System Name | SnowFire / The Reinforcer |
---|---|
Processor | i7 10700K 5.1ghz (24/7) / 2x Xeon E52650v2 |
Motherboard | Asus Strix Z490 / Dell Dual Socket (R720) |
Cooling | RX 360mm + 140mm Custom Loop / Dell Stock |
Memory | Corsair RGB 16gb DDR4 3000 CL 16 / DDR3 128gb 16 x 8gb |
Video Card(s) | GTX Titan XP (2025mhz) / Asus GTX 950 (No Power Connector) |
Storage | Samsung 970 1tb NVME and 2tb HDD x4 RAID 5 / 300gb x8 RAID 5 |
Display(s) | Acer XG270HU, Samsung G7 Odyssey (1440p 240hz) |
Case | Thermaltake Cube / Dell Poweredge R720 Rack Mount Case |
Audio Device(s) | Realtec ALC1150 (On board) |
Power Supply | Rosewill Lightning 1300Watt / Dell Stock 750 / Brick |
Mouse | Logitech G5 |
Keyboard | Logitech G19S |
Software | Windows 11 Pro / Windows Server 2016 |
But they also do not like to have to re-design a board all the time. Which could cause a bit of a stir in general if they had to rebuild a new designed motherboard supporting DDR4.That last bits probably the easiest ie motherboard maker's love anything that can sell more boards but an efficient low cost computer platform still needs low cost parts to fit it or your target market wont buy in
Yea that would be an oddity in general and to hard for them to do on a cost effective basis. I believe with DDR3 the way it is we still have a bit of room left for some extra power to come from it so my guess will be that they just integrate higher memory controllers into the design until they feel DDR4 is stable enough of a platform while keeping cost down.In LGA775 days, memory controllers were embedded into discrete north bridge chipsets. Nowadays, the north bridge functionality has moved onto the CPU itself and the north bridge no longer exists. Hence memory support is now coupled to the CPU you use, not motherboard.
Granted, there's no technical reason why AMD can't release CPUs that support both DDR3 and DDR4 at the same time... but there are plenty of good financial reasons why two memory controllers on a CPU don't make much sense. Especially when you're in AMD's position where they're targeting their CPUs at the price-conscious.
Processor | Ryzen 7 5800X3D |
---|---|
Motherboard | MSI MAG X570S Tomahawk Max WiFi |
Cooling | EK Supremacy EVO Elite + EK D5 + EK 420 Rad, TT Toughfan 140x3, TT Toughfan 120x2, Arctic slim 120 |
Memory | 32GB GSkill DDR4-3600 (F4-3600C16-8GVKC) |
Video Card(s) | Gigabyte Radeon RX 7900XTX Gaming OC |
Storage | WDBlack SN850X 4TB, Samsung 950Pro 512GB, Samsung 850EVO 500GB, 6TB WDRed, 36TB NAS, 8TB Lancache |
Display(s) | Benq XL2730Z (1440P 144Hz, TN, Freesync) & 2x ASUS VE248 |
Case | Corsair Obsidian 750D |
Audio Device(s) | Topping D50S + THX AAA 789, TH-X00 w/ V-Moda Boompro; 7Hz Timeless |
Power Supply | Corsair HX1000i |
Mouse | Sharkoon Fireglider optical |
Keyboard | Corsair K95 RGB |
Software | Windows 11 Pro |
wikipedia said:Socket AM2+ versions of the Phenom II (920, 940) lack forward-compatibility with Socket AM3.[8]Socket AM3 versions of the Phenom II are backwards-compatible with Socket AM2+, though this is contingent on motherboard manufacturers supplying BIOS updates. In addition to the Phenom II's pin compatibility, the AM3 memory controller supports both DDR2 and DDR3 memory (up to DDR2-1066 and DDR3-1333), allowing existing AM2+ users to upgrade their CPU without changing the motherboard or memory. However, similar to the way the original Phenom handled DDR2-1066, current Phenom II platforms limit the usage of DDR3-1333 to one DIMM per channel; otherwise, the DIMMs are under clocked to DDR3-1066.[9] AMD claims that this behaviour is due to the BIOS, not the memory controller, and plans to address it with a BIOS update. The dual-spec memory controller also gives motherboard manufacturers and system builders the option of pairing AM3 with DDR2, as compared to competing chips from Intel which require DDR3.
