Friday, November 27th 2020

TSMC Completes Its Latest 3 nm Factory, Mass Production in 2022

They say that it is hard to keep up with Moore's Law, however, for the folks over at Taiwan Semiconductor Manufacturing Company (TSMC), that doesn't seem to represent any kind of a problem. Today, to confirm that TSMC is one of the last warriors for the life of Moore's Law, we have information that the company has completed building its manufacturing facility for the next-generation 3 nm semiconductor node. Located in Southern Taiwan Science Park near Tainan, TSMC is expecting to start high-volume manufacturing of the 3 nm node in that Fab in the second half of 2022. As always, one of the first customers expected is Apple.

Estimated to cost an amazing 19.5 billion US Dollars, the Fab is expected to have an output of 55,000 300 mm (12-inch) wafers per month. Given that the regular facilities of TSMC exceed the capacity of over 100K wafers per month, this new facility is expected to increase the capacity over time and possibly reach the 100K level. The new 3 nm node is going to use the FinFET technology and will deliver a 15% performance gain over the previous 5 nm node, with 30% decreased power use and up to 70% density increase. Of course, all of those factors will depend on a specific design.
Source: Tom's Hardware
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56 Comments on TSMC Completes Its Latest 3 nm Factory, Mass Production in 2022

#51
medi01
SovsefandenDirectML will never bring what DLSS does
Brought to you by... "RDNA2 will only compete with 2080Ti" folks, known as "spot off team"... :roll:
You sound like you don't know what DirectML does, little one. :D
(if you wanted upscaling tech from AMD, it's FidelityFX CAS, Checkboard rendering)
But let me elaborate:

DirectML is Microsoft's API that reduces API overhead when doing neural network inference (i.e. "processing" input through the neural network that already has been trained).



The demo has brought up "NN upscaled" vs billinear upscaling (not the best upscaling we have mind you) visible on this pic:



Looks pretty good, although, one needs to note that:
  • this was done using NV's NN along with weights
  • the said stuff is available on the respective github ;)
  • too slow even on 2080Ti, sad
It wipes the floor with TAA derivative, but is too computationally expensive at the moment.


devblogs.microsoft.com/directx/gaming-with-windows-ml/
Sovsefanden[it is too painfull to read, whaaat, that picture cannot be real, whaaaa whaaaa.... but I can still write something insulting!]
No problems, and sorry if it offended your feelings as an owner of 3080.
I hope you didn't overpay scalpers.
SovsefandenI can actually afford new and relevant hardware
Oh, you poor thing, could not afford 3090? So sad.
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#52
user112
they may call it 3nm but in reality it's probably more like 4.5nm given how they brand their nodes.
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#53
TheoneandonlyMrK
AndrewIntelThis solution (3nm) is based on a 12 inch wafers but in the future the industry will move to 18 inch wafers, which means higher utilization of the fab and better pricing per wafer and eventually better prices to the end user. Basically much more dies per wafer. This die per wafer calculator show the various options per wafer size: anysilicon.com/die-per-wafer-formula-free-calculators/
It's a old thread but so is that 18" promise, the simple fact is you build the fab to do 18" , or you don't.

And few have or are.
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