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- Jul 5, 2013
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Why?Would love to see a PTM7950 comparison as well.
Can't see any reason why not.All cool to work with water blocks? Thanks.
Why?Would love to see a PTM7950 comparison as well.
Can't see any reason why not.All cool to work with water blocks? Thanks.
7950X is not a great CPU for testing thermal interface because it has high thermal resistance due to the thick heatspreader.Anothers review with a @ 14900K & 7950X would be amazing too like a part #2. Testing with a watercooling setup on CPU and pushing high load, for see how the sheet is good versus like KPX paste and LM
System Name | Firelance. |
---|---|
Processor | Threadripper 3960X |
Motherboard | ROG Strix TRX40-E Gaming |
Cooling | IceGem 360 + 6x Arctic Cooling P12 |
Memory | 8x 16GB Patriot Viper DDR4-3200 CL16 |
Video Card(s) | MSI GeForce RTX 4060 Ti Ventus 2X OC |
Storage | 2TB WD SN850X (boot), 4TB Crucial P3 (data) |
Display(s) | 3x AOC Q32E2N (32" 2560x1440 75Hz) |
Case | Enthoo Pro II Server Edition (Closed Panel) + 6 fans |
Power Supply | Fractal Design Ion+ 2 Platinum 760W |
Mouse | Logitech G602 |
Keyboard | Razer Pro Type Ultra |
Software | Windows 10 Professional x64 |
Nonsense. The IHS on the AM5 line-up has not shown any attributes that would indicated inhibited performance.7950X is not a great CPU for testing thermal interface because it has high thermal resistance due to the thick heatspreader.
How so? The sheet is flexible and thus would flex right along with any "bend" from the CPU.14900K bends slightly in the socket which may be a problem for the sheet.
No, an ideal CPU based test would be an OC'd Threadripper, full stop. However, the direct-die-contact made by the Radeon GPU W1zzard used provides the most ideal testing scenario one can get regardless of the type of heat-source. A better testing situation simply doesn't exist.The ideal test setup would be 14900K with a mounting frame, it can deliver a lot of heat too...
Incorrect. AM5 CPUs thermal throttle with far lower thermal output than LGA1700 CPUs. You can pump 300W from LGA1700 CPU without hitting thermal limit, you simply cannot do that with AM5 CPU without delidding it.Nonsense. The IHS on the AM5 line-up has not shown any attributes that would indicated inhibited performance.
The sheet is flexible but the base of the cooler is not.How so? The sheet is flexible and thus would flex right along with any "bend" from the CPU.
I actually do not think that the sheet is perfect for direct die cooling, because it does not seem to be perfectly homogeneous, unlike a layer of metal TIM under a heatspreader (provided there are no bubbles/voids in it).No, an ideal CPU based test would be an OC'd Threadripper, full stop. However, the direct-die-contact made by the Radeon GPU W1zzard used provides the most ideal testing scenario one can get regardless of the type of heat-source. A better testing situation simply doesn't exist.
Citation?Incorrect. AM5 CPUs thermal throttle with far lower thermal output than LGA1700 CPUs. You can pump 300W from LGA1700 CPU without hitting thermal limit, you simply cannot do that with AM5 CPU without delidding it.
Sit back and think that over for a moment or two..The sheet is flexible but the base of the cooler is not.
You're welcome to your opinion, but the laws of physics would argue(successfully) that direct-to-die testing is optimal.I actually do not think that the sheet is perfect for direct die cooling
You seem to be missing the context of both the testing parameters and the point of direct-to-die testing as a methodology.because it does not seem to be perfectly homogeneous, unlike a layer of metal TIM under a heatspreader (provided there are no bubbles/voids in it).
System Name | Purple Haze | Vacuum Box |
---|---|
Processor | AMD Ryzen 7 5800X3D (-30 CO) | Intel® Xeon® E3-1241 v3 |
Motherboard | MSI B450 Tomahawk Max | Gigabyte GA-Z87X-UD5H |
Cooling | Dark Rock 4 Pro, P14, P12, T30 case fans | 212 Evo & P12 PWM PST x2, Arctic P14 & P12 case fans |
Memory | 32GB Ballistix (Micron E 19nm) CL16 @3733MHz | 32GB HyperX Beast 2400MHz (XMP) |
Video Card(s) | AMD 6900XTXH ASRock OC Formula & Phanteks T30x3 | AMD 5700XT Sapphire Nitro+ & Arctic P12x2 |
Storage | ADATA SX8200 Pro 1TB, Toshiba P300 3TB x2 | Kingston A400 120GB, Fanxiang S500 Pro 256GB |
Display(s) | TCL C805 50" 2160p 144Hz VA miniLED, Mi 27" 1440p 165Hz IPS, AOC 24G2U 1080p 144Hz IPS |
Case | Modded MS Industrial Titan II Pro RGB | Heavily Modded Cooler Master Q500L |
Audio Device(s) | Audient iD14 MKII, Adam Audio T8Vs, Bloody M550, HiFiMan HE400se, Tascam TM-80, DS4 v2 |
Power Supply | Rosewill Capstone 1000M | Enermax Revolution X't 730W (both with P14 fans) |
Mouse | Logitech G305, Bloody A91, Amazon basics, Logitech M187 |
Keyboard | Redragon K530, Bloody B930, Epomaker TH80 SE, BTC 9110 |
Software | W10 LTSC 21H2 |
Common knowledge.Citation?
