alexp999
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System Name | Gaming Rig | Uni Laptop |
---|---|
Processor | Intel Q6600 G0 (2007) @ 3.6Ghz @ 1.45625v (LLC) / 4 GHz Bench @ 1.63v | AMD Turion 64 X2 TL-62 2 GHz |
Motherboard | ASUS P5Q Deluxe (Intel P45) | HP 6715b |
Cooling | Xigmatek Dark Knight w/AC MX2 ~ Case Fans: 2 x 180mm + 1 x 120mm Silverstone Fans |
Memory | 4GB OCZ Platinum PC2-8000 @ 1000Mhz 5-5-5-15 2.1v | 2 x 1GB DDR2 667 MHz |
Video Card(s) | XFX GTX 285 1GB, Modded FTW BIOS @ 725/1512/1350 w/Accelero Xtreme GTX 280 + Scythe sinks| ATI X1250 |
Storage | 2x WD6400AAKS 1 TB Raid 0, 140GB Raid 1 & 80GB Maxtor Basics External HDD (storage) | 160GB 2.5" |
Display(s) | Samsung SyncMaster SM2433BW @ 1920 x 1200 via DVI-D | 15.4" WSXGA+ (1680 x 1050 resolution) |
Case | Silverstone Fortress FT01B-W ~ Logitech G15 R1 / Microsoft Laser Mouse 6000 |
Audio Device(s) | Soundmax AD2000BX Onboard Sound, via Logitech X-230 2.1 | ADI SoundMAX HD Audio |
Power Supply | Corsair TX650W | HP 90W |
Software | Windows 7 Ultimate Build 7100 x64 | Windows 7 Ultimate Build 7100 x64 |
Benchmark Scores | 3DM06: 19519, Vantage: P16170 ~ Win7: -CPU 7.5 -MEM 7.5 -AERO 7.9 -GFX 6.0 -HDD 6.0 |
A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and Flash application products, presenting its entire XPG - Xtreme Performance Gear product line and latest XPG Series DRAM modules with superior conductive technology in Nangang Exhibition Hall during Computex Taipei 2009.
As the success of presenting the leading XPG Xtreme series DDR3-2133X v2.0 DRAM module in the industry at CeBIT 2009, A-DATA presenting its XPG Plus Series v2.0 and Gaming Series v2.0 DRAM module with superior thermal conductive technology and characteristics heat sink design at Computex 2009.
Adopting new dual copper heat pipe design, the XPG Plus Series v2.0 DRAM module offers offload heat with extreme efficiency to ensure superior stability and performance. Each memory chip is direct contact with a thermo-conductive copper heat pipe to perform heat away from the memory components, and dissipates it through the aluminum fin array. The XPG Gaming Series v2.0 DRAM module adopts additional surface area of heat sink to provide effective heat dissipation via effective heat sink design.
Moreover, both XPG Plus Series v2.0 and XPG Gaming Series v2.0 DRAM module come with doubling amount of copper of PCB (printed circuit board) to delivering low temperature and better power efficiency from critical areas of the DRAM module.
A-DATA is also presenting its new XPG SX94 2.5" SATA II SSD with RAID 0 array, available in 256GB and 512GB capacity, to deliver up to 230MB/sec and 160MB/sec read/write killer speed and reliability.
For more information about the latest XPG series products, please visit A-DATA booth at Computex 2009.
Date: June 2, 2009 - June 6, 2009
Place: Taipei World Trade Center Nangang Exhibition Hall (No.1, Jingmao 2nd Rd., Nangang District, Taipei City)
Booth No: J818, J824, J1017, J1023
View at TechPowerUp Main Site
As the success of presenting the leading XPG Xtreme series DDR3-2133X v2.0 DRAM module in the industry at CeBIT 2009, A-DATA presenting its XPG Plus Series v2.0 and Gaming Series v2.0 DRAM module with superior thermal conductive technology and characteristics heat sink design at Computex 2009.
Adopting new dual copper heat pipe design, the XPG Plus Series v2.0 DRAM module offers offload heat with extreme efficiency to ensure superior stability and performance. Each memory chip is direct contact with a thermo-conductive copper heat pipe to perform heat away from the memory components, and dissipates it through the aluminum fin array. The XPG Gaming Series v2.0 DRAM module adopts additional surface area of heat sink to provide effective heat dissipation via effective heat sink design.
Moreover, both XPG Plus Series v2.0 and XPG Gaming Series v2.0 DRAM module come with doubling amount of copper of PCB (printed circuit board) to delivering low temperature and better power efficiency from critical areas of the DRAM module.
A-DATA is also presenting its new XPG SX94 2.5" SATA II SSD with RAID 0 array, available in 256GB and 512GB capacity, to deliver up to 230MB/sec and 160MB/sec read/write killer speed and reliability.
For more information about the latest XPG series products, please visit A-DATA booth at Computex 2009.
Date: June 2, 2009 - June 6, 2009
Place: Taipei World Trade Center Nangang Exhibition Hall (No.1, Jingmao 2nd Rd., Nangang District, Taipei City)
Booth No: J818, J824, J1017, J1023
View at TechPowerUp Main Site
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