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| System Name | RBMK-1000 |
|---|---|
| Processor | AMD Ryzen 7 5700G |
| Motherboard | ASUS ROG Strix B450-E Gaming |
| Cooling | DeepCool Gammax L240 V2 |
| Memory | 2x 8GB G.Skill Sniper X |
| Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
| Storage | Western Digital Black NVMe 512GB |
| Display(s) | BenQ 1440p 60 Hz 27-inch |
| Case | Corsair Carbide 100R |
| Audio Device(s) | ASUS SupremeFX S1220A |
| Power Supply | Cooler Master MWE Gold 650W |
| Mouse | ASUS ROG Strix Impact |
| Keyboard | Gamdias Hermes E2 |
| Software | Windows 11 Pro |
After winning unanimous acclaims from game-players for the triple-channel Xtreem DDR3 2000 and Xtreem DDR3 1866 modules, Team introduces the brand new Xtreem LV (low voltage) DDR3 series targeted at high frequency and low latency. The Xtreem LV series includes the models at 2200, 2133, 2000, 1866, 1600MHz. It is expected that the Xtreem LV series will launch a new wave to the dual-channel module market.
Based on the memory architecture of Core i7/i5, Team has successfully boosted the frequency of DDR3 modules from 1333MHz to 2000MHz in the Xtreem LV series. In addition to enhancing the frequency by nearly 40%, Team has integrated the memory controller of the Xtreem DDR3 LV series to the CPU's internal architecture in order to break through the technical limit on X48 and P45 platforms. As a result, the performance of the Xtreem DDR3 LV series is unsurpassed. On the other hand, the Xtreem LV DDR3 1866/1600 models are equipped with a low latency design, 7-7-7-21 and 6-7-6-18 (tCL-tRCD-tRP-tRAS) respectively, at the same working voltage of 1.65V, showing off Team's excellent R&D capability.
In terms of appearance design, the Xtreem DDR3 LV series continues using the customized black aluminum heatsink on the triple-channel Xtreem DDR3 modules and the unique X identity logo to present a different and unique appearance. Based on the uncompromised production process, all Xtreem DDR3 LV modules have gone through the strict dual-channel tests prior to shipping. BGA-packaged genuine chips are used in a 128x8 layout and selected with the Team-exclusive sorting technology to ensure superior product quality. The Xtreem DDR3 LV modules are launched in the 4GB kit (2x2GB) and 2GB kit (2x1GB) to meet the different needs of customers. Also, the triple channel series is equipped with the built-in XMP (Extreme Memory Profiles) function to ensure the optimal application for all users.
View at TechPowerUp Main Site
Based on the memory architecture of Core i7/i5, Team has successfully boosted the frequency of DDR3 modules from 1333MHz to 2000MHz in the Xtreem LV series. In addition to enhancing the frequency by nearly 40%, Team has integrated the memory controller of the Xtreem DDR3 LV series to the CPU's internal architecture in order to break through the technical limit on X48 and P45 platforms. As a result, the performance of the Xtreem DDR3 LV series is unsurpassed. On the other hand, the Xtreem LV DDR3 1866/1600 models are equipped with a low latency design, 7-7-7-21 and 6-7-6-18 (tCL-tRCD-tRP-tRAS) respectively, at the same working voltage of 1.65V, showing off Team's excellent R&D capability.
In terms of appearance design, the Xtreem DDR3 LV series continues using the customized black aluminum heatsink on the triple-channel Xtreem DDR3 modules and the unique X identity logo to present a different and unique appearance. Based on the uncompromised production process, all Xtreem DDR3 LV modules have gone through the strict dual-channel tests prior to shipping. BGA-packaged genuine chips are used in a 128x8 layout and selected with the Team-exclusive sorting technology to ensure superior product quality. The Xtreem DDR3 LV modules are launched in the 4GB kit (2x2GB) and 2GB kit (2x1GB) to meet the different needs of customers. Also, the triple channel series is equipped with the built-in XMP (Extreme Memory Profiles) function to ensure the optimal application for all users.
View at TechPowerUp Main Site
