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TSMC told industry observers that its plans to test large 18 inch wafers are on schedule for 2012-13, and should reach volume production in 2015. Silicon chips are manufactured on large discs known as wafers, and cut out of them. Like pizza, the sizes of wafers are measured by their diameters. The 18 inch diameter wafer has been something TSMC has been working on. Larger the wafer, the more chips can be cut out of a single wafer. It works to reduce production costs. TSMC expects to have 95% of its 18 inch wafer production equipment installed in 2014, and commence volume production by 2015. Currently, TSMC faces technical hurdles that have to be solved in collaboration with equipment and material suppliers.
View at TechPowerUp Main Site
View at TechPowerUp Main Site