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Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling the latest generation of its Universal Flash Storage (UFS) Ver. 4.0 embedded flash memory devices. Supported in capacities of 256 gigabytes (GB), 512 GB, and 1 terabyte (TB), the new products are well suited for a variety of next-generation mobile applications, including leading-edge smartphones. The enhanced performance of the new UFS products provides optimal utilization of 5G connectivity, resulting in accelerated downloads, minimized latency, and an enhanced user experience. A smaller package size contributes to board space efficiency and design flexibility.
Kioxia was the first to introduce UFS technology, and continues to develop new products. The latest UFS Ver. 4.0 devices integrate the company's innovative BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2 gigabits per second (Gbps) per lane or 46.4 Gbps per device. UFS 4.0 is backward compatible with UFS 3.1.
Key Features include:
View at TechPowerUp Main Site
Kioxia was the first to introduce UFS technology, and continues to develop new products. The latest UFS Ver. 4.0 devices integrate the company's innovative BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2 gigabits per second (Gbps) per lane or 46.4 Gbps per device. UFS 4.0 is backward compatible with UFS 3.1.
Key Features include:
- Read / write speed improvement over previous generation: approx. +15% sequential write, +50% random write and +30% random read.
- Package size reduction over previous generation: Package size is 9 mm x 13 mm and package thickness is 0.8 mm (256 GB and 512 GB) and 0.9 mm (1 TB), resulting in an approx. 18% reduction compared to conventional package size (11 mm x 13 mm).
View at TechPowerUp Main Site