Ink cartridges for inkjet printers comes to mind. Once all manufacturers follow suit, it's a great way to massively shrink the size of the overall market. Very much an own-goal.
It's targeting non-SSD environments. Execute-In-Place (XIP) embedded solutions. There is no indication it uses hybrid DRAM approach so therefore it will rely on such SOCs also including internal SRAM for working memory as well as XIP caching support.
What would make sense to me is TSMC bring to the table not their technical know-how of fabricating, but rather the business operations around providing comprehensive foundry services for thousands of customers and tens of thousands of products at once. That's traditionally been an afterthought...
It's fair to say Asrock aren't all that concerned. Their main concern was with possible firmware or manufacturing problems. Since they've effective ruled those out they're happy to let it rest.
EDIT: Actually, looking at the photos, the dirt has come from the burnt CPU. So, it's not foreign...
They're not attributing any blame really, even the dirt mentioned is not attributed to any particular event. Treating it as a one-off that doesn't warrant any further investigation. Which is fair enough for now.
Well that's confusing. I thought "foundry" was the name used for the customer facing contract manufacturing division. Here it seems to be talking about the back end fabrication.