System Name | Sham Pc |
---|---|
Processor | i5-2500k @ 4.33 |
Motherboard | INTEL DZ77SL 50K |
Cooling | 2 bay res. "2L of fluid in loop" 1x480 2x360 |
Memory | 16gb 4x4 kingstone 1600 hyper x fury black |
Video Card(s) | hfa2 gtx 780 @ 1306/1768 (xspc bloc) |
Storage | 1tb wd red 120gb kingston on the way os, 1.5Tb wd black, 3tb random WD rebrand |
Display(s) | cibox something or other 23" 1080p " 23 inch downstairs. 52 inch plasma downstairs 15" tft kitchen |
Case | 900D |
Audio Device(s) | on board |
Power Supply | xion gaming seriese 1000W (non modular) 80+ bronze |
Software | windows 10 pro x64 |
In LGA775 days, memory controllers were embedded into discrete north bridge chipsets. Nowadays, the north bridge functionality has moved onto the CPU itself and the north bridge no longer exists. Hence memory support is now coupled to the CPU you use, not motherboard.
Granted, there's no technical reason why AMD can't release CPUs that support both DDR3 and DDR4 at the same time... but there are plenty of good financial reasons why two memory controllers on a CPU don't make much sense. Especially when you're in AMD's position where they're targeting their CPUs at the price-conscious.
FM2+ might be here to stay but AMD staying till 2016 is highly questionable
System Name | Apollo |
---|---|
Processor | Intel Core i9 9880H |
Motherboard | Some proprietary Apple thing. |
Memory | 64GB DDR4-2667 |
Video Card(s) | AMD Radeon Pro 5600M, 8GB HBM2 |
Storage | 1TB Apple NVMe, 4TB External |
Display(s) | Laptop @ 3072x1920 + 2x LG 5k Ultrafine TB3 displays |
Case | MacBook Pro (16", 2019) |
Audio Device(s) | AirPods Pro, Sennheiser HD 380s w/ FIIO Alpen 2, or Logitech 2.1 Speakers |
Power Supply | 96w Power Adapter |
Mouse | Logitech MX Master 3 |
Keyboard | Logitech G915, GL Clicky |
Software | MacOS 12.1 |
System Name | MoneySink |
---|---|
Processor | 2600K @ 4.8 |
Motherboard | P8Z77-V |
Cooling | AC NexXxos XT45 360, RayStorm, D5T+XSPC tank, Tygon R-3603, Bitspower |
Memory | 16GB Crucial Ballistix DDR3-1600C8 |
Video Card(s) | GTX 780 SLI (EVGA SC ACX + Giga GHz Ed.) |
Storage | Kingston HyperX SSD (128) OS, WD RE4 (1TB), RE2 (1TB), Cav. Black (2 x 500GB), Red (4TB) |
Display(s) | Achieva Shimian QH270-IPSMS (2560x1440) S-IPS |
Case | NZXT Switch 810 |
Audio Device(s) | onboard Realtek yawn edition |
Power Supply | Seasonic X-1050 |
Software | Win8.1 Pro |
Benchmark Scores | 3.5 litres of Pale Ale in 18 minutes. |
AMD rolled the dice back in 2007-08 and gambled that speed and a server-centric (high profit line) architecture was the way of the future. At the time AMD's server market share was just beginning its slide into oblivion...and of course both Hector Ruiz and Dirk Meyer both with a server backround.As I said. That was the whole idea of the design, to cut corners.
True enough. Sane and rational seldom sells product as well as hype and a new (if dubious) feature list and a new nameplate. Whether the product justifies itself to a handful of people with claims to being enthusiasts is largely immaterial - a hardware vendors fortunes rise or falls with OEM's...and OEM's demand new product. Somehow I don't think putting out a fourth or fifth revision of a 900-series chipset board every year cuts it for Asus and Co. and there is precious little to recommend these later offerings over the ones that came before.I get what you are saying and the market doesn't really demand much more than 4 generation old CPU's right now BUT......I think AMD should start being a little more proactive in the desktop/server area than reactive to Intel's advancements.
There is little fundamental difference between DDR2 and DDR3. DDR4 on the other hand has some distinct mechanical changes from DDR3. One that comes to mind is voltage margining. vREF DQ is now on the memory die and is accessed by the memory controller directly. AFAIK DDR3 relies upon external regulation chips of the boards memory sub-system - so you're looking at an overhaul of the memory controller in any case.Dual memory support is nothing new for AMD. Whether or not it makes sense to do so on a budget product is another matter entirely.
