If you had your eyes on those new Intel HEDT processors, which were posted just today with some... Interesting... price-points, you'll be a little miffed to know that Intel has gone on and done it again. The few cents per unit that soldering the CPU would add to the manufacturing costs of Intel's HEDT processors (starting at $999, tray-friendly prices) could definitely bring the blue giant to the red. As such, the company has decided to do away with solder even on its HEDT line of high-performance, eye-wateringly-expensive CPUs in favor of their dreaded TIM.

The news have been confirmed by der8auer, a renowned overclocker. And as you have probably seen in our own VSG's review (and if you haven't shame on you and click that link right away), delidding Intel's CPU's and ridding them of their TIM can improve temperatures by up to a staggering 21 ºC (case in point, an i7-7700K). And that's a quad-core CPU; imagine an Intel Core i9-7980XE 18-core processor sitting under that TIM, and overclocking it to boot. Those are more than four times the cores under an equally bad thermal interface; add to that the likely presence of a thermally-insulating air-gap, and you can imagine where this is going. If you are planning on going for Intel's HEDT platform, you better take those delidding tools off your shelf.

Update: Check this video here for some more information. Turns out both Skylake-X and Kaby Lake-X will make use of the referred TIM, but Skylake-X dies, which make use of a stacked PCB, won't be deliddable with current tools. A new tool is going to be developed by der8auer alongside ASUS for these chips.

Creating rich, immersive experiences and bringing them to life takes a lot of compute power. Creators, gamers and enthusiasts have an insatiable demand for more power, more performance and more capability that lets them focus on what they want to do, not on whether their computer is up to the task. Intel is committed to continue giving them that extreme platform. Introducing the new Intel Core X-series processor family: Intel's most scalable, accessible and powerful desktop platform ever. Ranging from 4 to 18 cores, it offers unprecedented scalability. With price points to match, there is an Intel Core X-series processor that is sure to meet the needs for the widest range of enthusiast customers ever.

We're also introducing the entirely new Intel Core i9 processor brand, representing the highest performance for advanced gaming, VR and content creation. At the top of the lineup is the new Intel Core i9 Extreme Edition processor - the first consumer desktop CPU with 18 cores and 36 threads of power. Select SKUs of the Intel Core X-series processor family brings extreme performance to enthusiasts with Intel Turbo Boost Max Technology 3.0 creating new levels of single-threaded and dual-threaded performance.

Videocardz is advancing an exclusive in that Intel seems to be about to introduce even more cores in a single package than previously thought. Intel's X299 platform, which we've just started officially started seeing some motherboards for (just scroll down on our news feed), looks to be the awakening of a slumbering giant. But you don't have to believe me on this: before we ever knew of AMD's Ryzen line of processors (much less about their Threadripper line), leaks on Intel's Skylake-X and Kaby Lake-X processors only showed core counts up to 10-cores - in line with previous Intel HEDT platforms (see below image.) Cue more recent leaks, and it would seem that Intel is increasing the core-counts on its upcoming platform on a daily basis - especially if the most recent leak referencing 14, 16 and 18-core parts pans out. (I am reminded of a "moar cores" meme that used to float around the web. Maybe one of you in the comments can find it for me?)

A new, leaked slide on Intel's X-series processors shows 18, 16, 14, and 12-core configurations as being available on the upcoming X299 platform, leveraging Intel's turbo Boost Max Technology 3.0 (which is apparently only available on Intel's Core i9-7820X, 7900X, 7920X (which we know to be a 12-core part), 7940X (probably the 14-core), 7960X (16-core) and the punchline 7980XE 18-core processor, which should see a price as eye-watering as that name tumbles around on the tip of the tongue. There is also mention of a "Rebalanced Intel Smart Cache hierarchy". But you don't want me to be rambling on about this. You want to comment about this story. Feel free to partake in a joyous conversation over these news (I'll also leave you with a bonus picture of some purported, upcoming Intel X-series packaging efforts. They're certainly colorful.)

Disclaimer: It's currently unclear whether or not the majority of these are actual X299 motherboards. Remember MSI's GODLIKE tease, which was expected to be a X299 motherboard due to the number of PCIe slots on offer, but ended up being a Z270-based one? Well, we remember, hence why we start with this disclaimer to pour some cold water on expectations. However, there is one model that can be said to be a X299 offering pretty confidently: MSI's tease of a new Gaming Pro motherboard, which shows the four RAM slots as close to the I/O bracket: a design usually reserved for quad-channel supporting platforms. Port design in the PCIe and M.2 fronts seems similar to the GODLIKE Z270, but it would seem that MSI has designed another kind of an M.2 Shield interface, which now encircles a PCIe port while cooling two simultaneous M.2 SSDs.

