VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90

[Cristian_25H]

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA COMe-8X90 module, featuring a 1.2 GHz VIA Nano X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Measuring 95 mm x 125 mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles.





Along with the VIA COMe-8X90 module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions.

"Embedded modules are ideal for creating highly tailored solutions with a short time to market approach," said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA COMe-8X90 module provides customers with an easily customizable platform with power efficient processing and rich I/O options, allowing them to quickly create optimized products for their target markets."

The VIA COMe-8X90 module will be on display at the VIA Embedded booth in Hall 1 of the Embedded World 2012 Exhibition and Conference, which is being held in Nuremberg, Germany from February 28th to March 1st, 2012. In addition, VIA will be presenting the latest embedded Android and x86 multi-core solutions for next generation embedded applications.

VIA COMe-8X90 Module

Available in the industry standard COM Express form factor of 95 mm x 125 mm, the VIA COMe-8X90 module includes a 1.2 GHz VIA Nano X2 E-Series dual core processor and a VIA VX900H MSP, which features the VIA ChromotionHD 2.0 video engine, boasting hardware acceleration of the most demanding video formats, including MPEG-4, H.264, MPEG-2, VC-1, WMV and Blu-ray support, for incredibly smooth playback of multimedia titles at resolutions up to 1080p. The VIA COMe-8X90 module offers support for the latest connectivity standards including 18/24-bit single-channel LVDS, VGA, Display Port and HDMI.

Onboard I/O includes two SATA II ports, one GigaLAN port, one USB client port, four USB 2.0 ports, SDIO, expansion buses for one PCIe X4 and one PCIe x1 and the VIA Labs VL800 USB 3.0 host controller which offers support for four USB 3.0 ports. System memory support includes two slots for up to 8 GB of SODIMM DDR3 RAM.

For more information about the VIA COMe-8X90module please visit:
http://www.viaembedded.com/en/products/boards/productDetail.jsp?productLine=1&id=1571&tabs=1

View at TechPowerUp Main Site

 

[faramir]

This "leading innovator of power efficient x86 processor platforms" will get stomped by not only Intel but also AMD's ULV Trinity by the time they actually put a product onto the market. They need to move to a smaller production node. Badly.

 

[Deleted member 3]

With the memory controller being on the CPU these days putting the RAM slots there as well makes sense. Now it's a DDR3 board, next year it uses DDR4 or whatever.

What's with the reversed PCIe slots though?

Edit: seems they're not reversed, the clip only is. Open on the end, that's good.

 

[TheLostSwede]

What's with the reversed PCIe slots though?

Edit: seems they're not reversed, the clip only is. Open on the end, that's good.

Uhm, the two on the bottom are, they look like reversed, open-ended x4 slots...
But that large PCB is a development board, so the slots could be anything and that PCB is unlikely to end up in a production system.

Edit: As per VIA's documentation:
1 x Reversed PCIe x4 slot for DVP port
1 x Reserved PCIe x4 slot for VCP port

Whatever those are...

 

[Deleted member 3]

Uhm, the two on the bottom are, they look like reversed, open-ended x4 slots...
But that large PCB is a development board, so the slots could be anything and that PCB is unlikely to end up in a production system.

Edit: As per VIA's documentation:
1 x Reversed PCIe x4 slot for DVP port
1 x Reserved PCIe x4 slot for VCP port

Whatever those are...

Ah, so that's why I got confused

Then the question remains, why?