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| System Name | RBMK-1000 |
|---|---|
| Processor | AMD Ryzen 7 5700G |
| Motherboard | ASUS ROG Strix B450-E Gaming |
| Cooling | DeepCool Gammax L240 V2 |
| Memory | 2x 8GB G.Skill Sniper X |
| Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
| Storage | Western Digital Black NVMe 512GB |
| Display(s) | BenQ 1440p 60 Hz 27-inch |
| Case | Corsair Carbide 100R |
| Audio Device(s) | ASUS SupremeFX S1220A |
| Power Supply | Cooler Master MWE Gold 650W |
| Mouse | ASUS ROG Strix Impact |
| Keyboard | Gamdias Hermes E2 |
| Software | Windows 11 Pro |
It's no secret that nearly all Intel Core processors are carved out of essentially one or two physical dies, be it the "2M" die that physically features four cores and 8 MB of L3 cache, or the "1M" die, which physically features two cores and 4 MB of L3 cache. The two silicons are further graded for energy-efficiency and performance before being assigned a package most suited to them: desktop LGA, mobile PGA, mobile BGA, and with the introduction of the 4th generation Core "Haswell," SoC (system on chip, a package that's going to be a multi-chip module of the CPU and PCH dies). The SoC package will be designed to conserve PCB real-estate, and will be suited for extremely size-sensitive devices such as Ultrabooks.
The third kind of grading for the two silicons relates to its on-die graphics processor, which makes up over a third of the die area. Depending on the number of programmable shaders and ROPs unlocked, there are two grades: GT2, and GT3, with GT3 being the most powerful. On the desktop front (identified by silicon extension "-DT,") Intel very much will retain dual-core processors, which will make up its Core i3, Pentium, and Celeron processor lines. It will be lead by quad-core parts. All desktop processors feature the GT2 graphics core.
Haswell-H consists of mobile quad-core parts in the BGA package, which will go into making mainstream notebooks and probably all-in-one desktops and NUC. Chips of these kind make for the bulk of Intel's processor sales. These chips are naturally not replaceable on the notebook. Intel will release two kinds of Haswell-H chips, based on the two integrated graphics variants.
The Haswell-MB consists of mobile chips in the replaceable PGA package, interestingly, Intel includes dual-core "1M" parts. Lastly, there's the SoC package (-ULT extension), which probably is the most expensive to make and sell, since it's a multi-chip module (MCM) of the CPU and PCH (chipset) dies. The package itself shouldn't be much bigger than Haswell-H (BGA), but conserves board footprint for a separate PCH chip, and a ton of wiring on the main board. There are no quad-core parts in this series, and they're graded on iGPU, and energy-efficiency. The most efficient one features the faster GT3 iGPU (since there's little room for discrete graphics) and just 10W TDP.
Last and most interestingly, it's reported that Intel will indeed have an LGA1150 desktop processor based on its "Broadwell" 5th generation Core architecture, which makes perfect sense, given that Broadwell is essentially die-shrunk Haswell micro-architecture. Its silicon lineup is charted out much in the same way as Haswell.
What's even more interesting, and reinforces the "desktop BGA apocalypto" theory, is the fact that there won't be a dual-core Broadwell processor in the LGA1150 package. So most entry- thru mainstream chips, which are dual-core, will be built in the BGA package. So for anyone with less than say $200 to spend on motherboard+CPU, motherboards with CPUs hardwired will be sold in the markets (much like graphics cards).
View at TechPowerUp Main Site
The third kind of grading for the two silicons relates to its on-die graphics processor, which makes up over a third of the die area. Depending on the number of programmable shaders and ROPs unlocked, there are two grades: GT2, and GT3, with GT3 being the most powerful. On the desktop front (identified by silicon extension "-DT,") Intel very much will retain dual-core processors, which will make up its Core i3, Pentium, and Celeron processor lines. It will be lead by quad-core parts. All desktop processors feature the GT2 graphics core.
Haswell-H consists of mobile quad-core parts in the BGA package, which will go into making mainstream notebooks and probably all-in-one desktops and NUC. Chips of these kind make for the bulk of Intel's processor sales. These chips are naturally not replaceable on the notebook. Intel will release two kinds of Haswell-H chips, based on the two integrated graphics variants.
The Haswell-MB consists of mobile chips in the replaceable PGA package, interestingly, Intel includes dual-core "1M" parts. Lastly, there's the SoC package (-ULT extension), which probably is the most expensive to make and sell, since it's a multi-chip module (MCM) of the CPU and PCH (chipset) dies. The package itself shouldn't be much bigger than Haswell-H (BGA), but conserves board footprint for a separate PCH chip, and a ton of wiring on the main board. There are no quad-core parts in this series, and they're graded on iGPU, and energy-efficiency. The most efficient one features the faster GT3 iGPU (since there's little room for discrete graphics) and just 10W TDP.
Last and most interestingly, it's reported that Intel will indeed have an LGA1150 desktop processor based on its "Broadwell" 5th generation Core architecture, which makes perfect sense, given that Broadwell is essentially die-shrunk Haswell micro-architecture. Its silicon lineup is charted out much in the same way as Haswell.
What's even more interesting, and reinforces the "desktop BGA apocalypto" theory, is the fact that there won't be a dual-core Broadwell processor in the LGA1150 package. So most entry- thru mainstream chips, which are dual-core, will be built in the BGA package. So for anyone with less than say $200 to spend on motherboard+CPU, motherboards with CPUs hardwired will be sold in the markets (much like graphics cards).
View at TechPowerUp Main Site
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