• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

UMC joins IBM chip alliance for 10 nm process development

Sin

News Editor
Joined
Mar 28, 2011
Messages
244 (0.05/day)
Location
under the bed
IBM (NYSE: IBM) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.

"Established over a decade ago, the IBM alliance allows the partners to leverage our combined expertise and collaborative research and innovative technology development to address the demanding needs for advanced semiconductor applications," said Gary Patton, VP, IBM Semiconductor Research & Development. "UMC is a strong addition to the alliance."



Po Wen Yen, CEO at UMC, added, "IBM is a recognized leader in fundamental semiconductor technology. We are extremely pleased to work jointly with IBM on advanced fundamentals, and to contribute our many years of experience in developing highly competitive manufacturing technology. Our role as one of the world's top foundries requires us to introduce leading-edge processes in a timely manner to enable next generation customer chip designs. We look forward to collaborating closely with IBM, leveraging their deep technology expertise to shorten our 10nm and FinFET R&D cycles and create a win-win situation for UMC and our customers."


The agreements between UMC and IBM expand upon their 2012 agreements concerning prior nodes, including 14nm FinFET. With IBM's support and know-how from this collaboration, UMC will continue to improve its internally developed 14nm FinFET to offer industry competitive low-power technology enhancements for mobile computing and communication products. The parties plan to develop baseline 10nm process technology to meet the needs of UMC customers. UMC will send an engineering team to join the 10nm development work that will take place in in Albany, New York, while UMC's 14nm FinFET and 10nm implementation will take place at UMC's Tainan, Taiwan R&D site.

View at TechPowerUp Main Site
 
Last edited by a moderator:

cdawall

where the hell are my stars
Joined
Jul 23, 2006
Messages
27,680 (4.13/day)
Location
Houston
System Name All the cores
Processor 2990WX
Motherboard Asrock X399M
Cooling CPU-XSPC RayStorm Neo, 2x240mm+360mm, D5PWM+140mL, GPU-2x360mm, 2xbyski, D4+D5+100mL
Memory 4x16GB G.Skill 3600
Video Card(s) (2) EVGA SC BLACK 1080Ti's
Storage 2x Samsung SM951 512GB, Samsung PM961 512GB
Display(s) Dell UP2414Q 3840X2160@60hz
Case Caselabs Mercury S5+pedestal
Audio Device(s) Fischer HA-02->Fischer FA-002W High edition/FA-003/Jubilate/FA-011 depending on my mood
Power Supply Seasonic Prime 1200w
Mouse Thermaltake Theron, Steam controller
Keyboard Keychron K8
Software W10P
Interesting not really much to be known about them reading through their stock profile.
 

juusu

New Member
Joined
Jun 14, 2013
Messages
2 (0.00/day)
Things just got very interesting for Intel and their Broadwell development.

If both 10nm process ARM and 14nm Broadwell were to enter the market at relatively the same time they'd likely be competing on the same computation level if Broadwell is an X86 CISC like Haswell, but the ARM chip would dominate out of sheer power efficiency.

If IBM and UMC do their best to get this process to manufacturing/fabrication standard as soon as possible they will have not only dug all the ARM partners out of the hole of being a step behind Intel, but will have clearly taken the lead and put Intel in the worst position.

I'm nervous to see how Intel will react in turn, and specifically how the irrelevancy of their planned roadmap will affect the desktop line.
 
Last edited:
Joined
Nov 1, 2008
Messages
477 (0.08/day)
System Name It does stuff
Processor Ryzen 3600
Motherboard B550 Gaming X V2
Cooling Stock
Memory 16GB DDR4 3600
Video Card(s) RX 6700XT
Storage Too much
Display(s) 27" & 21.5"
Case Antec 300
Power Supply 750W
AMD needs to get in on this and catch up. AMD's had chip / manufacturing process partnerships with IBM before, come on. Still shipping 32nm CPUs :shadedshu
 
Joined
Sep 15, 2011
Messages
6,728 (1.39/day)
Processor Intel® Core™ i7-13700K
Motherboard Gigabyte Z790 Aorus Elite AX
Cooling Noctua NH-D15
Memory 32GB(2x16) DDR5@6600MHz G-Skill Trident Z5
Video Card(s) ZOTAC GAMING GeForce RTX 3080 AMP Holo
Storage 2TB SK Platinum P41 SSD + 4TB SanDisk Ultra SSD + 500GB Samsung 840 EVO SSD
Display(s) Acer Predator X34 3440x1440@100Hz G-Sync
Case NZXT PHANTOM410-BK
Audio Device(s) Creative X-Fi Titanium PCIe
Power Supply Corsair 850W
Mouse Logitech Hero G502 SE
Software Windows 11 Pro - 64bit
Benchmark Scores 30FPS in NFS:Rivals
AMD needs to get in on this and catch up. AMD's had chip / manufacturing process partnerships with IBM before, come on. Still shipping 32nm CPUs :shadedshu

AMD doesn't poses fabs anymore. I think is TSMC job and/or Fujitsu job now. Not sure tho...
 

juusu

New Member
Joined
Jun 14, 2013
Messages
2 (0.00/day)
AMD needs to get in on this and catch up. AMD's had chip / manufacturing process partnerships with IBM before, come on. Still shipping 32nm CPUs :shadedshu

Honestly, AMD has been focused on and will continue to be focused on the new consoles and the roughly $100/unit they're guaranteed throughout the remainder of the year.

I think AMD would be wise to let Intel work themselves out of the gaming/enthusiast desktop market and work that niche. Come Broadwell we're going to see BGA soldered chips and the beginning of Intel proprietary motherboards... As well as Broadwell limiting bandwidth lanes to PCIe2x8 as they continue to gut the chipset and work towards increased power efficiency.

In a way, there's no future for PC gaming with Intel unless the enthusiast CPUs post-Haswell-E continue to support chipsets as maybe Intel will move to beastly TDP 8/10+ core architecture anyway. Which is a long shot to call at this point; let alone quite an investment for the average gamer.
 
Joined
Nov 1, 2008
Messages
477 (0.08/day)
System Name It does stuff
Processor Ryzen 3600
Motherboard B550 Gaming X V2
Cooling Stock
Memory 16GB DDR4 3600
Video Card(s) RX 6700XT
Storage Too much
Display(s) 27" & 21.5"
Case Antec 300
Power Supply 750W
AMD doesn't poses fabs anymore. I think is TSMC job and/or Fujitsu job now. Not sure tho...

Exactly, which is why they should try and get a look in on this for some tasty 10nm chips sooner than perhaps GloFlo can make them :)
 
Top