The next motherboard, which we can't confirm is really a X299 based-one, is teased by ASUS, under its Republic of gamers branding, which shows the integration a an LCD screen in the motherboard footprint. The LCD seems basic enough, and could be useful so as to visually check operating frequencies and temperatures, though ASUS naturally had to add their ROG bling to it. Seems like simple LED support was too 2016 for them.

SiSoft Sandra is one of the best (and more common) sources for details on upcoming, as-of-yet-unreleased hardware details and characteristics. Now, details on one of Intel's upcoming Skylake-X parts have surfaced, which gives us some details on what are likely final specifications, considering how close we are to X299's accelerated release.

The processor in the spotlight is one of Intel's 10-core processors, the Core i9 7900X (which is erroneously reported by the software as the Core i7 7900X), Intel's 10-core CPU. While initial reports pegged this CPU at as running at clock speeds of 3.30 GHz base and with 4.30 GHz Turbo Boost, it would seem Intel's release silicon will leverage much higher stock speeds, with the reported values on this SiSoft report being a staggering 4.0 GHz base, and 4.5 GHz Turbo Boost. These are extremely high clock speeds for a ten-core part, but all the other details about the Core i9 7900X check out: there are 14,080 KB (13.75 MB) of shared L3 cache, 1 MB L2 cache per core (for a total of 10 MB), as well as a 175 W TDP. This difference in clock speeds (especially when you compare it to Ryzen's much lower clock speeds) are probably an indicator of not only architectural differences between both designs, but a statement on Intel's fabrication process capabilities. And as an added bonus, check the motherboard that was used: a juicy, as-of-yet-unknown, X299 Gigabyte AORUS Gaming 7. Two details of this magnitude in a single screenshot? It's clearly a case of having your cake and eating it too.

MSI posted its third teaser pic for one of its upcoming socket LGA2066 motherboards, which is likely the X299 Gaming Pro. Designed for Core i7 "Kaby Lake-X" and Core i9 "Skylake-X" processors, the board appears to feature eight DDR4 DIMM slots (four slots on the left side of the socket). The teaser also gives us a glance of the LGA2066 socket, which could feature a similar retention mechanism to the current LGA2011v3 socket, even if the cooler support isn't consistent, given that some cooler manufacturers such as Noctua are already giving away LGA2066 brackets. The teaser pic also reveals two CPU power inputs, an 8-pin EPS and 4-pin ATX. This is unusual for a "mid-range" brand extension such as Gaming Pro, unless some of the Core i9 "Skylake-X" chips really do have >140W TDPs that demand more power inputs than your run of the mill single 8-pin EPS.

It seems that Intel's accelerated released schedule for its upcoming HEDT platform is starting to slowly bear fruits, with many details leaking through the cracks almost non-stop during the last few days (and before you ask, yes, I did have more links to show you.)

These should be two of the top performing processors in Intel's line-up, and the i9 7900X (10-core) and 7920X (12-core) have been tested on integer and floating point calculations. The 10-core i9-7900X (3.1 GHz base frequency, no Turbo listed)) scores 107 points in single-core benchmarks, and 1467 points in the multi-core test. The 12-core, 2.9 GHz base frequency 7920X, however, scores a head-scratchingly-higher 130 points in the same single-threaded benchmark, despite carrying the same architecture at... hmm... lower clocks. Maybe this processor's Turbo is working as expected, up to 3.25 GHz (average), and that's the factor for the higher single-core performance?

AMD Ryzen 9 "Threadripper" series 12-core, 14-core, and 16-core client desktop processors, which will form the company's next-generation high-end desktop (HEDT) lineup, which goes against Intel Core i9 "Skylake-X" series, could come in a brand new socket. This shouldn't come as a surprise because the chips have higher electrical requirements, besides double the I/O of socket AM4 Ryzen processors, such as a 44-lane PCIe gen 3.0 root complex, quad-channel DDR4 memory interface, and more. This socket, according to a "HotHardware" report, is an LGA (land-grid array) with 4,094 pins.

The new LGA-4094 socket, so-called SP3r2, will be slightly scaled up from the SP3 socket AMD has been selling enterprise Opteron-brand multi-socket CPUs on (pictured below). The consumer version of this socket could feature a more user-friendly retention mechanism that shouldn't require a screwdriver to fasten. Motherboards based on this distinctively rectangular socket will feature up to eight DDR4 DIMM slots to hold quad-channel DDR4 memory, and over four PCI-Express 3.0 x16 slots, with support for 3-way and 4-way multi-GPU solutions. The motherboards will also feature copious amounts of onboard devices, M.2 slots, and other storage connectivity. Since "Threadripper" is rumored to be a multi-chip module of two 14 nm "Summit Ridge" dies linked together on-package with with an Infinity Fabric interconnect, only one of the two dies links to the motherboard chipset (AMD X399 chipset), while all the PCIe lanes of the second die (including those which would make up the chipset bus) are freed up.