Not sure that would be possible TBH, two discrete memory controllers takes up die space and requires a certain amount of extra logic. DDR4 being single channel and requiring more direct interface between the MC and the memory sounds like a nightmare in waiting for anyone contemplating building a MC with DDR3 + DDR4 functionality.Granted, there's no technical reason why AMD can't release CPUs that support both DDR3 and DDR4 at the same time...
Processor | Intel Core i7 10850K@5.2GHz |
---|---|
Motherboard | AsRock Z470 Taichi |
Cooling | Corsair H115i Pro w/ Noctua NF-A14 Fans |
Memory | 32GB DDR4-3600 |
Video Card(s) | RTX 2070 Super |
Storage | 500GB SX8200 Pro + 8TB with 1TB SSD Cache |
Display(s) | Acer Nitro VG280K 4K 28" |
Case | Fractal Design Define S |
Audio Device(s) | Onboard is good enough for me |
Power Supply | eVGA SuperNOVA 1000w G3 |
Software | Windows 10 Pro x64 |
I'll just leave this here:
Dual memory support is nothing new for AMD. Whether or not it makes sense to do so on a budget product is another matter entirely.
System Name | Skunkworks 3.0 |
---|---|
Processor | 5800x3d |
Motherboard | x570 unify |
Cooling | Noctua NH-U12A |
Memory | 32GB 3600 mhz |
Video Card(s) | asrock 6800xt challenger D |
Storage | Sabarent rocket 4.0 2TB, MX 500 2TB |
Display(s) | Asus 1440p144 27" |
Case | Old arse cooler master 932 |
Power Supply | Corsair 1200w platinum |
Mouse | *squeak* |
Keyboard | Some old office thing |
Software | Manjaro |
And we saw how well that worked for AMD. they lost more market share, their cpu performance and pwer consumption took a step BACKWARDS, and AMD lost more money and went into panic mode, shedding staff and their CEO. And now.....fusions are all one or two module (cpu clusters dont count, no matter what amd says.). Im pretty sure that the "moar cores" philosophy didnt do amd much good.No, it was to save die space so you can fit more compute cores in the same area. They removed extra hardware that wasn't needed and added more where it needed it (eventually). A module is more of a dual core than you think because there are actually two full integer cores that run in parallel unlike with HyperThreading which re-uses components that aren't being used to get some extra work done. Some of the shared components are things like the op code decoders, cache, and a wide FPU (256-bit vs 128) and using things like XOP and FMA, that single wide FPU can be run as two individual 128-bit FPUs for particular instructions. It's not perfect but it made one thing very clear; CPUs should be doing mostly integer math and some floating point math and if you need to do a ton of floating point calculations, you should be doing it on a GPU/GPGPU setup. It's no different than nVidia gimping its double precision performance to improve single precision because that is what games typically use.
So no, they didn't do it to "cut corners", that's just how you feel about it which is different than why they did it. They did it to save die space so they could cram more cores on a single CPU.
System Name | PCGOD |
---|---|
Processor | AMD FX 8350@ 5.0GHz |
Motherboard | Asus TUF 990FX Sabertooth R2 2901 Bios |
Cooling | Scythe Ashura, 2×BitFenix 230mm Spectre Pro LED (Blue,Green), 2x BitFenix 140mm Spectre Pro LED |
Memory | 16 GB Gskill Ripjaws X 2133 (2400 OC, 10-10-12-20-20, 1T, 1.65V) |
Video Card(s) | AMD Radeon 290 Sapphire Vapor-X |
Storage | Samsung 840 Pro 256GB, WD Velociraptor 1TB |
Display(s) | NEC Multisync LCD 1700V (Display Port Adapter) |
Case | AeroCool Xpredator Evil Blue Edition |
Audio Device(s) | Creative Labs Sound Blaster ZxR |
Power Supply | Seasonic 1250 XM2 Series (XP3) |
Mouse | Roccat Kone XTD |
Keyboard | Roccat Ryos MK Pro |
Software | Windows 7 Pro 64 |
As I said. That was the whole idea of the design, to cut corners.
FPUs where not needed???
As I also said. A module is as much hardware as it is necessary, so that AMD can advertise it as a full dual core without the fear lawsuits start dropping like bombs in their headquarters for misleading their customers.
