A Closer Look

The ASUS DirectCU III cooler uses five heatpipes that make direct contact with the GPU's surface for as much heat transfer as possible.


Power delivery requires two 8-pin PCI-Express power connectors. This configuration is specified for up to 375 W power draw.


ASUS placed voltage-monitoring solder pads on their card, and the "OV" suggests that overvoltage might be possible.


ASUS rebranded the voltage controller on their card.


The HBM memory chips are made by Hynix. They are specified to run at 500 MHz. The two stacks pictured in the photo are each comprised of five stacked silicon dies, four DRAM and one controller. A total of four stacks are installed, sitting on the silicon interposer (the colorful parts), together with the large GPU die.


AMD's Fiji graphics processor uses the GCN shader architecture. It is produced on a 28 nm process at TSMC, Taiwan, with 8.9 billion transistors on a 596 mm² die.