Asetek today announced Acer as a new data center OEM partner. Acer will incorporate Asetek liquid cooling technology into its Altos dual Skylake high performance servers (W2200h-W670h F4). Asetek will be displaying an example of an Acer server with liquid cooling at its booth (#1625) at SC17 in Denver, CO November 13-16th, 2017.

"Given their engineering and design expertise, we are pleased to have been selected by Acer as they incorporate liquid cooling into their next generation of high density and high wattage server designs," said John Hamill, Asetek Chief Operating Officer. "Partnerships with OEMs such as Acer are a key component of our strategy to develop the emerging data center market.""With liquid cooling becoming more important for HPC and data centers generally, Asetek's low pressure and flexibility in adapting to server designs were important differentiators in our choice of cooling partner," said Evis Lin, General Manager of Server Products Business at Acer.

Asetek liquid cooling solutions for HPC data centers include RackCDU D2C (Direct-to-Chip), and ServerLSL (Server Level Sealed Loop). RackCDU D2C provides cooling energy savings greater than 50% and density increases of 2.5x-5x. ServerLSL provides liquid assisted air cooling for server nodes, replacing less efficient air coolers and enabling the servers to incorporate the highest performing CPUs and GPUs.