If the integer units where much faster and if the 6 FPUs in the Phenom II X6 where not doing circles around the 4 in the first 8 core Bulldozer chips, in most cases, or if there where stream processors in the FX chips in the first place to take advantage of GPGPU and also we had plenty of software for GPGPU, I could agree with you. But we have a ton of "IFs" years after the first Bulldozer and of course this isn't the same case as with Nvidia because Nvidia's cards are top performers. So I can't agree with you.
It is not a feeling. It is reality. They couldn't follow Intel in the thread count, Intel had an unfair advantage there with hyperthreading, they couldn't follow Intel in the manufacturing process, so they had to do something. And that something was to throw half the FPUs out and started counting integer units when advertising the chips. Now they started talking about compute cores so they can advertise 4, 8, or 12 cores(I hope this truck I posted doesn't transfer compute cores but integer cores, very optimistic but let's just hope).
You want to justify a design that failed miserably and brought AMD to it's knees. I can't stop you. I only can say to you that for the Jaguar design where space is much more limited and power consumption much more important, they didn't choose the module design. Even considering that Kabinis for example do have stream processors in them for GPGPU they still paired an integer unit with a full fpu. That should tell you something.
i dont see why fm2+ boards couldnt use ddr4 with some updated hardware on mother boards.
lga 775 managed to span ddr ddr2 and ddr3. obviously would be per board specific but i dont see how the socket type is relivant to what memory can be used.
System Name | MoneySink |
---|---|
Processor | 2600K @ 4.8 |
Motherboard | P8Z77-V |
Cooling | AC NexXxos XT45 360, RayStorm, D5T+XSPC tank, Tygon R-3603, Bitspower |
Memory | 16GB Crucial Ballistix DDR3-1600C8 |
Video Card(s) | GTX 780 SLI (EVGA SC ACX + Giga GHz Ed.) |
Storage | Kingston HyperX SSD (128) OS, WD RE4 (1TB), RE2 (1TB), Cav. Black (2 x 500GB), Red (4TB) |
Display(s) | Achieva Shimian QH270-IPSMS (2560x1440) S-IPS |
Case | NZXT Switch 810 |
Audio Device(s) | onboard Realtek yawn edition |
Power Supply | Seasonic X-1050 |
Software | Win8.1 Pro |
Benchmark Scores | 3.5 litres of Pale Ale in 18 minutes. |
Thinking like an end user. Advantage or no, new hardware is sold on the basis that it is new. Does it need to be practical ? Of course not. Why do you think OEM's strongarm AMD and Nvidia into rebranding graphics every product cycle?Since there is no tangible advantage to DDR4 for CPU powered desktop use, it's foolish to even bother with it.
Considering Intel's desktop is an offshoot of their pro CPU/chipsets, would you think Intel would make DDR4 available for Xeon and then devise a whole new platform for consumers using DDR3 ?Intel is using DDR4 as a gimmick for suckers. DDR4 is designed primarily for servers
Duh.and it will be more expensive than DDR3 LV.
Yeah, complete and utter bastards scamming people with that one-and-done FM1 socket.........................ah, waitChanging sockets for the sake of exploiting consumers is what Intel does.
System Name | RyzenGtEvo/ Asus strix scar II |
---|---|
Processor | Amd R5 5900X/ Intel 8750H |
Motherboard | Crosshair hero8 impact/Asus |
Cooling | 360EK extreme rad+ 360$EK slim all push, cpu ek suprim Gpu full cover all EK |
Memory | Corsair Vengeance Rgb pro 3600cas14 16Gb in four sticks./16Gb/16GB |
Video Card(s) | Powercolour RX7900XT Reference/Rtx 2060 |
