on the eye-candy much later. In its statement, Rockstar said that a network intrusion caused the footage to leak to the web, but assured gamers that the leak won't affect Rockstar's online services, and have no impact in the medium-long term on games that are in development.

NVIDIA in a cryptic tweet earlier this morning (evening September 7 in the US); teased something it calls "Project Beyond," with no further description. It comes with an animation showing a bunch of green rays projecting outward. We're inclined to believe Project Beyond is a marketing campaign leading up to the launch of the next-generation GeForce RTX 40-series "Ada" graphics cards, given that it was tweeted from the NVIDIA GeForce handle, and not the main NVIDIA (corporate) handle. Intel used a similar overarching marketing campaign for the Arc "Alchemist" series, under "Odyssey." We should hear a lot more about NVIDIA's Project Beyond at the GTC conference slated for a little later this month.

Update 11:49 UTC: We're learning that NVIDIA is planning a GeForce-exclusive event on September 20.

MSI welcomes the MEG Ai1300P PCIE5 power supply unit, the world's first power supply unit to be fully ready for ATX 3.0 and PCIe 5.0. With graphics cards becoming all the more important, users must know what components to buy for their system if they are looking to upgrade. To understand why the MEG Ai1300P PCIE5 is the ultimate future-proof power supply unit, let's begin with understanding ATX 3.0.

ATX 3.0 is Intel's new specification standard for existing PSUs. In short, ATX 3.0's main purpose is to help provide more reliability, and better power efficiency and provide graphics cards up to 600 watts of power. ATX 3.0 is created in response to graphics cards' increase in performance and the ever-increasing need for power. ATX 3.0 puts heavy emphasis on power excursions to make sure high-performance graphics cards can be sustained and your system can remain stable. Thanks to ATX 3.0 there is now an increase in efficiency while idling and a new power connector is added to help achieve all the above. ATX 3.0 added a new PCIe 5.0 12VHPWR connector that features 12+4 pins instead of the traditional 6 or 8. With the new PCIe 5.0 connector, the power supply and cable can supply up to 600 watts of power.