Enermax Unveils Thermal Conductive Coated CPU Coolers

[btarunr]

After the successful launch of the ETS-T40 series, Enermax now presents a new line of CPU Coolers in the series, the ETS-T40-Black Twister (ETS-T40-BK) and ETS-T40-White Cluster (ETS-T40-W). The new lineup not only inherits the superior performance of the ETS-T40 series with patented technologies, but also features an attractive heat sink decked out in a stunning coat, increasing the options and appeal of the ETS-T40 series family.

Black Twister and White Cluster are available in midnight black and arctic white colors, respectively. Both models employ a unique TCC (Thermal Conductive Coating) to create better velocity of thermal transference and prevent oxidation on the contact surface. ETS-T40-Black Twister features a circular blue LED PWM fan for a mesmerizing presentation. On the other hand, ETS-T40-White Cluster is equipped with the white LED fan with the unique PWM APS (Adjustable Peak Speed) control which offers 3 peak RPM options to satisfy the needs of consumers who prefer manual adjustability.



Enermax is committed to continually develop new and innovative cooling solutions. Both Black Twister and White Cluster feature several Enermax's patented technologies - the VGF, SEF, and VEF. The VGF (Vortex Generator Flow) helps increase air convection in-between the radiator fins; the SEF (Stack Effect) enhances heat transference from the bottom up; the VEF (Vacuum Effect) optimizes airflow inside the cooler. Furthermore, ETS-T40 employs four Ø6mm heat pipes with HDT (Heat-pipe Direct Touch) structure to shorten the distance between CPU and CPU Cooler, which vastly improves the thermal conduction.

Enermax ETS-T40 series CPU coolers come with a universal bracket for Intel LGA 775 / 1150 / 1155 / 1156 / 1366 / 2011 and AMDAM2 / AM2+ / AM3 / AM3+ / FM1 / FM2 platforms. All Enermax CPU Coolers are Haswell compatible. ETS-T40-Black Twister and ETS-T40-White Cluster will be available in US in July 2013 at MSRP of US$49.99.

For more information, visit the product pages of ETS-T40-BK and ETS-T40-W.

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[fullinfusion]

Direct touch heat pipes! Boooooo on that design.

 

[rooivalk]

Direct touch heat pipes! Boooooo on that design.

I don't follow heatsink news in recent years, and lately I heard that too. Care to elaborate why?

 

[FreedomEclipse]

I don't follow heatsink news in recent years, and lately I heard that too. Care to elaborate why?

Back in the day it was said that direct touch heatpipes were more of a marketing gimmick then anything thats actually useful and 'revolutionary' in air cooling.

I would rather they make the cooler a flat base, that way theres more contact with the CPU and thermal paste doesn't get stuck up them little nooks where the heatpipes make contact with the CPU

 

[PLAfiller]

Back in the day it was said that direct touch heatpipes were more of a marketing gimmick then anything thats actually useful and 'revolutionary' in air cooling.

I would rather they make the cooler a flat base, that way theres more contact with the CPU and thermal paste doesn't get stuck up them little nooks where the heatpipes make contact with the CPU

To solve the issue that you mentioned some introduced Continous Direct Contact . Those coolers both (HDT and HDT+CDC) perform just as good as any other air-based cooler. I am actually erecting two thumbs up in defense of the Enermax's decision to go for HDT

 

[Jorge]

Direct contact heatpipes have advantages over other designs but they need to be properly designed and manufactured. A solid contact block is convenient but it takes longer for the heat to transfer to the heatpipes and the transfer from the solid block to the heatpipes is less efficient than direct contact heatpipes. The slightly reduced contact area of the heatpipes on a direct heatpipe design do not cause any issues as these HSFs perform as good or better than many H2O systems.

Most enthusiasts do not understand that the ideal situation is 100% metal-to-metal contact between the heatsink and CPU/APU/GPU heat spreader. Since 100% mtm is not possible, TIM is by design intended to fill the minute scratches or imperfections in the two surfaces. TIM is a thermal insulator compared to mtm, so you only want TIM in the minute surface imperfections, NOT spread all over the CPU/APU/GPU like peanut butter. More TIM than what is needed to fill these minute imperfections actually reduces the coolers performance and increases the CPU/APU/GPU operating temp.

 

[hckngrtfakt]

Which is precisely why some air coolers are in par (temps/performance wise) with some closed-loop water systems.

The trick lies on the TIM application.

Remember people, you're not applying stucco on a wall

 

[drdeathx]

Direct contact heatpipes have advantages over other designs but they need to be properly designed and manufactured. A solid contact block is convenient but it takes longer for the heat to transfer to the heatpipes and the transfer from the solid block to the heatpipes is less efficient than direct contact heatpipes. The slightly reduced contact area of the heatpipes on a direct heatpipe design do not cause any issues as these HSFs perform as good or better than many H2O systems.

Most enthusiasts do not understand that the ideal situation is 100% metal-to-metal contact between the heatsink and CPU/APU/GPU heat spreader. Since 100% mtm is not possible, TIM is by design intended to fill the minute scratches or imperfections in the two surfaces. TIM is a thermal insulator compared to mtm, so you only want TIM in the minute surface imperfections, NOT spread all over the CPU/APU/GPU like peanut butter. More TIM than what is needed to fill these minute imperfections actually reduces the coolers performance and increases the CPU/APU/GPU operating temp.

LOL, Direct works better. It is a physical certainty. But they do not perform better than H20.