Storage | Silicon power 2TB nvme/8Tb external/1Tb samsung Evo nvme 2Tb sata ssd/1Tb nvme |
Display(s) | Samsung UAE28"850R 4k freesync.dell shiter |
Case | Lianli 011 dynamic/strix scar2 |
Audio Device(s) | Xfi creative 7.1 on board ,Yamaha dts av setup, corsair void pro headset |
Power Supply | corsair 1200Hxi/Asus stock |
Mouse | Roccat Kova/ Logitech G wireless |
Keyboard | Roccat Aimo 120 |
VR HMD | Oculus rift |
Software | Win 10 Pro |
Benchmark Scores | 8726 vega 3dmark timespy/ laptop Timespy 6506 |
System Name | Sham Pc |
---|---|
Processor | i5-2500k @ 4.33 |
Motherboard | INTEL DZ77SL 50K |
Cooling | 2 bay res. "2L of fluid in loop" 1x480 2x360 |
Memory | 16gb 4x4 kingstone 1600 hyper x fury black |
Video Card(s) | hfa2 gtx 780 @ 1306/1768 (xspc bloc) |
Storage | 1tb wd red 120gb kingston on the way os, 1.5Tb wd black, 3tb random WD rebrand |
Display(s) | cibox something or other 23" 1080p " 23 inch downstairs. 52 inch plasma downstairs 15" tft kitchen |
Case | 900D |
Audio Device(s) | on board |
Power Supply | xion gaming seriese 1000W (non modular) 80+ bronze |
Software | windows 10 pro x64 |
System Name | RyzenGtEvo/ Asus strix scar II |
---|---|
Processor | Amd R5 5900X/ Intel 8750H |
Motherboard | Crosshair hero8 impact/Asus |
Cooling | 360EK extreme rad+ 360$EK slim all push, cpu ek suprim Gpu full cover all EK |
Memory | Corsair Vengeance Rgb pro 3600cas14 16Gb in four sticks./16Gb/16GB |
Video Card(s) | Powercolour RX7900XT Reference/Rtx 2060 |
Storage | Silicon power 2TB nvme/8Tb external/1Tb samsung Evo nvme 2Tb sata ssd/1Tb nvme |
Display(s) | Samsung UAE28"850R 4k freesync.dell shiter |
Case | Lianli 011 dynamic/strix scar2 |
Audio Device(s) | Xfi creative 7.1 on board ,Yamaha dts av setup, corsair void pro headset |
Power Supply | corsair 1200Hxi/Asus stock |
Mouse | Roccat Kova/ Logitech G wireless |
Keyboard | Roccat Aimo 120 |
VR HMD | Oculus rift |
Software | Win 10 Pro |
Benchmark Scores | 8726 vega 3dmark timespy/ laptop Timespy 6506 |
System Name | MoneySink |
---|---|
Processor | 2600K @ 4.8 |
Motherboard | P8Z77-V |
Cooling | AC NexXxos XT45 360, RayStorm, D5T+XSPC tank, Tygon R-3603, Bitspower |
Memory | 16GB Crucial Ballistix DDR3-1600C8 |
Video Card(s) | GTX 780 SLI (EVGA SC ACX + Giga GHz Ed.) |
Storage | Kingston HyperX SSD (128) OS, WD RE4 (1TB), RE2 (1TB), Cav. Black (2 x 500GB), Red (4TB) |
Display(s) | Achieva Shimian QH270-IPSMS (2560x1440) S-IPS |
Case | NZXT Switch 810 |
Audio Device(s) | onboard Realtek yawn edition |
Power Supply | Seasonic X-1050 |
Software | Win8.1 Pro |
Benchmark Scores | 3.5 litres of Pale Ale in 18 minutes. |
Which is exactly what I said in my earlier post...except Jorge is talking the here-and-now, and I was talking about laying down designs and taking lead-in time into account. I'm also guessing that DDR4 introduction would mirror that of DDR2/DDR3, in that non-ECC desktop low-binned entry level DDR4(-2133CAS13) won't be overly expensive since many DDR3 sticks already exceed this.Yeah but you cant apply the new factor in the same way to a budget aware platform smokey so jorge was right and ddr4 at this point is irrelevant to amd apus
There are TWO ways of looking at this:AMD's R&D money men have short arms and deep pockets, and no amount of funding is going to claw back market share in x86 HEDT/server/workstation from Intel. The lead-in time is too great, and Intel's market penetration too encompassing. AMD's board are renowned for playing the short game, so I'd guess that they'd continue to look at markets where they can have an immediate impact.
