- Joined
- Jan 8, 2017
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System Name | Good enough |
---|---|
Processor | AMD Ryzen R9 7900 - Alphacool Eisblock XPX Aurora Edge |
Motherboard | ASRock B650 Pro RS |
Cooling | 2x 360mm NexXxoS ST30 X-Flow, 1x 360mm NexXxoS ST30, 1x 240mm NexXxoS ST30 |
Memory | 32GB - FURY Beast RGB 5600 Mhz |
Video Card(s) | Sapphire RX 7900 XT - Alphacool Eisblock Aurora |
Storage | 1x Kingston KC3000 1TB 1x Kingston A2000 1TB, 1x Samsung 850 EVO 250GB , 1x Samsung 860 EVO 500GB |
Display(s) | LG UltraGear 32GN650-B + 4K Samsung TV |
Case | Phanteks NV7 |
Power Supply | GPS-750C |
Anyone with 2 brain cells could tell you that air cannot move through solid metal, but upon contact it cools it depending on temperature of the air.
The flow of air once it hits though depends on which direction the gaps dictate.
Saying they are designed that way is not correct, it is physically impossible for air to dissipate any other way with such a design.
Anyone with 2 brain cells probably figured out what I said, what solid metal, what are you talking about ? The air is exhausted through the sides of the heatsinks because the PCB is in the way, so yes it's designed that way. For part of this design the air supposedly is meant to go directly perpendicularly through the heatsink, except that, like I pointed out, the that area looks closed off.
It's not like such design defies physical laws.
It doesn't, it's just severely inefficient.