Today is an eventful day in the tech world, with two high-impact leaks already offering themselves up to our scrutiny. We had previously covered AMD's upcoming HEDT platform, based on the company's new X399 chipset, as having a quite distinctive lineup of processors, with not only 16 and 12-core offerings hot on foundries presses', but also some 14-core, 28-thread chips as well. Now, a leak has apparently revealed the entire Ryzen HEDT platform, whose processor marketing name, Ryzen 9, sounds really close to Intel's Core i9.

AMD's offerings look to offer an edge at least on core-count, with the Red team's top offerings, the Ryzen 9 1998X and Ryzen 9 1998, bringing in a game-changer 16 cores and 32 threads to the table. Perhaps even more importantly, we have to mention that the 1998X (these names, if true, are quite a mouthful, though) achieves a 3.5 GHz base, 3.9 GHz boost clock, which owes nothing to AMD's Ryzen 7 1800X consumer flagship CPUs. Rumors of AMD's frequency demise on higher core-count Ryzen CPUs have been greatly exaggerated, it would seem. And did I mention that these chips are coming with a TDP of 155 W - 5 W lower than Intel's purported 12-core, i9-7920X offering? Consider that for a moment.

The folks at MSI seem to be particularly fond of puzzles at this point in time, for no discernible reason. I say so because they've been giving us snippets of an upcoming high-end motherboard, which we have previously covered. At the time, we posited it would fall somewhere along the X299-end of the spectrum, considering the huge amount of PCIe x16 ports on-board.

It would seem those suspicions were founded, since MSI's other GODLIKE branded motherboards (which means they have all the bells & whistles available on time of their release) were X99-based, so it would follow that the new GODLIKE would usher in their footsteps as well. From the new piece of the puzzle, we can glean that this motherboard will offer, in addition to its 4x PCIe x16 ports and 3x M.2 slots over the X299's 44 PCIe lanes, 3x Ethernet connectors, 6x USB 3.1, and 2x Wi-Fi antennas. Expect this motherboard to be one of the most feature-packed offerings for Intel's expected ninth coming (of their Core i9-branded HEDT processors, that is.)

Intel is reportedly giving final touches to a new line of high-end desktop processors under the Core i9 brand extension. Until now, the company used the Core i7 brand extension broadly, to cover both the top-end parts of the mainstream-desktop (LGA115x) segment, and the high-end desktop (HEDT) segment, consisting of the LGA1366 and LGA2011-series sockets. With the advent of the new LGA2066 socket, Intel will be launching two distinct kinds of products - the Core i7 "Kaby Lake-X" quad-core series; and the Core i9 "Skylake-X" 6-core, 8-core, 10-core, and 12-core processors.

The Core i7 "Kaby Lake-X" will include the much talked about Core i7-7740K and i7-7640K quad-core processors (there's no Core i5 Kaby Lake-X). These chips will feature up to 1 MB of dedicated L2 cache per core, which is four times that of the existing i7-7700K chip. The i7-7740K features 8 MB of shared L2 cache; while the i7-7640K features just 6 MB. Interestingly, the i7-7640K also happens to lack HyperThreading, while the i7-7740K features it. The i7-7740K will ship with higher clock speeds than the i7-7700K, with 4.30 GHz core, and 4.50 GHz Turbo Boost. The i7-7640K features 4.00 GHz core, with 4.20 GHz Turbo Boost. The Core i9 series is a whole different beast.

Intel's posterboy processor for the 32 nm Westmere architecture, the six-core Gulftown is now living, breathing silicon. The company seems to have already dispatched samples of the chip. Gulftown is based on the LGA-1366 socket. Featuring 6 cores and 12 threads with HyperThreading enabled, it holds 12 MB of L3 cache to support the additional data load over the QuickPath Interconnect.

A noted enthusiast has two Gulftown processors running in a dual-socket setup. This 12 core, 24 thread monstrosity uses 24 GB of DDR3 memory using 4 GB modules (perhaps 2 x 3 modules). The processors are running at 2.40 GHz (18 x 133 MHz). The machine was put through WPrime multi-threaded benchmark. It crunched WPrime 32M in a little over 6 seconds, and 1024M in 145.6 seconds. Going by older information, Gulftown should be implemented in a commercial product in Q1 2010, when Intel plans a host of other important product launches. When released as Core i9, the processor will target the premium enthusiast market.

Last week, Intel sketched out its strategy in dealing with its client processor brand Core, and placing its different kinds of processors in series of markers (such as "i3", "i5", and "i7"), on the merit of performance and features they offer, and not necessarily a segregation based on core type and socket type. This raised a big debate in our forums, on who is really going to benefit from this kind of branding.

Chinese website INPAI.com.cn sourced information which explains what factors go into determining which brand marker a processor gets. The table elaborates on how different kinds of Intel processors (determined by core and socket types) cross different lines, with a few features toggled or enhanced. It is sure to throw up some surprises.