System Name | RyzenGtEvo/ Asus strix scar II |
---|---|
Processor | Amd R5 5900X/ Intel 8750H |
Motherboard | Crosshair hero8 impact/Asus |
Cooling | 360EK extreme rad+ 360$EK slim all push, cpu ek suprim Gpu full cover all EK |
Memory | Corsair Vengeance Rgb pro 3600cas14 16Gb in four sticks./16Gb/16GB |
Video Card(s) | Powercolour RX7900XT Reference/Rtx 2060 |
Storage | Silicon power 2TB nvme/8Tb external/1Tb samsung Evo nvme 2Tb sata ssd/1Tb nvme |
Display(s) | Samsung UAE28"850R 4k freesync.dell shiter |
Case | Lianli 011 dynamic/strix scar2 |
Audio Device(s) | Xfi creative 7.1 on board ,Yamaha dts av setup, corsair void pro headset |
Power Supply | corsair 1200Hxi/Asus stock |
Mouse | Roccat Kova/ Logitech G wireless |
Keyboard | Roccat Aimo 120 |
VR HMD | Oculus rift |
Software | Win 10 Pro |
Benchmark Scores | 8726 vega 3dmark timespy/ laptop Timespy 6506 |
System Name | Apollo |
---|---|
Processor | Intel Core i9 9880H |
Motherboard | Some proprietary Apple thing. |
Memory | 64GB DDR4-2667 |
Video Card(s) | AMD Radeon Pro 5600M, 8GB HBM2 |
Storage | 1TB Apple NVMe, 4TB External |
Display(s) | Laptop @ 3072x1920 + 2x LG 5k Ultrafine TB3 displays |
Case | MacBook Pro (16", 2019) |
Audio Device(s) | AirPods Pro, Sennheiser HD 380s w/ FIIO Alpen 2, or Logitech 2.1 Speakers |
Power Supply | 96w Power Adapter |
Mouse | Logitech MX Master 3 |
Keyboard | Logitech G915, GL Clicky |
Software | MacOS 12.1 |
Amd will have 3 independent cpu architecture types for servers.
Bulldozer derivatives
Apu derived from but not the same as Bd
And Arm
They don't do too bad with their measly r and d budget.
System Name | RyzenGtEvo/ Asus strix scar II |
---|---|
Processor | Amd R5 5900X/ Intel 8750H |
Motherboard | Crosshair hero8 impact/Asus |
Cooling | 360EK extreme rad+ 360$EK slim all push, cpu ek suprim Gpu full cover all EK |
Memory | Corsair Vengeance Rgb pro 3600cas14 16Gb in four sticks./16Gb/16GB |
Video Card(s) | Powercolour RX7900XT Reference/Rtx 2060 |
Storage | Silicon power 2TB nvme/8Tb external/1Tb samsung Evo nvme 2Tb sata ssd/1Tb nvme |
Display(s) | Samsung UAE28"850R 4k freesync.dell shiter |
Case | Lianli 011 dynamic/strix scar2 |
Audio Device(s) | Xfi creative 7.1 on board ,Yamaha dts av setup, corsair void pro headset |
Power Supply | corsair 1200Hxi/Asus stock |
Mouse | Roccat Kova/ Logitech G wireless |
Keyboard | Roccat Aimo 120 |
VR HMD | Oculus rift |
Software | Win 10 Pro |
Benchmark Scores | 8726 vega 3dmark timespy/ laptop Timespy 6506 |
System Name | MoneySink |
---|---|
Processor | 2600K @ 4.8 |
Motherboard | P8Z77-V |
Cooling | AC NexXxos XT45 360, RayStorm, D5T+XSPC tank, Tygon R-3603, Bitspower |
Memory | 16GB Crucial Ballistix DDR3-1600C8 |
Video Card(s) | GTX 780 SLI (EVGA SC ACX + Giga GHz Ed.) |
Storage | Kingston HyperX SSD (128) OS, WD RE4 (1TB), RE2 (1TB), Cav. Black (2 x 500GB), Red (4TB) |
Display(s) | Achieva Shimian QH270-IPSMS (2560x1440) S-IPS |
Case | NZXT Switch 810 |
Audio Device(s) | onboard Realtek yawn edition |
Power Supply | Seasonic X-1050 |
Software | Win8.1 Pro |
Benchmark Scores | 3.5 litres of Pale Ale in 18 minutes. |
You're counting generational changes concurrently. Bulldozer (and Piledriver) is done and dead from an R&D point of view - no need to include an architecture that is 2+ years in the marketAmd will have 3 independent cpu architecture types for servers.
Bulldozer derivatives
Apu derived from but not the same as Bd
And Arm
They don't do too bad with their measly r and d budget.