"flexible" that means "able to flex" does not mean, that it can move the material from the area with high pressure to the area with low/no pressure unlike the normal thermal paste.Sit back and think that over for a moment or two.
It is not. Optimal for testing coolers and TIM is a heatplate with configurable and exact heat output. Using CPU or GPU as a heatsource is a lazy amateur approach.You're welcome to your opinion, but the laws of physics would argue(successfully) that direct-to-die testing is optimal.
Processor | 5800x3d |
---|---|
Motherboard | MSI Tomahawk x570 |
Cooling | Thermalright |
Memory | 32 gb 3200mhz E die |
Video Card(s) | 3080 |
Storage | 2tb nvme |
Display(s) | 165hz 1440p |
Case | Fractal Define R5 |
Power Supply | Toughpower 850 platium |
Mouse | HyperX Hyperfire Pulse |
Keyboard | EVGA Z15 |
Well, to see how it compares? I'm looking at purchasing some to put in my laptop.Why?
Can't see any reason why not.
System Name | Bragging Rights |
---|---|
Processor | Atom Z3735F 1.33GHz |
Motherboard | It has no markings but it's green |
Cooling | No, it's a 2.2W processor |
Memory | 2GB DDR3L-1333 |
Video Card(s) | Gen7 Intel HD (4EU @ 311MHz) |
Storage | 32GB eMMC and 128GB Sandisk Extreme U3 |
Display(s) | 10" IPS 1280x800 60Hz |
Case | Veddha T2 |
Audio Device(s) | Apparently, yes |
Power Supply | Samsung 18W 5V fast-charger |
Mouse | MX Anywhere 2 |
Keyboard | Logitech MX Keys (not Cherry MX at all) |
VR HMD | Samsung Oddyssey, not that I'd plug it into this though.... |
Software | W10 21H1, barely |
Benchmark Scores | I once clocked a Celeron-300A to 564MHz on an Abit BE6 and it scored over 9000. |
System Name | THU |
---|---|
Processor | Intel Core i5-13600KF |
Motherboard | ASUS PRIME Z790-P D4 |
Cooling | SilentiumPC Fortis 3 v2 + Arctic Cooling MX-2 |
Memory | Crucial Ballistix 2x16 GB DDR4-3600 CL16 (dual rank) |
Video Card(s) | MSI GeForce RTX 4070 Ventus 3X OC 12 GB GDDR6X (2610/21000 @ 0.91 V) |
Storage | Lexar NM790 2 TB + Corsair MP510 960 GB + PNY XLR8 CS3030 500 GB + Toshiba E300 3 TB |
Display(s) | LG OLED C8 55" + ASUS VP229Q |
Case | Fractal Design Define R6 |
Audio Device(s) | Yamaha RX-V381 + Monitor Audio Bronze 6 + Bronze FX | FiiO E10K-TC + Sony MDR-7506 |
Power Supply | Corsair RM650 |
Mouse | Logitech M705 Marathon |
Keyboard | Corsair K55 RGB PRO |
Software | Windows 10 Home |
Benchmark Scores | Benchmarks in 2024? |
Processor | Ryzen 7 5700X |
---|---|
Memory | 48 GB |
Video Card(s) | RTX 4080 |
Storage | 2x HDD RAID 1, 3x M.2 NVMe |
Display(s) | 30" 2560x1600 + 19" 1280x1024 |
Software | Windows 10 64-bit |
Great suggestionsAlso you can hook up thermal shrink tube to any tweezers and make it as a gentle pick up tool. Be creative.
Pro tip is to use a bit larger and put some small thermal paste dots in the substrate corners, so it sticks while you align the heatsink on.
Processor | Ryzen 7800X3D |
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Motherboard | ASRock X670E Taichi |
Cooling | Noctua NH-D15 Chromax |
Memory | 32GB DDR5 6000 CL30 |
Video Card(s) | MSI RTX 4090 Trio |
Storage | Too much |
Display(s) | Acer Predator XB3 27" 240 Hz |
Case | Thermaltake Core X9 |
Audio Device(s) | Topping DX5, DCA Aeon II |
Power Supply | Seasonic Prime Titanium 850w |
Mouse | G305 |
Keyboard | Wooting HE60 |
VR HMD | Valve Index |
Software | Win 10 |
Citation?
Common knowledge.
