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Traditionally, NVIDIA designs dual-GPU accelerators with two PCBs holding a GPU system each. With the GeForce GTX 295 and its competitive pricing, NVIDIA found itself in a difficult position, as it faces direct competition from ATI with its now competitively priced Radeon HD 4870 X2. On the one hand, escalating manufacturing costs due to extreme competition with the sub-$300 graphics card market, is making it difficult for NVIDIA to keep up with GTX 295 stocks, on the other its repercussions that include bad press and losses due to not being able to keep up with demand, have pushed NVIDIA to rethink a way to make the GeForce GTX 295.
Enter innovation. The company is reportedly redesigning the GeForce GTX 295, this time on a single PCB design, which ATI has been using for its dual-GPU accelerators. Both GPU systems of the GTX 295 will be placed on a single PCB. This is expected to significantly bring down manufacturing costs, allowing the company to keep up with demands and competitive pricing. Expreview sourced the drawings of one of the prototypes, which shows a long single PCB card, with a central fan. You will also observe that there is a back-plate in place. It shows that a number of memory chips will be populated on the back, and both GPU systems on the front. It will be an engineering challenge, to populate five major heat-producing components (two G200b GPUs, two NVIO2 processors, and one BR-03 bridge chip), 28 GDDR3 memory chips, and the VRM area to power it all. The new redesigned card may surface internally in April, and may enter production by May.
View at TechPowerUp Main Site
Enter innovation. The company is reportedly redesigning the GeForce GTX 295, this time on a single PCB design, which ATI has been using for its dual-GPU accelerators. Both GPU systems of the GTX 295 will be placed on a single PCB. This is expected to significantly bring down manufacturing costs, allowing the company to keep up with demands and competitive pricing. Expreview sourced the drawings of one of the prototypes, which shows a long single PCB card, with a central fan. You will also observe that there is a back-plate in place. It shows that a number of memory chips will be populated on the back, and both GPU systems on the front. It will be an engineering challenge, to populate five major heat-producing components (two G200b GPUs, two NVIO2 processors, and one BR-03 bridge chip), 28 GDDR3 memory chips, and the VRM area to power it all. The new redesigned card may surface internally in April, and may enter production by May.
View at TechPowerUp Main Site
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