System Name | RyzenGtEvo/ Asus strix scar II |
---|---|
Processor | Amd R5 5900X/ Intel 8750H |
Motherboard | Crosshair hero8 impact/Asus |
Cooling | 360EK extreme rad+ 360$EK slim all push, cpu ek suprim Gpu full cover all EK |
Memory | Corsair Vengeance Rgb pro 3600cas14 16Gb in four sticks./16Gb/16GB |
Video Card(s) | Powercolour RX7900XT Reference/Rtx 2060 |
Storage | Silicon power 2TB nvme/8Tb external/1Tb samsung Evo nvme 2Tb sata ssd/1Tb nvme |
Display(s) | Samsung UAE28"850R 4k freesync.dell shiter |
Case | Lianli 011 dynamic/strix scar2 |
Audio Device(s) | Xfi creative 7.1 on board ,Yamaha dts av setup, corsair void pro headset |
Power Supply | corsair 1200Hxi/Asus stock |
Mouse | Roccat Kova/ Logitech G wireless |
Keyboard | Roccat Aimo 120 |
VR HMD | Oculus rift |
Software | Win 10 Pro |
Benchmark Scores | 8726 vega 3dmark timespy/ laptop Timespy 6506 |
Processor | Intel i7-10700K @ 5.1 All-Core |
---|---|
Motherboard | Asus Z490 Prime-A |
Cooling | Custom Loop Dual DDC 360+280mm rads aquacomputer cpu and gpu blocks |
Memory | 32gb DDR4 3600mhz |
Video Card(s) | EVGA GTX 1080 |
Storage | 1tb A-Data M.2 nvme, 2x 512gb Samsung 860 Evo's. |
Display(s) | 2x Acer 27" 1440p IPS 144mhz displays. |
Case | Phanteks Enthoo Pro M Acrylic |
Audio Device(s) | Creative X-Fi Titanium HD |
Power Supply | EVGA Supernova G3 850w |
Mouse | Logitech G903 |
Keyboard | Logitech g710+ |
Software | Windows 10 Pro |
Benchmark Scores | Over 100,000 in 3dmark2001. |
the corner cutting was done during the mfr process.
Cutting corners would imply that they skimped to save on cost, which they didn't. AMD's chips are plenty fast, the problem is power consumption. If your cores make too much heat you can't add more or make them run faster. You're complaining about the wrong stuff.
When it comes to integer performance (what CPUs are doing most of the time since memory addresses and strings are represented as integers) that's what CPUs will be doing. More often than not, 4 FPUs will be more than enough for your typical floating point use. Also you're misunderstanding me if you're thinking I'm saying that CPU doesn't need any FPUs. If you're running an application that has more than 4 FPU intensive threads, then you really should be considering GPGPU but most of the time FPU instructions will be spread throughout code and not all bunched up so despite there only being 1 FPU per module, it doesn't matter if it's shared as it will just use whatever is free. You run out of FP performance in unique situations with FX chips which are typically only encountered on benchmarks and less in real world applications.
Kabini is a different animal because it doesn't use modules or even the Phenom II architecture for that matter. The pipeline is much shorter (shorter than Phenom IIs were in fact,) and is designed for low power use cases, not performance. The cost of a shorter pipeline is that (initially at least,) it can hinder clock speeds until the components on the pipeline are optimized like Intel has done over the last 8 years with the Core architecture.
System Name | Sham Pc |
---|---|
Processor | i5-2500k @ 4.33 |
Motherboard | INTEL DZ77SL 50K |
Cooling | 2 bay res. "2L of fluid in loop" 1x480 2x360 |
Memory | 16gb 4x4 kingstone 1600 hyper x fury black |
Video Card(s) | hfa2 gtx 780 @ 1306/1768 (xspc bloc) |
Storage | 1tb wd red 120gb kingston on the way os, 1.5Tb wd black, 3tb random WD rebrand |
Display(s) | cibox something or other 23" 1080p " 23 inch downstairs. 52 inch plasma downstairs 15" tft kitchen |
Case | 900D |
Audio Device(s) | on board |
Power Supply | xion gaming seriese 1000W (non modular) 80+ bronze |
Software | windows 10 pro x64 |
Ex-AMD Engineer Explains Bulldozer Fiasco: Lack of Fine Tuning.
Engineer: AMD Should Have Hand-Crafted Bulldozer to Ensure High Speed
[10/13/2011 11:21 PM]
by Anton Shilov
Performance that Advanced Micro Devices' eight-core processor demonstrated in real-world applications is far from impressive as the chip barely outperforms competing quad-core central processing units from Intel. The reason why performance of the long-awaited Bulldozer was below expectations is not only because it was late, but because AMD had adopted design techniques that did not allow it tweak performance, according to an ex-AMD engineer.
Cliff A. Maier, an AMD engineer who left the company several years ago, the chip designer decided to abandon practice of hand-crafting various performance-critical parts of its chips and rely completely on automatic tools . While usage of tools that automatically implement certain technologies into silicon speeds up the design process, they cannot ensure maximum performance and efficiency.