System Name | N\A |
---|---|
Processor | AMD Ryzen 7 5800X3D (BOX) |
Motherboard | ASUS ROG Crosshair VIII Dark Hero (BIOS v4902) |
Cooling | Noctua NH-D15 + NA-HC4 + NM-AMB12 (all chromax.black) |
Memory | 4x8GB Team Group Xtreem DDR4-4133 (3800@1900 15-15-15-15-30-45_T1 (55), V1.48) |
Video Card(s) | EVGA GeForce RTX 3080 Ti FTW3 Ultra Gaming |
Storage | 500GB Samsung SSD 980 Pro (System); 1TB Samsung SSD 990 Pro (Games and other) |
Display(s) | Philips Brilliance 239CQH (IPS, 1080p, 60Hz) |
Case | Open Stand |
Power Supply | Seasonic PRIME Ultra 850 Titanium |
Keyboard | Corsair K70 RGB RAPIDFIRE (1000Hz, with CHERRY MX Speed switches) |
Software | Microsoft WIndows 11 Pro 23H2 |
Try to use Putty instead of pads. You will not have to worry about thickness.It's REALLY cool to see review of KryoSheet on TPU!
I hope it help boost (a bit) development and wide spread of such products (and more research in this direction).
I personally tested Panasonic PGS and soft-PGS sheets. Latest i tested was Thermal Grizzly Carbonaut on RTX 3080 Ti FTW3 Ultra Gaming. There is small catch with this things:
0.2 mm thickness
On my GPU i got 2 mm (instead of 2.25mm by default) thermal pads (GP-Extreme from GELID) on VRAM. This give me memory overheat. Even if it wasn't part of a testing - it show problem. Of course when i removed Carbonaut and apply thermal paste again - VRAM temp back to normal.
So, need to pay more attention not only to dimensions (cut to die), but also thickness of sheet.
Last experiment was to apply GC4 from GELID, but VERY thin layer (0,05mm - thickness of Kapton tape) and test it. I got doubts it's even work, but decided to test anyway. It work awesome! After that i decided to apply same layer on my CPU - 5800X3D and got decent temperatures again!
System Name | MightyX |
---|---|
Processor | Ryzen 9800X3D |
Motherboard | Gigabyte X650I AX |
Cooling | Scythe Fuma 2 |
Memory | 32GB DDR5 6000 CL30 |
Video Card(s) | Asus TUF RTX3080 Deshrouded |
Storage | WD Black SN850X 2TB |
Display(s) | LG 42C2 4K OLED |
Case | Coolermaster NR200P |
Audio Device(s) | LG SN5Y / Focal Clear |
Power Supply | Corsair SF750 Platinum |
Mouse | Corsair Dark Core RBG Pro SE |
Keyboard | Glorious GMMK Compact w/pudding |
VR HMD | Meta Quest 3 |
Software | case populated with Artic P12's |
Benchmark Scores | 4k120 OLED Gsync bliss |
Processor | AMD Ryzen 7 9800X3D |
---|---|
Motherboard | Asrock X870E NOVA |
Cooling | Arctic Liquid Freezer III 360 |
Memory | G.Skill TRIDENT Z 32GB 6000MHz CL30 DDR5 |
Video Card(s) | MSI Suprim X RTX 4080 16GB |
Storage | Kingston KC3000 1TB |
Display(s) | Alienware AW3423DWF 34" 21:9 OLED |
Case | Antec C8 |
Power Supply | NZXT C1200 Gold ATX 3.1 |
Mouse | Roccat Kone Air |
Keyboard | OZONE StrikePro Spectra (CherryMX Red) |
Software | Windows 11 Pro x64 |
So you don't have any, that's all you had to say.Common knowledge.
In the context of testing absolute heat transfer in laboratory conditions, maybe. In the context of testing with ACTUAL electronics intended for use? No. The GPU test used in this review was an excellent choice. The only other choice would have been to use stock CPU setup, like a 14900K, 7950X or Threadripper model. When it comes to testing thermal interface materials, you don't use lab conditions, you use contextual testing, IE, you test with examples of equipment that the TIM is intended to be used for/on/with. Only then can you get a proper understanding of ACTUAL, real world performance.It is not. Optimal for testing coolers and TIM is a heatplate with configurable and exact heat output.
Says the person NOT doing the professional work? You're not helping your argument by taking silly jabs at known credible methodologies and people who are known for be very through in their work. You think you can do better hotshot? Prove up or shut-up. Do your own tests with your own equipment and let's see the results.Using CPU or GPU as a heatsource is a lazy amateur approach.
Ah, right, I've seen that. Here's the thing, DB's conclusion is based on a specific set of metrics and school of thought. Even he stated those were just his thoughts. In practicality, whatever limitations exist are not causing enough thermal transfer bottlenecking to be a problem even at full load for the 7000 series CPUs. So the argument of the thicker IHS, while worthy of momentary consideration, is not something to be concerned about.I don't know why he couldn't just link you a source but here is what you are looking for:
According to Derbauer the IHS on Ryzen 7000 series CPUs is both thicker and has less surface area.
The short and easy answer, it will do fine. Most general use TIMs perform within 5% of each other these days. Unless you're doing extreme OCing or you have a very high-end part, go with one that doesn't dry out or need replacing every year and you're good. Laptop you say? Buy what you want, smear it on. You're good to go.Well, to see how it compares? I'm looking at purchasing some to put in my laptop.