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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | ASUS ROG Strix B450-E Gaming |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 8GB G.Skill Sniper X |
Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
Storage | Western Digital Black NVMe 512GB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
Performance CPU cooler by X2. Following the award winning TherMax series CPU Coolers by our parent company Spire, the enthusiasts at X2 have further developed and improved the product's performance. Introducing the successor; Eclipse IV universal compatible performance CPU cooler.
Starting with the heat-sink, 45 aluminum stacked fins provide a larger surface area. The front and rear sides of the fins are patterned with shark-teeth for better outflow of air which helps to a more silent solution. Six (6) all copper heat-pipes of 6mm in diameter which are bend into the tower u-shape to achieve unrestricted air-flow and best cooling performance. All six (6) heat-pipes are soldered onto the heat spreader-base and cooling fins. Following the complete heat-sink is anodized and coated with pure nickel which fills any tiny imperfections and preserves the copper heat-pipes from oxidation.
Asymmetrical heat-sink design which ensures sufficient clearance in the direction of memory slots and RAM height clearance. Topped with two proprietary Nano-tech bearing 120x25mm high airflow DC Fans which are mounted with anti-vibe rubber corners and metal wire clips. Secure mounting with the robust H-bracket, application to all current AMD and Intel sockets and micro-processors (LGA1366, LGA1156, LGA1155, LGA1150, LGA775, AM2, AM2+, AM3, AM3+, FM1, FM2) and supplied with grade-A Thermica SP431 thermal grease that provides best contact ratio and outstanding reliability.
Main Features:
View at TechPowerUp Main Site
Starting with the heat-sink, 45 aluminum stacked fins provide a larger surface area. The front and rear sides of the fins are patterned with shark-teeth for better outflow of air which helps to a more silent solution. Six (6) all copper heat-pipes of 6mm in diameter which are bend into the tower u-shape to achieve unrestricted air-flow and best cooling performance. All six (6) heat-pipes are soldered onto the heat spreader-base and cooling fins. Following the complete heat-sink is anodized and coated with pure nickel which fills any tiny imperfections and preserves the copper heat-pipes from oxidation.
Asymmetrical heat-sink design which ensures sufficient clearance in the direction of memory slots and RAM height clearance. Topped with two proprietary Nano-tech bearing 120x25mm high airflow DC Fans which are mounted with anti-vibe rubber corners and metal wire clips. Secure mounting with the robust H-bracket, application to all current AMD and Intel sockets and micro-processors (LGA1366, LGA1156, LGA1155, LGA1150, LGA775, AM2, AM2+, AM3, AM3+, FM1, FM2) and supplied with grade-A Thermica SP431 thermal grease that provides best contact ratio and outstanding reliability.
Main Features:
- 45 wide aluminum heat-sink fins
- 6 all copper heat-pipes, 6mm in diameter
- U-shape tower, unrestricted air-flow
- All black-nickel coated, preserve from oxidation
- Asymmetrical heat-sink design, ensuring RAM clearance
- 2 proprietary Nano-tech bearing 120x25mm DC Fans
- Anti-vibe rubber fan corners with metal wire mounting-clips
- Robust H-bracket, secure and universal socket application
- Including grade-A Thermica SP431 thermal grease
- Best cooling performance up to 200W TDP
- Backed by 2 year manufacturer service warranty
View at TechPowerUp Main Site