Automated Design = 20% Bigger, 20% Slower
"The management decided there should be such cross-engineering [between AMD and ATI teams within the company] ,which meant we had to stop hand-crafting our CPU designs and switch to an SoC design style. This results in giving up a lot of performance, chip area, and efficiency. The reason DEC Alphas were always much faster than anything else is they designed each transistor by hand. Intel and AMD had always done so at least for the critical parts of the chip. That changed before I left - they started to rely on synthesis tools, automatic place and route tools, etc.," said Mr. Maier in a forum post noticed by Insideris.com web-site.
A wafer with AMD Orochi dies used for AMD Opteron "Interlagos"/"Valencia and AMD FX "Zambezi" microprocessors
Apparently, automatically-generated designs are 20% bigger and 20% slower than hand-crafted designs, which results in increased transistor count, die space, cost and power efficiency .
"I had been in charge of our design flow in the years before I left, and I had tested these tools by asking the companies who sold them to design blocks (adders, multipliers, etc.) using their tools. I let them take as long as they wanted. They always came back to me with designs that were 20% bigger, and 20% slower than our hand-crafted designs, and which suffered from electro-migration and other problems," the former AMD engineer said.
Inefficiencies in Design?
While it is unknown whether AMD used automatic design flow tools for everything, there are certain facts that point to some inefficient pieces of design within Bulldozer. Officially, AMD claims that the Zambezi/Orochi processor consists of around 2 billion transistors, which is a very large number.
AMD Orochi floorplan
AMD publicly said that each Bulldozer dual-core CPU module with 2MB unified L2 cache contains 213 million transistors and is 30.9mm2 large. By contrast, die size of one processing engine of Llano processor (11-layer 32nm SOI, K10.5+ micro-architecture) is 9.69mm2 (without L2 cache), which indicates that AMD has succeeded in minimizing elements of its new micro-architecture so to maintain small size and production cost of the novelty.
As a result, all four CPU modules with L2 cache within Zambezi/Orochi processor consist of 852 million of transistors and take 123.6mm2 of die space. Assuming that 8MB of L3 cache (6 bits per cell) consist of 405 million of transistors, it leaves around whopping 800 million of transistors to various input/output interfaces, dual-channel DDR3 memory controller as well as various logic and routing inside the chip.
800 million of transistors - which take up a lot of die space - in an incredibly high number for various I/O, memory, logic, etc. For example, Intel's Core i-series "Sandy Bridge" quad-core chip with integrated graphics consists of 995 million.
While it cannot be confirmed, but it looks like AMD Orochi/Zambezi has several hundreds of millions of transistors that are a result of heavy reliance onto automated design tools.
The Result? Profit Drop!
As a consequence of inefficient design and relatively low performance , AMD has to sell its eight-core FX series processors (315mm2 die size) for up to $245 in 1000-unit quantities. By contrast, Intel sells hand-crafted Core i-series "Sandy Bridge" quad-core chips (216mm2 die size) for up to $317 in 1000-unit quantities. Given the fact that both microprocessors are made using 32nm process technology [and thus have comparable per-transistor/per square mm die cost], the Intel one carries much better profit margin than AMD's microprocessor.
AMD did not comment on the news-story.
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System Name | PCGOD |
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Cooling | Scythe Ashura, 2×BitFenix 230mm Spectre Pro LED (Blue,Green), 2x BitFenix 140mm Spectre Pro LED |
Memory | 16 GB Gskill Ripjaws X 2133 (2400 OC, 10-10-12-20-20, 1T, 1.65V) |
Video Card(s) | AMD Radeon 290 Sapphire Vapor-X |
Storage | Samsung 840 Pro 256GB, WD Velociraptor 1TB |
Display(s) | NEC Multisync LCD 1700V (Display Port Adapter) |
Case | AeroCool Xpredator Evil Blue Edition |
Audio Device(s) | Creative Labs Sound Blaster ZxR |
Power Supply | Seasonic 1250 XM2 Series (XP3) |
Mouse | Roccat Kone XTD |
Keyboard | Roccat Ryos MK Pro |
Software | Windows 7 Pro 64 |
sure il just google one of the quotes and find some.
here is the one i pasted above.
but a few covered the story
http://www.xbitlabs.com/news/cpu/di...x_AMD_Engineer_Explains_Bulldozer_Fiasco.html